JPH0572268A - Jig for characteristic inspection for tape bonding semiconductor device - Google Patents

Abstract

PURPOSE:To decrease a shifting process of a tape bonding (TB) semiconductor device with a reduction in equipment costs by reducing the type of jigs for inspection of this TB semiconductor device to one. CONSTITUTION:The TB semiconductor device 1 is positioned and placed on a carrier 5 for testing and pads 13 for testing of the TB semiconductor device 1 are put on electrodes 53 for testing on the carrier 5. A keeper 6 is positioned and put on the carrier 5 from above the TB semiconductor device 1 to press the pads 13 for testing onto the electrodes 53 for testing with pressing pins 65. Under such a condition, a burn-in pretesting process, a burn-in process and a burn-in post-testing process are performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a characteristic inspection jig and tool used for inspecting electrical characteristics of a tape bonding semiconductor device after an assembling process.

[0002]

2. Description of the Related Art FIG. 5 shows a tape bonding (Tape Autom
individual tape bonding semiconductor device (for example, IC) (hereinafter referred to as “TB”) divided from an ated bonding type tape.
It is a top view of a "semiconductor device". Reference numeral 1 is a TB semiconductor device, which is configured as follows. A film portion 11 has a tape feed hole 11a and an external lead hole 11b. Reference numeral 12 is a large number of external leads formed on the film portion 11, a test pad 13 is provided at the tip, and a probe needle of an inspection device is applied thereto. Reference numeral 14 is a semiconductor chip (for example, an IC chip) bonded to the inner end of the external lead 12 via a bump.

FIG. 6 is a perspective view of a main part of a conventional inspection tool used in tests before and after burn-in. Reference numeral 2 is an inspection jig and has the following structure. Reference numeral 21 denotes a test head using an insulating material as a substrate, which connects the test apparatus and the TB semiconductor device 1 under test. Reference numeral 3 denotes a TB semiconductor device socket in which a large number are arranged on the inspection head 21, and a guide frame 31 and a lid 32 are provided. The TB semiconductor device 1 under test is positioned and placed on the socket 3.

FIG. 7 is a perspective view of a burn-in jig used for conventional burn-in. Reference numeral 4 denotes a burn-in jig, which is configured as follows. Burn-in board 41
A large number of extraction electrodes 42 for electrically connecting to a burn-in device (not shown) are provided at the upper end. A large number of sockets 3 are arranged on the burn-in board 41, and the corresponding extraction electrodes 42 are formed by the formed wirings 43.
It is connected to the.

Next, the operation will be described. The TB semiconductor device 1 shown in FIG. 5, which has been separated from the carrier tape after completion of the assembly process, is sent to the pre-test process of burn-in.
The sent TB semiconductor device 1 is housed in the socket 3 on the test head 21 of the inspection tool 2 as shown in FIG. TB semiconductor device 1 placed in this socket 3
Will be pre-tested for burn-in. After the test is completed, the work of transferring the good TB semiconductor device 1 to the socket 3 of the burn-in board 41 of the burn-in jig 4 is performed.
After the transfer is completed, the burn-in jig / tool 4 is mounted on a burn-in device (not shown). With burn-in equipment,
The ambient temperature of the TB semiconductor device 1 is maintained at a high temperature of about 70 to 100 ° C., electricity is passed through the test electrode 13 and the external lead 12 via the extraction electrode 42 of the burn-in board 41, the wiring 43, and maintained for about 4 to 24 hours. It When the burn-in is completed, the burn-in device will start the burn-in jig 4
Is removed, the TB semiconductor device 1 is extracted from the burn-in board 41, and is housed in the socket 3 of the test head 21 of the inspection tool 2. In this way, the post-burn-in test is performed in the same manner as the pre-burn-in test. The non-defective TB semiconductor devices 1 obtained by this test are packed and shipped together.

[0006]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
The inspection jig and tool for the B semiconductor device requires two kinds of jig and tool, that is, the test jig 2 and the burn-in jig 4, and there is a problem that the equipment cost increases. Further, there is a problem in that a large number of TB semiconductor devices 1 need to be inserted into and removed from the respective jigs 2 and 4, thus reducing productivity.

