JPH0563357A - Manufacture of metal core printed wiring board - Google Patents

Manufacture of metal core printed wiring board

Info

Publication number
JPH0563357A
JPH0563357A JP22452291A JP22452291A JPH0563357A JP H0563357 A JPH0563357 A JP H0563357A JP 22452291 A JP22452291 A JP 22452291A JP 22452291 A JP22452291 A JP 22452291A JP H0563357 A JPH0563357 A JP H0563357A
Authority
JP
Japan
Prior art keywords
hole
metal
metal plate
printed wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22452291A
Other languages
Japanese (ja)
Inventor
Daijiro Kamiyama
大治郎 上山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP22452291A priority Critical patent/JPH0563357A/en
Publication of JPH0563357A publication Critical patent/JPH0563357A/en
Pending legal-status Critical Current

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  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

PURPOSE:To make insulation of a terminal insertion hole sure by a simple process and using a small amount of insulative resin. CONSTITUTION:As shown in figure (c), a PPS film 121 and a PPS film 122 are stuck on the upper surface and the lower surface of a metal board 11 in which a through hole 111 is formed, respectively. A copper foil 131 is stuck on the lower surface of the PPS film 122. As shown in figure (d), a metal plate 11 is arranged on a lower side press tool 141, and an upper side press tool 142 is arranged on the upper side of the metal plate 11. In this state, the press tools 141, 142 are heated. As shown in figure (e), the press tool 142 is made to descend, and a metal rod 143 is inserted into the through hole 111 while deforming the PPS film 121. Thus the PPS film 121 is deformed, and fusion bonded to the inner surface of the through hole 111 and the lower PPS film 122. Thereby the insulation of a terminal insertion hole can easily be obtained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、金属板に電子回路を
構成したメタルコアプリント配線板の製造方法に係り、
特に、端子挿入孔の絶縁性を向上出来るようにしたメタ
ルコアプリント配線板の製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a metal core printed wiring board in which an electronic circuit is formed on a metal plate,
In particular, it relates to a method of manufacturing a metal core printed wiring board capable of improving the insulation of the terminal insertion hole.

【0002】[0002]

【従来の技術】近年、電子機器の高密度化・高性能化に
伴いプリント配線板に対する要求が高度化してきてい
る。例えば、高度の寸法安定性を有すること、多数の重
量部品の搭載に耐え得る剛性を持つこと、搭載部品から
発生した熱を速やかに除去するための高度の熱伝導性を
有することなどである。このような要求に対し従来の紙
フェノール基板やガラスエポキシ基板等の有機材料を用
いた基板では、これらの要求を満足できないため、アル
ミニウム、鉄等の金属板を芯として用いたメタルコアプ
リント配線板の開発及び実用化が成されている。図7は
このような従来のメタルコアプリント配線板を示す断面
図である。
2. Description of the Related Art In recent years, the demand for printed wiring boards has increased with the increase in density and performance of electronic devices. For example, it has a high degree of dimensional stability, a rigidity that can withstand the mounting of a large number of heavy parts, and a high degree of thermal conductivity for promptly removing heat generated from the mounted parts. In order to meet such demands, conventional substrates using organic materials such as paper phenol substrates and glass epoxy substrates cannot satisfy these demands. Therefore, metal core printed wiring boards using metal plates such as aluminum and iron as cores Has been developed and put to practical use. FIG. 7 is a cross-sectional view showing such a conventional metal core printed wiring board.

【0003】図7において、符号41はアルミニウム製
の金属板である。金属板41は、上面に絶縁層42が形
成され、その上に配線層43が形成される。配線層43
には、チップ部品や、パワートランジスタが搭載され
る。
In FIG. 7, reference numeral 41 is a metal plate made of aluminum. An insulating layer 42 is formed on the upper surface of the metal plate 41, and a wiring layer 43 is formed thereon. Wiring layer 43
Chip components and power transistors are mounted on the.

【0004】図7に示したメタルコアプリント配線板
は、搭載する部品が、リードレス部品に限定され、トラ
ンスや電解コンデンサ等のリード部品は使用できず用途
は限定されていた。このことに対応して、リード部品の
端子挿入孔を設けたメタルコアプリント配線板が開発さ
れている。図8はリード部品の端子挿入孔を設けた従来
のメタルコアプリント配線板を製造工程順に示す工程図
である。
In the metal core printed wiring board shown in FIG. 7, the components to be mounted are limited to leadless components, and lead components such as transformers and electrolytic capacitors cannot be used. In response to this, a metal core printed wiring board provided with a terminal insertion hole for a lead component has been developed. FIG. 8 is a process diagram showing a conventional metal core printed wiring board having terminal insertion holes for lead components in the order of manufacturing steps.

