JPH0578818A - Formation of partial film - Google Patents

Formation of partial film

Info

Publication number
JPH0578818A
JPH0578818A JP23970791A JP23970791A JPH0578818A JP H0578818 A JPH0578818 A JP H0578818A JP 23970791 A JP23970791 A JP 23970791A JP 23970791 A JP23970791 A JP 23970791A JP H0578818 A JPH0578818 A JP H0578818A
Authority
JP
Japan
Prior art keywords
strip
masking
metal strip
metal
bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23970791A
Other languages
Japanese (ja)
Inventor
Masahiko Kato
正彦 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP23970791A priority Critical patent/JPH0578818A/en
Publication of JPH0578818A publication Critical patent/JPH0578818A/en
Pending legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To greatly improve workability, productivity and quality and to easily form multilayered films. CONSTITUTION:A metallic bar 18 and a masking bar 1 consisting of org. matter are tightly adhered in the atmosph. by an adhesive having a good release property. There is no need for aligning the metallic bar 18 and the tape 1 in a longitudinal direction and the tight adhesion thereof in an arbitrary position is possible. The two bars are sent into a primary discharging and preheating chamber 10 after the tight adhesion and are heated to clean a vapor deposition part by an ion bombardment treatment. A vapor deposited metal 14 of a 1st layer is formed on these tow bars 1, 18 by vacuum vapor deposition in a vapor deposition chamber 11 and a vapor deposited metal 15 of a 2nd layer is formed by ion plating. Both the 1st layer and the 2nd layer are partially formed on the metallic bar 18 via apertures 2 for the films and positioning apertures 3 formed on the masking bar 1. The bars are cooled down to ordinary temp. in a cooling chamber 13 after the formation of the vapor deposited films and are again taken out into the atm. The bars are separated to the metallic bar 18 and the masking bar 1 and the respective bars are taken up on a metallic bar take-up reel 6 and a masking bar take-up reel 7.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、金属条に必要な被膜を
部分的に連続形成する部分被膜の形成方法に関するもの
である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a partial coating for partially continuously forming a coating required on a metal strip.

【0002】[0002]

【従来の技術】従来、リードフレーム用金属条などの金
属条に部分的に金属被膜、たとえば、Al被膜を形成す
る手段として、気相法によるAlの部分形成膜法があ
り、バッチ式よりも、連続式が注目されている。この連
続式の部分形成膜法は、リードフレーム用金属条に必要
部分のみ開口した金属製のマスキング条を密着させ、そ
れらをスプロケットホールなどを用いて位置決めし、金
属条とマスキング条とを同一速度で被膜形成装置へ送り
ながら、ここで成膜を行い所定の被膜を得た後、金属条
とマスキング条とを分離して巻き取る。ここで、リード
フレーム用金属条とマスキング条とは、被膜形成装置の
前段でイオンボンバード処理に付するために真空槽内に
入っており、また、被膜形成部の後段でも取り出される
金属条とマスキング条とは、被膜形成部の品質を維持す
るため(酸化防止等のため)常温になるまでに同様に真
空槽内に入れられている(例えば、特開昭61−261
471号公報、特開昭62−243758号公報)。
2. Description of the Related Art Conventionally, as a means for partially forming a metal coating film, for example, an Al coating film on a metal strip such as a lead frame metal strip, there is a partial formation film method of Al by a vapor phase method, which is more than a batch system. , Continuous type is attracting attention. In this continuous partial film formation method, a metal masking strip that opens only in the necessary parts is brought into close contact with the metal strip for the lead frame, and they are positioned using a sprocket hole, etc., and the metal strip and the masking strip are moved at the same speed. While feeding the film to the film forming apparatus, the film is formed here to obtain a predetermined film, and then the metal strip and the masking strip are separated and wound up. Here, the metal strip for masking the lead frame and the masking strip are contained in the vacuum chamber for the ion bombardment treatment at the front stage of the film forming apparatus, and the metal strip and the masking strip taken out also at the latter stage of the film forming unit. In order to maintain the quality of the coating film forming portion (for preventing oxidation, etc.), the strip is placed in the vacuum chamber in the same manner until it reaches room temperature (for example, JP-A-61-261
471, and JP-A-62-243758).

