JP3840146B2 - Multi-piece ceramic substrate - Google Patents

Multi-piece ceramic substrate Download PDF

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Publication number
JP3840146B2
JP3840146B2 JP2002177392A JP2002177392A JP3840146B2 JP 3840146 B2 JP3840146 B2 JP 3840146B2 JP 2002177392 A JP2002177392 A JP 2002177392A JP 2002177392 A JP2002177392 A JP 2002177392A JP 3840146 B2 JP3840146 B2 JP 3840146B2
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Japan
Prior art keywords
ceramic
substrate
mother substrate
ceramic mother
dividing groove
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JP2002177392A
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Japanese (ja)
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JP2004022894A (en
Inventor
修平 山下
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Kyocera Corp
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Kyocera Corp
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Description

【0001】
【発明の属する技術分野】
本発明は半導体素子や抵抗、コンデンサ等の電子素子が搭載される小型のセラミック基板を多数個集約的に製作するようになした多数個取りセラミック基板に関するものである。
【0002】
【従来の技術】
近時、半導体素子や抵抗、コンデンサ等の電子素子が搭載されるセラミック基板は電子機器の小型化、薄型化に伴ってその形状が極めて小型なものとなってきている。そのため、この小型のセラミック基板に半導体素子や抵抗等の電子部品を搭載する場合、小型のセラミック基板はその形状が小型で取扱い難いため、通常は小型のセラミック基板を多数個集約させた状態、即ち、多数個取りセラミック基板と成した状態で各小型のセラミック基板上に半導体素子等を搭載するようになしている。
【0003】
なお、前記多数個取りセラミック基板は例えば大型のセラミック母基板の両主面に幅および深さが略一定の分割溝を、その端部がセラミック母基板の外周より内側となるようにして入れ、該分割溝によって大型のセラミック母基板を所望する大きさの複数個の区画に区分したものであり、各区画には半導体素子等の電子素子の電極が接続されるメタライズ配線層が被着形成されており、半導体素子や抵抗等の電子素子をその電極が前記メタライズ配線層に接続されるようにして搭載した後、大型のセラミック母基板を前記分割溝に沿って撓折し、それによって半導体素子や抵抗等の電子素子が搭載された個々の小型セラミック基板が一度に多数個得られるようにしたものである。
【0004】
また、このような多数個取りセラミック基板は、セラミック母基板用のセラミックグリーンシートを準備するとともに、該セラミックグリーンシートの両主面にカッター刃や金型等により幅および深さが一定の分割溝用の切り込みを各区画を区分するがごとく入れ、それを高温で焼成することによって製作されている。
【0005】
【発明が解決しようとする課題】
しかしながら、大型のセラミック母基板を分割溝によって複数の区画に区分して成る従来の多数個取りセラミック基板は、その分割溝が同じ幅で形成されており、そのため分割溝内の側面と端面との間に略直角の角が形成された状態となっていた。そして、このセラミック母基板に例えば搬送時や電子素子を搭載する際等に外部から力が印加されると、その力が分割溝内の側面と端面との間に形成された略直角の角に集中して作用し、その角部を起点としてセラミック母基板に不用意に割れが発生し、その結果、大型のセラミック母基板の各区画に半導体素子や抵抗等の電子素子を正確、且つ確実に搭載するのが不可能となるという問題点を有していた。
