JPH056659Y2 - - Google Patents
Info
- Publication number
- JPH056659Y2 JPH056659Y2 JP1987175597U JP17559787U JPH056659Y2 JP H056659 Y2 JPH056659 Y2 JP H056659Y2 JP 1987175597 U JP1987175597 U JP 1987175597U JP 17559787 U JP17559787 U JP 17559787U JP H056659 Y2 JPH056659 Y2 JP H056659Y2
- Authority
- JP
- Japan
- Prior art keywords
- base film
- chip
- film
- good
- solder resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000002950 deficient Effects 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 239000012528 membrane Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Description
【考案の詳細な説明】
〈産業上の利用分野〉
本考案は、ICチツプ等の多端子チツプ部品の
ボンデイングに使用されるフイルムキヤリアに係
り、詳しくはベースフイルムに搭載されたチツプ
部品の良品、不良品の検査結果を表示するための
構造に関する。[Detailed description of the invention] <Industrial application field> The present invention relates to a film carrier used for bonding multi-terminal chip components such as IC chips. This invention relates to a structure for displaying inspection results of defective products.
〈従来の技術〉
一般に、フイルムキヤリアは、送り孔のあるベ
ースフイルムに一定ピツチ毎に窓孔を形成すると
ともに、窓孔部分に多数本のフインガーリードを
設け、中央の窓孔内にチツプ部品を配置して、そ
の各電極にフインガーリードを接続したものであ
る。<Prior art> Generally, in a film carrier, window holes are formed at regular pitches in a base film with feed holes, a large number of finger leads are provided in the window holes, and a chip component is inserted into the central window hole. are arranged and a finger lead is connected to each electrode.
チツプ部品は、ベースフイルムに取り付けられ
た状態でその電気特性が検査され、不良品である
場合は、目印としてベースフイルムの一部にパン
チ孔が穿設される。選別作業者はこのパンチ孔の
有無を目視して、良品と不良品との選別を行う。 The electrical properties of the chip parts are inspected while attached to the base film, and if the chip parts are found to be defective, a hole is punched in a part of the base film as a mark. A sorting worker visually checks the presence or absence of the punched holes to sort out good products from defective products.
〈考案が解決しようとする問題点〉
ところで、目視による良品、不良品の選別は、
製造ラインの中途部で機械装置を背景に行うもの
であり、これに対して、ベースフイルムは通常、
茶色系の低明度、低彩度の色であるから、ベース
フイルムと背景色との間に視覚的な差異が少な
く、そのため、前記のパンチ孔を、送り孔や窓孔
の一部とまぎれて見落としやすく、選別に誤りが
多かつた。<Problem that the invention aims to solve> By the way, visual inspection of good and defective products is done by
It is carried out in the middle of the production line with mechanical equipment in the background.In contrast, base film is usually
Since it is a brownish color with low brightness and low saturation, there is little visual difference between the base film and the background color. It was easy to overlook, and there were many errors in selection.
本考案は、上述の問題点に鑑みてなされたもの
であつて、ベースフイルムに搭載されたチツプ部
品の良品、不良品の表示を見やすくし、選別の誤
りを可及的減少させることを目的とする。 The present invention was developed in view of the above-mentioned problems, and its purpose is to make it easier to see whether the chip parts mounted on the base film are good or defective, and to reduce errors in sorting as much as possible. do.
〈問題点を解決するための手段〉
本考案は、上記の目的を達成するために、ベー
スフイルムの一部に、ソルダーレジストよりなる
良不良品表示部を形成して構成したものである。<Means for Solving the Problems> In order to achieve the above object, the present invention is constructed by forming a good/defective product indicator made of solder resist in a part of the base film.
〈作用〉
上記の構成において、表示部はソルダーレジス
トよりなりベースフイルム緑色を有しているか
ら、背景色がベースフイルムの地色に近似した色
であつても、表示部は目に付きやすく、したがつ
て、該表示部に付けられた不良品の印も視覚的に
とらえやすくなる。<Function> In the above configuration, since the display part is made of solder resist and has the green color of the base film, the display part is easily noticed even if the background color is similar to the ground color of the base film. Therefore, it becomes easier to visually recognize the mark of a defective product attached to the display section.
〈実施例〉
以下、本考案を図面に示す実施例に基づいて詳
細に説明する。<Example> Hereinafter, the present invention will be described in detail based on an example shown in the drawings.
図面は本考案の一実施例に係るフイルムキヤリ
アの裏面図であつて、図中の符号１はベースフイ
ルム、２はフインガーリード、３はICチツプで
ある。 The drawing is a back view of a film carrier according to an embodiment of the present invention, and the reference numeral 1 in the drawing is a base film, 2 is a finger lead, and 3 is an IC chip.
ベースフイルム１は、たとえば耐熱性ポリイミ
ド製のフイルムで、幅方向両側には送り孔４，…
が、また幅方向中央部分にチツプ取付用窓孔５
が、さらにこのチツプ取付用窓孔５の周りを取り
囲む形でリード露出用窓孔６，…が、それぞれ穿
設されている。チツプ取付用窓孔５とこれを取り
囲むリード露出用窓孔６，…とからなる窓孔の組
は、図示省略したが、ベースフイルム１の長手方
向に沿つて一定ピツチ毎に形成される。７は隣り
合うリード露出用窓孔６，６間の架橋部である。 The base film 1 is, for example, a film made of heat-resistant polyimide, and has feed holes 4 on both sides in the width direction.
However, there is also a window hole 5 for installing the chip in the center part in the width direction.
