JPH0567677A - Cutting method of laminate of silicon and glass - Google Patents

Abstract

PURPOSE:To provide a method of cutting a laminate of silicon and glass, which hardly causes damage to an electronic element formed on a silicon board or insulation failure to a wiring. CONSTITUTION:A method is provided for cutting a laminate 1 obtained by joining a silicon plate 2 and a glass plate 3 having prescribed thickness. The method includes a first process where the silicon plate 2 is cut first with a silicon cutting blade, and a cutting operation is stopped before the silicon cutting blade reaches to the glass 3, and a second process where the uncut silicon 2 and the glass 3 are cut with a glass cutting blade smaller than the silicon cutting blade in width.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for cutting a joining member of a silicon wafer and a Pyrex glass used for a semiconductor pressure sensor or the like.

[0002]

2. Description of the Related Art Conventionally, a glass blade is used for cutting a joining member between a silicon wafer and Pyrex glass. The reason is that the glass blade can cut silicon, but the silicon blade cannot cut glass.

[0003]

However, when silicon is cut using a glass blade, chipping (cutting chip) on the silicon surface becomes large. If this chipping is large, there is a problem that the chip in the peripheral portion is broken or the Al wiring is broken due to chipping. Also,
There is a problem that a small piece of silicon generated by the chipping damages the surface of the silicon wafer, destroys the element formed on the surface, and causes insulation failure of the Al wiring. The present invention has been made in order to solve the above-mentioned problems of the prior art. By using two types of blades and cutting in two steps, it is possible to perform cutting without chipping and to cut on a silicon plate. It is an object of the present invention to provide a method for cutting a silicon-glass bonding member that does not have a defect in an electronic element formed in the above or an insulation defect in wiring.

[0004]

In order to solve the above problems, the present invention uses a blade for silicon in a method of cutting a joining member in which flat silicon and glass having a predetermined thickness are joined. Cutting from the silicon plate side and stopping at a depth that does not reach the glass plate, and the remaining silicon plate and glass plate using a glass blade having a width narrower than the width of the silicon blade. It is characterized by comprising the step of cutting.

[0005]

[Function] Since the silicon part is cut with the blade for silicon, no chipping occurs. The glass blade is narrower than the silicon blade, and since the silicon surface is not cut, no chipping occurs.

[0006]

1 (a) and 1 (b) are sectional views showing a schematic manufacturing process of an embodiment of the present invention. In these figures,
Reference numeral 1 is a joining member. The joining member 1 has a silicon plate 2 having a thickness t of about 0.5 mm and a thickness T of 2 mm.
It is composed of a Pyrex glass plate 3 of a certain degree, and these plates 2 and 3 are bonded by, for example, anodic bonding.

First, in FIG. 1 (a), after the joining member 1 is attached to a cutting device (not shown), a thickness D (for example, 300
Using a silicon blade having a thickness of about μm, a cut (a portion indicated by a diagonal line K) having a depth d (for example, about 0.3 mm) is made in the silicon. In this case, the silicon surface is not chipped.

Next, in FIG. 2 (b), the blade is replaced with a glass plate having a slightly thin thickness D '(for example, about 250 .mu.m), and the remaining silicon and glass d are aligned with the centers of the cuts. The ‘(portion indicated by the diagonal line K ′) is cut. In this case, the glass blade is 50 against the silicon blade.
Since it is narrowed by μm, it is possible to grind the remaining 0.2 mm of silicon and 2 mm of glass without touching the surface of silicon. In the above embodiment, 30
An example using a silicon blade of about 0 μm was shown.
Such thick blades are custom-made items and are not generally sold. The reason is that the thickness of the silicon wafer is 0.3-
This is because it is about 0.5 mm, so that such a thick blade is not required (a custom-made product takes time to obtain and is expensive).

2A and 2B show schematic steps of cutting the joining member 1 by using a thin silicon blade having a thickness of, for example, about 40 μm. That is, in this embodiment,
In Figure (a), a 40 μm thick braid for silicon.
Use d to make two cuts in the width of d (the part indicated by the diagonal line K ₁ ).
Insert the place. In this case, the outer width D of the two cuts is, for example, about 300 μm. Also in this case, the silicon surface is not chipped.

Next, in FIG. 2 (b), the blade is exchanged for a glass plate having a slightly thin thickness D '(for example, about 250 μm), and the centers of the cuts are aligned with each other and the silicon and the glass (hatched K Cut the part indicated by ₁ '). According to the above method, it is possible to use silicon 2 without using a specially ordered blade.
The joining member 1 of the glass 3 can be cut.

[0011]

As described above in detail with reference to the embodiments, according to the method for cutting a silicon-glass bonding member of the present invention, the cutting is performed in two steps using two types of blades. As a result, it is possible to carry out cutting without chipping, and it is possible to realize a semiconductor device having no defects in electronic elements formed on a silicon plate and insulation defects in wiring.

[Brief description of drawings]

1A and 1B are cross-sectional views showing a schematic manufacturing process of an embodiment of the present invention.

2A and 2B are cross-sectional views showing a schematic manufacturing process of another embodiment of the present invention.

[Explanation of symbols] 1 joining member 2 silicon plate 3 glass plate

Claims (1)

[Claims] 1. A method for cutting a joining member in which flat-plate silicon having a predetermined thickness and glass are joined, in which a blade for silicon is used to cut from the silicon plate side and not reach the glass plate. Silicon-glass bonding, which comprises a step of stopping at a depth and a step of cutting the remaining silicon plate and glass plate using a glass blade having a width narrower than the width of the silicon blade. How to cut parts.