【0003】[0003]

【発明が解決しようとする課題】しかし、上述した従来
の連続式部分形成膜法によると、リードフレーム用金属
条とマスキング条とが真空槽内に入っているため作業が
断続的にならざるを得なかった。被膜形成部に送り込む
金属条とマスキング条を交換する時、真空のリークや真
空引きがその都度必要となるからである。また、真空中
であるため、特に金属製マスキング条を使った場合に
は、金属条とマスキング条との摩擦係数の増大や、蒸着
時の加熱、蒸着熱の影響などにより、位置決め用のスプ
ロケットホールが変形したり、金属条にキズが付く等の
問題があった。また、位置決め用スプロケットホールの
変形によって、その後、金属条をリードフレームの形状
に打ち抜く際の位置ずれの要因ともなっていた。
However, according to the conventional continuous partial formation film method described above, the work must be intermittent because the metal strip for the lead frame and the masking strip are contained in the vacuum chamber. I didn't get it. This is because when exchanging the metal strip and the mask strip to be sent to the film forming portion, a vacuum leak or vacuuming is required each time. In addition, since it is in a vacuum, especially when a metal masking strip is used, the sprocket hole for positioning may increase due to an increase in the friction coefficient between the metal strip and the masking strip, heating during vapor deposition, and the effect of vapor deposition heat. There were problems such as deformation of the metal and scratches on the metal strip. Further, the deformation of the positioning sprocket holes has also been a cause of positional deviation when the metal strip is subsequently punched into the shape of the lead frame.

【0004】さらに金属製マスキング条は、マスキング
条製作に要するコストが高いという欠点があり、それゆ
えに再利用することを余儀なくされている。再利用のた
めには、所定回数使用した後、付着した被膜を剥離する
ために、剥離作業や、被膜の溶解、洗浄といった一連の
煩雑な作業を行わなければならず、そのため作業性の低
下、および洗浄にともなう排水処理、マスキング条の汚
染が金属条へ転写することによる品質の低下など、製造
する上での不都合もあった。
Further, the metal masking strip has a drawback that the cost required for producing the masking strip is high, and therefore it is forced to be reused. For reuse, after using a predetermined number of times, in order to peel off the adhered coating film, it is necessary to perform a series of complicated operations such as peeling work, dissolution of the coating film, and cleaning, which results in deterioration of workability. In addition, there are inconveniences in manufacturing, such as wastewater treatment associated with washing and contamination of masking strips transferred to metal strips, resulting in deterioration of quality.

【0005】本発明の目的は、気相法による連続式部分
成膜法における前記した従来技術の欠点を解消して、高
品質な部分被膜を形成することが可能な連続式部分被膜
の形成方法を提供することにある。
An object of the present invention is to solve the above-mentioned drawbacks of the prior art in the continuous partial film formation method by the vapor phase method and to form a high quality partial coating film. To provide.

【0006】[0006]

【課題を解決するための手段】本発明の連続式部分被膜
の形成方法は、部分的に被膜を形成すべき金属条と、金
属条に部分的被膜を形成させるための被膜用開口部、お
よび部分的被膜の被膜による位置決め用マークを形成す
るための位置決め用開口部を有する非金属製のマスキン
グ条とを備える。また、気密構造の被膜形成装置を備え
る。
SUMMARY OF THE INVENTION A method of forming a continuous partial coating film of the present invention comprises a metal strip to be partially coated, a coating opening for forming a partial coating on the metal strip, and A non-metallic masking strip having a positioning opening for forming a positioning mark by the coating of the partial coating. In addition, a film forming device having an airtight structure is provided.

【0007】大気中において、金属条とマスキング条と
を密着させつつ被膜形成装置へ連続的に送り込む。この
密着させた両条の送り込まれた被膜形成装置では、まず
マスキング条の開口部から覗いている金属条の部分被膜
形成部および位置決め用マーク部の洗浄を行う。次に、
両開口部を介して部分的被膜および位置決め用マークを
形成し、しかる後に、少なくも金属条を再度大気中に取
り出すようにしたものである。この場合、金属条とマス
キング条とを分離しつつ取り出すようにすることが望ま
しい。
In the atmosphere, the metal strip and the masking strip are brought into close contact with each other and continuously fed into the film forming apparatus. In the film forming apparatus in which the two strips are brought into close contact with each other, first, the partial film forming portion and the positioning mark portion of the metal strip which are seen through the opening of the masking strip are washed. next,
A partial coating and a positioning mark are formed through both openings, and then at least the metal strip is taken out into the atmosphere again. In this case, it is desirable to take out the metal strip and the masking strip while separating them.

