JPH0458183B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an internal lead bonding device for collectively bonding internal leads of a film carrier and electrodes of a semiconductor pellet.

[Prior art] A conventional internal lead bonding device is, for example,
As shown in Japanese Patent Laid-open No. 225440 and Japanese Patent Application Laid-Open No. 60-234336, the internal leads of the film carrier are pressed down with a tool, and the internal leads are pressed against the electrodes of the semiconductor pellet to join them. In this manner, by pressing down on the inner lead with the tool, the inner lead is deformed and formed downward.
This forming of the internal leads is performed to prevent the semiconductor pellet from edging into the internal leads.

[Problems to be Solved by the Invention] In the conventional example described above, forming is only performed by pushing down the internal leads as the tool descends, so if the tool rises after joining, the springs of the internal leads There was a problem in that the internal leads were lifted upward by the backing and the forming amount was unstable.

An object of the present invention is to provide an internal lead bonding device that can obtain a stable forming amount.

[Means for Solving the Problems] The problems of the above-mentioned prior art are that there is a carrier guide member that guides the film carrier to the joining position, and a carrier guide member that is located below the carrier guide member and presses the film carrier against the carrier guide member. an internal lead comprising a clamper, a stage disposed below the clamper at the bonding position on which a semiconductor pellet is placed, and a tool movably disposed above the carrier guide member at the bonding position. This problem is solved by providing the bonding apparatus with a vertical movement mechanism that moves both the carrier guide member and the clamper upward when the tool presses the internal lead of the film carrier against the semiconductor pellet.

[Function] The clamper and the carrier guide member are lifted upward while the film carrier is held between the clamper and the carrier guide member, and the internal leads are pressed against the semiconductor pellet with a tool. This results in
Appropriate stress is applied to the internal leads to form them.

[Example] An example of the present invention will be described below with reference to FIGS. 1 and 2. The base plate 10 includes a fixed guide roller block 11 having a vertical guide groove,
11 are fixed facing each other, and a vertically movable roller block 12 is fitted between the fixed guide roller blocks 11, 11 so as to be vertically movable.
A carrier guide plate 14 for guiding a film carrier 13 is fixed to the vertically movable roller block 12, and this carrier guide plate 14 has a spring hook 15 fixed to the carrier guide plate 14 and a spring 16 hooked to the base plate 10. is biased downward.

A support plate 17 is fixed to the base plate 10, and a swing lever 19 is swingably attached to a support shaft 18 fixed to the support plate 17.
A groove is formed at one end of the swing lever 19, and this groove is used for the pin 2 fixed to the carrier guide plate 14.
0 is engaged. An operating rod of a cylinder 21 is disposed above the other end of the swing lever 19 to face it, and the cylinder 21 is fixed to a cylinder support plate 22 fixed to the support plate 17. A stopper 23 is fixed to the carrier guide plate 14, and a micrometer head 24 is disposed above the stopper 23. The micrometer head 24 is fixed to a micrometer head support plate 25 which is fixed to the base plate 10. An escape hole 14a into which a tool 27 is inserted is formed in a portion of the carrier guide plate 14 corresponding to the joining position 26.

A clamper 30 is disposed below the carrier guide plate 14, and this clamper 30 has rising portions 30 rising on both sides of the carrier guide plate 14.
a is swingably supported by the carrier guide plate 14 via a support shaft 31. The clamper 30 is provided with an actuating portion 30b on the opposite side of the joint position 26 with respect to the support shaft 31, and an actuating rod 32a of the cylinder 32 is disposed opposite to the actuating portion 30b above the actuating portion 30b. The cylinder 32 is fixed to the carrier guide plate 14 via a cylinder support plate 33. Further, a spring 36 is applied to a spring hook 34 fixed to the cylinder support plate 33 and a spring hook 35 fixed to the clamper 30, and the clamper 30 is biased by the spring 36 so that the joint position 26 side comes into pressure contact with the carrier guide plate 14. ing. Further, an escape hole 30c is formed in a portion of the clamper 30 corresponding to the joining position 26.

A carrier guide plate 14 is provided on the base plate 10.
Guide roller shafts 40, 41 are fixed on both sides of the guide roller shafts 40, 41, respectively.
Guide rollers 42 and 43 are rotatably supported on each of the guide rollers 42 and 43, respectively. The film carrier 13 sent out from a supply reel (not shown) passes through a guide roller 42, the lower surface of the carrier guide plate 14, and a guide roller 43, and is wound onto a take-up reel (not shown).

Further, a stage 51 for positioning and placing a semiconductor pellet 50 is provided below the clamper 30 at the bonding position 26. This stage 5
1 is attached to a rotary table which is vertically movably placed on an XY table which is movable in the XY directions.

