JPH0573256B2 - - Google Patents

Info

Publication number
JPH0573256B2
JPH0573256B2 JP61161743A JP16174386A JPH0573256B2 JP H0573256 B2 JPH0573256 B2 JP H0573256B2 JP 61161743 A JP61161743 A JP 61161743A JP 16174386 A JP16174386 A JP 16174386A JP H0573256 B2 JPH0573256 B2 JP H0573256B2
Authority
JP
Japan
Prior art keywords
plasma
reactive ion
ion etching
alternating current
solenoid coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61161743A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6317530A (ja
Inventor
Uirukinson Ooen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anelva Corp filed Critical Anelva Corp
Priority to JP16174386A priority Critical patent/JPS6317530A/ja
Publication of JPS6317530A publication Critical patent/JPS6317530A/ja
Publication of JPH0573256B2 publication Critical patent/JPH0573256B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
JP16174386A 1986-07-09 1986-07-09 磁気増強型リアクテイブイオンエツチング装置 Granted JPS6317530A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16174386A JPS6317530A (ja) 1986-07-09 1986-07-09 磁気増強型リアクテイブイオンエツチング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16174386A JPS6317530A (ja) 1986-07-09 1986-07-09 磁気増強型リアクテイブイオンエツチング装置

Publications (2)

Publication Number Publication Date
JPS6317530A JPS6317530A (ja) 1988-01-25
JPH0573256B2 true JPH0573256B2 (enrdf_load_stackoverflow) 1993-10-14

Family

ID=15741039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16174386A Granted JPS6317530A (ja) 1986-07-09 1986-07-09 磁気増強型リアクテイブイオンエツチング装置

Country Status (1)

Country Link
JP (1) JPS6317530A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68912400T2 (de) * 1988-05-23 1994-08-18 Nippon Telegraph & Telephone Plasmaätzvorrichtung.
US7316761B2 (en) 2003-02-03 2008-01-08 Applied Materials, Inc. Apparatus for uniformly etching a dielectric layer

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6094725A (ja) * 1983-10-28 1985-05-27 Hitachi Ltd ドライエツチング装置

Also Published As

Publication number Publication date
JPS6317530A (ja) 1988-01-25

Similar Documents

Publication Publication Date Title
JP4896164B2 (ja) プラズマ処理装置
JP4025193B2 (ja) プラズマ生成装置、それを有するエッチング装置およびイオン物理蒸着装置、プラズマにエネルギを誘導結合するｒｆコイルおよびプラズマ生成方法
JP3582287B2 (ja) エッチング装置
EP0251567B1 (en) Dry process apparatus
US7879186B2 (en) Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor
US5674321A (en) Method and apparatus for producing plasma uniformity in a magnetic field-enhanced plasma reactor
JPH0812856B2 (ja) プラズマ処理方法および装置
US5804027A (en) Apparatus for generating and utilizing magnetically neutral line discharge type plasma
JP4283360B2 (ja) プラズマ処理装置
JPH0573256B2 (enrdf_load_stackoverflow)
JPH07245195A (ja) プラズマ処理方法及び装置
JP2000208298A (ja) 誘導結合型プラズマ生成装置
JPH0781187B2 (ja) 真空プロセス装置
JPH07263192A (ja) エッチング装置
JPH09270299A (ja) プラズマ処理装置
JP2877398B2 (ja) ドライエッチング装置
JP4223143B2 (ja) プラズマ処理装置
JP3108556B2 (ja) プラズマ処理装置
JP3655966B2 (ja) プラズマ発生装置
JPH05209268A (ja) プラズマ処理装置
KR910000507B1 (ko) 드라이 프로세스장치
JPH0578849A (ja) 有磁場マイクロ波プラズマ処理装置
JPH0883695A (ja) プラズマ生成装置
JPH07245194A (ja) プラズマ処理方法及び装置
JPH0294628A (ja) プラズマ発生装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term