JPH0574887A - Probe - Google Patents

Abstract

PURPOSE:To fix the depth of a probe needle to be pierced into a pad and obtain electric contact definitely without peeling off the pad from the base. CONSTITUTION:Two good conductors 1 and 3 are incorporated into one piece with an insulator 2 clamped. The amount of the tip projections is adapted to vary with the insulator 2 kept in the middle. The two good conductors 1 and 2, if placed into contact with a pad 4 simultaneously, will obtain an electric connection definitely.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe in a prober for measuring characteristics of semiconductor devices.

[0002]

2. Description of the Related Art Usually, when measuring the specification of a semiconductor element, a plurality of probes provided in a prober are brought into contact with pads which are input / output terminals of the semiconductor element to receive a signal.

FIG. 2 is a sectional view of a conventional probe as an example. Conventionally, this type of probe is manufactured from a single metal rod, for example, as shown in FIG. When measuring the characteristics of the semiconductor element with the probe 5, the semiconductor device is measured by making contact with the pad 4 protruding on the semiconductor substrate 6. Actually, the pad 4 is made of a soft metal such as aluminum, and the probe 5 pierces the pad 4 to make contact with the pad 4.

[0004]

With this conventional probe for probing, the depth at which the bonding pad is pierced cannot be detected, so the strength with which the probe is pressed against the pad has been set arbitrarily. Therefore, when the probe is pressed hard, the probe peels off the pad from the base. Further, if the probe is pressed in a weak way, the contact resistance between the pad and the probe becomes high, and there is a problem that the semiconductor element can be accurately measured.

An object of the present invention is to provide a probe that pierces a pad to a certain depth and makes reliable contact without peeling the pad.

[0006]

The probe of the present invention is a probe in a prober for measuring the electrical characteristics of a semiconductor element, in which the insulator is sandwiched and integrated by the conductor, and the protrusion amount of the tip is the It is characterized in that the body is in the middle position, and the protrusion amounts of the conductors are different.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

1 (a) and 1 (b) are sectional views showing the probe in the order of operation for explaining the probe in one embodiment of the present invention. As shown in FIG. 1, this probe has two conductors 1,
3 is integrated with the insulator 2. And
The tip is sharpened, the conductor 1 is projected most, the insulator 2 is projected next, and the conductor 3 is retracted.

If the probe 5a is thus made into the two conductors 1 and 2 via the one insulator 2, for example, FIG.
As shown in, when the pad 4 is not sufficiently contacted,
No current flows between the conductor 1 and the conductor 3. Also, FIG.
As shown in (b), when the probe 5a is pierced until the conductor 3 and the pad 4 come into contact with each other, a current can be passed between the conductor 1 and the conductor 3 via the pad 4. In this state, the conductor 1 and the pad 4 are in sufficient contact with each other, and the contact resistance is also small.

As shown in FIG. 1 (b), when the probe 5a is stabbed into the pad to increase the depth, the conductor 1,
If the position of the probe 5a is fixed at the time when a current flows between the conductors 3, the depth at which the probe 5 is pierced can be made constant, and the metal of the pad 4 may be peeled off. Absent.

That is, according to the present invention, it is possible to detect whether or not the probe 5a pierces the pad at a constant depth (distance between the conductor 1 and the conductor 3). The structure of the conductor and the insulator may be a coaxial structure to enhance the strength of the probe. Alternatively, the needles may be independent and arranged side by side to be integrated. In the case of, each needle may be made replaceable.

[0012]

As described above, according to the present invention, the probe in the prober is composed of two conductors with an insulator interposed therebetween.
By making the projection amounts of the tips of these conductors different, the depth of the probe sticking to the pad can be detected. Therefore, according to the present invention, there is an effect that the probe can be reliably contacted with electric power without peeling the pad while keeping the depth of insertion of the probe constant.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an operation sequence for explaining a probe according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a probe showing a conventional example.

[Explanation of symbols]

 1,3 Conductor 2 Insulator 4 Pad 5,5a Probe 6 Semiconductor substrate

Claims (1)

[Claims] 1. A probe in a prober for measuring electrical characteristics of a semiconductor device, wherein an insulator is sandwiched and integrated by this conductor, and a protrusion amount of a tip of the insulator is set to a middle level,
A probe having different amounts of protrusion of the conductors.