JPH0563358A - Manufacture of metal core printed wiring board - Google Patents

Manufacture of metal core printed wiring board

Info

Publication number
JPH0563358A
JPH0563358A JP22452391A JP22452391A JPH0563358A JP H0563358 A JPH0563358 A JP H0563358A JP 22452391 A JP22452391 A JP 22452391A JP 22452391 A JP22452391 A JP 22452391A JP H0563358 A JPH0563358 A JP H0563358A
Authority
JP
Japan
Prior art keywords
hole
insulating resin
printed wiring
wiring board
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22452391A
Other languages
Japanese (ja)
Inventor
Daijiro Kamiyama
大治郎 上山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP22452391A priority Critical patent/JPH0563358A/en
Publication of JPH0563358A publication Critical patent/JPH0563358A/en
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

PURPOSE:To make insulation of a terminal insertion hole sure by a simple process and using a small amount of insulative resin. CONSTITUTION:An insulative resin spreading tool 123 wherein a metal rod 121 whose diameter is smaller than a through hole 111 is formed so as to protrude downward is arranged above the upper side of a metal plate 11. A tank 13 filled with fused thermoplastic insulative resin 131 is arranged below the lower side of the metal plate 11. The insulative resin spreading tool 123 is made to descend to insert the metal rod 121 into the through hole 111. The tool is further made to descend to sink the tip of the metal rod 121 in the thermoplastic resin 131. Next, the tool 123 wherein the thermoplastic resin 131 adheres to the tip of the metal rod 121 as shown in (e) is made to ascend, and the tip of the metal rod 121 to which tip the thermoplastic insulative resine 131 adheres is made to pass the through hole 111. As a result, the inner surface of the through hole 111 is coated with the thermoplastic resin 131 as shown in (f). Thereby the insulation of a terminal insertion hole can easily be obtained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、金属板に電子回路を
構成したメタルコアプリント配線板の製造方法に係り、
特に、端子挿入孔の絶縁性を向上出来るようにしたメタ
ルコアプリント配線板の製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a metal core printed wiring board in which an electronic circuit is formed on a metal plate,
In particular, it relates to a method of manufacturing a metal core printed wiring board capable of improving the insulation of the terminal insertion hole.

【0002】[0002]

【従来の技術】近年、電子機器の高密度化・高性能化に
伴いプリント配線板に対する要求が高度化してきてい
る。例えば、高度の寸法安定性を有すること、多数の重
量部品の搭載に耐え得る剛性を持つこと、搭載部品から
発生した熱を速やかに除去するための高度の熱伝導性を
有することなどである。このような要求に対し従来の紙
フェノール基板やガラスエポキシ基板等の有機材料を用
いた基板では、これらの要求を満足できないため、アル
ミニウム、鉄等の金属板を芯として用いたメタルコアプ
リント配線板の開発及び実用化が成されている。図6は
このような従来のメタルコアプリント配線板を示す断面
図である。
2. Description of the Related Art In recent years, the demand for printed wiring boards has increased with the increase in density and performance of electronic devices. For example, it has a high degree of dimensional stability, a rigidity that can withstand the mounting of a large number of heavy parts, and a high degree of thermal conductivity for promptly removing heat generated from the mounted parts. In order to meet such demands, conventional substrates using organic materials such as paper phenol substrates and glass epoxy substrates cannot satisfy these demands. Therefore, metal core printed wiring boards using metal plates such as aluminum and iron as cores Has been developed and put to practical use. FIG. 6 is a cross-sectional view showing such a conventional metal core printed wiring board.

【0003】図6において、符号41はアルミニウム製
の金属板である。金属板41は、上面に絶縁層42が形
成され、その上に配線層43が形成される。配線層43
には、チップ部品や、パワートランジスタが搭載され
る。
In FIG. 6, reference numeral 41 is a metal plate made of aluminum. An insulating layer 42 is formed on the upper surface of the metal plate 41, and a wiring layer 43 is formed thereon. Wiring layer 43
Chip components and power transistors are mounted on the.

