JPH0587980B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a bonding apparatus, and more particularly to a bonding apparatus in which a bonding tool is lowered to press a chip and a lead wire together.

``Prior Art'' Conventionally, a bonding device has been equipped with a lifting block provided on a base block so as to be able to rise and fall freely, a bonding tool provided on this lifting block, and a lifting mechanism provided on the base block to raise and lower the lifting block. There is known a device in which a bonding tool is lowered together with the lifting block to press the chip and the lead wire together (Japanese Utility Model Publication No. 57-56513).

"Problems to be Solved by the Invention" In the bonding apparatus having the above configuration, when the lifting block is lowered by the lifting mechanism and the lead wire and the chip are crimped by the bonding tool, the lifting block is lowered from the bonding tool. A reaction force is applied to the base block via the block and the lifting mechanism.

As a result, the part of the base block where the above-mentioned elevating mechanism is provided becomes easily distorted, and since the above-mentioned elevating block is provided in this part, the deformation causes the pressing surface of the bonding tool, the above-mentioned lead wire and chip to become distorted. The parallelism between the chip and the pressure contact surface tends to be distorted, and there is a risk that the chip and the lead wire cannot be evenly pressed together, resulting in poor adhesion.

``Means for Solving the Problems'' In view of such circumstances, the present invention is designed to enable, even if the portion of the base block provided with the lifting mechanism is distorted, the influence of the distortion to be transmitted to the lifting block. The present invention provides a bonding device that can prevent the damage from occurring, thereby ensuring uniform crimping of the chip and lead wires at all times.

That is, in the bonding apparatus described above, the present invention includes a swing frame that is swingably attached to the base block, and a lifting block that is provided on the swing frame so as to be able to rise and fall, so that the lifting block floats relative to the base block. The base block is vertically supported, and the lifting block is raised and lowered by a lifting mechanism provided on the base block.

"Function" According to the above structure, even if the part of the base block where the lifting mechanism is provided is distorted when the lead wire and the chip are crimped with the bonding tool, the lifting block can swing against the base block. Since it is floatingly supported by a swinging frame attached to the base block, the adverse effects of the above distortion can be reduced compared to when the lifting block is provided directly on the base block so that it can be raised and lowered freely. The chip and the lead wire can be crimped uniformly and well at all times.

"Example" The present invention will be described below with reference to the illustrated example.
In FIG. 1, a bonding device 1 is configured to sequentially press contact portions 3a of chips 3 such as semiconductors to lead wires 2b of adhesive portions 2a provided at predetermined intervals in the longitudinal direction of the tape 2 at a bonding position A. (See Figures 3 and 4).

As shown in FIGS. 3 and 4, the tape 2 has rectangular openings 2 formed at predetermined intervals in the longitudinal direction.
c, and a required number of lead wires 2b provided in advance on the four sides of each opening 2c, and each opening 2c and lead wire 2b constitute the adhesive portion 2a. In addition, engagement holes 2d are formed at equal intervals in the longitudinal direction on both sides of the tape 2, and the engagement claws of the claw sprocket 4 shown in FIG. 1 are engaged with the engagement holes 2d. The sprocket 4 is intermittently rotated by a predetermined angle by a stepping motor 5, and the tape 2 is applied at each pitch of the adjacent adhesive portion 2a.
We are now able to move forward.

The tape 2 is wound around a supply reel 7 provided in a tape storage section 6, and is intermittently drawn out via a plurality of idle rollers 8 and tension rollers 9. Lead wires 2 provided at each adhesive portion 2a of the tape 2 are placed on the transport path of the tape 2 before it is pulled out to the adhesive position A.
A detector (not shown) is provided to detect the suitability of the tape storage section 6, and the detection results of this detector are inputted to a control device 10 housed below the tape storage section 6.

If the detector detects that the lead wire 2b is defective, the control device 10 increases the amount of rotation of the sprocket 4 by the stepping motor 5, and removes the defective adhesive portion 2a.
is made to pass through without stopping at the bonding position A.