【0005】先ず、図8(a)に示すように、貫通孔5
11を形成した金属板51を用意する。図8(b)にて
表面及び裏面にガラスクロス52入り絶縁樹脂53(繊
維強化プラスチック54)を張付け、裏面側の繊維強化
プラスチック54の下に配線層55となる銅箔551を
形成する。そして、この状態の金属板51、繊維強化プ
ラスチック54及び銅箔551のヒートプレスを行い、
図8(c)に示すように、上記端子挿入孔511に繊維
強化プラスチック54の絶縁樹脂53を流し込む。次
に、図8(d)に示すように、銅箔551(図8(b)
参照)をエッチングして所定回路パターンを成す配線層
55を形成する。次に、図8(e)に示すように、絶縁
樹脂53が充填された貫通孔511の中心部を再び穿設
し、絶縁樹脂53が前の端子挿入孔511の内壁に残る
ようにして新たな端子挿入孔561を形成する。
First, as shown in FIG. 8A, the through hole 5
A metal plate 51 on which 11 is formed is prepared. In FIG. 8B, an insulating resin 53 (fiber reinforced plastic 54) containing a glass cloth 52 is attached to the front surface and the back surface, and a copper foil 551 to be a wiring layer 55 is formed under the fiber reinforced plastic 54 on the back surface side. Then, the metal plate 51, the fiber reinforced plastic 54 and the copper foil 551 in this state are heat-pressed,
As shown in FIG. 8C, the insulating resin 53 of the fiber reinforced plastic 54 is poured into the terminal insertion hole 511. Next, as shown in FIG. 8D, the copper foil 551 (FIG. 8B)
(See) to form a wiring layer 55 having a predetermined circuit pattern. Next, as shown in FIG. 8E, the central portion of the through hole 511 filled with the insulating resin 53 is re-drilled so that the insulating resin 53 remains on the inner wall of the previous terminal insertion hole 511. The terminal insertion hole 561 is formed.

【0006】以上によって形成されたメタルコアプリン
ト配線板は絶縁樹脂53で貫通孔511を埋めるため
に、繊維強化プラスチック54における絶縁樹脂53を
多くしなければならず、これにより熱抵抗が増大し、放
熱性を等しく損なう。これに対応して、絶縁樹脂53を
少なくした場合には、孔内部を完全に埋めることができ
ず、空洞ができたりして、端子と金属板51の間に短絡
を起こしたりする。また、絶縁樹脂53が充填された貫
通孔511の中心部を再び穿設する際に、絶縁樹脂53
にクラックが生じ、絶縁不良になる。また、熱プレスに
よる樹脂硬化を行うので、生産性が悪い。ここで、前記
熱抵抗の増大という問題に対応し、貫通孔に図9の斜視
図に示す円柱状の絶縁樹脂60を挿入する方法が開発さ
れている。図10はリード部品の端子挿入孔に絶縁樹脂
を挿入する従来のメタルコアプリント配線板を製造工程
順に示す工程図である。
In the metal core printed wiring board formed as described above, since the through hole 511 is filled with the insulating resin 53, the insulating resin 53 in the fiber reinforced plastic 54 must be increased, which increases the thermal resistance and heat dissipation. Equally impair sex. Correspondingly, when the amount of the insulating resin 53 is reduced, the inside of the hole cannot be completely filled and a cavity is formed, which causes a short circuit between the terminal and the metal plate 51. Further, when the central portion of the through hole 511 filled with the insulating resin 53 is re-drilled, the insulating resin 53
Cracks occur in the product, resulting in poor insulation. Moreover, since the resin is cured by hot pressing, the productivity is poor. Here, in response to the problem of increased thermal resistance, a method of inserting a cylindrical insulating resin 60 shown in the perspective view of FIG. 9 into the through hole has been developed. FIG. 10 is a process diagram showing a conventional metal core printed wiring board in which an insulating resin is inserted into the terminal insertion holes of lead components in the order of manufacturing steps.

