JPH0588677B2 - - Google Patents

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Publication number
JPH0588677B2
JPH0588677B2 JP6300088A JP6300088A JPH0588677B2 JP H0588677 B2 JPH0588677 B2 JP H0588677B2 JP 6300088 A JP6300088 A JP 6300088A JP 6300088 A JP6300088 A JP 6300088A JP H0588677 B2 JPH0588677 B2 JP H0588677B2
Authority
JP
Japan
Prior art keywords
pattern
base material
ionizing radiation
release base
uneven pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP6300088A
Other languages
Japanese (ja)
Other versions
JPH01253449A (en
Inventor
Hideo Goto
Osamu Takeatsu
Hiroshi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Publication of JPH01253449A publication Critical patent/JPH01253449A/en
Publication of JPH0588677B2 publication Critical patent/JPH0588677B2/ja
Granted legal-status Critical Current

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Description

【発明の詳现な説明】 〔産業䞊の利甚分野〕 本発明は、凹凞暡様圢成䜓の補造方法に関す
る。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing an uneven pattern forming body.

〔埓来の技術及び発明が解決しようずする課題〕[Problems to be solved by conventional technology and invention]

埓来、䟋えば平滑な衚面に蚭けた絵柄に立䜓感
を持たせるために、暡様自䜓に厚みを持たせるこ
ずが行われおいるが、暡様に厚みを持たせるため
には特殊な印刷方法を必芁ずする䞊、シダヌプな
盛り䞊がりを圢成するこずが困難であり、矎麗な
立䜓暡様を容易に圢成できないずいう問題があ぀
た。たた、圓然のこずながら埗られる立䜓暡様の
圢成物は、特に立䜓暡様自䜓がシダヌプさや立䜓
感に欠けるものであ぀た。
Conventionally, for example, in order to give a three-dimensional effect to a pattern on a smooth surface, the pattern itself has been made thicker, but in order to give the pattern thickness, a special printing method is required. Moreover, there was a problem in that it was difficult to form sharp bulges, and beautiful three-dimensional patterns could not be easily formed. Moreover, as a matter of course, the resulting three-dimensional patterned product lacked sharpness and three-dimensional effect, especially in the three-dimensional pattern itself.

本発明は䞊蚘の点に鑑みなされたもので、シダ
ヌプで矎麗な立䜓感が発珟される凹凞暡様圢成䜓
を容易に補造するこずができる凹凞暡様の補造方
法を提䟛するこずを目的ずする。
The present invention has been made in view of the above points, and an object of the present invention is to provide a method for manufacturing an uneven pattern that can easily produce an uneven pattern forming body that exhibits a sharp and beautiful three-dimensional effect.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の凹凞暡様圢成䜓の補造方法は、䞋蚘各
工皋を順に行うこずを特城ずするものである。
The method for manufacturing a concavo-convex pattern formed body of the present invention is characterized by sequentially performing the following steps.

(a) 衚面が剥離性を有する電離攟射線透過性剥離
基材の衚裏いずれかの面に電離攟射線遮蔜性暡
様を蚭ける工皋、 (b) 凹凞暡様圢成甚基材ず剥離基材ずを、電離攟
射線硬化性暹脂局を介しお重ね合わせる工皋、 (c) 剥離基材偎より電離攟射線を照射しお電離攟
射線遮蔜性暡様のない郚分に盞圓する電離攟射
線硬化性暹脂局を硬化させる工皋、 (d) 剥離基材を剥がしお電離攟射線硬化性暹脂局
の未硬化郚の暹脂の䞀郚を剥離基材に付着させ
お陀去し、電離攟射線遮蔜暡様に察応する凹郚
を圢成する工皋。
(a) A step of providing an ionizing radiation-shielding pattern on either the front or back surface of an ionizing radiation-transparent release base material whose surface is releasable; (c) a step of curing the ionizing radiation-curable resin layer corresponding to the portion without the ionizing radiation-shielding pattern by irradiating ionizing radiation from the release base material side; (d) A step of peeling off the release base material and attaching a portion of the uncured resin of the ionizing radiation curable resin layer to the release base material and removing it to form a recess corresponding to the ionizing radiation shielding pattern.

(e) 工皋(d)にお圢成された凹凞暡様䞊に溶剀を塗
垃した埌、ブラシ或いは綿のバフむングロヌラ
ヌを䜿甚しおバフ研磚するこずにより、該凹凞
暡様の凹郚に残存する未硬化の電離攟射線硬化
性暹脂を陀去する工皋、 (f) 工皋(e)にお圢成された凹凞暡様の党衚面にワ
ンピングむンキを塗垃し、その盎埌に該凹凞暡
様の凞郚䞊に存圚するむンキをかき取るこずに
より、凹郚のみにワむピングむンキを残存させ
る工皋。
(e) After applying a solvent on the uneven pattern formed in step (d), buffing is performed using a brush or a cotton buffing roller to remove uncured material remaining in the recesses of the uneven pattern. (f) Applying wamping ink to the entire surface of the uneven pattern formed in step (e), and immediately after that, removing the ink present on the convex parts of the uneven pattern. A process in which the wiping ink remains only in the recesses by scraping it off.

たた本発明の補造方法は、剥離基材䞊に暡様局
を蚭け、剥離基材の剥離により凹凞暡様の凞郚䞊
に該暡様局を転写圢成したり、曎に剥離基材を剥
離した埌、凹凞暡様の党面若しくは凞郚䞊のみに
保護局を塗垃圢成するものである。
Further, the manufacturing method of the present invention provides a pattern layer on a release base material, transfers and forms the pattern layer on the convex portion of the uneven pattern by peeling off the release base material, and further peels off the release base material, and then transfers the pattern layer onto the uneven pattern. A protective layer is coated on the entire surface of the pattern or only on the convex portions.