【0004】図6に示したメタルコアプリント配線板
は、搭載する部品が、リードレス部品に限定され、トラ
ンスや電解コンデンサ等のリード部品は使用できず用途
は限定されていた。このことに対応して、リード部品の
端子挿入孔を設けたメタルコアプリント配線板が開発さ
れている。図7はリード部品の端子挿入孔を設けた従来
のメタルコアプリント配線板を製造工程順に示す工程図
である。
In the metal core printed wiring board shown in FIG. 6, the components to be mounted are limited to leadless components, and lead components such as transformers and electrolytic capacitors cannot be used, and their applications are limited. In response to this, a metal core printed wiring board provided with a terminal insertion hole for a lead component has been developed. 7A to 7C are process diagrams showing a conventional metal core printed wiring board provided with terminal insertion holes for lead components in the order of manufacturing steps.

【0005】先ず、図7(a)に示すように、貫通孔5
11を形成した金属板51を用意する。図7(b)にて
表面及び裏面にガラスクロス52入り絶縁樹脂53(繊
維強化プラスチック54)を張付け、裏面側の繊維強化
プラスチック54の下に配線層55となる銅箔551を
形成する。そして、この状態の金属板51、繊維強化プ
ラスチック54及び銅箔551のヒートプレスを行い、
図7(c)に示すように、上記端子挿入孔511に繊維
強化プラスチック54の絶縁樹脂53を流し込む。次
に、図7(d)に示すように、銅箔551(図7(b)
参照)をエッチングして所定回路パターンを成す配線層
55を形成する。次に、図7(e)に示すように、絶縁
樹脂53が充填された貫通孔511の中心部を再び穿設
し、絶縁樹脂53が前の端子挿入孔511の内壁に残る
ようにして新たな端子挿入孔561を形成する。
First, as shown in FIG. 7A, the through hole 5
A metal plate 51 on which 11 is formed is prepared. In FIG. 7B, an insulating resin 53 (fiber reinforced plastic 54) containing a glass cloth 52 is attached to the front surface and the back surface, and a copper foil 551 to be a wiring layer 55 is formed under the fiber reinforced plastic 54 on the back surface side. Then, the metal plate 51, the fiber reinforced plastic 54 and the copper foil 551 in this state are heat-pressed,
As shown in FIG. 7C, the insulating resin 53 of the fiber reinforced plastic 54 is poured into the terminal insertion hole 511. Next, as shown in FIG. 7D, copper foil 551 (FIG. 7B)
(See) to form a wiring layer 55 having a predetermined circuit pattern. Next, as shown in FIG. 7E, the central portion of the through hole 511 filled with the insulating resin 53 is re-pierced so that the insulating resin 53 remains on the inner wall of the previous terminal insertion hole 511. The terminal insertion hole 561 is formed.

【0006】以上によって形成されたメタルコアプリン
ト配線板は絶縁樹脂53で貫通孔511を埋めるため
に、繊維強化プラスチック54における絶縁樹脂53を
多くしなければならず、これにより熱抵抗が増大し、放
熱性を等しく損なう。これに対応して、絶縁樹脂53を
少なくした場合には、孔内部を完全に埋めることができ
ず、空洞ができたりして、端子と金属板51の間に短絡
を起こしたりする。また、絶縁樹脂53が充填された貫
通孔511の中心部を再び穿設する際に、絶縁樹脂53
にクラックが生じ、絶縁不良になる。また、熱プレスに
よる樹脂硬化を行うので、生産性が悪い。ここで、前記
熱抵抗の増大という問題に対応し、貫通孔に図8の斜視
図に示す円柱状の絶縁樹脂60を挿入する方法が開発さ
れている。図9はリード部品の端子挿入孔に絶縁樹脂を
挿入する従来のメタルコアプリント配線板を製造工程順
に示す工程図である。
In the metal core printed wiring board formed as described above, since the through hole 511 is filled with the insulating resin 53, the insulating resin 53 in the fiber reinforced plastic 54 must be increased, which increases the thermal resistance and heat dissipation. Equally impair sex. Correspondingly, when the amount of the insulating resin 53 is reduced, the inside of the hole cannot be completely filled and a cavity is formed, which causes a short circuit between the terminal and the metal plate 51. Further, when the central portion of the through hole 511 filled with the insulating resin 53 is re-drilled, the insulating resin 53
Cracks occur in the product, resulting in poor insulation. Moreover, since the resin is cured by hot pressing, the productivity is poor. Here, in response to the problem of increased thermal resistance, a method has been developed in which the cylindrical insulating resin 60 shown in the perspective view of FIG. 8 is inserted into the through hole. FIG. 9 is a process diagram showing a conventional metal core printed wiring board in which an insulating resin is inserted into the terminal insertion holes of lead components in the order of manufacturing steps.