【0008】[0008]

【作用】本発明では、金属条とマスキング条を大気中に
置いて送り出し、被膜形成装置で成膜後、ふたたび大気
中にて取り出すようにしている。このため、作業が連続
的に行える。また、金属条に部分的被膜とともに、被膜
による位置決め用マークを同時に形成するようにしたの
で、この位置決め用マークを位置検出することで、部分
的被膜形成の位置を正確に把握することができる。従っ
て、従来必要とされた、部分被膜形成の位置決定のため
の位置決め用スプロケットホールを金属条にも、マスキ
ング条にも設ける必要がなくなる。そして、非金属製の
マスキング条を使っており、かつ大気中で両条を密着さ
せるので、金属製マスキング条に比して金属条との摩擦
係数が減少し、蒸着時の加熱、蒸着熱の影響がなくな
る。
In the present invention, the metal strip and the masking strip are placed in the atmosphere and sent out, and after the film is formed by the film forming apparatus, they are taken out again in the atmosphere. Therefore, the work can be continuously performed. Further, since the positioning mark by the coating is formed at the same time as the partial coating on the metal strip, the position of the positioning coating can be accurately detected by detecting the position of the positioning mark. Therefore, it is not necessary to provide a sprocket hole for positioning, which has been conventionally required, for determining the position for forming a partial coating on both the metal strip and the masking strip. Since a non-metal masking strip is used and both strips are brought into close contact with each other in the atmosphere, the coefficient of friction with the metal strip is reduced compared to the metal masking strip, and heating during vapor deposition and vapor deposition heat The influence disappears.

【0009】[0009]

【実施例】以下、本発明をリードフレームの製造に適用
した実施例を図1および図2を用いて説明する。図2は
マスキング条を構成するマスキング条1を示す。このマ
スキング条1には、リードフレーム用金属からなる金属
条に部分的に被膜を形成するための被膜用開口部2と、
部分的被膜の位置を特定するための被膜による位置決め
用マークを形成するための位置決め用開口部3とが形成
されている。被膜用開口部2はマスキング条1の中央に
マークキング条の長さ方向に等間隔に設けられ、位置決
め用開口部3はマスキング条1の幅方向両側に各被膜用
開口部2に対して一対設けられる。このマスキング条1
は金属製ではなく、非金属で形成する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment in which the present invention is applied to manufacturing a lead frame will be described below with reference to FIGS. FIG. 2 shows a masking strip 1 which constitutes the masking strip. The masking strip 1 has a coating opening 2 for partially forming a coating on a metal strip made of a lead frame metal,
A positioning opening 3 for forming a positioning mark by the film for specifying the position of the partial film is formed. The coating openings 2 are provided in the center of the masking strip 1 at equal intervals in the length direction of the marking strip, and the positioning openings 3 are provided on both sides of the masking strip 1 in the width direction with respect to each coating opening 2. It is provided. This masking strip 1
Is made of non-metal, not metal.

【0010】具体的には、マスキング条1は、厚さ75
μm、幅35mmの有機物フィルムであるポリイミドテ
ープに、被膜用開口部2と位置決め用開口部3をプレス
などにより作成しておく。これと密着するリードフレー
ム用金属条には、厚さ0.15mm、幅35mmの42
%Ni−Fe合金条を使用する。
Specifically, the masking strip 1 has a thickness of 75
An opening 2 for coating and an opening 3 for positioning are formed in a polyimide tape, which is an organic film having a width of 35 μm and a width of 35 mm, by pressing or the like. The metal strip for the lead frame, which is in close contact with this, has a thickness of 0.15 mm and a width of 35 mm.
% Ni-Fe alloy strip is used.

【0011】図1は本発明方法を実施するための連続式
部分蒸着装置の一例を示す。本装置は、金属条18とマ
スキング条1とを張合わせて密着して送り出す送出し部
31と、金属条18に部分的に被膜を形成する被膜形成
装置32と、金属条18とマスキング条1とを分離して
巻き取る巻取り部33とから構成される。
FIG. 1 shows an example of a continuous partial vapor deposition apparatus for carrying out the method of the present invention. The apparatus comprises a delivery section 31 for adhering the metal strip 18 and the masking strip 1 in close contact with each other, a film forming device 32 for partially forming a film on the metal strip 18, the metal strip 18 and the masking strip 1. And a winding portion 33 that separates and winds.

【0012】送出し部31は大気中に晒された状態で設
置され、金属条送りリール4に巻回された金属条18
と、マスキング条送りリール5に巻回されたマスキング
条1とを、ガイドローラ8、8によるガイドにより一対
の張付けローラ9、9間に導き、ここで両条18、1を
密着させて被膜形成装置32に送り出す。
The delivery section 31 is installed in a state of being exposed to the atmosphere, and the metal strip 18 wound around the metal strip feed reel 4 is provided.
And the masking strip 1 wound around the masking strip feed reel 5 are guided between the pair of tensioning rollers 9, 9 by the guide by the guide rollers 8, 8 and the strips 18, 1 are brought into close contact with each other to form a film. Send to device 32.

