JPH0577997U - Chip circuit component mounting device - Google Patents

Abstract

(57) [Summary] (Modified) [Purpose] After the template is applied to the lower surface of the distributor and the chip-shaped circuit components are stored in the storage section, make sure that the template is separated from directly under the distributor. Ensure reliable operation of the mounting device. [Constitution] After the template 6 is inserted directly below the distributor 2 and pressed against the lower surface of the distributor 2 by the rise of the vacuum case 4, when the vacuum case 4 descends, the pin 32 of the pin plunger 31 springs. The elastic force of 33 pushes the upper surface of the template 6, and thus the template 6 is reliably separated from the lower surface of the distributor 2. For this reason,
Template 6 only temporarily 2
The vacuum case 4 is not left on the side, and is lowered as the vacuum case 4 is lowered, so that the template 6 does not collide with the template frame 65 and is correctly placed on the template frame 65.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an improvement for reliably moving a chip-shaped circuit component and mounting it on a circuit board in a device for mounting a chip-shaped circuit component on a circuit board.

[0002]

[Prior Art]

 Conventionally, when a chip-shaped circuit component is mounted at a predetermined position on a circuit board, it has been carried out as follows using an automatic mounting device. That is, the chip-shaped circuit components that are stored in bulk in multiple containers are taken out one by one into the multiple guide tubes that are piped to the distributor, and the concave-shaped storage that is formed at the predetermined position on the template is taken out. Send to each department and collect there. The storage portion is arranged in accordance with the position where each chip-shaped circuit component is mounted on the circuit board. Then, the chip-shaped circuit component accommodated in the accommodating portion is moved and mounted on the circuit board by the component moving means having the suction head while maintaining the relative position when the chip-shaped circuit component is accommodated. As a result, each of the chip-shaped circuit components is mounted at a predetermined position on the circuit board. An adhesive is applied to the circuit board in advance at the position where the chip-shaped circuit component is to be mounted, and the mounted circuit component is soldered while the circuit component is temporarily fixed with this adhesive.

FIG. 6 shows a state in which the template 6 is inserted immediately below the distributor 2 to receive the chip-shaped circuit component in the storage portion of the template. That is, the template 6 is placed on the template frame 65 and inserted directly below the distributor 2. The distributor 2 is formed by installing a guide tube 21 between plate-shaped frames 22 and 23 arranged in parallel and facing each other vertically. The chip-shaped circuit parts sent from the container 1 through the tube 10 are It is guided to a predetermined position through the guide tube 21. At this time, the vacuum case 4 arranged below the template 6 rises and is applied to the lower surface of the template 6, and the template 6 is pushed up by the vacuum case 4 from the template frame 65, and the lower frame It is pressed against the lower surface of 22. At this time, the positioning pin 62 projecting from the template 6 is fitted into the positioning hole (not shown in FIGS. 6 and 7) provided in the lower frame 22 of the distributor 2, and the template plate 6 and the distributor 6 are distributed. The mutual positioning with the target 2 is performed. In this state, by depressurizing the vacuum case 4, the lower surface side of the template 6 is maintained at a negative pressure. Then, the chip-shaped circuit parts a falling through the guide tube 21 of the distributor 2 are received in respective predetermined storage portions on the template 6.

After that, the vacuum case 4 descends, the template 6 descends by its own weight, and the template 6 rests on the template frame 65 again. By the movement of the template frame 65, the chip-shaped circuit components sent to the suction head side and stored in the storage portion there are mounted on the circuit board.

[0005]

[Problems that the device is trying to solve]

 However, in the above-mentioned conventional chip-shaped circuit component mounting device, the positioning pin 62 for aligning the template 6 and the distributor 2 and the positioning hole on the template 2 side into which the positioning pin 62 is fitted are made with high precision, and the position between them is high. The play is small. Therefore, if dust or the like adheres to them, the positioning pin 62 and the positioning hole cannot be fitted and removed smoothly, and when the vacuum case 4 descends, the ten plate 6 sticks below the distributor 2. It may not fall for a while as it is. Then, the template 6 freely falls onto the template frame 65 after the lowering operation of the vacuum case 4, and in many cases, the template 6 collides with the template frame 65. Therefore, for example, the template 6 is not properly mounted on the template frame 6 as shown in FIG. 7, or the chip-shaped circuit components housed in the housing part pop out from the inside due to an impact. Then, there is a problem that the mounting device stops or a part of the chip-shaped circuit component mounted on the circuit board is missing, that is, a problem such as a so-called defective product occurs.

Therefore, the present invention has been made to solve the above-mentioned problems, and an object thereof is to apply a template to the lower surface of a distributor and to store a chip-shaped circuit component in a storage portion, The object of the present invention is to provide a chip-shaped circuit component mount device in which the mount device is reliably operated from directly below the distributor so that the mount device can be reliably operated.