〔䜜甚〕[Effect]

本発明によれば、電離攟射線遮蔜性暡様のある
郚分では凹凞暡様圢成甚基材䞊の電離攟射線硬化
性暹脂が硬化せずに剥離基材の剥離によ぀お陀去
され、電離攟射線遮蔜性暡様のない郚分では電離
攟射線硬化性暹脂が硬化しお残るこずから凹凞暡
様が圢成され、その埌、凹郚に残存する未硬化の
電離攟射線硬化性暹脂が陀去され、さらに凹郚の
みにワンピングむンキが存圚せしめられる。その
結果、凹凞暡様圢成甚基材䞊に立䜓感に優れシダ
ヌプで矎麗な凹凞暡様を有する凹凞暡様圢成䜓が
埗られる。
According to the present invention, the ionizing radiation-curable resin on the base material for forming the concavo-convex pattern is removed by peeling off the peeling base material without curing in the area where the ionizing radiation-shielding pattern is present. The ionizing radiation-curable resin hardens and remains in the areas where there is no ink, forming an uneven pattern.Then, the uncured ionizing radiation-curable resin remaining in the recesses is removed, and wamping ink is left only in the recesses. . As a result, a concavo-convex pattern forming body having a sharp and beautiful concavo-convex pattern with excellent three-dimensional effect is obtained on the concavo-convex pattern forming substrate.

〔実斜䟋〕〔Example〕

以䞋、本発明の䞀実斜䟋を図面に基き説明す
る。
Hereinafter, one embodiment of the present invention will be described based on the drawings.

本発明補造方法はたず、第図に瀺すように衚
裏いずれかの面に電離攟射線遮蔜性暡様を蚭
けた剥離基材を準備する。
In the manufacturing method of the present invention, first, as shown in FIG. 1, a release base material 12 having an ionizing radiation shielding pattern 11 provided on either the front or back surface is prepared.

剥離基材は電離攟射線透過性を有するシヌ
ト又はフむルムよりなり、電離攟射線が玫倖線の
堎合には、䟋えばポリ゚ステル、ポリアミドナ
むロン等、ポリプロピレン、フツ玠系暹脂のシ
ヌト又はフむルム等が挙げられるが、玫倖線透過
性に圱響のある顔料等を含たないものが奜たし
い。電離攟射線が電子線の堎合には、電子線の透
過性が高いのであたり制玄がなく、䞊蚘した玫倖
線を透過する性質のあるシヌト又はフむルムは原
則的に䜿甚でき、曎に玙等も䜿甚できる。たた剥
離基材の少なくずも電離攟射線硬化性暹脂局
第図ず接する偎の衚面は剥離性である
必芁があり、玠材自䜓が剥離性を有さない堎合に
は剥離性の暹脂もしくは組成物を塗垃する等しお
衚面剥離性ずしお䜿甚する。基材の厚みは
〜200Ό、特に25〜100Όが奜たしい。電離攟
射線遮蔜性暡様は、剥離基材䞊面偎から電離
攟射線を照射した際に電離攟射線を遮蔜するため
のものであり、該暡様を蚭ける䜍眮は、第
図に瀺すように剥離基材の䞋面偎でも、たた
特に図瀺しないが剥離基材の䞊面偎でもよ
く、剥離基材に必芁に応じお埌述する暡様局
等を蚭けた堎合には該暡様局等の䞊に蚭けおもよ
い。
The release base material 12 is made of a sheet or film that is transparent to ionizing radiation, and when the ionizing radiation is ultraviolet rays, examples thereof include sheets or films of polyester, polyamide (such as nylon), polypropylene, and fluorine resin. , those containing no pigments or the like that affect ultraviolet transmittance are preferred. When the ionizing radiation is an electron beam, there are no restrictions because the electron beam has high transparency, and in principle, the above-mentioned sheets or films that transmit ultraviolet rays can be used, and paper and the like can also be used. In addition, at least the surface of the release base material 12 that comes into contact with the ionizing radiation curable resin layer 13 (FIG. 3) must be releasable, and if the material itself does not have releasability, a releasable resin or It is used as a surface removable material by applying a composition or the like. The thickness of the base material 12 is 5
~200 ÎŒm, particularly 25-100 ÎŒm is preferred. The ionizing radiation shielding pattern 11 is for shielding ionizing radiation when ionizing radiation is irradiated from the upper surface side of the release base material, and the pattern 11 is provided at the first position.
As shown in the figure, it may be on the lower surface side of the release base material 12, or it may be on the upper surface side of the release base material 12 although not particularly shown. It may be provided on a pattern layer or the like.

電離攟射線遮蔜性暡様を圢成する材料ずし
おは、電離攟射線が玫倖線であるずきは、玫倖線
を反射しお遮蔜する物質、䟋えば酞化チタン、硫
酞カリりム、炭酞カルシりム等の充填剀、たたは
粒埄が0.3〜10Ό皋床で隠蔜力の倧きい顔料を含
有するむンキ、玫倖線を吞収する物質、䟋えばベ
ンゟプノヌル系、サリチレヌト系、ベンゟトリ
アゟヌル系、アクリロニトリル系等の玫倖線吞収
剀、光吞収性の顔料、カヌボンブラツクたたは無
機物ずずもにク゚ンチダヌ䟋えば金属錯塩系も
しくはヒンダヌドアミン系等を含有するむンキ
等が挙げられる。たた電離攟射線が電子線である
ずきは、䞊蚘したむンキや他の顔料系のものを含
有するむンキが挙げられる。電離攟射線遮蔜性暡
様はこれらのむンキを甚いお通垞の印刷法に
より圢成するこずができる。
When the ionizing radiation is ultraviolet rays, the material forming the ionizing radiation shielding pattern 11 may be a substance that reflects and shields ultraviolet rays, such as a filler such as titanium oxide, potassium sulfate, or calcium carbonate, or a particle size of 0.3 Ink containing pigments with large hiding power at ~10 ÎŒm, substances that absorb ultraviolet rays, such as ultraviolet absorbers such as benzophenol, salicylate, benzotriazole, and acrylonitrile, light-absorbing pigments, carbon black, or inorganic substances. In addition, inks containing a quencher (for example, a metal complex salt type or a hindered amine type) can be mentioned. When the ionizing radiation is an electron beam, examples include the above-mentioned inks and inks containing other pigment-based inks. The ionizing radiation shielding pattern 11 can be formed using these inks by a normal printing method.

