JPH0585858U - Electrodeposition processing device - Google Patents

Abstract

(57) [Summary] [Purpose] To prevent the formation of a surplus film by electrodepositing a work for a set time without excess or deficiency. [Structure] An electrodeposition treatment area (A1) in which a familiar treatment area (AO) in which the electrode (11) is not disposed is formed on the upstream side of the tank main body (1) in the work transfer direction, and in which the electrode (11) is disposed.
With the familiar processing time as the cycle time, the electrodeposition processing can be performed for a set time.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an electrodeposition processing apparatus. In particular, it relates to an electrodeposition processing apparatus used for performing electrodeposition resist processing or plating processing.

[0002]

[Prior Art]

 4 and 5 show a schematic structure of a conventional electrodeposition processing apparatus. In these figures, 1 is a tank body containing an electrolytic solution. A plurality of electrodes 11 are arranged on both sides of the tank main body 1 at a predetermined pitch in the work transfer direction.

Here, each electrode 11 is configured to be supplied with electric power from a power supply device (not shown) to perform an electrodeposition process on a work (for example, a printed circuit board) W. The electrodes 11 other than the leftmost electrode 11 in FIG. 4 are configured to be supplied with power synchronously. Further, the arrangement pitch of the electrodes 11 is determined by the transport speed of the work W (speed based on the cycle time of the work transport means (not shown)) and the electrodeposition processing time.

Therefore, the electrodeposition processing apparatus is configured to perform the electrodeposition processing of one work W for each cycle time. That is, the untreated work W is supplied to the input part P1 in the tank body 1 in accordance with the cycle time, and the respective works W immersed in the tank body 1 are horizontally moved and electrically charged by the electrodes 11. Is processed. As a result, a film having a predetermined thickness is formed on the surface of the work W. Further, the work W having been subjected to the electrodeposition treatment is taken out from the taking-out part P2 and transferred to the next step.

In FIG. 4, 21 A is a liquid circulation device for circulating the electrolytic solution in the tank body 1, and the electrolytic solution overflowing from the both sides of the tank body 1 to the overflow receivers 22 A is collected in the tank 29. After that, the circulation pump 23 sends it to the discharge pipe 25 through the filter 24 and discharges it from each nozzle of the pipe 25.

Reference numeral 35 denotes a polar liquid management unit (polar liquid tank 36, circulation pump 37, etc.), which is connected to each electrode 11 via a polar liquid supply pipe 31, a polar liquid discharge pipe 32, and the like.

Generally, in the electrodeposition processing apparatus, each electrode 11 is formed to be large in size so as to cope with a change (especially increase) in the electrodeposition processing time and a request for an increase in the work transfer speed. The area where the electrodes 11 are provided (electrodeposition processing area) is made longer by increasing the number of the electrodes 11 to be provided, thereby providing a margin.

[0008]

[Problems to be solved by the device]

 By the way, in the above-mentioned electrodeposition treatment apparatus, the work W is not immediately immersed in the tank body 1 and then the electrodeposition treatment is immediately started, but the electrodeposition treatment is started after the work W is sufficiently adjusted to the electrolytic solution. Has been done. That is, each electrode 11 is supplied with electric power after a predetermined familiar time, and the electrodeposition process is performed for a set time.

At this time, since the length of the electrodeposition processing region of the tank main body 1 is formed with a margin, the work W does not reach the unloading portion P2 even after a predetermined electrodeposition processing time has elapsed, and thus the workpiece W is removed. An extra film may be formed before reaching the projecting portion P2. Although the occurrence of such a situation has been accepted in the past, it not only causes an increase in cost, but also prevents fine pattern formation, especially in the electrodeposition resist process, and thus prevents the formation of a surplus film. Development of technology is required.

In view of the above circumstances, an object of the present invention is to provide an electrodeposition treatment apparatus capable of preventing the formation of a surplus film by electrodeposition treating a work for a set time without excess or deficiency.

[0011]

[Means for Solving the Problems]

 The electrodeposition processing apparatus according to the present invention has a plurality of electrodes arranged on both sides in the tank main body at a predetermined pitch in the work transfer direction, and the work is immersed by the transfer means from the upstream side to the downstream side. In an electrodeposition processing apparatus that is configured to perform electrodeposition processing for a set time while moving, a familiar processing area where the electrodes are not arranged is formed on the upstream side of the tank main body in the work transfer direction, and the electrodes are arranged. It is characterized in that the electrodeposition treatment area is set so that the electrodeposition treatment can be carried out for the set time with the familiar treatment time as a cycle time.

[0012]

[Action]

 In the present invention having the above-mentioned configuration, the work is electrode-processed for a set time in the electrodeposition process area after the acclimation processing time is set for the acclimation processing time in the tank body, and then for the set time. It

Therefore, it is possible to prevent excess film formation by subjecting the work to electrodeposition treatment for a set time without excess or deficiency.

[0014]

【Example】

 An embodiment of the present invention will be described with reference to the drawings. The electrodeposition processing apparatus according to the present embodiment performs electrodeposition resist processing, forms a familiar processing area A0 in which the electrode 11 is not disposed on the upstream side of the tank main body 1 in the work transfer direction, and also forms an electrode (diaphragm electrode). ) 11 is arranged in the electrodeposition processing area A1 so that the electrodeposition processing can be performed for a set time with the processing time as the cycle time. Specifically, the electrodeposition processing apparatus is configured to include a liquid circulating device 21, a polar liquid management unit 35, and a polar liquid receiver 41, in addition to the bath body 1 and the diaphragm electrode 11 described above. The same components as those shown in FIGS. 4 and 5 are designated by the same reference numerals, and the description thereof will be omitted or simplified.

