JP3840146B2 - Multi-piece ceramic substrate - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multi-cavity ceramic substrate in which a large number of small ceramic substrates on which electronic elements such as semiconductor elements, resistors, and capacitors are mounted are manufactured intensively.
[0002]
[Prior art]
In recent years, ceramic substrates on which electronic elements such as semiconductor elements, resistors, and capacitors are mounted have become extremely small in shape as electronic devices become smaller and thinner. Therefore, when electronic components such as semiconductor elements and resistors are mounted on this small ceramic substrate, the small ceramic substrate is small in shape and difficult to handle. A semiconductor element or the like is mounted on each small ceramic substrate in a state of being formed as a multi-piece ceramic substrate.
[0003]
In addition, the multi-cavity ceramic substrate is, for example, a split groove having a substantially constant width and depth on both main surfaces of a large ceramic mother substrate, with its end being inside the outer periphery of the ceramic mother substrate, A large ceramic mother substrate is divided into a plurality of sections of a desired size by the dividing grooves, and a metallized wiring layer to which electrodes of electronic elements such as semiconductor elements are connected is formed in each section. After mounting an electronic element such as a semiconductor element or a resistor so that its electrode is connected to the metallized wiring layer, the large ceramic mother board is bent along the dividing groove, thereby the semiconductor element A large number of individual small ceramic substrates on which electronic elements such as resistors and resistors are mounted are obtained at a time.
[0004]
In addition, such a multi-cavity ceramic substrate is prepared with ceramic green sheets for a ceramic mother substrate, and a split groove having a constant width and depth by a cutter blade or a mold on both main surfaces of the ceramic green sheet. It is made by cutting in the cut as if dividing each section and firing it at a high temperature.
[0005]
[Problems to be solved by the invention]
However, the conventional multi-cavity ceramic substrate in which a large ceramic mother substrate is divided into a plurality of sections by dividing grooves, the dividing grooves are formed with the same width, so that the side surface and the end surface in the dividing groove are A substantially right angle was formed between them. When a force is applied from the outside, for example, when transporting or mounting an electronic element on the ceramic mother board, the force is applied to a substantially right angle formed between the side surface and the end surface in the dividing groove. Acting in a concentrated manner, the ceramic mother board is inadvertently cracked starting from the corners, and as a result, electronic elements such as semiconductor elements and resistors are accurately and reliably placed on each section of the large ceramic mother board. There was a problem that it was impossible to install.
[0006]
The present invention has been devised in view of such conventional problems, and its purpose is to start from the end of the dividing groove even when an external force is applied during transportation or mounting of an electronic element. As a result, there is provided a multi-cavity ceramic substrate that can be used to accurately and reliably mount semiconductor elements, resistors, and other electronic elements in each section of a large ceramic mother board. There is to do.
[0007]
[Means for Solving the Problems]
In the multi-cavity ceramic substrate of the present invention, dividing grooves for dividing the ceramic mother substrate into a plurality of sections are formed on both main surfaces of the flat ceramic mother substrate so as to be separated from the outer periphery of the ceramic mother substrate. In addition, non-through holes that are wider than the divided grooves and deeper than the divided grooves are formed between both ends of the divided grooves and the outer periphery so as to communicate with the divided grooves at positions where they do not overlap each other. It is characterized by being.
[0008]
According to the multi-cavity ceramic substrate of the present invention, the dividing grooves for dividing the ceramic mother substrate into a plurality of sections are formed on both main surfaces of the flat ceramic mother substrate so as to be separated from the outer periphery of the ceramic mother substrate. In addition, the non-through holes that are wider than the divided grooves and deeper than the divided grooves are communicated with the divided grooves so as not to overlap each other between both ends of the divided grooves and the outer periphery. Therefore, even if a force is applied from the outside during transport or when mounting an electronic device, the force is good for non-through holes formed in communication with the upper and lower dividing grooves. It is possible to effectively prevent the ceramic mother substrate from being inadvertently cracked starting from the end of the dividing groove. In addition, since the non-through holes are formed at positions that do not overlap vertically, the strength of the ceramic mother substrate is not greatly reduced in the formation region of the non-through holes. Accordingly, electronic elements such as semiconductor elements and resistors can be accurately and reliably mounted on each section of the ceramic mother board.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Next, the present invention will be described in detail with reference to the accompanying drawings. 1 and 2 are a top view and a cross-sectional view showing an example of an embodiment of a multi-cavity ceramic substrate according to the present invention, in which 1 is a ceramic mother substrate, 2 is a dividing groove, and 3 is a metallized wiring layer. Reference numeral 4 denotes a non-through hole.
[0010]
The ceramic mother substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a glass-ceramic. It is made of a ceramic material and functions as a base material for manufacturing a large number of small ceramic substrates simultaneously. Then, electronic elements such as semiconductor elements, resistors, and capacitors are mounted on the upper surface of each small ceramic substrate.
[0011]
If the ceramic mother substrate 1 is made of, for example, an aluminum oxide sintered body, a suitable organic binder and solvent, plasticizer, dispersion for ceramic raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide The ceramic slurry obtained by adding and mixing the agent and the like is formed into a sheet shape using a conventionally known doctor blade method to obtain a ceramic green sheet. Thereafter, the ceramic green sheet is appropriately punched and processed. It is manufactured by laminating a plurality of sheets and firing them at a high temperature (about 1500 to 1800 ° C.).
[0012]