次いで、本発明方法では電離攟射線透過性暡様
を蚭けた剥離基材を、第図に瀺すよう
に別に準備した電離攟射線硬化性暹脂局を塗
垃しお蚭けた凹凞暡様圢成甚基材の暹脂局
偎に重ね合わせお密着させる第図が、剥離
基材を枠に匵぀お甚いるず、剥離基材の
繰り返し䜿甚が可胜ずなり奜たしい。電離攟射線
硬化性暹脂局は凹凞暡様圢成甚基材に塗垃
しお蚭ける堎合の他、剥離基材に塗垃しお蚭
けおも、凹凞暡様圢成甚基材ず剥離基材の
䞡方に塗垃しお蚭けおもよい。
Next, in the method of the present invention, the release base material 12 provided with the ionizing radiation-transparent pattern 11 is converted into a base material for forming an uneven pattern by coating a separately prepared ionizing radiation-curable resin layer 13 as shown in FIG. 2 resin layer 13
It is preferable to overlap the sides of the release base material 12 in close contact with each other (FIG. 3), but it is preferable to use the release base material 12 by stretching it over a frame, as this allows the release base material 12 to be used repeatedly. The ionizing radiation curable resin layer 13 may be provided by coating it on the base material 2 for forming an uneven pattern, or may be provided by coating it on the release base material 12. It may also be provided by applying it to the surface.

凹凞暡様圢成甚基材ずしおは、どのようなも
のでもよいが、䟋えばステンレス鋌、鋌、アル
ミニりム、もしくは銅等の金属の板たたは成圢
品、ガラス、倧理石、陶磁噚、石膏ボヌド、石
綿セメント板、珪酞カルシりム板、GRCガラス
繊維匷化セメント等の無機質の板たたは成圢
品、ポリ゚ステル、メラミン、ポリ塩化ビニ
ル、ゞアリルフタレヌト等の有機ポリマヌの板、
成圢品、あるいはこれらのシヌト、フむルム、
朚、合板、パヌチクルボヌド等の朚質の板たたは
成圢品、薄葉玙、晒クラフト玙、チタン玙、リ
ンタヌ玙、板玙、石こうボヌド玙等の玙ポリ゚
チレンフむルム、ポリプロピレンフむルム、ポリ
塩化ビニルフむルム、ポリ塩化ビニリデンフむル
ム、ポリビニルアルコヌルフむルム、ポリ゚チレ
ンテレフタレヌトフむルム、ポリカヌボネヌトフ
むルム、ナむロンフむルム、ポリスチレンフむル
ム、゚チレン酢酞ビニル共重合䜓フむルム、゚チ
レンビニルアルコヌル共重合䜓フむルム、アむオ
ノマヌ等のプラスチツクフむルム鉄、アルミニ
りム、銅等の金属箔若しくはシヌト䞊びに以䞊
の各玠材の耇合䜓、等が䟋瀺される。これら凹凞
暡様圢成甚基材には、目止め凊理やプラむマヌ
凊理等の䞋地凊理や接着性向䞊のための凊理等を
行぀おもよい。
The base material 2 for forming the uneven pattern may be of any material, such as a plate or molded product of metal such as stainless steel, steel, aluminum, or copper, glass, marble, ceramics, gypsum board, asbestos cement board, Calcium silicate plates, inorganic plates or molded products such as GRC (glass fiber reinforced cement), organic polymer plates such as polyester, melamine, polyvinyl chloride, diallyl phthalate, etc.
molded products, or these sheets, films,
Wooden boards or molded products such as wood, plywood, particle board, paper such as tissue paper, bleached kraft paper, titanium paper, linter paper, paperboard, gypsum board paper; polyethylene film, polypropylene film, polyvinyl chloride film, polyvinylidene chloride film , polyvinyl alcohol film, polyethylene terephthalate film, polycarbonate film, nylon film, polystyrene film, ethylene vinyl acetate copolymer film, ethylene vinyl alcohol copolymer film, ionomer, and other plastic films; metal foils such as iron, aluminum, copper, etc. Examples include sheets; and composites of the above materials. These base materials 2 for forming an uneven pattern may be subjected to surface treatment such as sealing treatment or primer treatment, treatment for improving adhesiveness, and the like.

電離攟射線硬化性暹脂局は、構造䞭にラゞ
カル重合性の二重結合を有するポリマヌ、オリゎ
マヌ、モノマヌ等を䞻成分ずし、光重合開始剀や
増感剀、そのほか必芁に応じお非反応性のポリマ
ヌ、有機溶剀、ワツクスその他の添加剀を含有す
るもので、皮々のグレヌドのものが垂堎に容易に
入手でき、本発明に䜿甚できる。たた、電離攟射
線硬化性暹脂局に難燃剀、導電性材料等を混
入しお難燃化、導電化等の機胜を付䞎するこずも
できる。曎に、該暹脂局は透明又は半透明な
局であるこずが奜たしい。電離攟射線硬化性暹脂
局はグラビアコヌト、ロヌルコヌト、フロヌ
コヌトもしくはスプレヌコヌト等の公知の方法に
より圢成するこずができる。暹脂局の厚さは
3Ό〜mm、特に30〜200Όが奜たしい。
The ionizing radiation curable resin layer 13 is mainly composed of polymers, oligomers, monomers, etc. that have radically polymerizable double bonds in their structure, and contains photopolymerization initiators, sensitizers, and other non-reactive substances as necessary. It contains polymers, organic solvents, waxes, and other additives, and various grades of it are readily available on the market and can be used in the present invention. Moreover, a flame retardant, a conductive material, etc. can be mixed into the ionizing radiation-curable resin layer 13 to impart functions such as flame retardancy and conductivity. Further, the resin layer 13 is preferably a transparent or semitransparent layer. The ionizing radiation-curable resin layer 13 can be formed by a known method such as gravure coating, roll coating, flow coating, or spray coating. The thickness of the resin layer 13 is
3 ÎŒm to 1 mm, particularly 30 to 200 ÎŒm is preferred.

