JPH0583443B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic component transport device that can transport electronic components such as ICs and LSIs.

[Prior Art] In order to transport electronic components such as ICs and LSIs to, for example, a measuring device or a predetermined feeding position, an electronic component transport device is usually used. As a conveyance device for electronic components, devices shown in, for example, Japanese Utility Model Publication No. 54-4941 and Japanese Utility Model Publication No. 54-7741 have been proposed. These devices include a transport rail comprising a longitudinal transport surface on which electronic components can slide, and are supported by the transport rail and arranged along the transport rail so as to cover the upper part of the transport surface. Equipped with an upper guide body,
Electronic components can be transported in a sliding state along a transport path formed between the transport surface of the transport rail and the upper guide body. As a result, it becomes possible to supply electronic components to a measuring device, a predetermined feeding position, etc. via the conveyance path.

[Problems to be Solved by the Invention] However, in the conventional electronic component transport device described above, the upper guide body disposed above the transport surface is supported in a fixed state with respect to the transport rail. For example, if an electronic component sliding on the conveyance path becomes jammed between the conveyance surface and the upper guide body, the upper guide body must be removed from the conveyance rail each time. In addition, when performing various maintenance such as checking the wear condition of the conveying surface or repairing the conveying surface, the guide body must be removed each time, ensuring a smooth conveying condition. It was thought that it would take a lot of effort.

In addition, in Japanese Utility Model Application Publication No. 51-56770, the transport space 12 for the electronic component 6 is formed by the metal pieces 10 and 11, and the metal piece 11 is cut in the middle to form the rotary piece 1.
1b, and this rotating piece 11b can be opened and closed via a hinge 14. However, since this rotating piece 11b has a sliding guide surface on the lower surface of the head 6a of the electronic component 6, as the rotating piece 11b rotates, the electronic component supported by this rotating piece 11b may fall from the conveyance space 12 carelessly. Furthermore, since a part of the sliding guide surface of the electronic component 6 is formed on the rotating piece 11b, the guide surface of this rotating piece 11b and the guide surface of the metal piece 11 other than the rotating piece 11b are A stepped portion or gap is formed between the two, and this becomes a cause of hindering smooth transportation of electronic components.

The present invention provides an electronic component transport device that does not disturb the smooth transportation of electronic components by the transport rail, and prevents the electronic components and alignment state on the transport rail from being disturbed due to clogging of the transport path or during maintenance of the transport surface. The purpose is to make it possible to deal with it easily without any problems.

[Means for Solving the Problems] The present invention provides a transport rail 12 comprising a longitudinal transport surface that allows electronic components 20 and 21 to slide.
and an upper guide body 23, 51 that is disposed along the transport rail 12 so as to cover the upper part of the transport surface and guides the upper part of the electronic components 20, 21 sliding while being supported by the transport rail 12. Electronic component transport device 1 that can transport electronic components 20 and 21 in a sliding state along a transport path 29 formed between the transport surface of a transport rail 12 and upper guide bodies 23 and 51
0,50, the upper guide bodies 23, 51 are separate from the conveyance rail 12, and the upper guide bodies 23, 51 are supported so as to be openable and closable in the direction toward and away from the conveyance surface of the conveyance rail 12. be.

[Function] By separating the upper guide body from the transport rail, it is possible to easily deal with cases such as when an electronic component becomes clogged in the transport path or during maintenance of the transport surface.

Since the upper guide body is separate from the transport rail that has the electronic component transport surface, even when the upper guide body is moved away from the transport rail, the electronic components remain supported by the transport rail. The alignment of the electronic components is not disturbed by the opening and closing movement of the upper guide body.

Since the upper guide body is separate from the conveyance rail that has the electronic component conveyance surface, the longitudinal conveyance surface of the conveyance rail does not have any steps, gaps, etc. associated with the opening/closing structure of the upper guide body. Smooth transportation of electronic components is not hindered.

[Example] Hereinafter, an example of the present invention will be described with reference to the drawings.

Fig. 1 is a partially cutaway side view showing an IC transfer device according to an embodiment of the present invention, Fig. 2 is an enlarged sectional view taken along the - line in Fig. 1, and Fig. 3 is an upper guide body. It is a sectional view showing an open state.

The IC transport device 10 is arranged on a longitudinal base 11 arranged at a predetermined inclination angle.
The IC transport device 10 includes a longitudinal transport rail 12 disposed above a longitudinal base 11, and the transport rail 12 is composed of a main frame 13 and a transport frame 14. Flange portions 1 are provided on both sides of the main frame 13 in the longitudinal direction [direction A].
5 is formed, and the flange portion 15 is attached to the base 11 via bolts 16. Thereby, the main frame 13 is supported on the base 11 and arranged with the longitudinal direction [direction A] inclined. On the other hand, the transport frame 14 is
It is arranged on the upper surface of the main frame 13 and attached to the main frame 13 via bolts 17. A recess 18 is formed in the upper surface of the transport frame 14 in the longitudinal direction [direction A], and a long hole 19 is formed in the center of the recess 18 along the longitudinal direction [direction A]. The bottom of this recess 18 is the transfer surface 2 of the IC 20 or 21.
2, and the IC 20 or 21 is allowed to slide on the conveying surface 22 along the inclined direction [direction A] from above to below.

