JPH0577036A - Nitrogen reflow apparatus - Google Patents

Nitrogen reflow apparatus

Info

Publication number
JPH0577036A
JPH0577036A JP23456991A JP23456991A JPH0577036A JP H0577036 A JPH0577036 A JP H0577036A JP 23456991 A JP23456991 A JP 23456991A JP 23456991 A JP23456991 A JP 23456991A JP H0577036 A JPH0577036 A JP H0577036A
Authority
JP
Japan
Prior art keywords
heating chamber
nitrogen gas
wind direction
substrate
outlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23456991A
Other languages
Japanese (ja)
Other versions
JP3356445B2 (en
Inventor
Toshio Nishi
壽雄 西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP23456991A priority Critical patent/JP3356445B2/en
Publication of JPH0577036A publication Critical patent/JPH0577036A/en
Application granted granted Critical
Publication of JP3356445B2 publication Critical patent/JP3356445B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To prevent flow of the outer air into a heating furnace from an inlet part and an outlet part. CONSTITUTION:In a nitrogen reflow apparatus providing a heating chamber 1 setting heaters 2 and fans 3, a conveyor 4 for carrying a substrate S from the inlet part 5 to the outlet part 6, a nitrogen gas supplying part 7 for supplying the nitrogen gas N2 in the above heating chamber 1, blasting direction adjusting means 13, 14, 15 for adjusting the blasting direction of the above nitrogen gas N2 are arranged in the above heating chamber 1.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はチッソリフロー装置に係
り、詳しくは入口部や出口部から加熱室内に外部空気が
流入して、加熱室内の酸素濃度が上昇するのを防止する
ための手段に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chisso reflow device, and more particularly to a means for preventing external air from flowing into an inside of a heating chamber from an inlet portion or an outlet portion thereof and increasing an oxygen concentration in the heating chamber. ..

【0002】[0002]

【従来の技術】基板に電子部品を実装するにあたって
は、基板に形成された銅箔などの回路パターンの電極部
にクリーム半田を塗布し、このクリーム半田上に電子部
品を接着した後、この基板をリフロー装置へ送りクリー
ム半田の加熱処理が行われる。
2. Description of the Related Art When mounting electronic components on a substrate, cream solder is applied to the electrode portion of a circuit pattern such as a copper foil formed on the substrate, the electronic components are bonded onto the cream solder, and then this substrate is mounted. Is sent to the reflow device and the heat treatment of the cream solder is performed.

【0003】従来、このような半田の加熱処理は、空気
を加熱して行われていたが、空気中には酸素が含まれて
いるので、銅箔などから成る回路パターンやクリーム半
田が加熱されて酸化しやすく、酸化すると半田のヌレ性
が低下し、電子部品を基板に良好に接着できなくなりや
すい問題があった。
Conventionally, such heat treatment of solder has been performed by heating air. However, since oxygen is contained in the air, the circuit pattern made of copper foil or the like and the cream solder are heated. Therefore, there is a problem that the wetting property of the solder is deteriorated by the oxidation, and the electronic component cannot be properly adhered to the substrate.

【0004】その改善策として、回路パターンやクリー
ム半田が酸化する虞れのないチッソガス雰囲気中におい
て、加熱処理を行うチッソリフロー装置が提案されてい
る。
As a remedy for this problem, there has been proposed a chisso reflow apparatus for performing heat treatment in a nitrogen gas atmosphere in which there is no fear of oxidation of the circuit pattern or cream solder.

【0005】図2を参照しながら、従来のチッソリフロ
ー装置を説明する。ヒータ100およびファン101が
配設された加熱室102内に、コンベア103により基
板104を搬送し、このヒータ100によりクリーム半
田の加熱処理を行う。この加熱室102の内部は、仕切
壁111,112により予熱ゾーン108、比較的高い
均等温度の均熱ゾーン109、クリーム半田を溶融する
高温の溶融ゾーン110に区画されており、上記チッソ
ガスN2 は、チッソガス供給手段105から各ゾーン1
08〜110内に常時供給されている。106は加熱室
102の入口部、107は出口部である。
A conventional chisso reflow apparatus will be described with reference to FIG. The substrate 104 is conveyed by the conveyer 103 into the heating chamber 102 in which the heater 100 and the fan 101 are arranged, and the heater 100 heats the cream solder. The inside of the heating chamber 102 is partitioned by partition walls 111 and 112 into a preheating zone 108, a soaking zone 109 having a relatively high uniform temperature, and a high-temperature melting zone 110 for melting the cream solder. Each zone 1 from the Chisso gas supply means 105
It is always supplied within 08-110. Reference numeral 106 is an inlet portion of the heating chamber 102, and 107 is an outlet portion.

