JPH0587959U - Fixing part of electronic component with heat sink to radiator - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a fixing portion of an electronic component with a heat sink to a radiator that can easily cope with a change in size and a change in the number of arrays of the electronic component with a heat sink. The electronic component 3 with a heat sink is electrically insulated and fixed to a radiator 5 via an electrically insulating adhesive 10 containing insulating particles 9.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 In the present invention, electronic components with a heat sink, in which electronic components such as transistors, SCRs and diodes used in rectifiers, regulators, motor controllers, etc. are mounted on a heat sink, are electrically insulated and fixed to a radiator. The present invention relates to a fixing part of a heat sink-equipped electronic component to a radiator.

[0002]

[Prior Art]

 The conventional fixing part of the electronic component with the heat sink to this type of radiator has the structure shown in FIGS. 6 (A), (B) and FIG. 7. That is, conventionally, an electronic component 3 with a heat sink in which an electronic component 1 such as a transistor, an SCR, and a diode is attached to a heat sink 2 is placed on a radiator 5 via an insulating sheet 4 such as a mylar film, and a fixing screw is attached. The structure was fixed to the radiator 5 at 6. In this case, when the fixing screw 6 is made of metal, the heat sink 2 and the radiator 5 are electrically insulated by the insulating seat plate 7. 1a is a terminal of the electronic component 1 and 5a is a radiation fin of the radiator 5.

[0003]

[Problems to be solved by the device]

 However, in such a fixing portion of the electronic component with the heat sink to the conventional radiator, the arrangement pitch of the electronic components 3 with the heat sink is determined by the arrangement pitch of the screw holes 8 of the radiator 5 into which the fixing screws 6 are screwed. Therefore, there is a problem that it is not possible to cope with a change in the size of the electronic component 3 with a heat sink or a change in the number of arrays.

An object of the present invention is to provide a fixing portion of an electronic component with a heat sink to a radiator that can easily cope with a change in size of the electronic component with a heat sink and a change in the number of arrangements.

[0005]

Means for Solving the Problems To explain the structure of the present invention for achieving the above object, the present invention is directed to a heatsink-equipped electronic component for a heatsink in which an electronic component with a heatsink is electrically insulated and fixed to the radiator. In the component fixing portion, the electronic component with a heat sink is fixed to the radiator via an electrically insulating adhesive mixed with insulating particles.

[0006]

[Action]

 When the electronic component with heat sink is fixed to the radiator via the electrically insulating adhesive in this way, the size of the electronic component with heat sink and the number of arrays can be easily changed by changing the bonding position. be able to.

Further, since the insulating particles are mixed in the electrically insulating adhesive, the insulating particles can surely maintain the electrical insulation distance between the heat sink and the radiator.

[0008]

【Example】

 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The parts corresponding to those in FIGS. 6A and 6B and FIG. 7 described above are denoted by the same reference numerals.

1 (A), (B) to FIG. 3 show a first embodiment of a fixing part of an electronic component with a heat sink to a radiator according to the present invention. In this embodiment, the electronic component 3 with a heat sink is electrically insulated and fixed to the radiator 5 via an electrically insulating adhesive 10 containing insulating particles 9. As the insulating particles 9, for example, fillers such as silica particles or alumina particles having a particle size of about 80 to 120 μm are used. As the electrically insulating adhesive 10, for example, an epoxy resin is used.

As described above, when the electronic component 3 with the heat sink is fixed to the radiator 5 via the electrically insulating adhesive 10, the size of the electronic component 3 with the heat sink and the number of arrays are changed by changing the bonding position. Can be easily accommodated.

Moreover, since the insulating particles 9 are mixed in the electrically insulating adhesive 10, the insulating particles 9 ensure that the required electrical insulation distance H between the heat sink 2 and the radiator 5 is maintained. can do.

FIGS. 4 (A), (B) and FIG. 5 show a second embodiment of the fixing portion of the electronic component with the heat sink to the radiator according to the present invention. In the present embodiment, the electronic component 3 with a heat sink shows an example in which one electronic component 1 such as a power transistor is fixed to the heat sink 2. Even with such a structure, the same effect as that of the first embodiment can be obtained.

[0013]

[Effect of the device]

 As described above, the fixing portion of the electronic component with the heat sink to the radiator according to the present invention has the electronic component with the heat sink fixed to the radiator via the electrically insulating adhesive. This makes it possible to easily respond to changes in the size of electronic components with switches and changes in the number of arrays. In particular, since insulating particles are mixed in the electrically insulating adhesive, the insulating particles can surely maintain the electrical insulation distance between the heat sink and the radiator.

[Brief description of drawings]

1A and 1B are a plan view and a side view showing a first embodiment of a fixing portion of an electronic component with a heat sink to a radiator according to the present invention.

FIG. 2 is an enlarged cross-sectional view taken along line XX of FIG.

3 is a partially enlarged cross-sectional view of FIG.

4A and 4B are a plan view and a side view showing a second embodiment of a fixing portion of a heat sink-equipped electronic component to a radiator according to the present invention.

FIG. 5 is a perspective view of an electronic component with a heat sink used in a second embodiment.

6A and 6B are a plan view and a side view showing a fixing portion of a conventional electronic component with a heat sink to a radiator.

FIG. 7 is an enlarged cross-sectional view taken along the line YY of FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic component, 1a ... Terminal, 2 ... Heat sink, 3 ... Electronic component with heat sink, 4 ... Insulating sheet, 5 ... Radiator, 5a ... Radiating fin, 6 ... Fixing screw, 9 ... Insulating particles,
10 ... Electrically insulating adhesive.

Claims (1)

[Scope of utility model registration request] 1. An electronic component with a heat sink is electrically insulated and fixed to a radiator. In a fixing portion of the electronic component with a heat sink to a radiator, the heat sink is attached via an electrically insulating adhesive containing insulating particles. A fixing part of an electronic component with a heat sink to a radiator, wherein the electronic component is fixed to the radiator.