Here, in the electrodeposition treatment area A1 of the tank main body 1, a plurality of diaphragm electrodes 11 are provided on both sides of the tank main body 1 at a predetermined pitch in the work transfer direction by the number determined by the cycle time and the electrodeposition processing time. It is attached to the inner wall surfaces 2 and 2. A polar liquid receiver 41 is attached to the outer wall surface 3 of the bath main body 1 in the electrodeposition treatment area A1. The polar liquid from each diaphragm electrode 11 collected by the polar liquid receiver 41 is sent to the polar liquid management unit 35, subjected to a predetermined treatment, and then recirculated to each diaphragm electrode structure 11. Further, an overflow receiver 22 having a vast accommodation space is attached to the non-electrodeposition treatment area A0 of the tank body 1.

Further, the liquid circulation device 21 is formed so that the upper layer flow of the electrolytic solution in the tank body 1 can be made opposite to the work transfer direction. Specifically, the liquid circulation device 21 is composed of an overflow receiver 22, a circulation pump 23, a filter 24, a discharge pipe 25, a pipe 26, and the like. The discharge pipe 25 is arranged on the bottom portion 5 of the tank main body 1 so as to extend in the work transfer direction, and is provided with a plurality of nozzles 25a at predetermined pitch intervals. Each nozzle 25a is formed so that the upper layer flow of the electrodeposition liquid is upward and opposite to the work transfer direction (that is, the overflow receiving direction 22).

The work W is transferred by a continuous tact type transfer device (not shown) using an elevator.

Next, the operation will be described. The work W is soaked with the electrolytic solution in the acclimatization processing area A0 of the tank body 1 for the acclimatization processing time, and then is electrodeposited for a set time in the electrodeposition processing area A1 with the acclimatization processing time as a cycle time. .. Therefore, the work W is electrodeposited for the set time without excess or deficiency.

At this time, the liquid circulation device 21 causes the upper layer flow of the electrolytic solution in the tank main body 1 to be opposite to the work transfer direction. As a result, the stagnation of gas and impurities on the surface of the electrolytic solution is made to flow toward the overflow receiver 22 attached to the non-electrodeposition treatment region A0 of the tank body 1 and discharged from the receiver 22. Since the overflow receiver 22 has a vast storage space, the flow rate of the overflowing electrolytic solution can be suppressed, and air is prevented from being mixed into the electrolytic solution circulated by the liquid circulating device 21. To be done. Therefore, the gas is prevented from adhering to the surface of the work W during electrolysis, and the formation of pits in the coating film is prevented.

Therefore, according to this embodiment, the familiar treatment area A0 in which the electrode (11) is not provided is formed on the upstream side of the tank main body 1 in the work transfer direction, and the electrode (11) is provided. Since the electrodeposition treatment area A1 is formed so that the familiar treatment time is the cycle time and the electrodeposition treatment can be performed for the set time, the work W can be electrodeposited for the set time without excess or deficiency to prevent the formation of the excess coating.

Further, the length of the electrodeposition treatment area A1 of the tank body 1 can be shortened, and the number of electrodes (11) can be reduced.

Further, since the overflow receiver 22 is attached to the familiar treatment area A0 of the tank body 1, the accommodation space of the receiver 22 can be increased. Therefore, the flow rate of the electrolytic solution that overflows can be suppressed, and air can be prevented from being mixed into the electrolytic solution circulated by the liquid circulating device 21. Therefore, it is possible to prevent the gas from adhering to the surface of the work W during electrolysis and prevent the formation of pits in the coating.

Further, since the polar liquid receiver 41 is provided on the outer wall surface 3 of the bath main body 1 in the electrodeposition treatment area A1, the polar liquid discharged from each diaphragm electrode 11 is collected by the polar liquid receiver 41. Can be sent to the polar liquid management unit 35. Therefore, a pipe for discharging the polar liquid from each diaphragm electrode 11 is not required, and the device can be simplified.

Furthermore, since the number of pipes connected to each diaphragm electrode structure 11 is reduced, it is easy to attach and detach, which is convenient for maintenance and the like.

[0025]

EFFECTS OF THE INVENTION According to the present invention, a familiar processing area without electrodes is formed on the upstream side of the tank body in the work transfer direction, and the electrodeposition processing area with electrodes is adapted to familiarize the processing time with a cycle time. As a result, the work can be electrodeposited for a set time, so that the work can be electrodeposited for a set time without excess or deficiency to prevent the formation of a surplus film.

[Brief description of drawings]

FIG. 1 is a diagram showing an overall configuration of an embodiment of the present invention.

FIG. 2 is a diagram for explaining an electrodeposition resist process of one example.

FIG. 3 is a diagram for explaining a positional relationship between a diaphragm electrode and a polar liquid receiver according to an embodiment.

FIG. 4 is a diagram showing a schematic configuration of a conventional electrodeposition processing apparatus.

FIG. 5 is a side sectional view of a conventional electrodeposition processing apparatus.

[Explanation of symbols]

 1 Tank main body 11 Diaphragm electrode (electrode) AO Familiar processing area A1 Electrodeposition processing area

Claims (1)

[Scope of utility model registration request] 1. A plurality of electrodes are provided on both sides in a tank main body at a predetermined pitch in a work transfer direction, and the work is immersed and moved from an upstream side to a downstream side by a transfer means, and electric power is supplied for a set time. In an electrodeposition processing apparatus formed to perform electrodeposition processing, a familiarization processing area in which the electrode is not disposed is formed on the upstream side of the tank main body in the work transfer direction, and the electrodeposition processing area in which the electrode is disposed is familiarized. An electrodeposition processing apparatus, wherein the processing time is a cycle time, and the electrodeposition processing is possible for the set time.