【0006】[0006]

【発明が解決しようとする課題】ところが、この加熱室
102内に供給されたチッソガスN2 は、各ファン10
1により下方へ吹き付けられた後、通常、入口部106
および出口部107から外部へ均等に少量づつ流亡する
が、しかしながら例えば各ファン101のパワー差など
による風量バランスの狂いを原因として、一般に矢印N
1のように入口部106から出口部107に向かうか、
矢印N2のように出口部107から入口部106に向か
うチッソガスN2 の一方向の流れが発生する虞れがあ
る。このようなトンネル効果によるチッソガスN2 の一
方向の流れが発生すると、単に加熱室102内のチッソ
ガスN2が出口部107や入口部106から大量に流出
するだけでなく、同図破線矢印のように上記チッソガス
N2 の一方向の流れに乗じて、入口部106または出口
部107から外部空気Eが加熱室102内に流れ込み、
このため加熱室102内の酸素濃度が次第に高くなっ
て、上述した回路パターンやクリーム半田の酸化による
弊害を起こすという問題点があった。
However, the nitrogen gas N2 supplied into the heating chamber 102 is supplied to each fan 10
After being blown downwards by 1, usually the inlet section 106
In addition, the air flows out from the outlet 107 to the outside evenly in small amounts.
From the inlet 106 to the outlet 107 as in 1,
There is a possibility that a unidirectional flow of the nitrogen gas N2 from the outlet portion 107 toward the inlet portion 106 may occur as shown by the arrow N2. When the unidirectional flow of the nitrogen gas N2 due to such a tunnel effect occurs, not only the nitrogen gas N2 in the heating chamber 102 flows out in large quantities from the outlet 107 and the inlet 106, but also as shown by the broken line arrow in FIG. The outside air E flows into the heating chamber 102 from the inlet 106 or the outlet 107 by riding on the one-way flow of the nitrogen gas N2,
For this reason, there is a problem that the oxygen concentration in the heating chamber 102 gradually increases, which causes a problem due to the above-described oxidation of the circuit pattern and cream solder.

【0007】そこで本発明は、外部空気が加熱室内に流
入して、加熱室内の酸素濃度が上昇するのを防止できる
チッソリフロー装置を提供することを目的とする。
Therefore, an object of the present invention is to provide a chisso reflow device which can prevent external air from flowing into the heating chamber to increase the oxygen concentration in the heating chamber.

【0008】[0008]

【課題を解決するための手段】本発明は、ヒータとファ
ンが配設された加熱室と、この加熱室の入口部から出口
部へ基板を搬送するコンベアと、上記加熱室にチッソガ
スを供給するチッソガス供給部とを備えたチッソリフロ
ー装置において、上記加熱室内に、上記チッソガスの風
向きを調整する風向調整手段を設けたものである。
According to the present invention, there is provided a heating chamber in which a heater and a fan are arranged, a conveyer for carrying a substrate from an inlet portion to an outlet portion of the heating chamber, and a nitrogen gas supply to the heating chamber. In a chisso reflow device provided with a nitrogen gas supply part, an air flow direction adjusting means for adjusting the air flow direction of the nitrogen gas is provided in the heating chamber.

【0009】[0009]

【作用】上記構成において、加熱室内に供給されたチッ
ソガスが入口部および出口部の両方から流出するよう
に、風向調整手段により加熱室内を流れるチッソガスの
風向きを調整することにより、上述したチッソガスの一
方向の流れが発生しないようにし、したがってトンネル
効果による外部空気が入口部や出口部から加熱室内へ流
れ込んで、加熱室内の酸素濃度が上昇するのを防止す
る。
In the above structure, the wind direction adjusting means adjusts the wind direction of the nitrogen gas flowing through the heating chamber so that the nitrogen gas supplied into the heating chamber flows out from both the inlet portion and the outlet portion. Directional flow is prevented from occurring, and therefore, the external air due to the tunnel effect is prevented from flowing into the heating chamber from the inlet portion or the outlet portion and increasing the oxygen concentration in the heating chamber.