【0013】被膜形成装置32は、カスケード接続され
た気密ないし真空の多段処理室(図示例では4段の処理
室)から構成される。第1段目〜第3段目の各部屋には
加熱用のヒータ17が備えられる。第1段目は図示しな
いイオンボンバード処理によって蒸着部、すなわち部分
的被膜形成部および位置決め用マーク部のクリーニング
を行う一次排気・予熱室10を構成する。第2段目およ
び第3段目は、それぞれルツボ16、16に収容した第
1層目の第一蒸着物14と第2層目の第二蒸着物15と
を順次蒸着して金属条18に部分的被膜および位置決め
用マークを形成する第一蒸着室11と第二蒸着室12を
構成する。これら第2段目、第3段目は、蒸着させる被
膜形成部の品質に応じ、一次排気部よりも、より高真空
にしたり、または反応ガス(Arガス、N2 ガス等)を
導入することも可能である。第4段目は前段にて加熱さ
れた両条を常温まで冷却する冷却室13を構成する。
The film forming apparatus 32 is composed of an airtight or vacuum multistage processing chamber (in the illustrated example, four processing chambers) connected in cascade. A heater 17 for heating is provided in each of the first-stage to third-stage rooms. The first stage constitutes a primary exhaust / preheating chamber 10 for cleaning the vapor deposition portion, that is, the partial coating film forming portion and the positioning mark portion by an ion bombarding process (not shown). In the second and third steps, the first vapor deposition material 14 of the first layer and the second vapor deposition material 15 of the second layer housed in the crucibles 16 and 16 are sequentially vapor-deposited to form metal strips 18. A first vapor deposition chamber 11 and a second vapor deposition chamber 12 for forming a partial coating and a positioning mark are configured. In the second and third stages, depending on the quality of the film forming part to be vapor-deposited, the vacuum should be made higher than that in the primary exhaust part, or a reaction gas (Ar gas, N 2 gas, etc.) should be introduced. Is also possible. The fourth stage constitutes a cooling chamber 13 for cooling both the strips heated in the previous stage to room temperature.

【0014】巻取り部33は、送出し部31と同様に大
気中に設置され、被膜形成装置32から取り出される密
着した金属条18、マスキング条1を一対のガイドロー
ラ8、8に導いた後分離させて、後段のガイドローラ
8、8のガイドにより金属条巻取りリール6とマスキン
グ条巻取りリール7とにそれぞれ巻き取る。これら金属
条巻取りリール6およびマスキング条巻取りリール7を
駆動原とし、両条を連続的に繰り出し、巻き取るように
してある。
The winding section 33 is installed in the atmosphere similarly to the feeding section 31, and guides the closely contacted metal strip 18 and masking strip 1 taken out from the film forming device 32 to the pair of guide rollers 8, 8. After being separated, the metal strip take-up reel 6 and the masking strip take-up reel 7 are respectively wound by the guides of the guide rollers 8 at the latter stage. The metal strip take-up reel 6 and the masking strip take-up reel 7 are used as driving sources to continuously feed and wind both strips.

【0015】さて、上記のような構成において、金属条
18とマスキング条1とをそれぞれ金属条送りリール4
とマスキング条送りリール5とに巻回して、ガイドロー
ラ8と張付けローラ9に通す。このとき、金属条18と
マスキング条1は、幅方向についての位置合せは必要と
するが、長さ方向については特別な位置合せは必要とせ
ず、任意の位置で張合わせることができる。部分的被膜
に加えて位置決め用マークが後に金属条に形成され、こ
のマークが位置合せ機能を発揮するからである。張付け
ローラ9によって金属条18とマスキング条1とは張り
合わせられるが、このとき、マスキング条1は金属条1
8に容易に剥離できる接着剤を使う。密着後、被膜形成
装置32の第1段目、すなわち、一次排気・予熱室10
へ送り込み、ヒータ17によって加熱して図示しないイ
オンボンバード処理によって両開口部2、3を介して蒸
着部のクリーニングを行う。
Now, in the above structure, the metal strip 18 and the masking strip 1 are respectively fed to the metal strip feed reel 4
And the masking strip feed reel 5 and the guide roller 8 and the tension roller 9 are passed. At this time, the metal strip 18 and the masking strip 1 need to be aligned in the width direction, but need not be specially aligned in the length direction and can be attached at any position. This is because, in addition to the partial coating, a positioning mark is later formed on the metal strip, and this mark exerts an alignment function. The metal strip 18 and the masking strip 1 are bonded to each other by the sticking roller 9. At this time, the masking strip 1 is the metal strip 1.
Use an adhesive that can be easily peeled off. After the adhesion, the first stage of the film forming apparatus 32, that is, the primary exhaust / preheating chamber 10
And is heated by the heater 17 to clean the vapor deposition portion through both openings 2 and 3 by an ion bombarding process (not shown).