【0007】図10(a)に示すように、金属板61を
用意する。次に、図10(b)に示すように、この金属
板61に貫通孔62,62を形成する。次に、図10
(c)にて金属板61の上面に絶縁層64を張付け、さ
らに絶縁層64の上面に配線層65となる銅箔651を
形成する。そして、図10(d)に示すように、貫通孔
62,62に図9の斜視図に示した絶縁樹脂60,60
を挿入し、図10(e)に示すように、銅箔651(図
10(c)参照)をエッチングして所定回路パターンを
成す配線層65を形成する。次に、図10(f)に示す
ように、絶縁樹脂65が充填された貫通孔62の中心部
を再び穿設とともに、これに連通して絶縁層64と配線
層65を穿設し、絶縁樹脂65が前の貫通孔62の内壁
に残るようにして新たな端子挿入孔66を形成する。
As shown in FIG. 10A, a metal plate 61 is prepared. Next, as shown in FIG. 10B, through holes 62, 62 are formed in the metal plate 61. Next, FIG.
In (c), an insulating layer 64 is attached to the upper surface of the metal plate 61, and a copper foil 651 to be the wiring layer 65 is further formed on the upper surface of the insulating layer 64. Then, as shown in FIG. 10D, the through holes 62, 62 have the insulating resins 60, 60 shown in the perspective view of FIG.
Then, as shown in FIG. 10E, the copper foil 651 (see FIG. 10C) is etched to form a wiring layer 65 having a predetermined circuit pattern. Next, as shown in FIG. 10 (f), the central portion of the through hole 62 filled with the insulating resin 65 is re-drilled, and the insulating layer 64 and the wiring layer 65 are bored in communication with the through hole 62 to insulate A new terminal insertion hole 66 is formed so that the resin 65 remains on the inner wall of the front through hole 62.

【0008】このようなプリント配線板では、絶縁樹脂
60が挿入される貫通孔62が多数ある場合、それぞれ
個別に絶縁樹脂60を挿入しなければならず、手間がか
かる。また、絶縁樹脂60が充填された貫通孔62の中
心部を再び穿設する際に、絶縁樹脂60にクラックが生
じ、絶縁不良になる。
In such a printed wiring board, when there are a large number of through holes 62 into which the insulating resin 60 is inserted, the insulating resin 60 must be inserted individually, which is troublesome. Further, when the central portion of the through hole 62 filled with the insulating resin 60 is re-drilled, a crack is generated in the insulating resin 60, resulting in poor insulation.

【0009】[0009]

【発明が解決しようとする課題】上述した従来のメタル
コアプリント配線板装置は、少ない繊維強化プラスチッ
クで端子挿入孔の絶縁性を確実にするために、貫通孔に
絶縁樹脂を挿入して端子挿入孔を形成していたが、端子
挿入孔が多数必要な場合、それぞれ個別に絶縁樹脂が挿
入しなければならず、手間がかかるとともに、絶縁樹脂
が充填された端子挿入孔の中心部を再び穿設する際に、
絶縁樹脂にクラックが生じる場合が多々あった。
SUMMARY OF THE INVENTION In the conventional metal core printed wiring board device described above, in order to ensure the insulation of the terminal insertion hole with a small amount of fiber reinforced plastic, an insulating resin is inserted into the through hole to insert the terminal insertion hole. However, if a large number of terminal insertion holes are required, it is necessary to insert the insulating resin separately for each, which is time-consuming, and the center portion of the terminal insertion hole filled with the insulating resin must be re-drilled. When doing
In many cases, the insulating resin was cracked.

【0010】この発明は上記問題点を除去し、簡易な工
程、少量の絶縁樹脂で端子挿入孔の確実な絶縁性を得る
ことができるメタルコアプリント配線板装置の提供を目
的とする。
SUMMARY OF THE INVENTION An object of the present invention is to provide a metal core printed wiring board device which eliminates the above problems and is capable of obtaining a reliable insulating property of a terminal insertion hole with a simple process and a small amount of insulating resin.