【0010】[0010]

【実施例】次に、図面を参照しながら本発明の実施例を
説明する。
Embodiments of the present invention will now be described with reference to the drawings.

【0011】図1はチッソリフロー装置の側面図であ
る。1は加熱室であり、その内部の上部にはヒータ2、
ファン3が配設されている。4は加熱室1内に配設され
たコンベヤであって、電子部品Pが実装された基板Sを
入口部5から出口部6へ向かって搬送する。7は加熱室
1内にチッソガスN2 を供給するチッソガス供給手段で
あり、加熱室1内に設けられた予熱ゾーン8、均熱ゾー
ン9、溶融ゾーン10にチッソガスN2 を常時供給して
いる。11,12は各ゾーン8〜10を区画する仕切
壁、13,14はチッソガスN2 の風向調整手段として
のダンパーであり、各仕切壁11,12の予熱ゾーン8
側および溶融ゾーン10側に設けられている。15は加
熱された基板Sの冷却用のシャワー部であり、チッソガ
ス供給手段7に接続されて、加熱室1内にピン16によ
り角度調整自在に軸着されている。17はこのシャワー
部15を回転させるシリンダである。シリンダ17を駆
動してロッド18を突没させると、そのロッド18の先
端部がシャワー部15を押圧してこれを回転させること
で、シャワー部15の角度調整を行う。これらの構成部
品15〜18により、上記ダンパー13,14と異なる
風向調整手段が構成される。
FIG. 1 is a side view of a chisso reflow device. Reference numeral 1 is a heating chamber, and a heater 2 is provided above the inside of the heating chamber.
A fan 3 is arranged. Reference numeral 4 denotes a conveyor arranged in the heating chamber 1, and conveys the substrate S on which the electronic component P is mounted from the inlet portion 5 toward the outlet portion 6. Reference numeral 7 is a nitrogen gas supply means for supplying nitrogen gas N2 into the heating chamber 1, and constantly supplies nitrogen gas N2 to the preheating zone 8, the soaking zone 9 and the melting zone 10 provided in the heating chamber 1. Reference numerals 11 and 12 are partition walls that divide the zones 8 to 10, and reference numerals 13 and 14 are dampers as wind direction adjusting means for the Chisso gas N2.
Side and the melting zone 10 side. Reference numeral 15 is a shower portion for cooling the heated substrate S, which is connected to the nitrogen gas supply means 7 and is pivotally mounted in the heating chamber 1 by a pin 16 so that the angle can be adjusted. Reference numeral 17 is a cylinder for rotating the shower unit 15. When the cylinder 17 is driven to project and retract the rod 18, the tip of the rod 18 presses the shower unit 15 and rotates the shower unit 15, thereby adjusting the angle of the shower unit 15. These component parts 15 to 18 constitute a wind direction adjusting means different from the dampers 13 and 14.

【0012】本装置は、上記のような構成より成り、次
に動作を説明する。図1において、コンベア4に移送さ
れた基板Sは入口部5から加熱室1内へ入り、次いで予
熱ゾーン8、均熱ゾーン9、溶融ゾーン10を順次通過
中に、ヒータ2により半田が加熱処理され、その後基板
Sはシャワー部15からのチッソガスN2 の吹き付けに
より冷却されて、出口部6から加熱室1の外へ搬出され
る。
The present apparatus has the above-mentioned structure, and its operation will be described below. In FIG. 1, the substrate S transferred to the conveyer 4 enters the heating chamber 1 through the inlet portion 5, and then the solder is heated by the heater 2 while sequentially passing through the preheating zone 8, the soaking zone 9, and the melting zone 10. After that, the substrate S is cooled by blowing nitrogen gas from the shower portion 15 and is carried out of the heating chamber 1 through the outlet portion 6.