【0016】その後、張合わせた両条18、1は第一蒸
着室11に送られ、第1層目の蒸着金属14であるTi
の真空蒸着を施されて厚さ0.2μm被膜が形成され
る。続いて第二蒸着室12に送られ、第2層目の蒸着金
属15であるAlがイオンプレーティングにより厚さ2
μmの被膜が形成される。この第1層目および第2層目
の被膜は共に、マスキング条1に形成した被膜用開口部
2および位置決め開口部3を介して金属条18に部分的
に形成される。
After that, both the bonded strips 18 and 1 are sent to the first vapor deposition chamber 11 and Ti which is the vapor deposition metal 14 of the first layer.
Vacuum deposition is performed to form a 0.2 μm thick coating film. Then, it is sent to the second vapor deposition chamber 12 and Al, which is the vapor deposition metal 15 of the second layer, has a thickness of 2
A μm film is formed. Both the first-layer coating and the second-layer coating are partially formed on the metal strip 18 through the coating opening 2 and the positioning opening 3 formed in the masking strip 1.

【0017】被膜形成後、最終段の冷却室13に送られ
常温まで冷却された後、被膜形成装置32から再び大気
中に出て、ガイドローラ8を通り、金属条18とマスキ
ング条1は剥離され、それぞれ金属条巻取りリール6と
マスキング条巻取りリール7に巻き取られる。
After the film is formed, it is sent to the cooling chamber 13 at the final stage and cooled to room temperature, and then the film forming device 32 again comes out into the atmosphere, passes through the guide roller 8, and the metal strip 18 and the masking strip 1 are separated. And is wound on the metal strip winding reel 6 and the masking strip winding reel 7, respectively.

【0018】このようにして巻き取られた金属条18に
は、図3に示すように、部分的被膜となるリード部用蒸
着膜19および位置決め用蒸着膜20が連続的に施され
ることになる。この金属条18をリードフレームに形成
するために図示しないプレス打ち抜き工程に送り、セン
サにて位置決め用蒸着膜20を読み取る。そして、図4
に示すように、その部分に打ち抜き用位置決め穴22を
打ち抜く。その後、この打ち抜き用決め穴22を使用
し、インナーリード23の先端にリード部用蒸着膜19
が残るようにリードフレームの形状に打ち抜いてリード
フレーム21とする。このように、位置決め用蒸着膜2
0に基づいて打ち抜き用位置決め穴22を後から打ち抜
くことができる(自己整合が取れる)ため、前述したよ
うに金属条18とマスキング条1との張合わせの際の位
置合せは不要となる。また、マスキング条1は、金属条
18に接着剤を介して密着されているため、リード部用
蒸着膜19の寸法制度を高めることが出来、リードフレ
ーム21に打ち抜き後も精度のよいリードフレームを得
ることが出来る。
As shown in FIG. 3, the vapor deposition film 19 for the lead portion and the vapor deposition film 20 for positioning, which are partial coatings, are continuously applied to the metal strip 18 thus wound up. Become. In order to form the metal strip 18 on the lead frame, the metal strip 18 is sent to a press punching step (not shown), and the positioning vapor deposition film 20 is read by a sensor. And FIG.
As shown in, a punching positioning hole 22 is punched in that portion. After that, the punching hole 22 is used, and the vapor deposition film 19 for the lead portion is attached to the tip of the inner lead 23.
Are punched out to form the lead frame 21. Thus, the deposition film 2 for positioning
Since the punching positioning hole 22 can be punched out later on the basis of 0 (self-alignment can be achieved), it is not necessary to align the metal strip 18 with the masking strip 1 as described above. Further, since the masking strip 1 is adhered to the metal strip 18 via the adhesive, the dimensional accuracy of the vapor deposition film 19 for the lead portion can be improved, and the lead frame 21 having a high accuracy even after being punched into the lead frame 21 can be obtained. You can get it.

