JPH058968U - Three-dimensional molded substrate - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a three-dimensional molded substrate that can easily change a circuit pattern such as circuit interruption and connection even when mounted in a device. [Structure] Substrate 1 having protrusions 3 protruding from one surface
And a conductive circuit pattern 11 formed on the opposite surface of the substrate 1 facing the one surface, and a concave recess 3d beyond the one surface at a position corresponding to the protrusion 3 on the opposite surface. Provided, the circuit pattern 11 extends through the recess, and the recess 3d defines the circuit pattern 11
And the projecting portion 3 crosses the circuit pattern 11
Of these, it can be removed together with the portion corresponding to the depression 3d.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

  The present invention relates to a circuit board mounted inside an electronic device. The present invention relates to a formed three-dimensional molded substrate.

[0002]

[Prior art]

  Conventionally, a circuit pattern is formed on the surface of a flat insulating substrate by copper plating, a rolled copper plate, etc. Formed printed wiring boards are known.

[0003]   On the other hand, a three-dimensional molding in which a circuit pattern is formed on a substrate molded by injection molding or the like. Substrates are known. This type of three-dimensional molded substrate is shown in FIGS. 4 (a), (b), (c) and And the molding method shown in (d).   As shown in FIG. 4A, the substrate 51 is three-dimensionally formed by injection molding, and As shown in b), the entire surface is subjected to etching treatment, catalytic treatment, and electroless copper plating. , Masking and imaging according to the circuit pattern as shown in FIG. Then, as shown in FIG. 4D, electroplating, resist stripping, copper etching, etc. are performed. Will be completed.

[0004]

[Problems to be solved by the device]

  However, in order to shut off a part of the formed circuit in the above-mentioned wiring board, Cut off a part of the conductor that directly forms the circuit pattern, and assemble the switch parts. I had to get in.   On the other hand, to connect a circuit with a conventional printed wiring board, jumper wires, etc. Had to be soldered with the wire.   Therefore, the conventional printed wiring board is mounted in the device and shut off after assembly. It is difficult to connect or connect, it takes man-hours, and it is not economical. It was   Therefore, the technical problem of the present invention is that the circuit is shielded even when it is mounted in the device. To provide a three-dimensional molded substrate that can easily change a circuit pattern such as disconnection and connection. It is in.

[0005]

[Means for Solving the Problems]

  According to the present invention, a substrate having a protrusion protruding from one surface, and the substrate A conductive circuit pattern formed on the opposite surface facing the surface, Is provided with a recess that extends beyond the one surface at a position corresponding to the protrusion, and A turn extends through the recess, the recess traversing the circuit pattern. And the protrusion is taken together with the portion of the circuit pattern corresponding to the depression. A three-dimensional molded substrate is obtained which is characterized in that it can be removed.   According to the present invention, a conductive film is formed on the outer surface of the protrusion. Thus, a three-dimensional molded substrate can be obtained.

[0006]

[Action]

  In the present invention, a conductive protrusion is provided in the circuit on the three-dimensional molded substrate. Therefore, after manufacturing the board and mounting it in the equipment, by breaking this protrusion, The path is cut off, and the circuit is connected by inserting this protrusion into the connection hole. Is possible.

[0007]

【Example】

  Next, an embodiment of the present invention will be described with reference to the drawings.   FIG. 1 is a perspective view showing a part of a three-dimensional molded substrate according to an embodiment of the present invention.   As shown in FIG. 1, a conductive circuit pattern is formed on one surface (back surface in the figure) of the insulating substrate 1. 11a, 11b, 11c and 12a, 12b, 12c are formed, respectively. This Crossing the circuit patterns 11a, 11b, and 11c of FIG. Protrusions 3a, 3b, 3c are provided so as to project to the facing (front surface in the figure) side.   On the other hand, the conductor films 2a, 2b, so as to cover the surfaces of the protrusions 3a, 3b, 3c, 2c are provided respectively. Notch 7 is formed on this protrusion so that it can be broken Has been done. The conductive films 2d, 2e, 2f and 2d 'on the substrate 1 side of the notch 7, 2e ′ and 2f ′ are formed in an arc shape so as to face each other via the protrusion. It   In addition, on the insulating substrate 1, the circuit patterns 12a, 12b formed on one surface, Connection holes 4a, 4b, 4c are formed through the front and back surfaces so as to block 12c. ing. The connection holes 4a, 4b, 4c are arranged such that the opposite edge surface is formed from the inner wall surface of the hole. Arc-shaped conductor films 2i and 2i 'are provided so as to face each other so as to cover.