【0013】この一連の作業中、各ゾーン8,9,10
内にはチッソガス供給手段7からチッソガスN2 が供給
され、この供給されたチッソガスN2 は、ファン3によ
りコンベア4上を流れる基板S上に吹き付けられる。と
ころで、このチッソガスN2の流れを加熱室1の全体か
らみると、発明が解決しようとする課題の項において述
べたように、入口部5から出口部6に向かって、または
出口部6から入口部5に向かってチッソガスN2 の一方
向の流れが発生しやすい。そこで、この流れをダンパー
13,14の回転角度およびシャワー部15の回転角度
を変更して阻止する。具体的には、矢印N1のように入
口部5から出口部6に向かう流れが生じている場合に
は、同図実線のように入口部5側のダンパー13の回転
角度を大きくして、予熱ゾーン8でのチッソガスN2の
風向きを入口部5側へ向け、また出口部6側のダンパー
14の回転角度を小さくするとともに、シリンダ17を
駆動してロッド18を突出させ、シャワー部15からの
チッソガスN2 の吹き出し方向を破線矢印方向へ向け
て、溶融ゾーン10における出口部6側へのチッソガス
N2 の流れを抑制する。また、矢印N1′のように出口
部6から入口部5に向かう場合には、同図鎖線のように
ダンパー13の回転角度を小さくして、予熱ゾーン8で
のチッソガスN2の風向きを出口部6側へ向け、またダ
ンパー14の回転角度を大きくするとともに、シリンダ
17を駆動してロッド18を引き戻し、シャワー部15
からのチッソガスN2 の吹き出し方向を実線矢印方向へ
向けて、予熱ゾーン10における入口部5側へのチッソ
ガスN2 の流れを抑制する。
During this series of operations, each zone 8, 9, 10
Chisso gas N2 is supplied from the nitrogen gas supply means 7, and the supplied nitrogen gas N2 is blown onto the substrate S flowing on the conveyor 4 by the fan 3. By the way, when the flow of the nitrogen gas N2 is viewed from the entire heating chamber 1, as described in the section of the problem to be solved by the invention, from the inlet portion 5 to the outlet portion 6 or from the outlet portion 6 to the inlet portion 6. A unidirectional flow of nitrogen gas N2 tends to be generated toward 5. Therefore, this flow is blocked by changing the rotation angles of the dampers 13 and 14 and the shower unit 15. Specifically, when the flow from the inlet portion 5 to the outlet portion 6 is generated as shown by the arrow N1, the rotation angle of the damper 13 on the inlet portion 5 side is increased as shown by the solid line in the figure to preheat The wind direction of the nitrogen gas N2 in the zone 8 is directed to the inlet portion 5 side, the rotation angle of the damper 14 on the outlet portion 6 side is reduced, and the rod 17 is projected by driving the cylinder 17 so that the nitrogen gas from the shower portion 15 is discharged. The flow direction of N2 is directed in the direction of the broken line arrow to suppress the flow of the nitrogen gas N2 toward the outlet portion 6 side in the melting zone 10. Further, in the case of going from the outlet portion 6 to the inlet portion 5 as shown by an arrow N1 ', the rotation angle of the damper 13 is made smaller as shown by the chain line in the figure, and the wind direction of the nitrogen gas N2 in the preheating zone 8 is changed to the outlet portion Toward the side and increasing the rotation angle of the damper 14, the cylinder 17 is driven to pull back the rod 18, and the shower unit 15
By directing the blowing direction of the nitrogen gas N2 from the direction of the solid line arrow, the flow of the nitrogen gas N2 to the inlet portion 5 side in the preheating zone 10 is suppressed.

【0014】このような調整を行うことで、加熱室1内
に供給されるチッソガスN2 の流れは、従来手段のよう
な入口部5から出口部6または出口部6から入口部5へ
の一方向の流れでなく、ちょうど無風状態における余剰
のチッソガスN2 が加熱室1の外部に少量づつ自然流亡
するような入口部5と出口部6の両方向に向かう流れと
なるため、従来手段において問題となっていたトンネル
効果によるチッソガスN2 の一方向の流れに乗じた外部
空気Eの加熱室1内への流入を、入口部5と出口部6か
ら外部へ流亡するチッソガスN2 により防止することが
できる。
By performing such adjustment, the flow of the nitrogen gas N2 supplied into the heating chamber 1 is unidirectional from the inlet portion 5 to the outlet portion 6 or from the outlet portion 6 to the inlet portion 5 as in the conventional means. However, the excess nitrogen gas N2 in the windless state flows toward both directions of the inlet portion 5 and the outlet portion 6 such that the small amount of surplus nitrogen gas N2 spontaneously flows out of the heating chamber 1 in a small amount, which is a problem in the conventional means. In addition, the inflow of the external air E into the heating chamber 1 by the unidirectional flow of the nitrogen gas N2 due to the tunnel effect can be prevented by the nitrogen gas N2 flowing out from the inlet portion 5 and the outlet portion 6.