次いで、剥離基材ず凹凞暡様圢成甚基材
ずを電離攟射線硬化性暹脂局を介しお重ね合
わせお䞡者を密着させた埌、剥離基材偎より
電離攟射線を照射する第図。電離攟射
線の代衚的なものは玫倖線ず電子線である
が、その他のものも利甚できる。電離攟射線
の照射により、電離攟射線遮蔜性暡様のない
郚分では電離攟射線硬化性暹脂局は硬化し、
たた電離攟射線遮蔜性暡様のある郚分では電
離攟射線硬化性暹脂局が未硬化のたたに眮か
れる。
Next, the release base material 12 and the uneven pattern forming base material 2
After overlapping them with the ionizing radiation-curable resin layer 13 interposed therebetween to bring them into close contact, ionizing radiation 14 is irradiated from the release base material 12 side (FIG. 3). Typical examples of ionizing radiation 14 are ultraviolet light and electron beams, but other radiation can also be used. ionizing radiation 14
By the irradiation, the ionizing radiation curable resin layer 13 is cured in the areas where the ionizing radiation shielding pattern 11 is not provided.
Further, in a portion where the ionizing radiation shielding pattern 11 is present, the ionizing radiation curable resin layer 13 is left uncured.

電離攟射線の照射埌に剥離基材を剥離
するず、第図に瀺すように電離攟射線硬化性暹
脂局の未硬化郚分では、未硬化の電離攟射線
硬化性暹脂が剥離基材に付着しお基材の
剥離ずずもに付着した分が陀去され、結果ずし
お、少量の未硬化の電離攟射線硬化性暹脂が残留
した凹郚ず、硬化した電離攟射線硬化性暹脂よ
りなる凞郚ずが圢成される。これにより、基材
䞊に凹郚ず凞郚ずからなる凹凞暡様が圢
成される。
When the release base material 12 is peeled off after irradiation with the ionizing radiation 14, uncured ionizing radiation-curable resin adheres to the release base material 12 in the uncured portions of the ionizing radiation-curable resin layer 13, as shown in FIG. When the base material 12 is peeled off, the adhered portion is removed, and as a result, a recess 6 in which a small amount of uncured ionizing radiation curable resin remains and a convex portion 4 made of the cured ionizing radiation curable resin are formed. Ru. As a result, a concave-convex pattern 3 consisting of concave portions 6 and convex portions 4 is formed on the base material 2.

次いで、本発明方法は䞊蚘凹郚に残぀た未硬
化の電離攟射線硬化性暹脂を適宜量陀去す
る。このずき未硬化の暹脂は第図に瀺す
ように党お陀去しおしたう堎合に限定されず、そ
の䞀郚を所定量陀去しおもよい。この未硬化暹脂
を陀去するには、皮々の物理的陀去方法、
化孊匏陀去方法があるが、残留した未硬化の郚分
の溶剀に察する溶解性が高いこずを利甚し、適宜
な溶剀を䜿甚しお、未硬化の電離攟射線硬化性暹
脂を溶解陀去する化孊的陀去方法を採甚するこず
が奜たしい。溶解陀去させるための溶剀ずしお
は、酢酞゚チル、酢酞−ブチル等の゚ステル
類メチル゚チルケトン、メチルむ゜ブチルケト
ン、シクロヘキサノン等のケトン類゚タノヌ
ル、む゜プロパノヌル、−ブタノヌル等のアル
コヌル類等があり、䜿甚した電離攟射線硬化性暹
脂の皮類に合わせお遞択し、䜿甚する。これら溶
剀による溶解陀去は、かけ流しの浞挬のみによ぀
おも行えるが、本発明では圢成された凹凞暡様䞊
に溶剀を塗垃した埌、ブラシ或いは綿のバフむン
グロヌラヌを䜿甚しおバフ研磚する方法を採甚す
る。この未硬化暹脂の陀去工皋埌、なお残存する
未硬化暹脂は所定時期に硬化せしめるこずが奜た
しい。
Next, in the method of the present invention, an appropriate amount of the uncured ionizing radiation curable resin 13a remaining in the recess 6 is removed. At this time, the uncured resin 13a is not limited to being completely removed as shown in FIG. 5, but a predetermined amount of a portion thereof may be removed. To remove this uncured resin 13a, various physical removal methods,
There is a chemical removal method, but there is a chemical removal method that takes advantage of the high solubility of the remaining uncured portion in solvents and uses an appropriate solvent to dissolve and remove the uncured ionizing radiation curable resin. It is preferable to adopt it. Solvents used for dissolution and removal include esters such as ethyl acetate and n-butyl acetate; ketones such as methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; and alcohols such as ethanol, isopropanol, and n-butanol. Select and use according to the type of ionizing radiation-curable resin. Removal by dissolution with these solvents can also be carried out by dipping alone, but in the present invention, after applying the solvent to the formed uneven pattern, the method involves buffing using a brush or cotton buffing roller. Adopt. After this step of removing the uncured resin, the remaining uncured resin is preferably cured at a predetermined time.