[0007]

[Means for Solving the Problems]

 That is, in order to achieve the above-mentioned object, the present invention provides a plurality of containers 1, 1 ... In which chip-shaped electronic components are stored in a bulk shape, and a chip-shaped electronic component accommodated in each container 1, 1. Distributor 2 that distributes and supplies, a template 6 on which a housing portion that receives the chip-shaped electronic components supplied from distributor 2 is arranged at a predetermined position, and template 6 that is moved up and down 2, a vacuum case 4 that presses the lower surface of the template 6 and separates it, a conveyor 7 that conveys the circuit board 9, and electronic components stored in the storage portion of the template 6 are sucked from the storage portion, and the circuit board 9 In a chip-shaped electronic component mount device equipped with a suction head 8 mounted on, a pin plunger 31 is provided on the lower surface of the distributor 2. A pin-shaped electronic component mounting device characterized in that the pin 32 at the tip of the plunger 31 urges the elastic force of a spring 33 in the direction in which it pushes the template 6 placed under the distributor 2 downward. suggest.

[0008]

[Action]

 In the chip-shaped circuit component mounting device of the present invention, when the template 6 is inserted immediately below the distributor 2 and is pressed against the lower surface of the distributor 2 by the vacuum case 4 being raised, the vacuum case 4 is lowered. Since the pin 32 of the pin plunger 31 is pushed out by the elastic force of the spring 33 and pushes the upper surface of the template 6 downward, the template 6 is reliably separated from the lower surface of the distributor 2. Therefore, only the template 6 is not temporarily left on the distributor 2 side, and the template case 6 descends as the vacuum case 4 descends, the template 6 does not collide with the template frame 65, and the template frame 65 does not collide properly. On top of.

[0009]

【Example】

 Next, embodiments of the present invention will be specifically described with reference to the drawings. FIG. 3 shows an outline of the entire mounting device for a chip-shaped circuit component according to an embodiment of the present invention. That is, a plurality of containers 1 in which chip-shaped circuit components are stored in a bulk form are arranged, and a delivery section 11 which is an escapement is connected to the containers 1 via a tube 10. Further, the distributor 2 is arranged below the sending unit 11.

The distributor 2 includes an upper frame 23 fixed below the sending portion 11, a lower frame 22 arranged in parallel thereunder, and having the lower surface side to which the template 6 is detachably attached. Between the upper frame 23 and the lower frame 22, flexible guide tubes 21, 21 ... Which guide and convey the chip-shaped circuit component are provided.

Below the lower frame 22, the template 6 placed on the template frame 65 is inserted. The template 6 is provided with a pair of positioning pins 62 on both sides, and a guide case that serves as a storage portion for the chip-shaped circuit components on the base board 60 according to the mounting position of the chip-shaped circuit components on the circuit board. 61 are provided. These guide cases 61 are arranged on the lower side when the template 6 is inserted immediately below the distributor 2 and further positioned at a predetermined position with respect to the distributor 2 by the positioning pins 62 as described later. The guide tube 21 connected to the frame 22 is arranged just below the lower end of the guide tube 21.

When the template 6 is inserted directly below the distributor 2, the vacuum case 4 is placed under the template 6 and the vacuum case 4 is further raised so that the template 6 is below the distributor 2. It is applied to the lower surface of the frame 22. At the same time, the vacuum case 4 is depressurized and the lower surface side of the template 6 is maintained at a negative pressure. At this time, as shown in FIG. 5, the positioning pin 62 projecting from the template 6 is fitted into the positioning hole 24 provided in the lower frame 22 of the distributor 2, and the template 6 and the distributor 2 are separated from each other. The mutual positioning is performed. In this state, when the vacuum case 4 is depressurized, air is drawn from the guide tube 21 through the through hole formed at the bottom of the guide case 61 to the back surface side of the template 6, and an air flow is formed. Here, the chip-shaped circuit component a sent from each container 1 side is sent through the guide tube 21 of the distributor 2 by the gravity and the flow of the air, and the guide case 61 of the template 6 is sent. Is housed inside.

As shown in FIG. 3, the template 6 placed on the template frame 65 is moved by a slide mechanism 66 between directly below the distributor 2 and directly below the suction head 8. As a result, the template 6 directly below the distributor 2 receives the chip-shaped circuit components in the predetermined guide cases 61, and then the template 6 moves to below the suction head 8. Then, the chip-shaped circuit components received in the guide case 61 are adsorbed by the set nozzles of the suction head 8, respectively. After that, the template is withdrawn from under the suction head 8, and the circuit board 9 conveyed by the conveyor 7 is inserted under the head 8. Then, the suction head 8 mounts the chip-shaped circuit component sucked on the tip of the set nozzle on the circuit board 9.