【0011】[0011]

【課題を解決するための手段】この発明は、金属板を芯
として用い、この金属板にリード部品の端子挿入用の貫
通孔を形成し、その内面に絶縁層を形成するメタルコア
プリント配線板の製造方法において、前記金属板に前記
貫通孔を形成した後、前記金属板の一面に熱可塑性絶縁
フィルムを配設し、前記貫通孔よりも小径の棒状部材を
加熱した状態で前記金属板の前記一面側から前記熱可塑
性絶縁フィルムを挟んで前記貫通孔に挿入して、前記熱
可塑性絶縁フィルムを前記貫通孔の内面に融着するよう
にしたことを特徴とする。
The present invention provides a metal core printed wiring board in which a metal plate is used as a core, a through hole for inserting a terminal of a lead component is formed in the metal plate, and an insulating layer is formed on the inner surface thereof. In the manufacturing method, after forming the through-hole in the metal plate, a thermoplastic insulating film is disposed on one surface of the metal plate, and the rod-shaped member having a diameter smaller than the through-hole is heated to the metal plate. It is characterized in that the thermoplastic insulating film is inserted from the one surface side into the through hole while sandwiching the thermoplastic insulating film, and the thermoplastic insulating film is fused to the inner surface of the through hole.

【0012】[0012]

【作用】このような構成によれば、前記熱可塑性絶縁フ
ィルムを前記貫通孔の内面に融着して端子挿入孔を形成
することにより、簡易な工程、少量の絶縁樹脂で端子挿
入孔の確実な絶縁性が得られる。
With this structure, the thermoplastic insulating film is fused to the inner surface of the through hole to form the terminal insertion hole, so that the terminal insertion hole can be securely formed with a simple process and a small amount of insulating resin. Insulation is obtained.

【0013】[0013]

【実施例】以下、この発明を図示の実施例によって詳細
に説明する。図1及び図2はこの発明に係るメタルコア
プリント配線板の製造方法の一実施例を製造工程順に示
した工程図である。
The present invention will be described in detail below with reference to the embodiments shown in the drawings. 1 and 2 are process diagrams showing an embodiment of a method of manufacturing a metal core printed wiring board according to the present invention in the order of manufacturing steps.

【0014】本実施例は、先ず、図1(a)に示すよう
に、金属板11を用意する。金属板11は、厚さ略1〜
3mmのアルミニウムで出来ている。次に、図1(b)に
示すように、この金属板11に、端子挿入用の貫通孔1
11を形成してから、脱脂、アルマイト処理等の前処理
を必要に応じて行う。次に、図1(c)に示すように、
金属板11の上面及び下面に、熱可塑性絶縁フィルムと
して厚さ0.1mmのポリフェニレンサルファイドフィル
ム(以下PPSフィルムと呼ぶ)121,122をそれ
ぞれ張り付けるとともに、PPSフィルム122の下面
に厚さ3.5×10-2mmの銅箔131を張り付ける。次
に、図1(d)に示すように、下側プレス形成金具14
1の上に、金属板11を、銅箔131を張り付けた面を
下側にして設置するとともに、上側プレス形成金具14
2を金属板11の上側に配設する。この場合の下側プレ
ス形成金具141は、鉄等の金属を板状に形成したもの
である。一方、上側プレス形成金具142は、半径がP
PSフィルム121の厚み分小径の棒状部材として金属
棒143を金属板144に下方に向けて突設したもので
あり、駆動装置によって上下に移動するようになってい
る。この状態で、プレス形成金具141,142を加熱
し、プレス形成金具142を下降させて、PPSフィル
ム121を変形させながら金属棒143を貫通孔111
に挿入する。そうすると、図1(e)に示すように、P
PSフィルム121は、変形して、貫通孔111の内面
に融着するとともに、下方のPPSフィルム122に融
着する。また、この場合、PPSフィルム121,12
2は金属板11の平面部とも融着する。この後、プレス
形成金具142を上昇させ、図2(f)に示すように、
PPSフィルム121,122を融着させた金属板11
をプレス形成金具141,142から取り外し、図2
(g)に示すように、銅箔131(図1(c)参照)を
エッチングして所定回路パターンを成す配線層13を形
成する。この後、図2(h)に示すように、PPSフィ
ルム121,122及び配線層13の貫通孔111の中
心部に対応する位置を穿設し、新たな端子挿入孔161
を形成する。以上のようにしてメタルコアプリント配線
板が製造される。
In this embodiment, first, as shown in FIG. 1A, a metal plate 11 is prepared. The metal plate 11 has a thickness of approximately 1 to
Made of 3mm aluminum. Next, as shown in FIG. 1B, through holes 1 for inserting terminals are formed in the metal plate 11.
After forming 11, the pretreatment such as degreasing and alumite treatment is performed if necessary. Next, as shown in FIG.
Polyphenylene sulfide films (hereinafter referred to as PPS films) 121 and 122 each having a thickness of 0.1 mm are attached to the upper surface and the lower surface of the metal plate 11 as thermoplastic insulating films, and the lower surface of the PPS film 122 has a thickness of 3.5 mm. × pasting copper foil 131 of 10 -2 mm. Next, as shown in FIG. 1D, the lower press forming metal fitting 14
1, the metal plate 11 is installed with the surface on which the copper foil 131 is attached facing down, and the upper press forming metal fitting 14
2 is arranged above the metal plate 11. In this case, the lower press forming metal member 141 is formed of a metal such as iron in a plate shape. On the other hand, the upper press forming metal fitting 142 has a radius of P
A metal rod 143, which is a rod-shaped member having a small diameter corresponding to the thickness of the PS film 121, is provided on a metal plate 144 so as to project downward, and is vertically moved by a driving device. In this state, the press forming metal fittings 141 and 142 are heated, and the press forming metal fitting 142 is lowered to deform the PPS film 121 and insert the metal rod 143 into the through hole 111.
To insert. Then, as shown in FIG. 1 (e), P
The PS film 121 is deformed and fused to the inner surface of the through hole 111 and also fused to the PPS film 122 below. Also, in this case, the PPS films 121, 12
2 is also fused with the flat surface portion of the metal plate 11. After that, the press forming metal fitting 142 is raised, and as shown in FIG.
Metal plate 11 with PPS films 121 and 122 fused
2 is removed from the press forming metal fittings 141 and 142, and FIG.
As shown in (g), the copper foil 131 (see FIG. 1C) is etched to form the wiring layer 13 forming a predetermined circuit pattern. After this, as shown in FIG. 2H, a position corresponding to the center of the through hole 111 of the PPS films 121 and 122 and the wiring layer 13 is bored, and a new terminal insertion hole 161 is formed.
To form. The metal core printed wiring board is manufactured as described above.