【0007】図9(a)に示すように、金属板61を用
意する。次に、図9(b)に示すように、この金属板6
1に貫通孔62,62を形成する。次に、図9(c)に
て金属板61の上面に絶縁層64を張付け、さらに絶縁
層64の上面に配線層65となる銅箔651を形成す
る。そして、図9(d)に示すように、貫通孔62,6
2に図8の斜視図に示した絶縁樹脂60,60を挿入
し、図9(e)に示すように、銅箔651(図9(c)
参照)をエッチングして所定回路パターンを成す配線層
65を形成する。次に、図9(f)に示すように、絶縁
樹脂65が充填された貫通孔62の中心部を再び穿設と
ともに、これに連通して絶縁層64と配線層65を穿設
し、絶縁樹脂65が前の貫通孔62の内壁に残るように
して新たな端子挿入孔66を形成する。
As shown in FIG. 9A, a metal plate 61 is prepared. Next, as shown in FIG. 9B, the metal plate 6
Through holes 62, 62 are formed in 1. Next, in FIG. 9C, an insulating layer 64 is attached to the upper surface of the metal plate 61, and a copper foil 651 to be the wiring layer 65 is formed on the upper surface of the insulating layer 64. Then, as shown in FIG. 9D, the through holes 62, 6
2, the insulating resin 60, 60 shown in the perspective view of FIG. 8 is inserted, and as shown in FIG. 9E, the copper foil 651 (FIG. 9C) is inserted.
(See reference) is etched to form a wiring layer 65 forming a predetermined circuit pattern. Next, as shown in FIG. 9 (f), the central portion of the through hole 62 filled with the insulating resin 65 is re-drilled, and the insulating layer 64 and the wiring layer 65 are bored so as to communicate with the through hole 62, and insulation is performed. A new terminal insertion hole 66 is formed so that the resin 65 remains on the inner wall of the front through hole 62.

【0008】このようなプリント配線板では、絶縁樹脂
60が挿入される貫通孔62が多数ある場合、それぞれ
個別に絶縁樹脂60を挿入しなければならず、手間がか
かる。また、絶縁樹脂60が充填された貫通孔62の中
心部を再び穿設する際に、絶縁樹脂60にクラックが生
じ、絶縁不良になる。
In such a printed wiring board, when there are a large number of through holes 62 into which the insulating resin 60 is inserted, the insulating resin 60 must be inserted individually, which is troublesome. Further, when the central portion of the through hole 62 filled with the insulating resin 60 is re-drilled, a crack is generated in the insulating resin 60, resulting in poor insulation.

【0009】[0009]

【発明が解決しようとする課題】上述した従来のメタル
コアプリント配線板装置は、少ない繊維強化プラスチッ
クで端子挿入孔の絶縁性を確実にするために、貫通孔に
絶縁樹脂を挿入して端子挿入孔を形成していたが、端子
挿入孔が多数必要な場合、それぞれ個別に絶縁樹脂が挿
入しなければならず、手間がかかるとともに、絶縁樹脂
が充填された端子挿入孔の中心部を再び穿設する際に、
絶縁樹脂にクラックが生じる場合が多々あった。
SUMMARY OF THE INVENTION In the conventional metal core printed wiring board device described above, in order to ensure the insulation of the terminal insertion hole with a small amount of fiber reinforced plastic, an insulating resin is inserted into the through hole to insert the terminal insertion hole. However, if a large number of terminal insertion holes are required, it is necessary to insert the insulating resin separately for each, which is time-consuming, and the center portion of the terminal insertion hole filled with the insulating resin must be re-drilled. When doing
In many cases, the insulating resin was cracked.