As shown in FIGS. 1 and 2, the above bonding position A
Below is the adhesive part 2 stopped at the adhesive position A.
A chip supply mechanism 11 for supplying chips 3 is provided directly below a. This chip supply mechanism 11
After moving the support table 12 on which the chip 3 is placed to a position directly below the bonding position A, the support table 12 is raised to a predetermined height position, thereby attaching the chip 3 to the bonding part 2a. They can be placed in close proximity. Since such a chip supply mechanism 11 is already known, a detailed explanation thereof will be omitted.

A video camera 13 is installed above the bonding position A, and the video camera 13 displays images on a monitor 14 to see if the lead wire 2b of the tape 2 and the chip 3 are located in the correct positions relative to each other. It is now possible to check. If lead wire 2b
If the contact portion 3a of the tip 3 is misaligned, the operator moves the support table 12 that supports the tip 3 in a horizontal plane by operating an operating lever (not shown), and thereby The lead wire 2b and the chip 3 can be adjusted to the correct position.

Further, a bonding tool 16 operated by a drive mechanism 15 is provided above the bonding position A and below the video camera 13. The bonding tool 16 is moved back from the position directly above the bonding position A by the drive mechanism 15 when the position of the lead wire 2b and the chip 3 is inspected by the video camera 13, and when the inspection by the video camera 13 is completed. The lead wire 2b of the bonding part 2a is advanced to a position directly above the bonding position A, and is further lowered.
is pressed onto the chip 3 supported by the support table 12 (see FIGS. 3 and 4).

This bonding tool 16 is provided with a heater (not shown), and the lead wire 2 is heated by the heat of the heater.
Each contact part 3 of the chip 3 by heating b
A lead wire 2b can be attached to each of the leads 2b.

After bonding the chip 3 to the lead wire 2b in this manner, the bonding tool 16 is raised by the drive mechanism 15 and retreated to its original position, and the tape 2 is advanced one pitch to bond a new bonding portion 2a. While being carried into position A,
A new chip 3 is carried to the bonding position A by the chip supply mechanism 11, and the same operation is repeated.

On the other hand, each bonded portion 2a to which the chip 3 is bonded is
As the sprocket wheel 4 rotates, the tape 2 is sequentially transferred to the cutting mechanism 17, and the cutting mechanism 17 cuts the tape 2 after, for example, four bonded parts 2a have passed through. The tape strips 2 cut at predetermined positions are sequentially stored in the magazine 18.

However, the drive mechanism 15 is shown in FIGS. 5 to 7.
As shown in the figure, it is provided on a box-shaped frame 24 disposed on one side of the adhesion position A of the tape 2 (see FIG. 6), and the flat upper surface of this frame 24 is arranged so that the conveyance direction of the tape 2 is A guide groove 24a is formed in the orthogonal direction, and a rectangular base block 25 is slidably attached to the guide groove 24a.

As shown in FIG. 7, the base block 25
A piston rod 26a of a cylinder device 26 attached to the frame 24 is connected to a protrusion 25a provided in the frame 24, and the base block 25 can be moved forward and backward along the guide groove 24a of the frame 24 by the cylinder device 26. I'm trying to make it possible.

Also, a stopper portion 2 is attached to the base block 25.
5b is formed protrudingly from the base block 25.
When the base block 25 is positioned at the forward end position, the stopper part 25 is brought into contact with a shock absorber 27 provided on the frame 24 just before the base block 25 is positioned at the forward end position, so that the base block 25 can be stopped smoothly.

When the base block 25 is inspected by the video camera 13 mentioned above, it is located in the retracted position shown by the solid line in FIGS. When the bonding tool 16 is moved forward to this point, the bonding tool 16 provided in front of the base block 25 can be moved to a position directly above the bonding position A. Further, as shown in FIG. 7, the frame 2
A recess 24b is formed in the center of the front surface of 4.
When the base block 25 is placed in the retracted position, the bonding tool 16 is attached to the frame 24.
I am careful not to come into contact with it.

On the upper surface of the base block 25, as shown in FIG.
A bracket 28 is attached to the right end in FIG. 7, and the right end of the first swing frame 29 is swingably attached to the bracket 28 via a horizontal first support shaft 30. By providing the bonding tool 16 at the left end portion 29a of the first swing frame 29, the first swing frame 29 swings about the axis of the first support shaft 30, and the bonding tool 16 The vertical direction, that is, the axial direction, can be adjusted within the plane of the paper of FIG.