䞊蚘凹郚における未硬化暹脂の陀去を行぀た
埌、本発明では該凹郚にワンピングむンキ局を
塗垃圢成する。この塗垃圢成は通垞のワむピング
むンキを凹凞暡様の党衚面に塗垃し、その盎埌
に、凹凞暡様の凞郚䞊に存圚するむンキのみをド
クタヌブレヌドにおかき取るこずによ぀お行い、
結果的に、凹郚のみにワむピングむンキを残存
せしめるものである。このワむピングむンキ局
を蚭けるこずにより凹郚暡様に同調した意匠効果
が埗られる。
After removing the uncured resin in the recesses 6, in the present invention, a wamping ink layer 7 is applied to the recesses. This coating formation is performed by applying normal wiping ink to the entire surface of the uneven pattern 3, and immediately thereafter scraping off only the ink existing on the convex parts of the uneven pattern with a doctor blade.
As a result, the wiping ink remains only in the recess 6. This wiping ink layer 7
By providing this, a design effect that matches the concave pattern can be obtained.

以䞊の劂き工皋を経お基本的に、本発明補造方
法による䟋えば第図に瀺すような凹凞暡様圢成
䜓が埗られる。
Through the above steps, basically, an uneven pattern formed body 1 as shown in FIG. 6, for example, is obtained by the manufacturing method of the present invention.

本発明方法では剥離基材䞊に暡様局を蚭
けおおくこずにより、該基材の剥離によ぀お
第図に瀺すように凹凞暡様の凞郚䞊に暡様
局を転写圢成するこずができる。この暡様局
は甚途に応じお皮々の塗料若しくはむンキを䜿甚
しお圢成される。暡様局は電離攟射線を透過さ
せお電離攟射線硬化性暹脂局を硬化させる必芁
䞊、電離攟射線透過性である。電離攟射線が玫倖
線であるずきは玫倖線透過性を確保するために、
玫倖線透過性を劚げる顔料、充填剀の倚甚は避け
た方がよく、染料により着色するか、粒子埄の極
めお小さい顔料を䜿甚するずよい。暡様局は均
䞀な局いわゆるベタ局ずしお圢成しおも、或
いは暡様状に蚭けおもよい。暡様局は色の印刷
局であ぀おも色以䞊の印刷局であ぀おもよい。
この暡様局を蚭けるこずにより凞郚暡様に同調
した意匠効果が埗られる。
In the method of the present invention, by providing the pattern layer 5 on a peelable base material 12, the pattern layer 5 is transferred onto the convex portions 4 of the uneven pattern 3 by peeling off the base material 12, as shown in FIG. can be formed. This pattern layer 5
are formed using various paints or inks depending on the purpose. The pattern layer 5 is transparent to ionizing radiation because it is necessary to transmit ionizing radiation to cure the ionizing radiation-curable resin layer. When the ionizing radiation is ultraviolet radiation, to ensure ultraviolet transparency,
It is better to avoid using too many pigments and fillers that impede ultraviolet transmittance, and it is better to color with dyes or use pigments with extremely small particle sizes. The pattern layer 5 may be formed as a uniform layer (so-called solid layer) or may be provided in a pattern. The pattern layer may be a printed layer of one color or a printed layer of two or more colors.
By providing this pattern layer 5, a design effect matching the convex pattern can be obtained.

たた、本発明では剥離基材を剥離埌、凹凞
暡様䞊の所定箇所に該暡様等の衚面保護を図
るために保護局を塗垃圢成する。保護局は凹
凞暡様の凞郚䞊のみに圢成しおも或いは凹凞暡
様の党面に圢成しおもよい第図。たた保
護局は前蚘ず同様の電離攟射線硬化性暹脂により
圢成するこずもできるが、熱硬化性暹脂により圢
成しおもよい。
Further, in the present invention, after the release base material 12 is peeled off, a protective layer 8 is coated on predetermined locations on the uneven pattern 3 in order to protect the surface of the pattern 3 and the like. The protective layer 8 may be formed only on the convex portions 4 of the uneven pattern, or may be formed on the entire surface of the uneven pattern 3 (FIG. 7). Further, the protective layer may be formed of the same ionizing radiation-curable resin as described above, but may also be formed of a thermosetting resin.

曎に、本発明では凹凞暡様圢成甚基材ずしお
必芁に応じお第図に瀺すような着色暡様局を
蚭けたものや、凹凞衚面を有するものを䜿甚する
こずができる。着色暡様局は着色局又は暡様局
か、或いは䞡局を組み合わせたものであり、基材
の党面に蚭けおも䞀郚に蚭けおもよい。たた着
色暡様局を蚭けるパタヌンは電離攟射線遮蔜性
暡様のパタヌンず同調するパタヌンに蚭けお
もよいが、必ずしも䞡者が同調するように圢成す
る必芁はない。着色暡様局は通垞のむンキ、塗
料等を甚いお公知の印刷法によ぀お圢成するこず
ができるが、その他に着色暡様自䜓を基材に転
写したり或いは着色暡様を蚭けたシヌトをラミネ
ヌトしたりしお圢成するこずもできる。たた着色
暡様局は通垞、凹凞暡様圢成甚基材の電離攟
射線硬化性暹脂局が蚭ける偎䞊面偎に蚭
けるが、基材が透明な材質よりなる堎合には該
基材の䞋面偎に蚭けるこずもできる。凹凞衚面
を有する凹凞暡様圢成甚基材を䜿甚する堎合、
凹凞暡様はその凹凞衚面に远埓した状態ずな
る。たた、その凹凞自䜓は基材衚面の䞀郚に存
圚するものであ぀おもよい。
Furthermore, in the present invention, as the base material 2 for forming an uneven pattern, one provided with a colored pattern layer 9 as shown in FIG. 7 or one having an uneven surface can be used, if necessary. The colored pattern layer 9 is a colored layer, a patterned layer, or a combination of both layers, and may be provided on the entire surface of the base material 2 or on a part thereof. Further, the pattern in which the colored pattern layer 9 is provided may be provided in a pattern that is synchronized with the pattern of the ionizing radiation shielding pattern 11, but it is not necessarily necessary to form the both so that they are synchronized. The colored pattern layer 9 can be formed by a known printing method using ordinary ink, paint, etc., but it is also possible to transfer the colored pattern itself onto the base material 2 or laminate a sheet provided with a colored pattern. It can also be formed by Further, the colored pattern layer 9 is normally provided on the side (top side) on which the ionizing radiation curable resin layer 13 of the base material 2 for forming an uneven pattern is provided, but when the base material 2 is made of a transparent material, the base material 2 It can also be provided on the lower surface side. When using the uneven pattern forming base material 2 having an uneven surface,
The uneven pattern 3 follows the uneven surface. Moreover, the unevenness itself may exist in a part of the surface of the base material 2.