【0006】
本発明は、かかる従来の問題点に鑑み案出されたものであり、その目的は、搬送時や電子素子を搭載する際等に外部から力が印加されても、分割溝の端部を起点として不用意に割れが発生することがなく、それにより大型のセラミック母基板の各区画に半導体素子や抵抗等の電子素子を正確、且つ確実に搭載することが可能な多数個取りセラミック基板を提供することにある。
【0007】
【課題を解決するための手段】
本発明の多数個取りセラミック基板は、平板状のセラミック母基板の両主面に、該セラミック母基板を複数の区画に区分する分割溝が前記セラミック母基板の外周から離間して形成されているとともに、前記各分割溝の両端と前記外周との間に前記分割溝より幅が広くかつ前記分割溝より深さの深い非貫通穴が互いに上下に重ならない位置に前記分割溝と連通して形成されていることを特徴とするものである。
【0008】
本発明の多数個取りセラミック基板によれば、平板状のセラミック母基板の両主面に、該セラミック母基板を複数の区画に区分する分割溝が前記セラミック母基板の外周から離間して形成されているとともに、前記各分割溝の両端と前記外周との間に前記分割溝より幅が広くかつ前記分割溝より深さの深い非貫通穴が互いに上下に重ならない位置に前記分割溝と連通して形成されていることから、搬送時や電子素子を搭載する際等に外部から力が印加されたとしても、その力は、上下の分割溝と連通して形成されている非貫通穴で良好に分散されて、分割溝の端部を起点としてセラミック母基板に不用意に割れが発生することを有効に防止することができる。また、非貫通穴は上下に重ならない位置に形成されていることから、非貫通穴の形成領域においてセラミック母基板の強度が大きく低下することがない。したがって、セラミック母基板の各区画に半導体素子や抵抗等の電子素子を正確、かつ確実に搭載することができる。
【0009】
【発明の実施の形態】
次に本発明を添付の図面に基づき詳細に説明する。図1、図2はそれぞれ本発明の多数個取りセラミック基板の実施の形態の一例を示す上面図および断面図であり、図中、1はセラミック母基板、2は分割溝、3はメタライズ配線層、4は非貫通穴である。
【0010】
セラミック母基板1は、例えば酸化アルミニウム質焼結体やムライト質焼結体、窒化アルミニウム質焼結体、炭化珪素質焼結体、窒化珪素質焼結体、ガラス−セラミックス等の電気絶縁性のセラミック材料から成り、小型のセラミック基板を多数個同時集約的に製作するための母材として機能する。そして、各小型のセラミック基板の上面に半導体素子や抵抗、コンデンサ等の電子素子が搭載される。
【0011】
なお、セラミック母基板1は、例えば酸化アルミニウム質焼結体から成る場合であれば、酸化アルミニウム、酸化珪素、酸化マグネシウム、酸化カルシウム等のセラミック原料粉末に適当な有機バインダーおよび溶剤、可塑剤、分散剤等を添加混合して得たセラミックスラリーを従来周知のドクターブレード法を採用してシート状に成形してセラミックグリーンシートを得、しかる後、セラミックグリーンシートに適当な打ち抜き加工を施すとともにこれを複数枚積層し、高温(約1500〜1800℃)で焼成することによって製作される。
【0012】
また、セラミック母基板1は、その両主面に該セラミック母基板1を複数の区画に区分するごとく分割溝2が格子状に形成されており、分割溝2で区分された各区画の上面や下面にはメタライズ配線層3が被着されている。メタライズ配線層3は、小型のセラミック基板に搭載される電子素子を外部電気回路基板に電気的に接続するための導電路として機能し、タングステンやモリブデン、銅、銀等の金属粉末メタライズから成り、セラミック母基板1用のセラミックグリーンシートにスクリーン印刷法によりメタライズ配線層3用のメタライズペーストを印刷塗布しておくとともにこれをセラミック母基板1用のセラミックグリーンシートとともに焼成することによって各区画の上面や下面に被着形成される。そして、各区画に電子素子をその電極がメタライズ配線層3に電気的に接続されるようにして搭載するとともに、セラミック母基板1を分割溝2に沿って撓折することによって、多数個の電子装置が同時集約的に製作される。
【0013】
セラミック母基板1の両主面に形成された分割溝2は、セラミック母基板1を所望する小型のセラミック基板の形状に対応した大きさの複数の区画に区分するとともに各区画に電子素子を搭載した後、セラミック母基板1を撓折して多数個の小型セラミック基板となす際、その撓折を容易かつ正確とする作用を為し、その両端がセラミック母基板1の外周から離間するようにして形成されており、その幅は0.1〜1mm程度であり、その深さは0.05〜1mm程度である。なお、このような分割溝2は、断面がV字状の刃先を有するカッター刃や金型をセラミック母基板1用のセラミックグリーンシートに押し付けて切り込みを入れておくことによってセラミック母基板1の両主面に格子状に形成される。