The first swing adjustment mechanism 31 that adjusts the swing angle of the first swing frame 29 is configured to adjust the swing angle of the first swing frame 29.
A pair of left and right through holes 29b are bored in the first swing frame 29 adjacent to the tip end 29a of the base block 25, and a through hole 29b is provided upright on the upper surface of the base block 25 and is loosely fitted into each through hole 29b. A pair of pins 32
A coil spring 33 is elastically mounted between the head of each pin 32 and the first swing frame 29, and the elastic force of each coil spring 33 causes the first
The swing frame 29 is biased counterclockwise in FIG.

Further, as shown in FIGS. 6 and 8, a cylindrical member 35 is fixed closer to the tip end 29a than the through hole 29b, and the upper threaded portion 36a of the adjustment screw 36 is screwed into this cylindrical member 35. ing. A lower threaded portion 36b is formed at the lower end of the adjustment screw 36, and the lower threaded portion 36b is screwed into the abutment member 37 slidably fitted into the cylindrical member 35, and the abutment member The lower end portion of the slide frame 37 is brought into contact with a contact portion 25c protruding from the slide frame 25.

Therefore, the first swing frame 29 is urged counterclockwise in FIG. 6 by the coil spring 33, and the contact member 37 contacts the contact portion 25c of the slide frame 25. It will stop in this state.

Furthermore, a projection 37a is provided on the outer periphery of the abutment member 37.
This protrusion 37a is formed to protrude from the cylindrical member 3.
By engaging with the slit 35a formed in the axial direction of the adjusting screw 36, the corresponding contact member 37 is prevented from rotating as the adjusting screw 36 rotates.

The upper threaded part 36a and the lower threaded part 36b are screwed in the same direction, but for example, the pitch of the upper threaded part 36a is 2 mm, and the lower threaded part 36b is
By setting the pitch of 1.75 mm, when the adjustment screw 36 is rotated once, the contact member 37
0.25mm of the above pitch difference with respect to the swing frame 29
It is designed so that it can be raised and lowered only.

That is, when the adjusting screw 36 is rotated once in the direction in which the adjusting screw 36 descends relative to the first swinging frame 29, the adjusting screw 36 descends by 2 mm relative to the first swinging frame 29. become. On the other hand, when the adjusting screw 36 is rotated once, the abutting member 37 is raised by 1.75 mm relative to the adjusting screw 36, so the abutting member 37 is lowered by 0.25 mm relative to the first swing frame 29. will be done.

Therefore, by rotating the adjusting screw 36, the first swinging frame 29 can be slightly swung, thereby allowing the bonding tool 16 to swing slightly.
can be easily and precisely positioned at a desired position in the paper plane of FIG. 6 in the axial direction.

Next, a second swing frame 41 is swingably attached to the left end portion 29a of the first swing frame 29, and the bonding tool 1 is attached to a lifting block 42 provided on the second swing frame 41 so as to be able to rise and fall freely.
6 is fixed. The second swing frame 41
is swingably mounted via a horizontal second support shaft 43 in a direction substantially orthogonal to the axis of the first support shaft 30 that swingably supports the first swing frame 29. Therefore, by swinging the second swing frame 41 about the second support shaft 43 in a vertical plane parallel to the paper surface of FIG.
The axial direction of the bonding tool 16 can be swung within a vertical plane parallel to the paper plane of FIG.

As shown in FIG.
A second swing adjustment mechanism 44 is provided for adjusting the swing position of the second swing adjustment mechanism 44, and this second swing adjustment mechanism 44 has substantially the same structure as the first swing adjustment mechanism 31 described above. That is, a stopper part 41a is provided protrudingly from the center of the upper end of the second swing frame 41, and a pin 45, which is erected in parallel with the first support shaft 30 described above, is attached to the stopper part at the tip end 29a of the first swing frame 29. 41a
It is loosely inserted into a through hole protruding from the hole. Then, a coil spring 46 is brought into elastic contact between the head of the pin 45 and the stopper part 41a to bias the second swing frame 41 clockwise in FIG.
is brought into elastic contact with an abutment member 48 screwed onto the adjustment screw 47 of the second swing adjustment mechanism 44.