The present invention has been made in order to solve such problems, and requires only one type of jig for characteristic inspection, which reduces equipment costs and reduces the steps of inserting and extracting TB semiconductor devices. The object is to obtain a tool for inspecting characteristics of a TB semiconductor device having improved properties.

[0008]

A tool for inspecting characteristics of a TB semiconductor device according to the present invention has a plurality of mounting portions for mounting the TB semiconductor device formed on a mounting board of a test receiver. The mounting portion is provided with a positioning protrusion for positioning the film of the TB semiconductor device and a test electrode corresponding to and in contact with each test pad of the TB semiconductor device. In the TB semiconductor device mounted on the mounting portion on the mounting board, each test pad is pressed into contact with each test electrode by a retainer. A plurality of extraction electrodes are provided at the ends on the mounting board, and each test electrode and each extraction electrode are connected by wiring. A plurality of TB semiconductor devices are positioned and mounted on the jig for characteristic inspection, and in this state, each process of a pre-burn-in test, a burn-in, and a post-burn-in test can be performed.

[0009]

In the present invention, the TB semiconductor device is positioned and mounted on the test receiver, and each test pad is pressed against each test electrode by the retainer. The jig for inspection in this state is sent to the test process and the test before burn-in is performed to remove defective products. In this state, the inspection tool is sent to the burn-in process for burn-in. After the burn-in, the inspection tool is sent to the test process, the post-burn-in test is performed, and defective products are removed.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1A and 1B show a T according to the present invention.
3A and 3B are a plan view and a cross-sectional view of a main part showing an embodiment of a tool for inspecting characteristics of a B semiconductor device. The TB semiconductor device 1 is positioned and mounted on the mounting portion 52 (see FIG. 2) on the mounting board 51 of the test receiver 5. This positioning is performed by fitting the tape feed holes 11a of the tape film 11 of the TB semiconductor device 1 to the positioning projections 54 provided on the mounting board 51 for two or more rows on both sides. The test pads 13 addressed to a large number of four sides of the TB semiconductor device 1 are respectively received by the test electrodes 53 provided on the mounting board 51. In this state, the presser foot 6 is lowered from above the mounting board 51, and the positioning pins 62 provided below the four corners of the support 61 of the presser foot 6 are inserted into the four through holes 55 of the mounting board 51. Is positioned by.
By lowering the presser foot 6, the presser body 63 in the lower part of the support body 61 is
The pressing pins 65 provided at the lower part of the four sides for a large number of four sides press the corresponding compression pads 64 to move the corresponding test pads 13,
The test electrodes 53 are brought into pressure contact with each other.

With the inspection jig in this state, the TB semiconductor devices are subjected to the pre-burn-in test process, the burn-in process and the post-burn-in test process without being transferred.

The test receptacle 5 is shown in a perspective view in FIG. Reference numeral 5 denotes a test receiver, on the upper surface of a mounting board 51 made of an insulating material, mounting portions 52 of the plurality of TB semiconductor devices 1 are set. 53 is a large number of test electrodes corresponding to the respective test pads 13 of the TB semiconductor device 1, 54
Is a positioning protrusion into which each tape feed hole 11a of the tape film 11 is fitted, and 55 is a through hole provided at the four corners of the mounting portion 52, into which the positioning pin 62 of the support 61 is inserted. Reference numeral 56 denotes a large number of extraction electrodes formed at the end of the mounting board 51, which are connected to the test electrodes 53 by wiring 57 such as printed wiring. Each extraction electrode 56 is connected to each electrode of a test apparatus and a burn-in apparatus (neither is shown) in each step.

The mounting portion 52 of the test receiver 5 of FIG. 2 is shown in FIGS. 3A and 3B in an enlarged plan view and a sectional view. On the upper surface of the mounting board 51, a test electrode 53 and a positioning projection 54 are provided so as to project, and through holes 55 are provided at four corners.
Are provided so as to penetrate therethrough.

The presser foot 6 is shown in FIGS. 4A and 4B in a perspective view and a sectional view. Positioning pins 62 are projected downward at four corners of the support 61 of the retainer 6. Support 61
A recess 61a is provided in the lower part of the. Reference numeral 61b is an escape hole provided corresponding to each positioning protrusion 54 of the mounting board 51. Reference numeral 63 denotes a pressing body that is vertically movably inserted into the recess 61a and is pressed by the compression spring 64. Reference numeral 65 denotes a large number of pressing pins provided below the pressing body 63, which are electrodes for testing on the mounting board 51. It corresponds to 53 from above.