【0015】このような実施例によれば、貫通孔111
の内面を熱により柔らかくなったPPSフィルム121
で覆い、自然冷却することにより、端子挿入孔161の
絶縁を容易かつ確実に取ることができ、貫通孔111の
絶縁を行う絶縁樹脂(この場合PPSフィルム121)
にクラックが生じる心配もなく、絶縁樹脂の削減にも役
立つ。また、貫通孔に融着されるPPSフィルム121
は、熱硬化する必要がなく、自然冷却だけで絶縁層が作
れるので生産性が向上する。さらに、金属板11に貫通
孔111が複数形成されている場合は、プレス形成金具
142に複数の貫通孔111にそれぞれ対応する複数の
金属棒143を金属板144に突設することにより、複
数の貫通孔111を同時にPPSフィルム121で覆う
ことができるので、製造コストを削減できる。図3は本
発明に係る他の実施例であり、配線層を補強するもので
ある。
According to such an embodiment, the through hole 111
PPS film 121 whose inner surface is softened by heat
An insulating resin (in this case, the PPS film 121) that can easily and surely insulate the terminal insertion hole 161 by covering it with natural cooling and insulates the through hole 111.
There is no concern that cracks will occur on the surface, and it also helps reduce the amount of insulating resin. In addition, the PPS film 121 fused to the through hole
, It is not necessary to heat-cure, and the insulating layer can be formed only by natural cooling, which improves productivity. Furthermore, when a plurality of through-holes 111 are formed in the metal plate 11, a plurality of metal rods 143 corresponding to the plurality of through-holes 111 in the press forming metal fitting 142 are provided on the metal plate 144 so as to project a plurality of metal rods 143. Since the through hole 111 can be covered with the PPS film 121 at the same time, the manufacturing cost can be reduced. FIG. 3 shows another embodiment according to the present invention for reinforcing the wiring layer.

