JP3878871B2 - Multi-piece ceramic substrate - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multi-cavity ceramic substrate in which a large number of small ceramic substrates on which electronic elements such as semiconductor elements, resistors, and capacitors are mounted are manufactured intensively.
[0002]
[Prior art]
In recent years, ceramic substrates on which electronic elements such as semiconductor elements, resistors, and capacitors are mounted have become extremely small in shape as electronic devices become smaller and thinner. Therefore, when electronic components such as semiconductor elements and resistors are mounted on this small ceramic substrate, the small ceramic substrate is small in shape and difficult to handle. A semiconductor element or the like is mounted on each small ceramic substrate in a state of being formed as a multi-piece ceramic substrate.
[0003]
The multi-cavity ceramic substrate is provided with a division groove having a substantially constant width and depth on at least one main surface of a large ceramic mother substrate so that its end is inside the outer periphery of the ceramic mother substrate. The large-sized ceramic mother board is divided into a plurality of sections of a desired size by the dividing grooves, and metallized wiring layers to which electrodes of electronic elements such as semiconductor elements are connected are formed in each section. After mounting an electronic element such as a semiconductor element or a resistor so that its electrode is connected to the metallized wiring layer, a large ceramic mother substrate is bent along the dividing groove, thereby forming a semiconductor A large number of individual small ceramic substrates on which electronic elements such as elements and resistors are mounted are obtained at a time.
[0004]
In addition, such a multi-cavity ceramic substrate is prepared with a ceramic green sheet for a ceramic mother substrate, and at least one main surface of the ceramic green sheet has a constant width and depth by a cutter blade or a mold. It is manufactured by putting incisions for dividing grooves as if dividing each section and firing it at a high temperature.
[0005]
[Problems to be solved by the invention]
However, the conventional multi-cavity ceramic substrate in which a large ceramic mother substrate is divided into a plurality of sections by dividing grooves, the dividing grooves are formed with the same width, so that the side surface and the end surface in the dividing groove are A substantially right angle was formed between them. When a force is applied from the outside, for example, when transporting or mounting an electronic element on the ceramic mother board, the force is applied to a substantially right angle formed between the side surface and the end surface in the dividing groove. Acting in a concentrated manner, the ceramic mother board is inadvertently cracked starting from the corners, and as a result, electronic elements such as semiconductor elements and resistors are accurately and reliably placed on each section of the large ceramic mother board. There was a problem that it was impossible to install.
[0006]
The present invention has been devised in view of such conventional problems, and its purpose is to start from the end of the dividing groove even when an external force is applied during transportation or mounting of an electronic element. As a result, there is provided a multi-cavity ceramic substrate that can be used to accurately and reliably mount semiconductor elements, resistors, and other electronic elements in each section of a large ceramic mother board. There is to do.
[0007]
[Means for Solving the Problems]
The multi-cavity ceramic substrate of the present invention is formed with at least one main surface of a flat ceramic green sheet having a dividing groove that divides the ceramic green sheet into a plurality of sections separated from the outer periphery of the ceramic green sheet. And a plurality of ceramic green sheets obtained by firing a ceramic green sheet for a ceramic mother board in which holes wider than the dividing grooves are formed between both ends of the dividing grooves and the outer periphery. The dividing groove includes a vertical dividing groove and a horizontal dividing groove, and the vertical dividing groove and the horizontal dividing groove are located outside the intersections thereof. The hole extends to a region, and the holes are provided at both ends of the dividing groove that extends to the region .
The multi-cavity ceramic substrate of the present invention is characterized in that the hole is a through hole or a non-through hole.
[0008]
According to the multi-cavity ceramic substrate of the present invention, even if a force is applied from the outside during transportation or mounting of an electronic element, the force is good at the hole formed in communication with the dividing groove. It is possible to effectively prevent the ceramic mother substrate from being inadvertently cracked starting from the end of the dividing groove. Accordingly, electronic elements such as semiconductor elements and resistors can be accurately and reliably mounted on each section of the ceramic mother board.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Next, the present invention will be described in detail with reference to the accompanying drawings. 1 and 2 are a top view and a cross-sectional view, respectively, showing an example of an embodiment of a multi-cavity ceramic substrate according to the present invention. 4 is a hole.
[0010]
The ceramic mother substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a glass-ceramic. It is made of a ceramic material and functions as a base material for manufacturing a large number of small ceramic substrates simultaneously. Then, electronic elements such as semiconductor elements, resistors, and capacitors are mounted on the upper surface of each small ceramic substrate.
[0011]
If the ceramic mother substrate 1 is made of, for example, an aluminum oxide sintered body, a suitable organic binder and solvent, plasticizer, dispersion for ceramic raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide The ceramic slurry obtained by adding and mixing the agent and the like is formed into a sheet shape using a conventionally known doctor blade method to obtain a ceramic green sheet. Thereafter, the ceramic green sheet is appropriately punched and processed. It is manufactured by laminating a plurality of sheets and firing them at a high temperature (about 1500 to 1800 ° C.).
[0012]