【0019】以上述べたように本実施例によれば、リー
ドフレーム用金属条とマスキング条とは大気中で交換可
能で、かつ大気中で密着するようになっているため、作
業性、生産性が従来の連続式装置に比較し、約3倍も向
上させることができる。また、金属条に被膜用開口部の
他に位置決め用開口部を設けて、金属条に本来必要とな
る部分的被膜とともに、被膜による位置決め用マークを
同時に形成するようにしてある。このため、リードフレ
ーム形状の打ち抜きに必要な打ち抜き用位置決め穴を容
易に形成できる。従って、金属条での部分被膜形成の位
置決定のための位置決め用のスプロケットホールを金属
条にも、マスキング条にも設ける必要がなくなり、当
然、そのスプロケットホールの変形や、その変形による
金属条へのキズ生成等の問題がなくなる。そして、大気
中で密着させるとともに、非金属製のマスキング条を使
うようにしているので、金属製マスキング条に比して金
属条との摩擦係数が減少し、蒸着時の加熱、蒸着熱の影
響がなくなり、品質を大幅に向上させることができる。
また、蒸着室を増設することにより多層膜の成膜も可能
となる。
As described above, according to this embodiment, the metal strip for the lead frame and the masking strip are replaceable in the atmosphere and are in close contact with each other in the atmosphere, so that workability and productivity are improved. Can be improved about 3 times as compared with the conventional continuous type device. In addition, the metal strip is provided with a positioning opening in addition to the coating opening so that a positioning mark formed by the coating is formed simultaneously with a partial coating originally required for the metal strip. Therefore, the punching positioning hole necessary for punching the lead frame shape can be easily formed. Therefore, it is not necessary to provide a sprocket hole for positioning for determining the position for forming a partial coating on the metal strip, neither on the metal strip nor on the masking strip. Naturally, the sprocket hole is deformed or the metal strip is deformed by the deformation. Problems such as scratches are eliminated. In addition, since the masking strips made of non-metal are used in close contact with each other in the atmosphere, the friction coefficient with the metal strips is reduced compared to the masking strips made of metal. Can be eliminated, and the quality can be greatly improved.
In addition, it is possible to form a multilayer film by adding an evaporation chamber.

【0020】なお、上記実施例ではプレス打ち抜きにて
リードフレームを形成する場合について説明したが、部
分被膜を成膜後、エッチング法にてリードフレーム21
を形成することも可能であり、この場合、より細密なリ
ードフレームを製造することが出来るが、実用上問題は
ないものの蒸着膜に若干の汚染が認められることが分っ
ている。また、真空蒸着およびイオンプレーティング法
により成膜した場合について説明したが、本発明は他の
気相成膜法でも可能である。また、蒸着金属の加熱、溶
融、蒸発させる手段として本実施例では電子ビームを使
用したが、抵抗加熱などその他の方法も可能である。ま
た、マスキング条は無機物系でも可能である。さらに、
3層膜、4層膜等、蒸着室を増設することにより、より
多層の成膜を、またより複雑な成膜を行うことが容易
で、その場合でも生産性が損われることはない。さら
に、金属条はリードフレーム用金属条に限定されるもの
ではなく、本発明は部分被膜を必要とする他の金属条に
も適用できる。
In the above embodiment, the case where the lead frame is formed by press punching has been described. However, after forming the partial coating film, the lead frame 21 is formed by the etching method.
It is also possible to form a lead frame. In this case, a finer lead frame can be manufactured, but it has been found that some pollution is recognized in the deposited film although there is no practical problem. Further, although the case where the film is formed by the vacuum vapor deposition and the ion plating method has been described, the present invention can be applied to other vapor phase film forming methods. Further, although an electron beam was used as a means for heating, melting, and evaporating the vapor-deposited metal in this embodiment, other methods such as resistance heating are also possible. Further, the masking strip can be made of an inorganic material. further,
By increasing the number of vapor deposition chambers such as a three-layer film and a four-layer film, it is possible to easily form more multilayer films and more complicated films, and even in that case, productivity is not impaired. Furthermore, the metal strip is not limited to the lead frame metal strip, and the present invention can be applied to other metal strips that require a partial coating.

【0021】[0021]

【発明の効果】本発明によれば次の効果が得られる。According to the present invention, the following effects can be obtained.

【0022】(1)大気中で金属条とマスキング条の交
換および密着が可能となったため、作業性、生産性が従
来の連続式装置に比較し、大幅に向上した。
(1) Since the metal strips and the masking strips can be exchanged and adhered to each other in the atmosphere, workability and productivity are greatly improved as compared with the conventional continuous type apparatus.

【0023】(2)金属条における部分的被膜の位置決
めはマスキング条に設けた位置決め用開口部により金属
条に同時形成される位置決め用マークを利用するように
したため、金属条とマスキング条の位置合せが不要とな
り、従って、従来位置合せのために必要とされたスプロ
ケットホールを金属条およびマスキング条の何れにも設
ける必要がなくなる。
(2) Since the positioning of the partial coating on the metal strip uses the positioning marks formed on the metal strip at the same time by the positioning openings provided on the masking strip, the metal strip and the masking strip are aligned. Therefore, it is not necessary to provide the sprocket holes conventionally required for alignment on both the metal strip and the masking strip.

【0024】(3)マスキング条を有機物等の非金属製
としたことにより、マスキング条と金属条との摩擦がな
くなり、キズ等の不良を可及的に低減することができ
る。
(3) Since the masking strip is made of a non-metallic material such as an organic substance, friction between the masking strip and the metal strip is eliminated, and defects such as scratches can be reduced as much as possible.