【0014】
さらに、本発明の多数個取りセラミック基板においては、分割溝2の両端とセラミック母基板1の外周との間に、分割溝2よりも幅が広くかつ分割溝2よりも深さが深い略円形の非貫通穴4が互いに上下に重ならない位置に分割溝2と連通するようにして形成されている。この非貫通穴4は、セラミック母基板1に搬送時や電子素子を搭載する際等に外部から力が印加された場合に、分割溝2の両端に印加される応力を緩和分散させる作用をなし、このように分割溝2の両端とセラミック母基板1の外周との間に分割溝2より幅が広くかつ分割溝2より深さの深い非貫通穴4が互いに上下に重ならない位置に分割溝2と連通して形成されていることから、セラミック母基板1に搬送時や電子素子を搭載する際等に外部から力が印加されたとしても、その力は上下の分割溝2と連通して形成されている非貫通穴4で良好に分散されて、分割溝2の端部を起点としてセラミック母基板1が不用意に割れることを有効に防止することができる。さらに、非貫通穴4は上下に重ならない位置に形成されていることから、非貫通穴4の形成領域においてセラミック母基板1の強度が大きく低下することがない。したがって、本発明の多数個取りセラミック基板によれば、セラミック母基板1の各区画に半導体素子や抵抗等の電子素子を正確、かつ確実に搭載するのが可能となる。なお、このような非貫通穴4は、分割溝2の両端に印加される応力を良好に分散させるためには円形であることが好ましく、その幅は分割溝2の幅の2倍以上であることが好ましい。また、このような非貫通穴4は、セラミック母基板1用のセラミックグリーンシートのいくつかに非貫通穴4用の略円形の貫通孔を打ち抜いておくことによって分割溝2の両端とセラミック母基板1の外周との間に分割溝2と連通するように形成される。
【0015】
かくして本発明の多数個取りセラミック基板によれば、分割溝2によって区分された各区画に半導体素子や抵抗等の電子素子を例えば自動機等を使用して搭載した後、分割溝2に沿って撓折され、これによって製品としての小型セラミック基板の個々に分離される。
【0016】
なお、本発明は上述の実施の形態例に限定されるものではなく、本発明の要旨を逸脱しない範囲であれば種々の変更は可能であり、例えば上述の実施の形態例では非貫通穴4は略円形としたが、非貫通穴4は略四角形としてもよく、その他の形状であってもよい。
【0017】
【発明の効果】
本発明の多数個取りセラミック基板によれば、平板状のセラミック母基板の両主面に、該セラミック母基板を複数の区画に区分する分割溝が前記セラミック母基板の外周から離間して形成されているとともに、前記各分割溝の両端と前記外周との間に前記分割溝より幅が広くかつ前記分割溝より深さの深い非貫通穴が互いに上下に重ならない位置に前記分割溝と連通して形成されていることから、搬送時や電子素子を搭載する際等に外部から力が印加されたとしても、そ力は上下の分割溝と連通して形成されている非貫通穴で良好に分散されて、分割溝の端部を起点としてセラミック母基板に不用意に割れが発生することを有効に防止することができる。また、非貫通穴は上下に重ならない位置に形成されていることから、非貫通穴の形成領域においてセラミック母基板の強度が大きく低下することはない。したがって、セラミック母基板の各区画に半導体素子や抵抗等の電子素子を正確、かつ確実に搭載することが可能な多数個取りセラミック基板を提供することができる。
【図面の簡単な説明】
【図1】本発明の多数個取りセラミック基板の実施の形態の一例を示す上面図である。
【図2】図1に示す多数個取りセラミック基板のX−Xにおける断面図である。
【符号の説明】
1・・・セラミック母基板
2・・・分割溝
3・・・メタライズ配線層
4・・・非貫通穴
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multi-cavity ceramic substrate in which a large number of small ceramic substrates on which electronic elements such as semiconductor elements, resistors, and capacitors are mounted are manufactured intensively.