【0010】この発明は上記問題点を除去し、簡易な工
程、少量の絶縁樹脂で端子挿入孔の確実な絶縁性を得る
ことができるメタルコアプリント配線板装置の提供を目
的とする。
SUMMARY OF THE INVENTION An object of the present invention is to provide a metal core printed wiring board device which eliminates the above problems and is capable of obtaining a reliable insulating property of a terminal insertion hole with a simple process and a small amount of insulating resin.

【0011】[0011]

【課題を解決するための手段】この発明は、金属板を芯
として用い、この金属板にリード部品の端子挿入用の貫
通孔を形成し、その内面に絶縁層を形成するメタルコア
プリント配線板の製造方法において、前記金属板に前記
貫通孔を形成した後、前記貫通孔よりも小径の棒状部材
の先端に溶融した熱可塑性絶縁樹脂を付着させ、前記端
子挿入孔に前記棒状部材の先端を通過させて、熱可塑性
絶縁樹脂を前記貫通孔に塗布するようにしたことを特徴
とする。
According to the present invention, there is provided a metal core printed wiring board in which a metal plate is used as a core, a through hole for inserting a terminal of a lead component is formed in the metal plate, and an insulating layer is formed on an inner surface of the through hole. In the manufacturing method, after forming the through-hole in the metal plate, a molten thermoplastic insulating resin is attached to the tip of a rod-shaped member having a diameter smaller than that of the through-hole, and the tip of the rod-shaped member is passed through the terminal insertion hole. Then, the thermoplastic insulating resin is applied to the through holes.

【0012】[0012]

【作用】このような構成によれば、棒状部材の先端に溶
融した熱可塑性絶縁樹脂を付着させ、端子挿入用の貫通
孔に前記棒状部材の先端を通過させて、熱可塑性絶縁樹
脂を前記貫通孔に塗布して端子挿入孔を形成することに
より、簡易な工程、少量の絶縁樹脂で端子挿入孔の確実
な絶縁性が得られる。
According to this structure, the molten thermoplastic insulating resin is attached to the tip of the rod-shaped member, and the tip of the rod-shaped member is passed through the through hole for inserting the terminal to penetrate the thermoplastic insulating resin. By forming the terminal insertion hole by coating the hole, it is possible to obtain reliable insulation of the terminal insertion hole with a simple process and a small amount of insulating resin.

【0013】[0013]

【実施例】以下、この発明を図示の実施例によって詳細
に説明する。図1乃至図3はこの発明に係るメタルコア
プリント配線板の製造方法の一実施例を製造工程順に示
した工程図である。
The present invention will be described in detail below with reference to the embodiments shown in the drawings. 1 to 3 are process diagrams showing an embodiment of a method of manufacturing a metal core printed wiring board according to the present invention in the order of manufacturing steps.