Conveyance surface 2 that allows IC20 or 21 to slide
An upper guide body 23 is disposed above the transport surface 22 so as to cover the conveyance surface 22 . The upper guide body 23 is
It is composed of a support piece 24 and a longitudinal guide frame 25, of which the support piece 24 is attached to the main frame 13.
It is supported via a hinge member 26 on one side. The guide frame 25 is attached to the support piece 24 via bolts 27, and is arranged with the longitudinal direction [direction A] inclined. A long hole 28 is formed in the longitudinal direction (direction A) of the guide frame 25, and is bored in the vertical direction (direction B in FIG. 2).
The elongated hole 28 allows the conveying surface 22 to be viewed from above.

In this way, a conveyance path 29 for the IC 20 or 21 to be slid is formed between the guide frame 25 of the upper guide body 23 and the conveyance surface 22 of the conveyance frame 14, and the IC 20 or 21 is moved along the conveyance path 29. It will be transported in the direction of arrow C along.

Of the ICs 20 or 21 conveyed through the conveyance path 29, the IC 20 is of a small size, and the IC 21 is of a large size. The IC 20 includes terminals 31 projecting above both sides of a main body 30. Also IC
21 similarly has terminals 33 above both sides of the main body 32.
It is equipped with a protruding state. The small-sized IC 20 is transported with each terminal 31 along each guide surface 34 of the guide frame 25. Therefore, the width between both guide surfaces 34 is equal to the width of the terminal 31 between both sides of the main body 30. The width T1 is assumed to be somewhat smaller than the width T1. As a result, the IC 20 slides on the transport surface 22 with each terminal 31 being guided by the guide surface 34, and is sequentially transported downward. On the other hand, the large-sized IC 21 is transported with each side of the main body 32 along two corresponding guide surfaces 36 of the recess 18 . Therefore, the width between both guide surfaces 36 is the width T2 between both side parts.
It is considered to be somewhat larger than As a result, the IC
21 is slid along each of the two sides while being guided by the guide surfaces 36, and is sequentially conveyed downward.

A measuring device 37 for the IC 20 or 21 to be transported is provided below the transport path 29, as shown in FIG.
or 21 stopping means 38 and a measuring section 39. The stopping means 38 comprises a cylinder device 40 supported by the main frame 13, which moves the piston rod 41 onto the conveying surface 2.
I want to be able to stand out in 2. As a result, the cylinder device 40 can sequentially stop the transported ICs 20 or 21 at the measurement position 42 by driving the piston rod 41 to protrude. On the other hand, the measuring section 39 is disposed at a position facing the conveying surface 22 at the measuring position 42 and includes a plurality of contacts 43 . The measuring unit 39 is movable up and down in the direction of arrow D, and the contact 43 is stopped at the measuring position 42.
Each terminal 31 or 33 of the IC 20 or 21 can be contacted or separated. The measurement unit 39 is capable of transmitting and receiving measurement signals to and from the IC 20 or 21 when the contactor 43 is in contact with each terminal 31 or 33. As a result, the IC 20 or 21 is stopped at the measurement position 42 by transmitting and receiving the measurement signal.
Each characteristic will be measured. The ICs 20 or 21 for which the measurement has been completed are sequentially transported downward.

The IC 20 or 21 conveying the conveyance path 29 is
It is slid downward one after another, and each characteristic is measured as described above. At this time, since a long hole 19 is formed in the recess 18, the IC 20 sliding on the conveying surface 22
Or it becomes possible to reduce the frictional resistance with 21. Furthermore, since dirt, dust, etc. on the conveyance surface 22 are also dropped into the elongated hole 19, IC20 or
This makes it possible to ensure a smooth sliding condition. Furthermore, the elongated hole 28 formed in the guide frame 25 makes it possible to visually check the conveyance surface 22, and thereby allows the IC 20 or 21 to slide.
This makes it possible to check for clogging, wear of the conveyance surface 22, etc.

The upper guide body 23 is supported by the main frame 13 via a hinge member 26 and is rotatable in the direction of arrow E. As a result, the upper guide body 23
2, it can be opened and closed freely. When it is confirmed that the sliding IC 20 or 21 is clogged or the conveyance surface 22 is worn out as described above, the upper guide body 23 is opened to the conveyance surface 22 as shown in FIG. As a result, IC20 or 2
It becomes possible to perform work to clear the blockage 1 and repair the conveyance surface 22. In addition, transport frame 1
4 can also be replaced with the upper guide body 23 in an open state, and this replacement is performed in a state where a constant sliding state cannot be obtained due to the conveying surface 22. In this way, when the work such as clearing the blockage of the IC 20 or 21 and repairing the conveying surface 22 is completed, the upper guide body 23 is closed as shown in FIG. 2, and the IC 20 or 21 is conveyed again. It happens.