Here, in the present invention, the pin plunger 31 is provided so as to project from the lower surface of the lower frame 22 of the distributor 2. In the illustrated embodiment, as shown in FIGS. Pin plungers 31 are provided on both sides of the positioning hole 24 into which the positioning pin 62 on the template 6 side is fitted. As shown in FIG. 5, this pin plunger 31 has a pin 32 movably attached to the lower end of a cylinder case 32 vertically planted in the lower frame 22 of the distributor 2, and the pin plunger 31 of the cylinder case 32. A screw-in type sealing member 34 is screwed into the upper surface side to close the upper surface, and a compression spring 33 is mounted between the sealing member 34 and the pin 32. The elastic force of the compression spring 33 urges the pin 32 in a direction of pushing the pin 32 downward from the lower end of the cylinder case 32, and the flange-shaped portion of the upper end side of the pin 32 hits the lower end opening edge of the cylinder case 32. The compression spring 33 pushes down to that point and projects from the lower end of the cylinder case 32. The spring 33 and the pin 32 can be replaced by removing the sealing member 34, and the resilience of the compression spring 33 can be adjusted by adjusting the screwing depth of the sealing member 34 with respect to the cylinder case 32. .

As shown in FIGS. 1 and 5, when the template 6 is lifted from the template frame 65 by the vacuum case 4 and the template 6 is attached to the upper surface of the lower frame 22 of the distributor 2, The upper end of the plunger 31 hits the upper surface of the base board 60 of the template 6, and as shown in FIG. 5, the pin 32 is pushed up against the resilience of the compression vane 33, and is inserted into the cylinder case 32. At this time, the positioning pin 62 of the template 6 is fitted into the positioning hole 24 of the lower frame 22 of the distributor 2 as described above. As described above, in this state, after the chip-shaped circuit component a is accommodated in the guide case 61 of the template 6 through the guide tube 21 of the distributor 2 as shown in FIG. 5, the vacuum case 4 is lowered. At this time, the elastic force accumulated in the compression spring 33 of the pin plunger 31 of the distributor 2 acts on the upper surface of the base board 60 of the template 6 via the pin 32, and the template 6 is separated from the distributor 2 downward. help. Therefore, as shown in FIG. 2, the template 6 is surely separated from the lower frame 22 of the distributor 2, and the template 6 is lowered on the vacuum case 4 while being placed on the vacuum case 4, and the template 6 is placed on the template frame 65. Can be posted on.

In the above-described embodiment, the guide case 61 is provided on the base board 60 in order to form the concave storage portion for storing the chip-shaped circuit component a on the template 6, but the guide case 61 is provided on the base board 60. It goes without saying that the present invention can be similarly applied to a template in which a concave portion is directly formed and used as a storage portion.

[0017]

[Effect of the device]

 As described above, according to the present invention, the template is applied to the lower surface of the distributor, and after the chip-shaped circuit component is housed in the housing part, the template is surely separated from directly under the distributor. Thus, it is possible to provide a chip-shaped circuit component mount device that ensures reliable operation of the mount device.

[Brief description of drawings]

FIG. 1 is a front view of a main portion of a chip-shaped circuit component mounting apparatus according to an embodiment of the present invention in a state in which a template is applied directly below a distributor.

FIG. 2 is a front view of essential parts of the chip-shaped circuit component mounting apparatus according to the embodiment of the present invention in a state where the template is unloaded from directly under the distributor.

FIG. 3 is a schematic perspective view showing a chip-shaped circuit component mounting device according to an embodiment of the present invention.

FIG. 4 is a perspective view of a distributor of the chip-shaped circuit component mounting device according to the embodiment of the present invention, as viewed from the lower surface side thereof.

FIG. 5 is an enlarged sectional view of an essential part showing the chip-shaped circuit component mounting apparatus according to the embodiment.

FIG. 6 is a front view of a chip-shaped circuit component mounting apparatus according to a conventional example in a state where a template is applied directly below a distributor.

FIG. 7 is a front view of a conventional chip-shaped circuit component mounting apparatus in a state where a template is unloaded from directly below a distributor.

[Explanation of symbols]

 1 Container 2 Distributor 6 Template 9 Circuit Board 7 Conveyor 8 Suction Head 31 Pin Plunger 32 Pin 33 Compression Spring

Claims (1)

[Reference number] 0031038-01 [Claims for utility model registration] 1. A plurality of containers (1), (1) ... In which chip-shaped electronic components are stored in a bulk shape, and chip-shaped electronic components stored in each container (1), (1). A distributor (2) for distributing and supplying, a template (6) in which an accommodating portion for receiving the chip-shaped electronic components supplied from the distributor (2) is arranged at a predetermined position, and the template (6) The vacuum case (4), which is moved up and down and pressed against the lower surface of the distributor (2) and released, the conveyor (7) for carrying the circuit board (9), and the electronic parts housed in the housing part of the template (6). A chip-shaped electronic component mounting apparatus, comprising: a suction head (8) for adsorbing a component from the same storage portion and mounting the component on the circuit board (9); , A pin plunger (31) is provided, and a pin (32) at the tip of the pin plunger (31) has a spring (in a direction in which the pin (32) is pressed downwardly against the template (6) placed under the distributor (2). 33) A chip-shaped electronic component mounting device characterized in that the elasticity of 33) is applied.