【0014】本実施例は、先ず、図1(a)に示すよう
に、金属板11を用意する。金属板11は、厚さ略1〜
3mmのアルミニウムで出来ている。次に、図1(b)に
示すように、この金属板11に、端子挿入用の貫通孔1
11を形成する。次に、図1(c)に示すように、貫通
孔111よりも小径の金属棒121を金属板122に下
方に向けて突設した絶縁樹脂塗布金具123を金属板1
1の上側に配設し、溶融した熱可塑性絶縁樹脂131で
満たされた槽13を金属板11の下側に配設し、絶縁樹
脂塗布金具123を下降させて、金属棒121を貫通孔
111に挿入する。この後、図1(d)に示すように、
さらに絶縁樹脂塗布金具123を下降させて、金属棒1
21の先端を熱可塑性絶縁樹脂131に沈下させる。次
に、図2(e)に示すように、金属棒121の先端に熱
可塑性絶縁樹脂131が付着した絶縁樹脂塗布金具12
3を上昇させ、熱可塑性絶縁樹脂131が付着した金属
棒121の先端を貫通孔111に通過させることによ
り、図2(f)に示すように、貫通孔111の内面に熱
可塑性絶縁樹脂131を塗布する。これら図1(c)〜
図2(f)の動作を数回繰り返すことにより貫通孔11
1の内面に熱可塑性絶縁樹脂131が確実に塗布され
る。貫通孔111の内面に塗布された熱可塑性絶縁樹脂
131は、熱が大気及び金属板11に吸収されて固体化
する。
In this embodiment, first, as shown in FIG. 1A, a metal plate 11 is prepared. The metal plate 11 has a thickness of approximately 1 to
Made of 3mm aluminum. Next, as shown in FIG. 1B, through holes 1 for inserting terminals are formed in the metal plate 11.
11 is formed. Next, as shown in FIG. 1 (c), a metal rod 121 having a diameter smaller than that of the through hole 111 is provided on the metal plate 122 so as to project downward, and the insulating resin coating metal fitting 123 is attached to the metal plate 1.
1, the tank 13 filled with the molten thermoplastic insulating resin 131 is arranged below the metal plate 11, the insulating resin coating fitting 123 is lowered, and the metal rod 121 is inserted into the through hole 111. To insert. After this, as shown in FIG.
Further, the insulating resin coating metal fitting 123 is lowered to make the metal rod 1
The tip of 21 is submerged in the thermoplastic insulating resin 131. Next, as shown in FIG. 2 (e), the insulating resin application fitting 12 in which the thermoplastic insulating resin 131 is attached to the tip of the metal rod 121
3 is moved up and the tip of the metal rod 121 to which the thermoplastic insulating resin 131 is attached is passed through the through hole 111, so that the thermoplastic insulating resin 131 is applied to the inner surface of the through hole 111 as shown in FIG. Apply. These FIG. 1 (c)-
By repeating the operation of FIG.
The thermoplastic insulating resin 131 is surely applied to the inner surface of 1. The thermoplastic insulating resin 131 applied to the inner surface of the through hole 111 absorbs heat into the atmosphere and the metal plate 11 and solidifies.

【0015】このようにして貫通孔111の内面に熱可
塑性絶縁樹脂131が塗布された金属板11は、図3
(g)にて上面及び下面に絶縁層141,142を張付
け、上側の絶縁層14の上面に配線層15となる銅箔1
51を形成する。次に、図3(h)に示すように、銅箔
151(図3(g)参照)をエッチングして所定回路パ
ターンを成す配線層15を形成する。この後、図3
(i)に示すように、絶縁層141,142と配線層1
5との貫通孔111の中心部に対応する位置を穿設し、
貫通孔111の内面に熱可塑性絶縁樹脂131が塗布さ
れた状態で、新たな端子挿入孔161を形成する。以上
のようにしてメタルコアプリント配線板が製造される。
The metal plate 11 having the thermoplastic insulating resin 131 applied to the inner surface of the through hole 111 in this manner is shown in FIG.
In (g), the insulating layers 141 and 142 are attached to the upper and lower surfaces, and the copper foil 1 becomes the wiring layer 15 on the upper surface of the upper insulating layer 14.
51 is formed. Next, as shown in FIG. 3 (h), the copper foil 151 (see FIG. 3 (g)) is etched to form the wiring layer 15 forming a predetermined circuit pattern. After this,
As shown in (i), the insulating layers 141 and 142 and the wiring layer 1
5 is provided at a position corresponding to the center of the through hole 111,
A new terminal insertion hole 161 is formed with the thermoplastic insulating resin 131 applied to the inner surface of the through hole 111. The metal core printed wiring board is manufactured as described above.