Next, the operation will be explained with reference to FIG.
FIG. 1 shows that the cylinder 32 is activated and the actuating rod 32
a protrudes downward, and the actuating portion 30b of the clamper 30 is pushed downward by the actuating rod 32a.
The clamper 30 is at the joint position 2 with the support shaft 31 as the center.
6 side is upward, that is, the film carrier 13 is in the closed state pressed against the carrier guide plate 14. When feeding the film carrier 13, the actuating rod 32a of the cylinder 32 is retracted upward, and the clamper 30 is moved by the biasing force of the spring 36 to the open state with the joint position 26 side facing downward, that is, away from the carrier guide plate 14, about the support shaft 31. It is in. With the clamper 30 in the open state, the film carrier 13 is fed by a feeding mechanism (not shown), and the internal lead 13a of the film carrier 13 is positioned at the bonding position 26. on the other hand,
Semiconductor pellet 5 positioned on stage 51
0 is sent to the joining position 26 and is on standby. In this state, the cylinder 32 operates and the operating rod 32a
is projected downward, and the clamper 30 is closed as shown in FIG. 1 by the above-described operation.

Next, as shown in FIG. 3a, the stage 51 is raised to the vicinity of the film carrier 13, and the tool 27 is lowered to press the internal lead 13a of the film carrier 13 against the electrode 50a of the semiconductor pellet 50.

In this state, the cylinder 21 operates and pushes down the swing lever 19. As a result, the swing lever 19 rotates about the support shaft 18, and the carrier guide plate 14 is raised along the fixed guide roller block 11 via the pin 20 until the stopper 23 comes into contact with the micrometer head 24. Since the clamper 30 is attached to the carrier guide plate 14, the carrier guide plate 14 is attached as shown in FIG. 3b.
The film carrier 13 is lifted up with the film carrier 13 being held between the clamper 30 and the clamper 30. Since the inner lead 13a remains pressed against the electrode 50a of the semiconductor pellet 50 by the tool 27, the inner lead 13a is deformed as shown in FIG. 3c.

Next, the tool 27 is raised, the stage 51 is lowered, and the bonding between the internal lead 13a of the film carrier 13 and the electrode 50a of the semiconductor pellet 50 is completed. Next, the actuating rod 32a of the cylinder 32 is retracted, the clamper 30 is opened, and the cylinder 2
The operating rod 1 retracts and the carrier guide plate 14
is lowered by the biasing force of the spring 16, resulting in the state shown in FIG. This completes the series of bonding operations.

In this way, with the internal lead 13a pressed against the semiconductor pellet 50 by the tool 27, the carrier guide plate 14 and the clamper 30 hold the carrier guide plate 14 and lift it upward, so that a moderate stress is applied to the internal lead 13a. is added and formed. This amount of forming can be easily changed by adjusting the micrometer head 24.

[Effects of the Invention] As is clear from the above description, according to the present invention, when a tool presses the internal lead of the carrier guide member against the semiconductor pellet, both the carrier guide member and the clamper are moved upward. Since a vertical movement mechanism is provided, a stable forming amount can always be obtained.

[Brief explanation of the drawing]

Figure 1 is a front view showing one embodiment of the present invention, Figure 2 is a front view showing one embodiment of the present invention;
The figure is a plan view of FIG. 1, and FIGS. 3a, b, and c are operation explanatory diagrams. 11: Fixed guide roller block, 12: Vertical moving roller block, 13: Film carrier,
13a: Internal lead, 14: Carrier guide plate,
16: Spring, 18: Support shaft, 19: Swing lever, 2
1: cylinder, 26: joining position, 27: tool,
30: Clamper, 31: Support shaft, 32: Cylinder,
36: Spring, 50: Semiconductor pellet, 50a: Electrode, 51: Stage.

Claims (1)

[Scope of Claims] 1. A carrier guide member that guides the film carrier to the joining position, a clamper that is located below the carrier guide member and presses the film carrier against the carrier guide member, and a clamper that is located under the carrier guide member and presses the film carrier against the carrier guide member, and In the internal lead bonding apparatus, the internal lead bonding apparatus includes a stage disposed below to place a semiconductor pellet, and a tool vertically movably disposed above the carrier guide member at the bonding position. An internal lead bonding device comprising a vertical movement mechanism that moves both the carrier guide member and the clamper upward when the internal lead is pressed against the semiconductor pellet. 2. The internal lead joining device according to claim 1, wherein the clamper is attached to a carrier guide member, and the vertical movement mechanism supports the carrier guide member and moves the carrier guide member up and down.