JPH0585073U - Adhesive pressure bonding head - Google Patents

Abstract

(57) [Abstract] [Purpose] When conductively connecting an FPC, tape carrier, etc. and the liquid crystal panel periphery etc. with an anisotropic conductive adhesive,
Provided is an adhesive pressure-bonding head capable of suppressing such thermal expansion as much as possible. [Structure] An adhesive pressure-bonding head comprising a pressure-contact surface 2 of a pressure-bonding head 1 provided with groove-shaped patterns 2a having a minute pitch and a minute depth.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an adhesive pressure bonding head in an anisotropic conductive adhesive pressure bonding connection device.

[0002]

[Prior Art]

 For example, in order to connect an FPC that connects a peripheral portion of a liquid crystal panel to a drive circuit board or a tape carrier on which a driving semiconductor element is mounted, heat curing is performed between the panel electrode and the FPC or tape carrier. With a so-called anisotropic conductive resin in which conductive particles or powder are mixed and dispersed in a conductive or thermoplastic resin, a pressure bonding device with a pressure bonding head with a flat pressure contact surface is used to apply heat or pressure. Conductive connection was made by cooling after pressure bonding.

[0003]

[Problems to be solved by the device]

 In the above-described conventional conductive connection method, since heating is performed at about 130 to 200 ° C. during crimping, expansion occurs due to heat in the FPC, tape carrier, etc., and a force that tends to expand in the lateral direction acts on them. To do. As described above, since the pressure contact surface of the pressure bonding head is smooth, it is not possible to sufficiently suppress the above-mentioned force of extending in the lateral direction. Therefore, the FPC and the tape carrier are stretched, and a gap is generated between the FPC and the tape carrier and the opposite electrode which is a connection partner, which causes a connection failure. In order to prevent the occurrence of the connection failure, it is necessary to properly select the pitch of the connection terminal from the thermal expansion coefficient of the FPC and the tape carrier and the length of the pressure bonding section, and there is a limit to miniaturization.

In addition, in the method of conductive connection for curing at high temperature and terminating the connection, since the FPC and the tape carrier are fixed by the adhesive in a state where they are expanded at high temperature, they are fixed at room temperature. Due to the difference in the coefficient of thermal expansion from the opposing substrate, they continue to receive a large stress, which is a problem in terms of product reliability.

The present invention has been made based on the above circumstances, and it is possible to suppress the expansion of the FPC, tape carrier, etc. at the time of thermocompression bonding, and to prevent the occurrence of great stress on them after conductive connection. An agent pressure bonding head is provided.

[0006]

[Means for Solving the Problems]

 The adhesive crimping head of the present invention is an adhesive in an anisotropic conductive adhesive crimping / connecting device. Is formed.

[0007]

[Action]

 In the adhesive pressure bonding head of the present invention having the above structure, the groove pattern increases the friction between the FPC, tape carrier, etc. and the pressure contact surface of the pressure bonding head, and the force that tends to extend in the lateral direction of the FPC, tape carrier, etc. Can be suppressed and the elongation in the above direction can be suppressed.

[0008]

【Example】

 Embodiments of the present invention will be described below with reference to the drawings. 1 (a) is a front view showing an embodiment of the present invention, FIG. 1 (b) is a side view thereof, FIG. 1 (c) is a plan view showing a pressure contact surface of the embodiment, and FIG. 1 (b) is an enlarged cross-sectional view of the pressing surface, and FIG. 2 (b) is an enlarged plan view of the same. The embodiment shown in these drawings is an embodiment in which the present invention is applied to a crimping head of a pulse heating type crimping device. The pressure bonding head 1 is made of a material having an extremely small linear expansion coefficient, such as Fe—Ni alloy (commonly called Invar). Then, the press contact surface 2 is provided with a number of concentric arc-shaped groove patterns 2a centered on the center of the press contact surface 2 by machining such as cutting, electric discharge machining, etching by lithography technique, and the like. There is.

For example, the pitch between the individual grooves of the concentric arcuate groove-shaped pattern shown in FIG. 1B is 100 μm, and the depth of each individual groove is 80 μm.

According to the pressure-bonding head of the present invention having the above-described structure, the groove-shaped pattern formed on the pressure-contact surface 2 can sufficiently prevent expansion of the FPC, tape carrier, etc. under heat and pressure due to heat. You can Therefore, there is no deviation from the opposing electrode that is the other party of connection, and there is no risk of connection failure due to this.

In the above embodiment, since the groove-shaped pattern has a concentric arc shape, there is no possibility that the groove-shaped pattern directly interferes with the linear terminal during crimping.

When the tape carrier having the terminal pitch of 100 and the number of terminals of 100 is crimped and connected by using the anisotropic conductive adhesive by the crimping head of the present invention having the above-mentioned structure, the conventional crimping surface is flat. Compared to the case where crimping connection is performed using a crimping head, thermal expansion of the tape carrier is suppressed and good conductive connection without pitch deviation can be achieved.

The present invention is not limited to the above embodiment. For example, the depth, pitch, shape, etc. of the groove having the groove pattern can be arbitrarily selected.

[0014]

[Effect of the device]

 As described above, according to the adhesive pressure bonding head of the present invention, the displacement of the terminals due to the thermal expansion of the FPC and the tape carrier to be pressure bonded can be suppressed to the utmost limit. Therefore, the connection between the FPC having a finer pitch terminal arrangement, the tape carrier, etc. and the connection partner can be performed with high reliability, easily and inexpensively at a high yield.

[Brief description of drawings]

1A is a front view of an embodiment of the present invention, FIG. 1B is a side view thereof, and FIG. 1C is a plan view showing a pressure contact surface of the embodiment.

2A is a sectional view showing an enlarged pressure contact surface in FIG. 1B, and FIG.

[Explanation of symbols]

 1 ... Pressure bonding head, 2 ... Pressure contact surface, 2a ... Groove pattern.

Claims (1)

[Scope of utility model registration request] 1. An adhesive pressure-bonding head in an anisotropic conductive adhesive pressure-bonding connection device, wherein a fine groove-like pattern is formed to increase friction with a surface of a pressure-bonded object with which a pressure-contact surface of the pressure-bonding head is abutted. An adhesive pressure bonding head, which is characterized in that