Next, the operation will be described. Finish the assembly process,
The separated TB semiconductor devices 1 are mounted on the mounting portion 52 on the mounting board 51 of the test fixture 5. At this time, the tape feed hole 11a of the TB semiconductor device 1 is fitted and positioned by the positioning protrusion 54, and each test pad 13 overlaps each test electrode 53. Next, by placing the pressing tool 6, the positioning pin 62 is moved to the through hole 55.
Is inserted and positioned. Continue to lower the presser foot 6,
By pressing the pressing pin 65 by the spring pressure of the compression spring 64, the test pad 13 is pressed and brought into contact with the corresponding test electrode 53.

As described above, the inspection tool on which the TB semiconductor device 1 is mounted is sent to the test process before burn-in.
The test is done. After the test, the defective TB semiconductor device 1 is removed. The inspection jigs and tools in which the non-defective products are left are sent to the burn-in process, mounted on the burn-in device, and kept at a high temperature for a predetermined time as in the conventional example. When the burn-in is completed, the inspection jig is sent to the test process after the burn-in and tested. After the test, the defective TB semiconductor devices 1 are removed, and the good TB semiconductor devices are packed and shipped together.

[0017]

As described above, according to the present invention, means for positioning the tape film of the TB semiconductor device on the plurality of mounting portions on the mounting board of the test receiver, and each of the TB semiconductor devices. Each test electrode corresponding to the test pad is provided, the TB semiconductor device is positioned and mounted on the mounting portion on the mounting board, and the test pad is overlaid on the test electrode. Since each test pad is brought into pressure contact with each test electrode by each press pin of the presser body of the presser tool, the inspection jig on which the TB semiconductor device is mounted has a test process before burn-in. The burn-in process and the test process after the burn-in are performed, and only one type of jig for inspection is required, the equipment cost is reduced, the transfer work of the TB semiconductor device is reduced, and the productivity is improved.

[Brief description of drawings]

FIG. 1A is a plan view of a main part of a tool for inspecting characteristics of a TB semiconductor device according to an embodiment of the present invention, and FIG. 1B is a sectional view taken along line B ₁ -B ₁ of FIG. 1A. Is.

2 is a perspective view of the test receiver of FIG. 1. FIG.

3 (A) is an enlarged plan view of a mounting portion of the test receiver of FIG. 2, and FIG. 3 (B) is a sectional view taken along line B ₃ -B ₃ of FIG. ₃ (A).

[4] (A) Figure is a perspective view of the retainer of Figure 1, Figure (B) is a cross-sectional view taken along B ₄ -B ₄ line (A) and FIG.

FIG. 5 is a plan view of a TB semiconductor device under test.

FIG. 6 is a perspective view of a main part of a test jig of the conventional characteristic inspection jig of the TB semiconductor device.

FIG. 7 is a plan view of a burn-in jig of a conventional tool for inspecting characteristics of a TB semiconductor device.

[Explanation of symbols]

 1 Tape bonding (TB) semiconductor device 11 Tape film 11a Tape feed hole 13 Test pad 5 Test receiver 51 Mounting board 52 Mounting portion 53 Test electrode 54 Positioning protrusion 55 Positioning through hole 56 Lead electrode 57 Wiring 6 Presser foot 61 Support 62 Positioning pin 63 Presser 64 Compression spring 65 Push pin

Claims (1)

[Claims] 1. A mounting board having a plurality of mounting portions for the tape bonding semiconductor device on an upper portion, a positioning means for the tape bonding semiconductor device on the mounting portion, and a plurality of tests for the tape bonding semiconductor device. And a plurality of test electrodes that come into contact with the test pad, are provided at the end of the above-mentioned mounting board, and have a plurality of extraction electrodes that are respectively connected to the test electrodes by wiring. , A supporting body placed above the tape bonding semiconductor device mounted on each of the mounting portions and positioned on the mounting board, and a pressing force provided by a spring means disposed below the supporting body. A presser having an applied presser body and a plurality of pressing pins fixed to the lower part of the presser body and pressing the test pads to bring them into pressure contact with the test electrodes are provided. -Loop bonding semiconductor device jig for inspecting characteristics of.