In addition, the ceramic mother substrate 1 has a dividing groove 2 formed in a lattice shape on both main surfaces so as to divide the ceramic mother substrate 1 into a plurality of sections, and the upper surface of each section divided by the dividing grooves 2 A metallized wiring layer 3 is deposited on the lower surface. The metallized wiring layer 3 functions as a conductive path for electrically connecting an electronic element mounted on a small ceramic substrate to an external electric circuit substrate, and is made of metal powder metallization such as tungsten, molybdenum, copper, silver, The metallized paste for the metallized wiring layer 3 is printed and applied to the ceramic green sheet for the ceramic mother substrate 1 by screen printing, and this is fired together with the ceramic green sheet for the ceramic mother substrate 1 so that the upper surface of each section Deposited on the bottom surface. An electronic element is mounted in each compartment so that its electrode is electrically connected to the metallized wiring layer 3, and the ceramic mother substrate 1 is bent along the dividing groove 2, thereby allowing a large number of electrons. The device is manufactured intensively at the same time.
[0013]
The dividing grooves 2 formed on both main surfaces of the ceramic mother board 1 divide the ceramic mother board 1 into a plurality of sections having a size corresponding to the shape of a desired small ceramic substrate, and mount electronic elements in each section. After that, when the ceramic mother board 1 is bent into a large number of small ceramic boards, the bending is performed easily and accurately, and both ends thereof are separated from the outer periphery of the ceramic mother board 1. The width is about 0.1 to 1 mm, and the depth is about 0.05 to 1 mm. Such a dividing groove 2 is formed by pressing a cutter blade or a die having a V-shaped cutting edge against a ceramic green sheet for the ceramic mother substrate 1 to make both of the ceramic mother substrates 1. It is formed in a lattice shape on the main surface.
[0014]
Further, in the multi-cavity ceramic substrate of the present invention, a substantially circular shape having a width wider than the dividing groove 2 and a depth deeper than the dividing groove 2 between both ends of the dividing groove 2 and the outer periphery of the ceramic mother substrate 1. The non-through holes 4 are formed so as to communicate with the dividing grooves 2 at positions where they do not overlap each other. This non-through hole 4 acts to relax and disperse stress applied to both ends of the dividing groove 2 when a force is applied from the outside, for example, when transporting or mounting an electronic element on the ceramic mother board 1. In this way, the non-through holes 4 that are wider than the dividing groove 2 and deeper than the dividing groove 2 between the both ends of the dividing groove 2 and the outer periphery of the ceramic mother substrate 1 are positioned so as not to overlap each other. 2, even if a force is applied from the outside when the ceramic mother board 1 is transported or when an electronic element is mounted, the force communicates with the upper and lower divided grooves 2. It is possible to effectively prevent the ceramic mother substrate 1 from being inadvertently cracked starting from the end portion of the dividing groove 2 by being well dispersed in the formed non-through holes 4. Furthermore, since the non-through hole 4 is formed at a position where it does not overlap vertically, the strength of the ceramic mother substrate 1 does not drop significantly in the region where the non-through hole 4 is formed. Therefore, according to the multi-cavity ceramic substrate of the present invention, electronic elements such as semiconductor elements and resistors can be accurately and reliably mounted on each section of the ceramic mother substrate 1. In addition, such a non-through hole 4 is preferably circular in order to satisfactorily disperse the stress applied to both ends of the dividing groove 2, and its width is at least twice the width of the dividing groove 2. It is preferable. Further, such non-through holes 4 are formed by punching out substantially circular through holes for the non-through holes 4 in some of the ceramic green sheets for the ceramic mother substrate 1 so that both ends of the dividing grooves 2 and the ceramic mother substrate are formed. It is formed so as to communicate with the dividing groove 2 between the outer periphery of 1.
[0015]
Thus, according to the multi-cavity ceramic substrate of the present invention, an electronic element such as a semiconductor element or a resistor is mounted on each section divided by the dividing groove 2 using, for example, an automatic machine, and then along the dividing groove 2. It bends and thereby separates the individual small ceramic substrates as products.
[0016]
The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the above-described embodiment, the non-through hole 4 is possible. Is substantially circular, but the non-through hole 4 may be substantially square or may have other shapes.
[0017]
【The invention's effect】
According to the multi-cavity ceramic substrate of the present invention, the dividing grooves for dividing the ceramic mother substrate into a plurality of sections are formed on both main surfaces of the flat ceramic mother substrate so as to be separated from the outer periphery of the ceramic mother substrate. In addition, the non-through holes that are wider than the divided grooves and deeper than the divided grooves are communicated with the divided grooves so as not to overlap each other between both ends of the divided grooves and the outer periphery. since it was formed Te, as external force is applied to the like when mounting the conveyance time and the electronic device, the force of that is excellent in non-through hole formed in communication with the upper and lower dividing groove It is possible to effectively prevent the ceramic mother substrate from being inadvertently cracked starting from the end of the dividing groove. Further, since the non-through hole is formed at a position where it does not overlap vertically, the strength of the ceramic mother substrate is not greatly reduced in the formation region of the non-through hole. Therefore, it is possible to provide a multi-piece ceramic substrate capable of accurately and reliably mounting electronic elements such as semiconductor elements and resistors in each section of the ceramic mother substrate.
[Brief description of the drawings]
FIG. 1 is a top view showing an example of an embodiment of a multi-cavity ceramic substrate of the present invention.
2 is a cross-sectional view taken along the line XX of the multi-cavity ceramic substrate shown in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Ceramic mother board 2 ... Dividing groove 3 ... Metallized wiring layer 4 ... Non-through hole

Claims (1)

Divided grooves that divide the ceramic mother substrate into a plurality of sections are formed on both main surfaces of the plate-shaped ceramic mother substrate apart from the outer periphery of the ceramic mother substrate, and both ends of the divided grooves and the A large number of non-through holes that are wider than the dividing groove and deeper than the dividing groove are formed between the outer periphery and the outer periphery so as to communicate with the dividing groove at positions that do not overlap each other. Take ceramic substrate.

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