However, lead exposure windows 6, . . . are further formed to surround the chip mounting window 5. Although not shown, a set of windows consisting of a chip attachment window 5 and a lead exposure window 6 surrounding it are formed at regular pitches along the longitudinal direction of the base film 1. Reference numeral 7 denotes a bridge between adjacent lead exposure windows 6, 6.
フインガーリード２は、多数本のものがベース
フイルム１に貼り付いた状態で、リード露出用窓
孔６の外側からチツプ取付用窓孔５内に延出して
いる。これらのフインガーリード２は、ベースフ
イルム１の一面にラミネートされた銅箔をエツチ
ングすることにより形成されたもので、表面には
錫、金もしくは半田のメツキが施されている。こ
のフインガーリード２の中途部分は、ソルダーレ
ジスト膜８で被覆されている。 A large number of finger leads 2 are stuck to the base film 1 and extend from outside the lead exposure window 6 into the chip attachment window 5. These finger leads 2 are formed by etching copper foil laminated on one side of the base film 1, and the surface is plated with tin, gold, or solder. A midway portion of the finger lead 2 is covered with a solder resist film 8.
ICチツプ３は、チツプ取付用窓孔５内に配置
され、その表面側のバンプ（図示せず）に、対応
するフインガーリード２の内端部が接続されてい
る。 The IC chip 3 is placed in the chip mounting window 5, and the inner end of the corresponding finger lead 2 is connected to a bump (not shown) on the front surface of the IC chip 3.
本考案の特徴とするところは、ベースフイルム
１の一部に良品、不良品の表示部としてソルダー
レジストよりなる膜体９が形成されている点であ
る。この膜体９は、ソルダーレジスト膜８と同時
に形成される。本実施例では、この膜体９は、１
個のICチツプ３に対して対称位置に２つ設けら
れ、また、各膜体９には、隣接するICチツプと
混同しないように対応するICチツプ３を示すた
めに矢印状の指示部９ａが付設されている。 A feature of the present invention is that a film body 9 made of solder resist is formed on a part of the base film 1 as an indicator of good and defective products. This film body 9 is formed simultaneously with the solder resist film 8. In this embodiment, this membrane body 9 has 1
Two IC chips 3 are provided at symmetrical positions with respect to each other, and each membrane body 9 has an arrow-shaped indicator 9a to indicate the corresponding IC chip 3 so as not to confuse it with an adjacent IC chip. It is attached.
上記構成において、ICチツプ３について電気
特性を検査した結果、当該チツプ３が不良品であ
る場合は、対応する２つの膜体９，９のいずれか
一方に、パンチ孔１０が穿設される。選別作業者
は、このパンチ孔１０の有無を目視により確認し
て選別を行うのであるが、パンチ孔１０が穿設さ
れる膜体９は、緑色でベースフイルム１の地色と
顕著に見分けられるので、目に付きやすく、した
がつて、見落としが少なくなる。 In the above configuration, if the IC chip 3 is found to be defective as a result of testing the electrical characteristics thereof, a punch hole 10 is punched in one of the two corresponding membrane bodies 9, 9. The sorting operator performs sorting by visually checking the presence or absence of the punched holes 10, and the film body 9 in which the punched holes 10 are formed is green in color, which is clearly distinguishable from the ground color of the base film 1. Therefore, it is easy to notice, and therefore, it is less likely to be overlooked.
なおまた、良品、不良品の表示には、パンチ孔
を穿設するほか、インクを塗布する等のマーキン
グにより表示するようにしてもよい。 In addition, in addition to punching holes, markings such as applying ink may be used to indicate whether the product is good or defective.
〈考案の効果〉
以上のように、本考案によれば、良品、不良品
の表示部がソルダーレジストにより形成されベー
スフイルムの地色と異なるので目に付きやすく、
したがつて、該表示部に付けられた良品、不良品
の印も視覚的にとらえやすく、選別の誤りが減少
する。<Effects of the invention> As described above, according to the invention, the display area for good and defective products is formed of solder resist and is easily noticed because it is different from the ground color of the base film.
Therefore, the markings of good and defective products attached to the display section are easily recognized visually, and errors in sorting are reduced.
とくに表示部がソルダーレジスト膜と同一の材
料の膜体で構成されているので、ソルダーレジス
ト膜の形成と同時に形成することができ、製造が
容易に行われる。 In particular, since the display section is made of a film body made of the same material as the solder resist film, it can be formed simultaneously with the formation of the solder resist film, making manufacturing easy.
図面は本考案の一実施例の裏図面である。
１……ベースフイルム、２……フインガーリー
ド、３……ICチツプ（チツプ部品）、９……膜体
（良不良品表示部）。
The drawing is a back view of an embodiment of the present invention. 1...Base film, 2...Finger lead, 3...IC chip (chip parts), 9...Membrane body (good/defective product display section).
Claims (1)
りなる良不良品表示部を形成したことを特徴とす
るフイルムキヤリア。 A film carrier characterized in that a part of the base film is formed with a good/defective product indicator made of solder resist.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987175597U JPH056659Y2 (en) | 1987-11-17 | 1987-11-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987175597U JPH056659Y2 (en) | 1987-11-17 | 1987-11-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0179836U JPH0179836U (en) | 1989-05-29 |
| JPH056659Y2 true JPH056659Y2 (en) | 1993-02-19 |
Family
ID=31467382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987175597U Expired - Lifetime JPH056659Y2 (en) | 1987-11-17 | 1987-11-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH056659Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5828862A (en) * | 1981-08-13 | 1983-02-19 | Nec Corp | Tape carrier |
-
1987
- 1987-11-17 JP JP1987175597U patent/JPH056659Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5828862A (en) * | 1981-08-13 | 1983-02-19 | Nec Corp | Tape carrier |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0179836U (en) | 1989-05-29 |
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