[0002]
[Prior art]
In recent years, ceramic substrates on which electronic elements such as semiconductor elements, resistors, and capacitors are mounted have become extremely small in shape as electronic devices become smaller and thinner. Therefore, when electronic components such as semiconductor elements and resistors are mounted on this small ceramic substrate, the small ceramic substrate is small in shape and difficult to handle. A semiconductor element or the like is mounted on each small ceramic substrate in a state of being formed as a multi-piece ceramic substrate.
[0003]
In addition, the multi-cavity ceramic substrate is, for example, a split groove having a substantially constant width and depth on both main surfaces of a large ceramic mother substrate, with its end being inside the outer periphery of the ceramic mother substrate, A large ceramic mother substrate is divided into a plurality of sections of a desired size by the dividing grooves, and a metallized wiring layer to which electrodes of electronic elements such as semiconductor elements are connected is formed in each section. After mounting an electronic element such as a semiconductor element or a resistor so that its electrode is connected to the metallized wiring layer, the large ceramic mother board is bent along the dividing groove, thereby the semiconductor element A large number of individual small ceramic substrates on which electronic elements such as resistors and resistors are mounted are obtained at a time.
[0004]
In addition, such a multi-cavity ceramic substrate is prepared with ceramic green sheets for a ceramic mother substrate, and a split groove having a constant width and depth by a cutter blade or a mold on both main surfaces of the ceramic green sheet. It is made by cutting in the cut as if dividing each section and firing it at a high temperature.
[0005]
[Problems to be solved by the invention]
However, the conventional multi-cavity ceramic substrate in which a large ceramic mother substrate is divided into a plurality of sections by dividing grooves, the dividing grooves are formed with the same width, so that the side surface and the end surface in the dividing groove are A substantially right angle was formed between them. When a force is applied from the outside, for example, when transporting or mounting an electronic element on the ceramic mother board, the force is applied to a substantially right angle formed between the side surface and the end surface in the dividing groove. Acting in a concentrated manner, the ceramic mother board is inadvertently cracked starting from the corners, and as a result, electronic elements such as semiconductor elements and resistors are accurately and reliably placed on each section of the large ceramic mother board. There was a problem that it was impossible to install.
[0006]
The present invention has been devised in view of such conventional problems, and its purpose is to start from the end of the dividing groove even when an external force is applied during transportation or mounting of an electronic element. As a result, there is provided a multi-cavity ceramic substrate that can be used to accurately and reliably mount semiconductor elements, resistors, and other electronic elements in each section of a large ceramic mother board. There is to do.
[0007]
[Means for Solving the Problems]
In the multi-cavity ceramic substrate of the present invention, dividing grooves for dividing the ceramic mother substrate into a plurality of sections are formed on both main surfaces of the flat ceramic mother substrate so as to be separated from the outer periphery of the ceramic mother substrate. In addition, non-through holes that are wider than the divided grooves and deeper than the divided grooves are formed between both ends of the divided grooves and the outer periphery so as to communicate with the divided grooves at positions where they do not overlap each other. It is characterized by being.
[0008]
According to the multi-cavity ceramic substrate of the present invention, the dividing grooves for dividing the ceramic mother substrate into a plurality of sections are formed on both main surfaces of the flat ceramic mother substrate so as to be separated from the outer periphery of the ceramic mother substrate. In addition, the non-through holes that are wider than the divided grooves and deeper than the divided grooves are communicated with the divided grooves so as not to overlap each other between both ends of the divided grooves and the outer periphery. Therefore, even if a force is applied from the outside during transport or when mounting an electronic device, the force is good for non-through holes formed in communication with the upper and lower dividing grooves. It is possible to effectively prevent the ceramic mother substrate from being inadvertently cracked starting from the end of the dividing groove. In addition, since the non-through holes are formed at positions that do not overlap vertically, the strength of the ceramic mother substrate is not greatly reduced in the formation region of the non-through holes. Accordingly, electronic elements such as semiconductor elements and resistors can be accurately and reliably mounted on each section of the ceramic mother board.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Next, the present invention will be described in detail with reference to the accompanying drawings. 1 and 2 are a top view and a cross-sectional view showing an example of an embodiment of a multi-cavity ceramic substrate according to the present invention, in which 1 is a ceramic mother substrate, 2 is a dividing groove, and 3 is a metallized wiring layer. Reference numeral 4 denotes a non-through hole.