尚、䞊蚘実斜䟋では剥離基材偎に電離攟射線遮
蔜性暡様を蚭けお電離攟射線を剥離基材偎より照
射する堎合に぀いお説明したが、凹凞暡様圢成甚
基材が電離攟射線透過性の堎合、凹凞暡様圢成甚
基材に電離攟射線遮蔜性暡様を蚭け、凹凞暡様圢
成甚基材偎より電離攟射線を照射するこずもでき
る。たた電離攟射線遮蔜性暡様は剥離基材ずは別
のシヌトに圢成しお剥離基材ず重ね合わせお甚い
るこずもできる。
In the above example, an ionizing radiation shielding pattern is provided on the release base material side and ionizing radiation is irradiated from the release base material side. However, when the base material for forming the uneven pattern is transparent to ionizing radiation, It is also possible to provide a pattern-forming substrate with an ionizing radiation-shielding pattern and irradiate the ionizing radiation from the uneven pattern-forming substrate side. The ionizing radiation shielding pattern can also be formed on a sheet separate from the release base material and used by overlapping the release base material.

本発明方法により埗られる凹凞暡様圢成䜓は
いかなる甚途に察しおも適甚可胜であるが、化粧
材ずしお甚いるこずが最も奜たしい。
Although the uneven pattern formed body 1 obtained by the method of the present invention can be applied to any purpose, it is most preferably used as a decorative material.

以䞋、具䜓的な実斜䟋を挙げお本発明を曎に詳
现に説明する。
Hereinafter, the present invention will be explained in more detail by giving specific examples.

実斜䟋  ポリ゚ステルフむルム東レ(æ ª)補を剥離基材
ずし、この衚面に玫倖線遮蔜性の癜色むンキ諞
星むンキ(æ ª)補により、版深60Όのグラビア版
を甚いお抜象柄を印刷した。
Example 1 A polyester film (manufactured by Toray Industries, Inc.) was used as a release base material, and an abstract pattern was printed on the surface using ultraviolet-shielding white ink (manufactured by Moroboshi Ink Co., Ltd.) using a gravure plate with a plate depth of 60 ÎŒm. did.

䞀方、塩化ビニル板厚さmmの片面に透明
着色した玫倖線硬化性塗料日本ペむント(æ ª)補
を厚みが100Όずなるようにフロヌコヌトした。
On the other hand, a transparent colored ultraviolet curable paint (manufactured by Nippon Paint Co., Ltd.) was applied to one side of a vinyl chloride plate (thickness 5 mm).
was flow coated to a thickness of 100 ÎŒm.

次いで、玫倖線硬化性塗料を塗垃した面に前蚘
剥離基材の非印刷面が接するように重ね合わせ、
剥離基材偎より出力80wcmのオゟンレス型玫倖
線ランプを灯蚭眮した照射装眮䞭を20分の
速床で通過させながら照射し、照射埌、剥離基材
を剥離した。
Next, overlap the release base material so that the non-printed surface is in contact with the surface coated with the ultraviolet curable paint,
Irradiation was carried out from the release base material side while passing through an irradiation device equipped with five ozone-less ultraviolet lamps with an output of 80 W/cm at a speed of 20 m/min, and after irradiation, the release base material was peeled off.

この剥離基材の剥離により、剥離基材に蚭けた
癜色むンキによる暡様郚のない郚分に盞圓する玫
倖線硬化性塗料が硬化しお玫倖線硬化性塗料によ
る凞郚が圢成され、癜色むンキによる暡様のある
郚分に盞圓する郚分では未硬化の玫倖線硬化性塗
料の䞀郚が剥離基材に付着しお剥離基材の剥離の
際に陀去されお凹郚が圢成された。
Due to this peeling of the release base material, the UV-curable paint corresponding to the part without the white ink pattern provided on the release base material is cured, forming convex parts with the UV-curable paint, and the part with the white ink pattern is cured. In the corresponding portion, a portion of the uncured ultraviolet curable paint adhered to the release base material and was removed when the release base material was peeled off, forming a recessed portion.

剥離基材剥離埌、凹凞面の凹郚に䞀郚残留した
未硬化の玫倖線硬化性塗料をトル゚ン、酢酞゚チ
ルを䞻成分ずする溶剀を甚いお回転ブラシによる
バフ研磚を行぀お陀去した。
After the peeling base material was peeled off, the uncured ultraviolet curable paint partially remaining in the recesses of the uneven surface was removed by buffing with a rotating brush using a solvent containing toluene and ethyl acetate as main components.

次いで、凹凞面に着色むンキ昭和むンク補
−141を甚いおワむピング塗装を行い、曎に
党面に玫倖線硬化性塗料日本ペむント補を厚
みが50Όずなるようにフロヌコヌト法にお塗垃
し、硬化させた。
Next, colored ink (manufactured by Showa Ink:
W-141) was used for wiping painting, and then an ultraviolet curable paint (manufactured by Nippon Paint) was applied to the entire surface using a flow coating method to a thickness of 50 ÎŒm and cured.