【0016】図3において、銅箔131とPPSフィル
ム121との間に繊維強化樹脂層17を設けている。こ
の状態で銅箔131(図1(c)参照)をエッチングし
て所定回路パターンを成す配線層を形成してから、PP
Sフィルム121,122、繊維強化樹脂層17及び配
線層の貫通孔111の中心部に対応する位置を穿設し、
新たな端子挿入孔を形成する。これ以外の構成は、図1
の実施例と同様になっている。このような変形例によれ
ば、図1の実施例と同様の効果があるとともに、配線層
を繊維強化樹脂層17により補強することができる。図
4は本発明に係るもう一つの他の実施例であり、配線層
を更に補強するものである。
In FIG. 3, a fiber reinforced resin layer 17 is provided between the copper foil 131 and the PPS film 121. In this state, the copper foil 131 (see FIG. 1C) is etched to form a wiring layer that forms a predetermined circuit pattern, and then PP
The S films 121 and 122, the fiber reinforced resin layer 17 and the wiring layer are provided at positions corresponding to the central portions of the through holes 111,
A new terminal insertion hole is formed. Other configurations are shown in FIG.
It is similar to the embodiment. According to such a modification, the wiring layer can be reinforced by the fiber reinforced resin layer 17 as well as the same effect as the embodiment of FIG. FIG. 4 shows another embodiment of the present invention, which further reinforces the wiring layer.

【0017】図4において、金属板11の下側に張り付
けるフィルムとして純PPSフィルムを用いるかわり
に、ガラス繊維とPPSによる繊維強化樹脂フィルム1
8を用いている。これ以外の構成は、図1の実施例と同
様になっている。
In FIG. 4, instead of using a pure PPS film as a film attached to the lower side of the metal plate 11, a fiber reinforced resin film 1 made of glass fiber and PPS is used.
8 is used. The other structure is the same as that of the embodiment of FIG.

【0018】このような変形例によれば、図3の実施例
と同様の効果があるとともに、銅箔131を繊維強化樹
脂フィルム18に熱融着させることができるので、配線
層を更に補強することができる。図5は本発明に係るも
う一つの他の実施例であり、端子挿入孔の絶縁を更に確
実するものである。
According to such a modification, the same effect as the embodiment of FIG. 3 can be obtained, and the copper foil 131 can be heat-sealed to the fiber reinforced resin film 18, so that the wiring layer is further reinforced. be able to. FIG. 5 shows another embodiment of the present invention, which further ensures the insulation of the terminal insertion hole.

【0019】先ず、図5(a)において、金属板21
に、端子挿入用の貫通孔211を形成してから、金属板
21の上面及び下面に、PPSフィルム221,222
をそれぞれ張り付ける。この状態の金属板21を、半径
がPPSフィルム222の厚み分小径の貫通孔245を
形成したプレス形成金具241の上に配置する。図1の
上側プレス形成金具142と同様の上側プレス形成金具
242を金属板21の上側に配設する。次に、図5
(b)に示すように、プレス形成金具241及びプレス
形成金具242を加熱し、プレス形成金具242を下降
させて、PPSフィルム222を変形させながら金属棒
243を貫通孔211に挿入する。そうすると、PPS
フィルム222が変形して、貫通孔211の内面に融着
するとともに、下方のPPSフィルム221に融着す
る。また、この場合、PPSフィルム221,222は
金属板21の平面部とも融着する。この後、図5(c)
に示すように、さらに、プレス形成金具242を下降さ
せる。これにより、金属棒243を貫通孔245に挿入
して、PPSフィルム221,222を押し切り、PP
Sフィルム221,222の貫通孔245に対応する位
置を貫通させる。PPSフィルム221,222を融着
させた金属板21を、図6(d)に示すように、プレス
形成金具241,242から取り外し、次に、図6
(e)に示すように、PPSフィルム221の下面に繊
維強化樹脂層27を形成するとともに、繊維強化樹脂層
27の下面に銅箔281を形成する。この状態で銅箔2
81をエッチングして所定回路パターンを成す配線層を
形成してから、繊維強化樹脂層27及び配線層の貫通孔
211の中心部に対応する位置を穿設し、新たな端子挿
入孔を形成する。
First, in FIG. 5A, the metal plate 21
After forming the through holes 211 for inserting terminals, the PPS films 221 and 222 are formed on the upper and lower surfaces of the metal plate 21.
Stick each one. The metal plate 21 in this state is placed on the press forming metal member 241 in which the through hole 245 having a radius smaller than the thickness of the PPS film 222 is formed. An upper press forming metal member 242 similar to the upper press forming metal member 142 of FIG. 1 is arranged on the upper side of the metal plate 21. Next, FIG.
As shown in (b), the press forming metal member 241 and the press forming metal member 242 are heated, the press forming metal member 242 is lowered, and the metal rod 243 is inserted into the through hole 211 while deforming the PPS film 222. Then, PPS
The film 222 is deformed and fused to the inner surface of the through hole 211 and also fused to the PPS film 221 below. Further, in this case, the PPS films 221 and 222 are also fused with the flat surface portion of the metal plate 21. After this, FIG. 5 (c)
As shown in, the press forming metal member 242 is further lowered. As a result, the metal rod 243 is inserted into the through hole 245, the PPS films 221 and 222 are pushed out, and the PP
The positions corresponding to the through holes 245 of the S films 221 and 222 are penetrated. The metal plate 21 to which the PPS films 221 and 222 are fused is removed from the press forming metal members 241 and 242 as shown in FIG.
As shown in (e), the fiber-reinforced resin layer 27 is formed on the lower surface of the PPS film 221, and the copper foil 281 is formed on the lower surface of the fiber-reinforced resin layer 27. Copper foil 2 in this state
81 is etched to form a wiring layer forming a predetermined circuit pattern, and then a position corresponding to the center of the through hole 211 of the fiber reinforced resin layer 27 and the wiring layer is bored to form a new terminal insertion hole. ..