[0010]
The ceramic mother substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a glass-ceramic. It is made of a ceramic material and functions as a base material for manufacturing a large number of small ceramic substrates simultaneously. Then, electronic elements such as semiconductor elements, resistors, and capacitors are mounted on the upper surface of each small ceramic substrate.
[0011]
If the ceramic mother substrate 1 is made of, for example, an aluminum oxide sintered body, a suitable organic binder and solvent, plasticizer, dispersion for ceramic raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide The ceramic slurry obtained by adding and mixing the agent and the like is formed into a sheet shape using a conventionally known doctor blade method to obtain a ceramic green sheet. Thereafter, the ceramic green sheet is appropriately punched and processed. It is manufactured by laminating a plurality of sheets and firing them at a high temperature (about 1500 to 1800 ° C.).
[0012]
In addition, the ceramic mother substrate 1 has a dividing groove 2 formed in a lattice shape on both main surfaces so as to divide the ceramic mother substrate 1 into a plurality of sections, and the upper surface of each section divided by the dividing grooves 2 A metallized wiring layer 3 is deposited on the lower surface. The metallized wiring layer 3 functions as a conductive path for electrically connecting an electronic element mounted on a small ceramic substrate to an external electric circuit substrate, and is made of metal powder metallization such as tungsten, molybdenum, copper, silver, The metallized paste for the metallized wiring layer 3 is printed and applied to the ceramic green sheet for the ceramic mother substrate 1 by screen printing, and this is fired together with the ceramic green sheet for the ceramic mother substrate 1 so that the upper surface of each section Deposited on the bottom surface. An electronic element is mounted in each compartment so that its electrode is electrically connected to the metallized wiring layer 3, and the ceramic mother substrate 1 is bent along the dividing groove 2, thereby allowing a large number of electrons. The device is manufactured intensively at the same time.
[0013]
The dividing grooves 2 formed on both main surfaces of the ceramic mother board 1 divide the ceramic mother board 1 into a plurality of sections having a size corresponding to the shape of a desired small ceramic substrate, and mount electronic elements in each section. After that, when the ceramic mother board 1 is bent into a large number of small ceramic boards, the bending is performed easily and accurately, and both ends thereof are separated from the outer periphery of the ceramic mother board 1. The width is about 0.1 to 1 mm, and the depth is about 0.05 to 1 mm. Such a dividing groove 2 is formed by pressing a cutter blade or a die having a V-shaped cutting edge against a ceramic green sheet for the ceramic mother substrate 1 to make both of the ceramic mother substrates 1. It is formed in a lattice shape on the main surface.