[0008]   2 (a), (b) and (c) show changes in the circuit pattern of the three-dimensional molded substrate 10 shown in FIG. It is sectional drawing which shows the further operation.   In FIG. 2A, the three-dimensional molded substrate 10 is provided with the protrusion 3 on one surface side, Further, the connection hole 4 is formed. This protrusion 3 has one surface side more than the other surface. A deep recess 3d is formed. A conductor film 2g is formed along the recess 3d. The conductor film 2g forms a part of the circuit pattern 11 formed on one surface. ing. In addition, the connection hole 4 is formed with the conductor films 2i, 2 which are continuous with the circuit pattern 12 on one surface. i ', and the conductor films 2i, 2i' have edges along the hole wall surface to the other surface side, respectively. They are formed so as to face each other so as not to have contact with each other. Fold the protrusion 3 from this state When it is taken, the state shown in FIG.   In FIG. 2 (b), the substrate 1 from which the protrusions 3 have been broken has holes 5 formed therein. It Along the inner wall surface of the hole 5, the conductive film 2h and the conductive films 2d and 2d 'around the hole are formed. It remains in a state of being left. Conductor films 2h and 2h 'are halved in an arc shape on the inner wall surface of the hole. It has a shape of facing each other and has no contacts.   From the state of FIG. 2 (b), fold it off from the lower surface of this hole 5 and from the lower surface of the connection hole 4. When the top of the protruding portion is inserted, the state shown in FIG.   In FIG. 2C, the conductor film 2f is projected by the projection 6 inserted in the hole 5. The conductive film 2a formed on the surface of 6 is connected.   On the other hand, the hole 4 is also formed by the conductor film 2a formed on the surface of the protrusion 6 in the same manner. 2i and 2i are connected to each other.

[0009]   FIG. 3 shows a state where the circuit pattern of the three-dimensional molded substrate shown in FIG. 1 is changed. There is. In FIG. 3, the protrusions 3a, 3b, 3c are broken off, and the conductor pattern 11a and 11b are cut off, and the conductor pattern 11c has the projection 6 By inserting, the connected state is the same as that shown in Fig. 2 (c). It Into the connection hole 4 that cuts off the circuit pattern 12a, the projecting portion 6 that has been cut off is inserted. As a result, the connection is established.   As described above, in the three-dimensional molded substrate according to the embodiment of the present invention, the protrusion is broken off. To insert the protrusion into the formed hole or the preformed connection hole. By doing so, connection becomes possible.

[0010]

[Effect of device]

  As described above, according to the present invention, the conductive protrusion and the connection hole are formed in the circuit. By forming it, you can break off the protrusion or insert it into this connection hole. It is possible to provide a three-dimensional molded substrate that can easily change the road pattern.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an example of a three-dimensional molded substrate of the present invention.

2A to 2D are cross-sectional views sequentially showing how to use the three-dimensionally molded substrate of FIG.

FIG. 3 is a perspective view showing a changed state of a circuit pattern using the three-dimensional molded substrate of FIGS. 1 and 2.

FIG. 4 is a diagram showing a method for manufacturing a three-dimensional molded substrate according to a conventional example.

[Explanation of symbols]

1 substrate 2a conductive film 3 protrusions 3a protrusion 3b protrusion 3c protrusion 3d depression 4 connection holes 5 Hole formed by folding the protrusion 6 Projection after breaking off 10 Three-dimensional molded substrate 11 circuit pattern 12 circuit patterns

Claims (2)

[Scope of utility model registration request] 1. A substrate having a protrusion protruding from one surface, and a conductive circuit pattern formed on the opposite surface of the substrate facing the one surface, the opposite surface corresponding to the protrusion. A recess is formed at a position exceeding the one surface, and the circuit pattern extends through the recess,
The three-dimensionally molded substrate, wherein the depression crosses the circuit pattern, and the protrusion is configured to be removable together with a portion of the circuit pattern corresponding to the depression. 2. The three-dimensional molded substrate according to claim 1, wherein a conductive film is formed on the outer surface of the protrusion.