【0025】(4)非金属製のマスキング条は金属製マ
スキング条と比較し低価格であるため、数回程度で使い
捨てとすることが可能となり、マスキング条の洗浄など
が不要となる。
(4) Since the non-metal masking strip is less expensive than the metal masking strip, it can be disposable after several times, and cleaning of the masking strip becomes unnecessary.

【0026】このように本発明によれば、高品質の部分
的被膜を金属条に形成することができる。
As described above, according to the present invention, a high quality partial coating can be formed on the metal strip.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の部分被膜の形成方法を実施する連続式
部分蒸着装置の一例を示す概略構成図。
FIG. 1 is a schematic configuration diagram showing an example of a continuous partial vapor deposition apparatus for carrying out a partial coating film forming method of the present invention.

【図2】本実施例によるマスキング条の一部平面図。FIG. 2 is a partial plan view of a masking strip according to this embodiment.

【図3】本実施例によるリードフレーム用金属条の一部
平面図。
FIG. 3 is a partial plan view of a lead strip metal strip according to the present embodiment.

【図4】本実施例によるリードフレームの一部平面図。FIG. 4 is a partial plan view of the lead frame according to the present embodiment.

【符号の説明】[Explanation of symbols]

1 マスキング条 2 被膜用開口部 3 位置決め用開口部 10 一次排気・予熱室 11 第一蒸着室 12 第二蒸着室 13 冷却室 14 第一蒸着物 15 第二蒸着物 16 ルツボ 17 ヒータ 18 金属条 19 リード部用蒸着膜(部分的被膜) 20 位置決め用蒸着膜(位置決め用マーク) 21 リードフレーム 22 打ち抜き用位置決め穴 1 Masking Strips 2 Coating Openings 3 Positioning Openings 10 Primary Exhaust / Preheat Chamber 11 First Deposition Chamber 12 Second Deposition Chamber 13 Cooling Room 14 First Deposition Material 15 Second Deposition Material 16 Crucible 17 Heater 18 Metal Strip 19 Vapor deposition film for lead (partial coating) 20 Vapor deposition film for positioning (positioning mark) 21 Lead frame 22 Positioning hole for punching

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】部分的に被膜を形成すべき金属条と、金属
条に部分的被膜を形成させるための被膜用開口部、およ
び被膜による部分的被膜の位置決め用マークを形成する
ための位置決め用開口部を有する非金属製のマスキング
条とを備え、前記金属条とマスキング条とを大気中にて
密着させつつ気密室へ連続的に送り込み、前記気密室に
て金属条の部分的被膜形成部および位置決め用マーク部
の洗浄を行った後、前記マスキング条の両開口部を介し
て部分的被膜および位置決め用マークを金属条に形成
し、しかる後に金属条を大気中に取り出すようにしたこ
とを特徴とする部分被膜の形成方法。
1. A metal strip to be partially coated, a coating opening for forming a partial coating on the metal strip, and a positioning for forming a positioning mark for the partial coating by the coating. A non-metallic masking strip having an opening, and the metal strip and the masking strip are continuously fed into an airtight chamber while being brought into close contact with each other in the atmosphere, and a partial film forming portion of the metal strip is formed in the airtight chamber. After cleaning the positioning mark portion, the partial coating and the positioning mark are formed on the metal strip through both openings of the masking strip, and then the metal strip is taken out into the atmosphere. A method for forming a characteristic partial coating film.
JP23970791A 1991-09-19 1991-09-19 Formation of partial film Pending JPH0578818A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23970791A JPH0578818A (en) 1991-09-19 1991-09-19 Formation of partial film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23970791A JPH0578818A (en) 1991-09-19 1991-09-19 Formation of partial film

Publications (1)

Publication Number Publication Date
JPH0578818A true JPH0578818A (en) 1993-03-30

Family

ID=17048732

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23970791A Pending JPH0578818A (en) 1991-09-19 1991-09-19 Formation of partial film

Country Status (1)

Country Link
JP (1) JPH0578818A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5429843A (en) * 1991-11-21 1995-07-04 Nisshin Steel Co., Ltd. Vapor deposition for formation of plating layer
DE19901088A1 (en) * 1999-01-14 2000-07-20 Leybold Systems Gmbh Device for treating a band-shaped substrate with a gas
WO2003046246A1 (en) * 2001-11-27 2003-06-05 Nec Corporation Device and method for vacuum film formation
WO2003069016A3 (en) * 2002-02-14 2004-01-29 3M Innovative Properties Co In-line deposition processes for circuit fabrication
EP1918412A1 (en) * 2006-10-23 2008-05-07 General Electric Company Apparatus for selective deposition of graded coatings
US8137464B2 (en) 2006-03-26 2012-03-20 Lotus Applied Technology, Llc Atomic layer deposition system for coating flexible substrates
US8187679B2 (en) 2006-07-29 2012-05-29 Lotus Applied Technology, Llc Radical-enhanced atomic layer deposition system and method
US8637117B2 (en) 2009-10-14 2014-01-28 Lotus Applied Technology, Llc Inhibiting excess precursor transport between separate precursor zones in an atomic layer deposition system