Next, the operation of the above embodiment will be explained.

According to the IC transport device 10 according to the above embodiment,
Since the upper guide body 23 can be opened and closed with respect to the transport surface 22 of the transport rail 12, the transport path 29 can be easily opened. For this reason, IC20
21 is clogged in the conveyance path 29 or when the conveyance surface 2
It becomes possible to easily cope with the maintenance, etc. described in No. 2. Thereby, the IC 20 or 21 can be transported reliably and smoothly.

Furthermore, since the upper guide body 23 is separate from the conveyance rail 12 having a conveyance surface for the IC 20 or 21, even when the upper guide body 23 is moved away from the conveyance rail 12, the IC 20 or 21 is conveyed. The IC 20 or 21 remains supported by the rail 12, and the alignment of the IC 20 or 21 is not disturbed by the opening and closing movement of the upper guide body 23.

In addition, since the upper guide body 23 is separate from the conveyance rail 12 having the conveyance surface of the IC 20 or 21, the longitudinal conveyance surface of the conveyance rail 12 has a stepped portion due to the opening/closing structure of the upper guide body 23. Smooth transportation of the IC 20 or 21 is not hindered without any interruption.

FIGS. 4 and 5 are cross-sectional views showing an IC transport device according to a modification of the above embodiment. This IC
The transport device 50 includes a pair of upper guide bodies 51 above the transport surface 22. Each upper guide body 51
is a support piece 52 and a guide frame 5 having an L-shaped cross section.
3, of which each support piece 52 is supported on each side of the main frame 13 via a hinge member 54. Each guide frame 53
are attached to the corresponding support pieces 52 via bolts 55. A guide portion 56 is provided at the tip of each guide frame 53 and is capable of guiding the terminal 31 of the smaller IC 20 among the ICs 20 or 21 being slid. The width between each guide portion 56 is made somewhat smaller than the width T1 between the terminals 31 of the IC 20, and between each guide portion 56,
A gap 57 is formed that allows the transport surface 22 to be viewed. As a result, the IC 20 is slid on the conveyance surface 22 with the terminal 31 guided by the guide portion 56, and each IC 20 that is slid further
or 21 will be confirmed from the gap 57.

Each upper guide body 51 is rotatable in the direction of arrow F with respect to the main frame 13 by a hinge member 54, and as a result, each upper guide body 51 can be opened and closed with respect to the conveyance surface 22. IC sliding on conveyance surface 22
When clogging of 20 or 21 or wear of the conveying surface 22 is confirmed from the gap 57, each upper guide body 51 is opened to the conveying surface 22, as shown in FIG. As a result, in the open state, the IC
20 or 21 for clearing the jam or the conveyance surface 22
It becomes possible to repair the transport frame 14 and replace the transport frame 14. Other configurations and effects are as follows:
This is the same as in the previous embodiment.

[Effects of the Invention] As described above, according to the present invention, in an electronic component conveyance device, the conveyance rail can be removed when the conveyance path is clogged or during maintenance of the conveyance surface, etc., without interfering with the smooth conveyance of electronic components by the conveyance rail. This can be easily handled without disturbing the alignment of the electronic components above.

[Brief explanation of the drawing]

Fig. 1 is a partially cutaway side view showing an IC transfer device according to an embodiment of the present invention, Fig. 2 is an enlarged sectional view taken along the - line in Fig. 1, and Fig. 3 is an upper guide body. 4 and 5 are cross-sectional views showing an open state, and FIGS. 4 and 5 relate to a modification of the IC transport device shown in FIG. 1. FIG. 4 is a sectional view similar to FIG. 2, and FIG. FIG. 10, 50... IC transport device, 12... Transport rail, 20, 21... IC, 22... Transport surface,
23, 51... Upper guide body, 29... Conveyance path, 2
6, 54... Hinge member.

Claims (1)

[Scope of Claims] 1. A transport rail 12 comprising a longitudinal transport surface on which the electronic components 20, 21 can slide, and a transport rail 12 disposed along the transport rail 12 so as to cover the upper part of the transport surface. A transport path 29 is provided with upper guide bodies 23 and 51 that guide the upper parts of the electronic components 20 and 21 that slide while being supported by the transport rail 12, and is formed between the transport surface of the transport rail 12 and the upper guide bodies 23 and 51. In the electronic component transport device 10, 50 that can transport the electronic components 20, 21 in a sliding state along the transport rail 12, the upper guide bodies 23, 51 is supported so as to be freely openable and closable in the direction toward and away from the conveyance surface of the conveyance rail 12.