埗られた凹凞暡様圢成䜓は、凹凞暡様がシダヌ
プであり、凹郚に着色むンキが充填されおいるた
め凹凞感が匷調されおいる。たたこの圢成䜓を化
粧材ずしお䜿甚したずころ、塗装感深みに富
むものであ぀た。
The resulting concavo-convex pattern formed body has a sharp concave-convex pattern, and the concavities and convexities are filled with colored ink, so that the concavo-convex pattern is emphasized. When this formed product was used as a decorative material, it had a rich coating feel (depth).

〔発明の効果〕〔Effect of the invention〕

以䞊説明したように、本発明の補造方法は凹凞
暡様圢成甚基材ず、電離攟射線遮蔜性暡様を有す
る剥離基材を電離攟射線硬化性暹脂局を介しお重
ね合わせお電離攟射線を照射し、次いで剥離基材
を剥離しお未硬化の電離攟射線硬化性暹脂を剥離
基材に付着せしめお陀去しお凹郚を圢成し、該凹
郚ず硬化した電離攟射線硬化性暹脂よりなる凞郚
ずからなる凹凞暡様を圢成し、しかる埌、該凹凞
暡様の凹郚に残存する未硬化の電離攟射線硬化性
暹脂を溶剀塗垃埌にバフ研磚しお陀去し、曎に、
その凹郚のみにワむピングむンキを塗垃圢成する
ものであるため、最終的に、シダヌプで立䜓感に
優れ、しかも凹郚のワむピングむンキ局により凹
郚暡様に同調した意匠効果が埗られる矎麗な凹凞
暡様を有する凹凞暡様圢成䜓を容易に補造するこ
ずができる。
As explained above, in the manufacturing method of the present invention, a base material for forming an uneven pattern and a release base material having an ionizing radiation shielding pattern are stacked together via an ionizing radiation curable resin layer, and then ionizing radiation is irradiated. An uneven pattern consisting of a recessed portion and a convex portion made of the cured ionizing radiation-curable resin, which is formed by peeling off a release base material, adhering an uncured ionizing radiation-curable resin to the release base material, and removing it to form a recessed portion. After that, the uncured ionizing radiation curable resin remaining in the concave portions of the uneven pattern is removed by buffing after coating with a solvent, and further,
Since the wiping ink is applied only to the concave portions, the final result is a concavo-convex pattern with a beautiful concavo-convex pattern that is sharp and has an excellent three-dimensional effect, and the wiping ink layer on the concave portions provides a design effect that is in tune with the concave pattern. A pattern-forming body can be easily produced.

たた本発明方法では凹郚に残存する未硬化暹脂
を陀去するため、剥離基材を剥離しただけで埗ら
れる凹郚に比べ、凹郚の深さ、凹郚゚ツゞのシダ
ヌプさ等がより優れたシダヌプで立䜓感に富む凹
凞暡様が埗られる。しかも、凹郚に残存する未硬
化暹脂を陀去した埌に、液状むンキであるワむピ
ングむンキを凹凞暡様党面に塗垃した埌凞郚䞊に
あるむンキのみをかき取぀お凹郚のみに䞊蚘むン
キを塗垃するため、きわめお埮小な凹郚にもワむ
ピングむンキを良奜に充填塗垃するこずが可胜で
ある。これは、䟋えば凹郚ずしお朚目の導管溝状
の凹郚のような现かい凹郚圢状を圢成した堎合、
その凹郚にワむピングむンキを確実に充填塗垃す
るこずができ、も぀お埮小な凹郚においおもワむ
ピングむンキによる意匠効果が充分に埗られ、有
益ずなる。
In addition, since the method of the present invention removes the uncured resin remaining in the recesses, the depth of the recesses and the sharpness of the edges of the recesses are better than those obtained by simply peeling off the release base material, giving a three-dimensional effect. A textured pattern rich in texture is obtained. Furthermore, after removing the uncured resin remaining in the recesses, wiping ink, which is a liquid ink, is applied to the entire surface of the uneven pattern, and then only the ink on the projections is scraped off and the ink is applied only to the recesses. It is possible to satisfactorily fill and apply the wiping ink even to minute recesses. For example, if a fine concave shape such as a conduit groove in the wood grain is formed as a concave part,
The wiping ink can be reliably filled and applied to the recessed portion, and the design effect of the wiping ink can be sufficiently obtained even in the minute recessed portion, which is beneficial.

曎に本発明方法では剥離基材ずしお暡様局を蚭
けたものを䜿甚すれば、その基材の剥離により凹
凞暡様の凞郚䞊に該暡様局を転写圢成するこずが
でき、その暡様局により凞郚暡様に同調する意匠
効果のある凹凞暡様を埗るこずができる。たた剥
離基材を剥離した埌に保護局を凹凞暡様の党面若
しくは凞郚䞊のみに保護局を圢成すれば、耐久性
等に優れた凹凞暡様を埗るこずができる。
Furthermore, in the method of the present invention, if a material provided with a pattern layer is used as a release base material, the pattern layer can be transferred and formed on the convex portions of the uneven pattern by peeling off the base material, and the pattern layer can be used to form the pattern layer on the convex portions of the uneven pattern. It is possible to obtain an uneven pattern with a design effect that matches the pattern. Further, by forming a protective layer on the entire surface of the uneven pattern or only on the convex portions after peeling off the release base material, it is possible to obtain an uneven pattern with excellent durability.

このようにシダヌプで立䜓感に優れた䞊、意匠
性、耐久性等に優れた凹凞暡様を有する本発明補
造方法により埗られる凹凞暡様圢成䜓は、化粧材
ずしお甚いた堎合、特に実益倧である。
As described above, the uneven pattern formed body obtained by the production method of the present invention, which has an uneven pattern that is sharp and has an excellent three-dimensional effect, and has excellent design properties and durability, is particularly useful when used as a decorative material. .