In addition, the ceramic mother board 1 has a plurality of divided grooves 2 formed in a lattice pattern on the upper surface thereof so as to divide the ceramic mother board 1 into a plurality of sections, and is formed on the upper and lower surfaces of each section divided by the divided grooves 2. The metallized wiring layer 3 is applied. The metallized wiring layer 3 functions as a conductive path for electrically connecting an electronic element mounted on a small ceramic substrate to an external electric circuit substrate, and is made of metal powder metallization such as tungsten, molybdenum, copper, silver, The metallized paste for the metallized wiring layer 3 is printed and applied to the ceramic green sheet for the ceramic mother substrate 1 by screen printing, and this is fired together with the ceramic green sheet for the ceramic mother substrate 1 so that the upper surface of each section Deposited on the bottom surface. An electronic element is mounted in each compartment so that its electrode is electrically connected to the metallized wiring layer 3, and the ceramic mother substrate 1 is bent along the dividing groove 2, thereby allowing a large number of electrons. The device is manufactured intensively at the same time.
[0013]
The dividing groove 2 formed on the upper surface of the ceramic mother board 1 divides the ceramic mother board 1 into a plurality of sections having a size corresponding to the shape of a desired small ceramic substrate and mounts an electronic element on each section. When the ceramic mother board 1 is bent to form a large number of small ceramic boards, the bending is performed easily and accurately, and both ends thereof are separated from the outer periphery of the ceramic mother board 1. The width is about 0.1 to 1 mm, and the depth is about 0.05 to 1 mm. In addition, such a division | segmentation groove | channel 2 is the upper surface of the ceramic mother board | substrate 1 by pressing the cutter blade and metal mold | die which have a V-shaped cross-section against the ceramic green sheet for ceramic mother board | substrates 1 and making a notch | incision. It is formed in a lattice shape.
[0014]
Further, in the multi-cavity ceramic substrate of the present invention, a substantially circular shape having a width wider than the dividing groove 2 and a depth deeper than the dividing groove 2 between both ends of the dividing groove 2 and the outer periphery of the ceramic mother substrate 1. The hole 4 is formed so as to communicate with the dividing groove 2. This hole 4 acts to relax and disperse the stress applied to both ends of the dividing groove 2 when a force is applied from the outside during transportation or mounting of an electronic element on the ceramic mother substrate 1. Thus, the holes 4 wider than the dividing grooves 2 and deeper than the dividing grooves 2 are formed between both ends of the dividing grooves 2 and the outer periphery of the ceramic mother substrate 1 so as to communicate with the dividing grooves 2. Even when a force is applied from the outside during transportation or mounting of an electronic element on the ceramic mother board 1, the force is well dispersed in the holes 4 formed in communication with the dividing grooves 2. Further, it is possible to effectively prevent the ceramic mother substrate 1 from being carelessly cracked starting from the end portion of the dividing groove 2. Therefore, according to the multi-cavity ceramic substrate of the present invention, electronic elements such as semiconductor elements and resistors can be accurately and reliably mounted on each section of the ceramic mother substrate 1. Such holes 4 are preferably circular in order to satisfactorily disperse the stress applied to both ends of the dividing groove 2, and the width thereof should be at least twice the width of the dividing groove 2. preferable. Further, such holes 4 are formed by punching out substantially circular through holes for the holes 4 in some of the ceramic green sheets for the ceramic mother substrate 1, so that both ends of the dividing grooves 2 and the outer periphery of the ceramic mother substrate 1 are formed. Are formed so as to communicate with the dividing groove 2.
[0015]
Thus, according to the multi-cavity ceramic substrate of the present invention, an electronic element such as a semiconductor element or a resistor is mounted on each section divided by the dividing groove 2 using, for example, an automatic machine, and then along the dividing groove 2. It bends and thereby separates the individual small ceramic substrates as products.
[0016]
It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the above-described embodiment, the division groove 2 and the holes 4 are formed only on the upper surface of the ceramic mother substrate 1, but the dividing grooves 2 and the through holes 4 may be formed on both upper and lower surfaces of the ceramic mother substrate 1. In the above-described embodiment, the hole 4 is a non-through hole, but the hole 4 may be a through hole. Further, in the above-described embodiment, the hole 4 has a substantially circular shape, but the hole 4 may have a substantially rectangular shape or other shapes.
[0017]
【The invention's effect】
According to the multi-cavity ceramic substrate of the present invention, even if a force is applied from the outside during transportation or mounting of an electronic element, the force is good at the hole formed in communication with the dividing groove. It is possible to effectively prevent the ceramic mother substrate from being inadvertently cracked starting from the end of the dividing groove. Accordingly, electronic elements such as semiconductor elements and resistors can be accurately and reliably mounted on each section of the ceramic mother board.
[Brief description of the drawings]
FIG. 1 is a top view showing an example of an embodiment of a multi-cavity ceramic substrate of the present invention.
2 is a cross-sectional view taken along the line XX of the multi-cavity ceramic substrate shown in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Ceramic mother board 2 ... Dividing groove 3 ... Metallized wiring layer 4 ... Hole

Claims (2)

Split grooves that divide the ceramic green sheet into a plurality of sections are formed on at least one main surface of the flat ceramic green sheet so as to be separated from the outer periphery of the ceramic green sheet, and both ends of the split grooves and the A multi-cavity ceramic substrate obtained by firing a ceramic green sheet for a ceramic mother board in which a hole having a width wider than the dividing groove is formed between the outer periphery and the outer periphery ,
The dividing groove includes a vertical dividing groove and a horizontal dividing groove, and the vertical dividing groove and the horizontal dividing groove are extended to a region outside the intersection. A multi-cavity ceramic substrate, wherein the holes are provided at both ends of the dividing groove extending to the region.   The multi-cavity ceramic substrate according to claim 1, wherein the hole is a through hole or a non-through hole.

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