【0020】このような構成によれば、図3の実施例と
同様の効果があるとともに、PPSフィルム221,2
22に一度に貫通孔を形成することができるので、より
一層の製造コストの削減に役立つ。
According to this structure, the same effects as those of the embodiment shown in FIG. 3 are obtained, and the PPS films 221 and 221 are formed.
Since the through holes can be formed in 22 at once, it is possible to further reduce the manufacturing cost.

【0021】尚、図1乃至図6の実施例では、金属板1
1,21には、アルミニウムを用いたが他の金属、例え
ば鉄、ステンレス等でもよい。また、熱可塑性絶縁フィ
ルムの材料としてPPSを用いたが、他の材料、例えば
ポリエーテルサルホン、ポリカーボネイト、ポリエーテ
ルエーテルケトン等を用いてもよい。さらに、棒状部材
として金属棒143,243を用いたが、耐熱性の高い
材質を用いた棒状部材ならば、別のもの例えばセラミッ
ク等を用いてよい。また、棒状部材と金属板11,21
の貫通孔111,211とのギャプは、熱可塑性絶縁フ
ィルムの厚みと同じにしているが、貫通孔111,21
1の内面のPPSフィルム221,222が亀裂及び融
着不良を起こさない範囲なよらば、ギャプを変更しても
よい。
In the embodiment shown in FIGS. 1 to 6, the metal plate 1 is used.
Although aluminum is used for 1 and 21, other metals such as iron and stainless steel may be used. Although PPS is used as the material of the thermoplastic insulating film, other materials such as polyether sulfone, polycarbonate, polyether ether ketone, etc. may be used. Further, although the metal rods 143 and 243 are used as the rod-shaped members, another rod-shaped member made of a material having high heat resistance, such as ceramics, may be used. In addition, the rod-shaped member and the metal plates 11 and 21
The gap between the through holes 111 and 211 is the same as the thickness of the thermoplastic insulating film.
The gap may be changed within a range in which the PPS films 221 and 222 on the inner surface of No. 1 do not cause cracking and defective fusion.

【0022】[0022]

【発明の効果】以上説明したようにこの発明によれば、
前記熱可塑性絶縁フィルムを前記貫通孔の内面に融着し
て端子挿入孔を形成することにより、簡易な工程、少量
の絶縁樹脂で端子挿入孔の確実な絶縁性を得ることがで
きる。また、貫通孔に融着される熱可塑性絶縁フィルム
は、熱硬化する必要がなく、冷却だけで絶縁層が作れる
ので生産性が向上する。
As described above, according to the present invention,
By fusion-bonding the thermoplastic insulating film to the inner surface of the through hole to form the terminal insertion hole, a reliable insulating property of the terminal insertion hole can be obtained by a simple process and a small amount of insulating resin. Further, the thermoplastic insulating film fused to the through hole does not need to be thermoset, and the insulating layer can be formed only by cooling, so that the productivity is improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明に係るメタルコアプリント配線板の製
造方法の一実施例を示すPPSフィルムを前記貫通孔の
内面に融着させるまでの工程図。
FIG. 1 is a process diagram showing a method of manufacturing a metal core printed wiring board according to an embodiment of the present invention until a PPS film is fused to the inner surface of the through hole.

【図2】図1のメタルコアプリント配線板の製造方法の
端子挿入孔を形成する工程の工程図。
FIG. 2 is a process drawing of a process of forming a terminal insertion hole in the method of manufacturing the metal core printed wiring board of FIG.

