JPH0574810U - Dicing blade - Google Patents

Abstract

(57) [Summary] [Objective] To realize a dicing blade capable of forming a V groove in a dicing portion on one surface of a semiconductor wafer at the same time as dicing. In a dicing blade for dicing a semiconductor wafer, a dicing blade portion for dicing the semiconductor wafer, and a taper-shaped V-groove forming blade for forming a V-groove in a dicing portion on one surface of the semiconductor wafer provided in the dicing portion. And a dicing blade.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a dicing blade capable of forming a V groove in a dicing portion on one surface of a semiconductor wafer at the same time as dicing.

[0002]

[Prior Art]

 FIG. 5 is an explanatory diagram of a main part configuration of a conventional example that is generally used in the past. For example, it is shown in a catalog “DUAL DICER SERIES”, published by Disco Co., Ltd., issued in October, 1990.

In the figure, 1 is a dicing blade and 2 is a V-groove blade. The dicing blade 1 and the V-groove blade 2 are set according to the dicing interval t. In the above structure, as shown in FIG. 6, at the time of dicing, first, the V groove A is formed in the semiconductor wafer 3 by the V groove blade 2. Next, the V groove A is dug down with the dicing blade 1 and dicing B is performed.

[0004]

[Problems to be solved by the device]

 However, in such a device, (1) V groove A formation and dicing B are performed in two steps, which is a double labor. (2) Positioning between the dicing blade 1 and the V-groove blade 2 is difficult, and the centers of the dicing B groove and the V groove A are deviated. The present invention solves this problem.

An object of the present invention is to provide a dicing blade capable of forming a V groove in a dicing portion on one surface of a semiconductor wafer at the same time as dicing.

[0006]

[Means for Solving the Problems]

 In order to achieve this object, the present invention provides a dicing blade for dicing a semiconductor wafer, a dicing blade portion for dicing the semiconductor wafer, and a V-shaped groove on one side of the semiconductor wafer provided in the middle of the dicing portion. And a taper-shaped V-groove forming blade portion for forming a dicing blade.

[0007]

[Action]

 In the above structure, the V-groove formation and the dicing can be performed at once by setting the dicing blade at a predetermined position on the semiconductor wafer and performing the dicing. Hereinafter, detailed description will be given based on examples.

[0008]

【Example】

 FIG. 1 is an explanatory view of the main configuration of an embodiment of the present invention. Reference numeral 11 is a dicing blade portion for performing dicing B on the semiconductor wafer 3. Reference numeral 12 denotes a tapered V groove forming blade portion which is provided in the middle of the dicing blade portion 11 and forms the V groove A in the dicing portion 13 on one surface of the semiconductor wafer 1.

In the above structure, as shown in FIG. 2, by setting the dicing blade at a predetermined position on the semiconductor wafer 3 and performing dicing, the V groove A formation and the dicing B can be performed at the same time.

As a result, (1) V-groove A formation and dicing B can be performed in one step, and the manufacturing cost can be reduced. (2) The centers of the dicing groove and the V groove can be easily aligned with each other. FIG. 3 is an explanatory view of a main part configuration of another embodiment of the present invention. In this embodiment, the tip of the dicing blade portion 21 is tapered. FIG. 4 is an explanatory diagram of a main part configuration of another embodiment of the present invention. In this embodiment, the V-groove forming blade portion 31 has a curved surface.

[0011]

[Effect of the device]

 As described above, according to the present invention, in a dicing blade for dicing a semiconductor wafer, a dicing blade portion for dicing the semiconductor wafer and a V groove is formed in the dicing portion on one surface of the semiconductor wafer provided in the middle of the dicing portion. A dicing blade having a tapered V-groove forming blade was constructed.

As a result, (1) V-groove formation and dicing can be performed in one step, and manufacturing cost can be reduced. (2) The centers of the dicing groove and the V groove can be easily aligned with each other.

Therefore, according to the present invention, it is possible to realize a dicing blade capable of forming a V groove in a dicing portion on one surface of a semiconductor wafer at the same time as dicing.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a main part configuration of an embodiment of the present invention.

FIG. 2 is an operation explanatory diagram of FIG.

FIG. 3 is an explanatory view of a main part configuration of another embodiment of the present invention.

FIG. 4 is an explanatory diagram of a main part configuration of another embodiment of the present invention.

FIG. 5 is an explanatory diagram of a configuration of a conventional example that is generally used in the past.

FIG. 6 is an operation explanatory diagram of FIG. 5;

[Explanation of symbols]

 3 ... Semiconductor wafer 11 ... Dicing blade portion 12 ... V groove forming blade portion 21 ... Dicing blade portion 31 ... V groove forming blade portion

Claims (1)

[Scope of utility model registration request] 1. A dicing blade for dicing a semiconductor wafer, wherein a dicing blade portion for dicing the semiconductor wafer, and a tapered V groove for forming a V groove in a dicing portion on one surface of the semiconductor wafer provided in the dicing portion. A dicing blade comprising a forming blade portion.