【0015】本発明は上記実施例に限定されないのであ
って、例えばダンパー13,14のみによって風向きを
調整し、シャワー部15による風向き調整はせずともよ
く、あるいは風向調整手段としては、ダンパー13,1
4の大きさを変えることによりチッソガスN2 の風向き
を変更してもよい。
The present invention is not limited to the above-described embodiment. For example, the wind direction may be adjusted only by the dampers 13 and 14 and the wind direction may not be adjusted by the shower unit 15, or the wind direction adjusting means may be dampers 13, 14. 1
The wind direction of the nitrogen gas N2 may be changed by changing the size of No. 4.

【0016】[0016]

【発明の効果】以上説明したように本発明は、加熱室内
にチッソガスの風向きを調整する風向調整手段を設けた
ことで、トンネル効果によるチッソガスの一方向の流れ
が発生しないように加熱室内を流れるチッソガスの風向
きを調整して、外部空気がこれらの入口部や出口部から
加熱室内へ流れ込むのを防止することができる。
As described above, according to the present invention, the wind direction adjusting means for adjusting the wind direction of the nitrogen gas is provided in the heating chamber, so that the one-way flow of the nitrogen gas due to the tunnel effect does not flow in the heating chamber. The wind direction of the nitrogen gas can be adjusted to prevent external air from flowing into the heating chamber through these inlets and outlets.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係るチッソリフロー装置の側面図FIG. 1 is a side view of a chisso reflow device according to the present invention.

【図2】従来手段に係るチッソリフロー装置の側面図FIG. 2 is a side view of a conventional chisso reflow device.

【符号の説明】[Explanation of symbols]

1 加熱室 2 ヒータ 4 コンベア 5 入口部 6 出口部 7 チッソガス供給部 13 風向き調整手段 14 風向き調整手段 15 風向き調整手段 N2 チッソガス S 基板 1 Heating Chamber 2 Heater 4 Conveyor 5 Inlet 6 Outlet 7 Chisso Gas Supply 13 13 Wind Direction Adjusting Means 14 Wind Direction Adjusting Means 15 Wind Direction Adjusting Means N2 Chisso Gas S Substrate

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】ヒータとファンが配設された加熱室と、こ
の加熱室の入口部から出口部へ基板を搬送するコンベア
と、上記加熱室にチッソガスを供給するチッソガス供給
部とを備えたチッソリフロー装置において、上記加熱室
内に、上記チッソガスの風向きを調整する風向調整手段
を設けたことを特徴とするチッソリフロー装置。
1. A chisso having a heating chamber in which a heater and a fan are arranged, a conveyor for transporting a substrate from an inlet portion to an outlet portion of the heating chamber, and a nitrogen gas supply portion for supplying nitrogen gas to the heating chamber. In the reflow device, a wind direction adjusting means for adjusting the wind direction of the nitrogen gas is provided in the heating chamber.
JP23456991A 1991-09-13 1991-09-13 Chisso reflow device Expired - Fee Related JP3356445B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23456991A JP3356445B2 (en) 1991-09-13 1991-09-13 Chisso reflow device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23456991A JP3356445B2 (en) 1991-09-13 1991-09-13 Chisso reflow device

Publications (2)

Publication Number Publication Date
JPH0577036A true JPH0577036A (en) 1993-03-30
JP3356445B2 JP3356445B2 (en) 2002-12-16

Family

ID=16973073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23456991A Expired - Fee Related JP3356445B2 (en) 1991-09-13 1991-09-13 Chisso reflow device

Country Status (1)

Country Link
JP (1) JP3356445B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250852A (en) * 1995-03-10 1996-09-27 Senju Metal Ind Co Ltd Reflow method, reflow furnace and hot air heater for the furnace
JP2006156487A (en) * 2004-11-25 2006-06-15 Furukawa Electric Co Ltd:The Equipment and method of reducing nitrogen gas consumption of reflow furnace

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250852A (en) * 1995-03-10 1996-09-27 Senju Metal Ind Co Ltd Reflow method, reflow furnace and hot air heater for the furnace
JP2006156487A (en) * 2004-11-25 2006-06-15 Furukawa Electric Co Ltd:The Equipment and method of reducing nitrogen gas consumption of reflow furnace

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