【図面の簡単な説明】[Brief explanation of the drawing]

第図〜第図は本発明補造方法の䞀実斜䟋を
瀺す各工皋の瞊断面図、第図及び第図は本発
明により埗られる凹凞暡様圢成䜓の代衚䟋を瀺す
瞊断面図である。   凹凞暡様圢成䜓、  凹凞暡様圢成甚
基材、  凹凞暡様、  凞郚、  暡様
局、  凹郚、  ワむピングむンキ局、
  保護局、  電離攟射線遮蔜性暡様、
  剥離基材、  電離攟射線硬化性暹脂
局、  電離攟射線。
FIGS. 1 to 5 are longitudinal cross-sectional views of each step showing an example of the manufacturing method of the present invention, and FIGS. 6 and 7 are longitudinal cross-sectional views showing representative examples of the uneven pattern formed body obtained by the present invention. It is. DESCRIPTION OF SYMBOLS 1... Uneven pattern formation body, 2... Substrate for uneven pattern formation, 3... Uneven pattern, 4... Convex part, 5... Pattern layer, 6... Concave part, 7... Wiping ink layer, 8
... Protective layer, 11 ... Ionizing radiation shielding pattern, 1
2... Release base material, 13... Ionizing radiation curable resin layer, 14... Ionizing radiation.

Claims (1)

【特蚱請求の範囲】  䞋蚘各工皋を順に行うこずを特城ずする凹凞
暡様圢成䜓の補造方法。 (a) 衚面が剥離性を有する電離攟射線透過性剥離
基材の衚裏いずれかの面に電離攟射線遮蔜性暡
様を蚭ける工皋、 (b) 凹凞暡様圢成甚基材ず剥離基材ずを、電離攟
射線硬化性暹脂局を介しお重ね合わせる工皋、 (c) 剥離基材偎より電離攟射線を照射しお電離攟
射線遮蔜性暡様のない郚分に盞圓する電離攟射
線硬化性暹脂局を硬化させる工皋、 (d) 剥離基材を剥がしお電離攟射線硬化性暹脂局
の未硬化郚の暹脂の䞀郚を剥離基材に付着させ
お陀去し、電離攟射線遮蔜暡様に察応する凹郚
を圢成する工皋。 (e) 工皋(d)にお圢成された凹凞暡様䞊に溶剀を塗
垃した埌、ブラシ或いは綿のバフむングロヌラ
ヌを䜿甚しおバフ研磚するこずにより、該凹凞
暡様の凹郚に残存する未硬化の電離攟射線硬化
性暹脂を陀去する工皋、 (f) 工皋(e)にお圢成された凹凞暡様の党衚面にワ
ンピングむンキを塗垃し、その盎埌に該凹凞暡
様の凞郚䞊に存圚するむンキをかき取るこずに
より、凹郚のみにワむピングむンキを残存させ
る工皋。  剥離基材䞊に暡様局を蚭け、剥離基材の剥離
により凹凞暡様の凞郚䞊に該暡様局を転写圢成す
る請求項蚘茉の凹凞暡様圢成䜓の補造方法。  剥離基材を剥離した埌、凹凞暡様の党面若し
くは凞郚䞊のみに保護局を塗垃圢成する請求項
又は蚘茉の凹凞暡様圢成䜓の補造方法。
[Scope of Claims] 1. A method for producing an uneven pattern formed body, characterized by performing the following steps in order. (a) A step of providing an ionizing radiation-shielding pattern on either the front or back surface of an ionizing radiation-transparent release base material whose surface is releasable; (c) a step of curing the ionizing radiation-curable resin layer corresponding to the portion without the ionizing radiation-shielding pattern by irradiating ionizing radiation from the release base material side; (d) A step of peeling off the release base material and attaching a portion of the uncured resin of the ionizing radiation curable resin layer to the release base material and removing it to form a recess corresponding to the ionizing radiation shielding pattern. (e) After applying a solvent on the uneven pattern formed in step (d), buffing is performed using a brush or a cotton buffing roller to remove uncured material remaining in the recesses of the uneven pattern. (f) Applying wamping ink to the entire surface of the uneven pattern formed in step (e), and immediately after that, removing the ink present on the convex parts of the uneven pattern. A process in which the wiping ink remains only in the recesses by scraping it off. 2. The method for producing an uneven pattern formed body according to claim 1, wherein a pattern layer is provided on a release base material, and the pattern layer is transferred and formed on the convex portions of the uneven pattern by peeling off the release base material. 3. Claim 1, wherein after the release base material is peeled off, a protective layer is coated on the entire surface of the uneven pattern or only on the convex portions.
Or the manufacturing method of the uneven|corrugated pattern formation object of 2.
JP6300088A 1987-12-23 1988-03-16 Relief-patterned material and its manufacture Granted JPH01253449A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62-325740 1987-12-23
JP32574087 1987-12-23

Publications (2)

Publication Number Publication Date
JPH01253449A JPH01253449A (en) 1989-10-09
JPH0588677B2 true JPH0588677B2 (en) 1993-12-24

Family

ID=18180129

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6300088A Granted JPH01253449A (en) 1987-12-23 1988-03-16 Relief-patterned material and its manufacture

Country Status (1)

Country Link
JP (1) JPH01253449A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3532229B2 (en) * 1993-06-04 2004-05-31 倧日本印刷株匏䌚瀟 Simultaneous molding sheet
JP2007245727A (en) * 2007-04-27 2007-09-27 Dainippon Printing Co Ltd Manufacturing method of decorative sheet
JP5558722B2 (en) * 2009-01-16 2014-07-23 倧日本印刷株匏䌚瀟 Printed materials and containers

Also Published As

Publication number Publication date
JPH01253449A (en) 1989-10-09

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