Therefore, by rotating the adjustment screw 47, the second swing frame 41 is adjusted to the second support shaft 4.
3, thereby making it possible to adjust the axial direction of the bonding tool 16.

Furthermore, as shown in FIGS. 6 and 7, a first swing frame 2 is provided on the upper surface of the base block 25.
A roughly L-shaped support arm 51 is fixed across 9, and a tip 51a of this support arm 51 has a
An air cylinder 52 is installed as a lifting mechanism for lowering the lifting block 42 and bonding tool 16 together.

As shown in FIG. 5, the lifting block 42 has a stopper portion 4 provided on the lifting block 42.
2a and the support arm 51, and a tension spring 54 tensioned between the lifting block 42 and the first swing frame 29. Second swing frame 4
1 (see FIG. 9)
It is held at the rising end position where it comes into contact with.

A cam roller 55 is pivotally supported at the center of the upper end of the lifting block 42, and when the lifting block 42 is located at the upper end position, the cam roller 55 is
5 is an air cylinder 5 provided on the support arm 51.
It is located directly below and close to the second piston rod 52a. And the air cylinder 5
2, the lifting block 42 and the bonding tool 16 can be lowered together through the cam roller 55 against the springs 53 and 54.

In this way, by lowering the lifting block 42 via the cam roller 55, the lifting block 42 is swung by the first swing adjustment mechanism 31 and the second swing adjustment mechanism 44, and thereby the air Even if the relative positions of the lifting block 42 and the cam roller 55 with respect to the cylinder 52 change, the state of contact between the air cylinder 52 and the cam roller 55 can be maintained substantially constant.

Further, as shown in FIG. 5, a shock absorber 5 is attached to the second swing frame 41 for the same purpose as the shock absorber 27 attached to the frame 24.
6 is attached, and by bringing the stopper portion 42a of the lifting block 42 into contact with the shock absorber 56, it is possible to absorb the impact when the lifting block 42 is lowered and stopped by the air cylinder 52. ing.

In the above configuration, the adhesive part 2a of the tape 2 pulled out from the supply reel 7 is stopped at the above-mentioned adhesive position A, and the chip 3 placed on the support table 12 by the chip supply mechanism 11 is moved to the above-mentioned adhesive position. When the tape is supplied to A, the video camera 13 and monitor 14 inspect whether the lead wire 2b of the tape 2 and the chip 3 are located in the correct positions relative to each other.

At this time, since the base block 25 is positioned at the right-hand retreat position in FIGS. 6 and 7 by the cylinder device 26, the first
The bonding tool 16 attached via the swing frame 29, second swing frame 41, and lifting block 42 is also located at the rearward end.

It is confirmed that the lead wire 2b of the tape 2 and the chip 3 are located in the correct positions with respect to each other,
Alternatively, once positioned at the correct position, the base block 25 is advanced by the cylinder device 26, and the bonding tool 16 is positioned directly above the bonding position A.

In this state, the air cylinder 52 provided on the support arm 51 integrated with the base block 25
is actuated, and the piston rod 52a moves the lifting block 42 via the cam roller 55 to the spring 53,
54 to the lowering end, the bonding tool 16 is also lowered together with the bonding tool 16, and all the lead wires 2b provided on the bonding part 2a are continuously connected to the contact part 3a of the chip 3 for a predetermined period of time by the pressing surface of the lower end. Press them together. At this time, since the bonding tool 16 has been previously heated to a predetermined temperature by a heater (not shown), the lead wire of the bonding part 2a is
b and chip 3 are now bonded together.

Also, use the bonding tool 16 to
The reaction force due to pressure contact between the chip 3 and the lifting block 4 to which the bonding tool 16 is attached
2. It is received by the base block 25 via the cam roller 55, the piston rod 52a of the air cylinder 52, and the support arm 51. At this time,
The base block 25 is made with high rigidity, and since the part of the base block 25 to which the support arm 51 is connected is located on the frame 24, the reaction force received via the support arm 51 is converted into a moment. Therefore, the base block 25 is hardly distorted, and the support arm 51 is only distorted. And even if the support arm 51 is distorted,
Since the influence does not affect the lifting block 42 to which the bonding tool 16 is attached, the tip 3
and the lead wire 2b can be uniformly crimped.