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5429843A (en) * 1991-11-21 1995-07-04 Nisshin Steel Co., Ltd. Vapor deposition for formation of plating layer
DE19901088B4 (en) * 1999-01-14 2008-11-27 Applied Materials Gmbh & Co. Kg Apparatus for treating a belt-shaped substrate with a gas
DE19901088A1 (en) * 1999-01-14 2000-07-20 Leybold Systems Gmbh Device for treating a band-shaped substrate with a gas
WO2003046246A1 (en) * 2001-11-27 2003-06-05 Nec Corporation Device and method for vacuum film formation
US7462244B2 (en) 2001-11-27 2008-12-09 Nec Corporation Device and method for vacuum film formation
CN1332060C (en) * 2001-11-27 2007-08-15 日本电气株式会社 Device and method for vacuum film formation
JP2005517810A (en) * 2002-02-14 2005-06-16 スリーエム イノベイティブ プロパティズ カンパニー In-line deposition for circuit manufacturing
US7297361B2 (en) 2002-02-14 2007-11-20 3M Innovative Properties Company In-line deposition processes for circuit fabrication
WO2003069016A3 (en) * 2002-02-14 2004-01-29 3M Innovative Properties Co In-line deposition processes for circuit fabrication
US8137464B2 (en) 2006-03-26 2012-03-20 Lotus Applied Technology, Llc Atomic layer deposition system for coating flexible substrates
US9238868B2 (en) 2006-03-26 2016-01-19 Lotus Applied Technology, Llc Atomic layer deposition method for coating flexible substrates
US9469901B2 (en) 2006-03-26 2016-10-18 Lotus Applied Techonology, Llc Atomic layer deposition method utilizing multiple precursor zones for coating flexible substrates
US8187679B2 (en) 2006-07-29 2012-05-29 Lotus Applied Technology, Llc Radical-enhanced atomic layer deposition system and method
EP1918412A1 (en) * 2006-10-23 2008-05-07 General Electric Company Apparatus for selective deposition of graded coatings
US7976899B2 (en) 2006-10-23 2011-07-12 General Electric Company Methods for selective deposition of graded materials on continuously fed objects
US8637117B2 (en) 2009-10-14 2014-01-28 Lotus Applied Technology, Llc Inhibiting excess precursor transport between separate precursor zones in an atomic layer deposition system

Similar Documents

Publication Publication Date Title
US7323093B2 (en) Producing method of flexible wired circuit board
JP4336869B2 (en) Vacuum film forming apparatus, vacuum film forming method, and battery electrode manufacturing method
US4964945A (en) Lift off patterning process on a flexible substrate
JP4985227B2 (en) Vapor deposition mask, vapor deposition mask device, vapor deposition mask manufacturing method, vapor deposition mask device production method, and vapor deposition mask sheet-like member production method
JPH0578818A (en) Formation of partial film
KR20010086385A (en) Device and method for lamination
JP2009052073A (en) Sheet provided with vapor deposition mask, method for manufacturing device provided with vapor deposition mask, and method for manufacturing sheet provided with vapor deposition mask
JPH0424435B2 (en)
JP2003133230A (en) Semiconductor treatment device of flexible substrate
JP2003335443A (en) Exposing device for strip-shaped work
RU2019573C1 (en) Method of continuous selective deposition of cover on belt-type base in vacuum
TWI849108B (en) Vacuum film forming device and vacuum film forming method
JPH01312547A (en) Method and device for exposing shadow mask
JPS62243758A (en) Partial coating method
JP2615217B2 (en) Continuous vacuum deposition equipment
JPS6373654A (en) Manufacture of lead frame
JPS62228490A (en) Method for laminating and processing thin metallic plates
JP2002222836A (en) Laminated belt for tab, its manufacturing method, printed wiring board made thereof, and semiconductor device
JPS6192431A (en) Manufacture of magnetic recording medium
JPS596372A (en) Method and apparatus for partial vacuum vapor deposition of metal strip
JPH1120114A (en) Method and equipment for sticking film
JPS61261471A (en) Partial coating method
JP7102989B2 (en) Anti-adhesive film material and film forming equipment equipped with it
JPH07321155A (en) Manufacture of tab tape carrier
JPS61278032A (en) Method and device for manufacturing magnetic recording medium