【図3】この発明に係るメタルコアプリント配線板の製
造方法の他の実施例を示す工程図。
FIG. 3 is a process drawing showing another embodiment of the method for manufacturing a metal core printed wiring board according to the present invention.

【図4】この発明に係るメタルコアプリント配線板の製
造方法のもう一つの他の実施例を示す工程図。
FIG. 4 is a process drawing showing another embodiment of the method for manufacturing a metal core printed wiring board according to the present invention.

【図5】この発明に係るメタルコアプリント配線板の製
造方法のさらにもう一つの他の実施例の熱可塑性絶縁フ
ィルムを貫通孔の内面に融着させるまでの工程図。
FIG. 5 is a process drawing until a thermoplastic insulating film of still another embodiment of the method of manufacturing a metal core printed wiring board according to the present invention is fused to the inner surface of the through hole.

【図6】図5のメタルコアプリント配線板の製造方法の
端子挿入孔を形成する工程の工程図。
FIG. 6 is a process drawing of a process of forming a terminal insertion hole in the method of manufacturing the metal core printed wiring board of FIG.

【図7】従来のメタルコアプリント配線板を示す断面
図。
FIG. 7 is a cross-sectional view showing a conventional metal core printed wiring board.

【図8】リード部品の端子挿入孔を設けた従来のメタル
コアプリント配線板の製造工程を示す工程図。
FIG. 8 is a process drawing showing a manufacturing process of a conventional metal core printed wiring board provided with terminal insertion holes for lead components.

【図9】従来のメタルコアプリント配線板に用いられる
絶縁樹脂を示す斜視図。
FIG. 9 is a perspective view showing an insulating resin used in a conventional metal core printed wiring board.

【図10】図9の絶縁樹脂を用いた従来のメタルコアプ
リント配線板の製造工程を示す工程図。
FIG. 10 is a process drawing showing a manufacturing process of a conventional metal core printed wiring board using the insulating resin of FIG.

【符号の説明】[Explanation of symbols]

11 金属板 111 貫通孔 121 PPSフィルム 143 金属棒 11 Metal Plate 111 Through Hole 121 PPS Film 143 Metal Rod

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 金属板を芯として用い、この金属板にリ
ード部品の端子挿入用の貫通孔を形成し、その内面に絶
縁層を形成するメタルコアプリント配線板の製造方法に
おいて、 前記金属板に前記貫通孔を形成した後、前記金属板の一
面に熱可塑性絶縁フィルムを配設し、前記貫通孔よりも
小径の棒状部材を加熱した状態で前記金属板の前記一面
側から前記熱可塑性絶縁フィルムを挟んで前記貫通孔に
挿入して、前記熱可塑性絶縁フィルムを前記貫通孔の内
面に融着するようにしたことを特徴とするメタルコアプ
リント配線板の製造方法。
1. A method of manufacturing a metal core printed wiring board, comprising using a metal plate as a core, forming through holes for inserting terminals of lead components in the metal plate, and forming an insulating layer on the inner surface of the through hole. After forming the through hole, a thermoplastic insulating film is provided on one surface of the metal plate, and the thermoplastic insulating film is applied from the one surface side of the metal plate in a state where a rod-shaped member having a diameter smaller than that of the through hole is heated. A method of manufacturing a metal core printed wiring board, characterized in that the thermoplastic insulating film is fused to the inner surface of the through hole by inserting the thermoplastic insulating film into the through hole while sandwiching.
JP22452291A 1991-09-05 1991-09-05 Manufacture of metal core printed wiring board Pending JPH0563357A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22452291A JPH0563357A (en) 1991-09-05 1991-09-05 Manufacture of metal core printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22452291A JPH0563357A (en) 1991-09-05 1991-09-05 Manufacture of metal core printed wiring board

Publications (1)

Publication Number Publication Date
JPH0563357A true JPH0563357A (en) 1993-03-12

Family

ID=16815119

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22452291A Pending JPH0563357A (en) 1991-09-05 1991-09-05 Manufacture of metal core printed wiring board

Country Status (1)

Country Link
JP (1) JPH0563357A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6725537B2 (en) * 2000-02-01 2004-04-27 Kabushiki Kaisha Tokai Rika Denki Seisakusho Method of connecting circuit element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6725537B2 (en) * 2000-02-01 2004-04-27 Kabushiki Kaisha Tokai Rika Denki Seisakusho Method of connecting circuit element

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