[0014]
Further, in the multi-cavity ceramic substrate of the present invention, a substantially circular shape having a width wider than the dividing groove 2 and a depth deeper than the dividing groove 2 between both ends of the dividing groove 2 and the outer periphery of the ceramic mother substrate 1. The non-through holes 4 are formed so as to communicate with the dividing grooves 2 at positions where they do not overlap each other. This non-through hole 4 acts to relax and disperse stress applied to both ends of the dividing groove 2 when a force is applied from the outside, for example, when transporting or mounting an electronic element on the ceramic mother board 1. In this way, the non-through holes 4 that are wider than the dividing groove 2 and deeper than the dividing groove 2 between the both ends of the dividing groove 2 and the outer periphery of the ceramic mother substrate 1 are positioned so as not to overlap each other. 2, even if a force is applied from the outside when the ceramic mother board 1 is transported or when an electronic element is mounted, the force communicates with the upper and lower divided grooves 2. It is possible to effectively prevent the ceramic mother substrate 1 from being inadvertently cracked starting from the end portion of the dividing groove 2 by being well dispersed in the formed non-through holes 4. Furthermore, since the non-through hole 4 is formed at a position where it does not overlap vertically, the strength of the ceramic mother substrate 1 does not drop significantly in the region where the non-through hole 4 is formed. Therefore, according to the multi-cavity ceramic substrate of the present invention, electronic elements such as semiconductor elements and resistors can be accurately and reliably mounted on each section of the ceramic mother substrate 1. In addition, such a non-through hole 4 is preferably circular in order to satisfactorily disperse the stress applied to both ends of the dividing groove 2, and its width is at least twice the width of the dividing groove 2. It is preferable. Further, such non-through holes 4 are formed by punching out substantially circular through holes for the non-through holes 4 in some of the ceramic green sheets for the ceramic mother substrate 1 so that both ends of the dividing grooves 2 and the ceramic mother substrate are formed. It is formed so as to communicate with the dividing groove 2 between the outer periphery of 1.
[0015]
Thus, according to the multi-cavity ceramic substrate of the present invention, an electronic element such as a semiconductor element or a resistor is mounted on each section divided by the dividing groove 2 using, for example, an automatic machine, and then along the dividing groove 2. It bends and thereby separates the individual small ceramic substrates as products.
[0016]
The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the above-described embodiment, the non-through hole 4 is possible. Is substantially circular, but the non-through hole 4 may be substantially square or may have other shapes.
[0017]
【The invention's effect】
According to the multi-cavity ceramic substrate of the present invention, the dividing grooves for dividing the ceramic mother substrate into a plurality of sections are formed on both main surfaces of the flat ceramic mother substrate so as to be separated from the outer periphery of the ceramic mother substrate. In addition, the non-through holes that are wider than the divided grooves and deeper than the divided grooves are communicated with the divided grooves so as not to overlap each other between both ends of the divided grooves and the outer periphery. since it was formed Te, as external force is applied to the like when mounting the conveyance time and the electronic device, the force of that is excellent in non-through hole formed in communication with the upper and lower dividing groove It is possible to effectively prevent the ceramic mother substrate from being inadvertently cracked starting from the end of the dividing groove. Further, since the non-through hole is formed at a position where it does not overlap vertically, the strength of the ceramic mother substrate is not greatly reduced in the formation region of the non-through hole. Therefore, it is possible to provide a multi-piece ceramic substrate capable of accurately and reliably mounting electronic elements such as semiconductor elements and resistors in each section of the ceramic mother substrate.
[Brief description of the drawings]
FIG. 1 is a top view showing an example of an embodiment of a multi-cavity ceramic substrate of the present invention.
2 is a cross-sectional view taken along the line XX of the multi-cavity ceramic substrate shown in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Ceramic mother board 2 ... Dividing groove 3 ... Metallized wiring layer 4 ... Non-through hole

Claims (1)

平板状のセラミック母基板の両主面に、該セラミック母基板を複数の区画に区分する分割溝が前記セラミック母基板の外周から離間して形成されているとともに、前記各分割溝の両端と前記外周との間に前記分割溝より幅が広くかつ前記分割溝より深さの深い非貫通穴が互いに上下に重ならない位置に前記分割溝と連通して形成されていることを特徴とする多数個取りセラミック基板。Divided grooves that divide the ceramic mother substrate into a plurality of sections are formed on both main surfaces of the plate-shaped ceramic mother substrate apart from the outer periphery of the ceramic mother substrate, and both ends of the divided grooves and the A large number of non-through holes that are wider than the dividing groove and deeper than the dividing groove are formed between the outer periphery and the outer periphery so as to communicate with the dividing groove at positions that do not overlap each other. Take ceramic substrate.
JP2002177392A 2002-06-18 2002-06-18 Multi-piece ceramic substrate Expired - Fee Related JP3840146B2 (en)

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JP7153438B2 (en) * 2017-10-26 2022-10-14 日東電工株式会社 Substrate assembly sheet

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