Furthermore, even if the base block 25 is slightly distorted due to the reaction force moment received via the support arm 51, the lifting block 42 to which the bonding tool 16 is attached can be directly attached to the base block 25 so as to be able to move up and down. The base block 2 is rotated through the second swing member 41 instead of
Since it is floatingly mounted on the first swinging frame 29 which is swingably mounted on the base block 5, the influence of distortion on the base block 25 can be minimized, and therefore the chip 3 can be moved smoothly at all times. It becomes possible to uniformly crimp the lead wire 2b and the lead wire 2b.

When the predetermined pressure contact time by the bonding tool 16 has elapsed, the operation of the air cylinder 52 is stopped and the lifting block 42 is returned to its original ascending end position, so that the bonding tool 16 is also returned to its ascending end position, and further The bonding tool 16 is retracted together with the base block 25 to the retracted end, and the same operation is repeated thereafter.

Next, if the parallelism between the pressing surface of the bonding tool 16 and the pressing surface of the lead wire 2b and the chip 3 is out of alignment, the adjustment screw 36 of the first swing adjustment mechanism 31 and the second Swing adjustment mechanism 44
The first swing frame 29 and the second swing frame 41 may be caused to swing about the support shafts 30 and 43, respectively, by rotating the adjustment screw 47. As a result, the bonding tool 16 can be swung between a vertical plane parallel to the plane of FIG. 6 and a vertical plane parallel to the plane of FIG. Therefore, the pressing surface can be adjusted to be exactly parallel to the pressing surface.

Further, the first swing adjustment mechanism 31 is provided on the base block 25, and the second swing adjustment mechanism 44 is provided on the first swing frame 29, and these adjustment mechanisms can be incorporated into the lifting block 42 as in the conventional case. Since it is not necessary, it is not affected by heat,
In addition, since it can be placed at a relatively free position, it is possible to use a large and highly accurate structure at a position where adjustment work can be easily performed.

"Effects of the Invention" As described above, in the present invention, instead of providing the lifting block provided with the bonding tool directly on the base block, it is provided on the swing frame that is swingably attached to the base block. Therefore, it is possible to reduce the adverse effects caused by distortion that occurs in the base block during bonding, and it is therefore possible to achieve the effect that the chip and the lead wire can always be bonded uniformly and in a good manner.

[Brief explanation of the drawing]

Figure 1 is a front view showing one embodiment of the present invention, Figure 2 is a front view showing one embodiment of the present invention;
The figure is a plan view of the main part of Fig. 1, Fig. 3 is an enlarged view of the main part of Fig. 1, Fig. 4 is a perspective view of the main part of Fig. 1, and Fig. 5 is an enlarged front view of the main part of Fig. 1. 6 is a right side view showing a part of FIG. 5 in cross section, FIG. 7 is a plan view of FIG. 5, FIG. 8 is an enlarged sectional view of the main part of FIG. 6, and FIG.
The figure is an enlarged front view of the main part of FIG. 5. 1... Bonding device, 2... Tape, 2b
... Lead wire, 3 ... Chip, 16 ... Bonding tool, 25 ... Base block, 29 ...
First swing frame, 30... First support shaft, 31...
...first swing adjustment mechanism, 42...lifting block, 5
1...Support arm, 52...Air cylinder (elevating mechanism).

Claims (1)

[Scope of Claims] 1. A lifting block provided on a base block so as to be freely raised and lowered, a bonding tool provided on the lifting block, and an lifting mechanism provided on the base block for raising and lowering the lifting block, In a bonding device in which a bonding tool is lowered and the chip and lead wire are crimped to each other, a swinging frame is swingably attached to the base block, and the lifting block is movable up and down on the swinging frame. A bonding apparatus characterized in that a lifting block is floatingly supported with respect to the base block, and the lifting block is raised and lowered by a lifting mechanism provided on the base block.