JPH0576969B2 - - Google Patents

Info

Publication number
JPH0576969B2
JPH0576969B2 JP60270424A JP27042485A JPH0576969B2 JP H0576969 B2 JPH0576969 B2 JP H0576969B2 JP 60270424 A JP60270424 A JP 60270424A JP 27042485 A JP27042485 A JP 27042485A JP H0576969 B2 JPH0576969 B2 JP H0576969B2
Authority
JP
Japan
Prior art keywords
general formula
resin
carbon atoms
alkyl group
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60270424A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62130546A (ja
Inventor
Akiko Kitayama
Hideto Suzuki
Haruo Tabata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP60270424A priority Critical patent/JPS62130546A/ja
Publication of JPS62130546A publication Critical patent/JPS62130546A/ja
Publication of JPH0576969B2 publication Critical patent/JPH0576969B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP60270424A 1985-11-30 1985-11-30 樹脂封止半導体装置 Granted JPS62130546A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60270424A JPS62130546A (ja) 1985-11-30 1985-11-30 樹脂封止半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60270424A JPS62130546A (ja) 1985-11-30 1985-11-30 樹脂封止半導体装置

Publications (2)

Publication Number Publication Date
JPS62130546A JPS62130546A (ja) 1987-06-12
JPH0576969B2 true JPH0576969B2 (cs) 1993-10-25

Family

ID=17486078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60270424A Granted JPS62130546A (ja) 1985-11-30 1985-11-30 樹脂封止半導体装置

Country Status (1)

Country Link
JP (1) JPS62130546A (cs)

Also Published As

Publication number Publication date
JPS62130546A (ja) 1987-06-12

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Legal Events

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Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term