【0016】このような実施例によれば、熱可塑性絶縁
樹脂131を金属棒121の先端で貫通孔111に塗付
することにより、端子挿入孔161の絶縁を容易に取る
ことができる。また、端子挿入孔161に塗布される熱
可塑性絶縁樹脂131は、熱硬化する必要がなく、冷却
だけで絶縁層が作れるので生産性が高い。さらに、貫通
孔111と金属棒121とのクリアランスを変えること
により、端子挿入孔34の内壁の熱可塑性絶縁樹脂131
による絶縁層の厚みを調整出来る。金属板11に貫通孔
111が複数形成されている場合は、絶縁樹脂塗布金具
123に複数の貫通孔111にそれぞれ対応する複数の
金属棒121を金属板122に突設することにより、複
数の貫通孔111に同時に熱可塑性絶縁樹脂131を塗
布できるので、製造コストを削減できる。図4は本発明
に係る他の実施例を示している。図4の他の実施例は、
端子挿入孔の絶縁を更に確実するものである。
According to this embodiment, the terminal insulating hole 161 can be easily insulated by applying the thermoplastic insulating resin 131 to the through hole 111 at the tip of the metal rod 121. Further, the thermoplastic insulating resin 131 applied to the terminal insertion holes 161 does not need to be thermoset, and the insulating layer can be formed only by cooling, so that the productivity is high. Further, the thermoplastic insulating resin 131 on the inner wall of the terminal insertion hole 34 is changed by changing the clearance between the through hole 111 and the metal rod 121.
The thickness of the insulating layer can be adjusted by. When a plurality of through-holes 111 are formed in the metal plate 11, a plurality of metal rods 121 corresponding to the plurality of through-holes 111 in the insulating resin coating fitting 123 are provided on the metal plate 122 so as to project a plurality of through-holes. Since the thermoplastic insulating resin 131 can be applied simultaneously to the holes 111, the manufacturing cost can be reduced. FIG. 4 shows another embodiment according to the present invention. Another embodiment of FIG. 4 is
This further ensures the insulation of the terminal insertion hole.

【0017】先ず、図4(a)に示すように、表面及び
裏面に絶縁層22,22を張付けた金属板21を用意す
る。図4(b)に示すように、この金属板21の絶縁層
22を張付けた部分の中心に貫通孔23を形成する。次
に図1に示した絶縁樹脂塗布金具と、熱可塑性絶縁樹脂
で満たされた槽を用いて、図4(c)に示すように、貫
通孔23の内面に熱可塑性絶縁樹脂131を塗布する。
この後、図示しない配線パターンを形成して、メタルコ
ア印刷配線板とする。本実施例によれば、絶縁層22,
22に直接熱可塑性絶縁樹脂131を塗布できるので、
絶縁性が向上する。図5は本発明に係る他の実施例であ
り、端子挿入孔の絶縁を更に確実するものである。
First, as shown in FIG. 4A, a metal plate 21 having insulation layers 22 and 22 attached to the front and back surfaces thereof is prepared. As shown in FIG. 4B, a through hole 23 is formed at the center of the portion of the metal plate 21 on which the insulating layer 22 is attached. Next, as shown in FIG. 4C, using the insulating resin coating fitting shown in FIG. 1 and the tank filled with the thermoplastic insulating resin, the thermoplastic insulating resin 131 is coated on the inner surface of the through hole 23. ..
Then, a wiring pattern (not shown) is formed to obtain a metal core printed wiring board. According to this embodiment, the insulating layer 22,
Since the thermoplastic insulating resin 131 can be directly applied to 22,
The insulation is improved. FIG. 5 shows another embodiment according to the present invention, which further secures the insulation of the terminal insertion hole.

【0018】先ず、図5(a)に示すように、絶縁層3
2及び銅箔33が形成された金属板31を用意する。次
に、図5(b)に示すように、金属板31、絶縁層32
及び銅箔33を連通して、貫通孔34を形成する。次
に、図1に示した絶縁樹脂塗布金具と、熱可塑性絶縁樹
脂で満たされた槽を用いて、図5(c)に示すように、
貫通孔34の内面に熱可塑性絶縁樹脂131を塗布す
る。次に、貫通孔34から食み出した熱可塑性絶縁樹脂
131を研磨装置(グラインダ等)で削る。この後、銅
箔33にエッチング等を行い配線パターンを形成して、
メタルコア印刷配線板とする。本実施例によれば、銅箔
33の貫通孔34内にも直接熱可塑性絶縁樹脂131を
塗布できるので、図4の実施例よりもさらに絶縁性が向
上する。
First, as shown in FIG. 5A, the insulating layer 3
2 and the metal plate 31 on which the copper foil 33 is formed are prepared. Next, as shown in FIG. 5B, the metal plate 31, the insulating layer 32
And the copper foil 33 is communicated with each other to form a through hole 34. Next, using the insulating resin coating metal fitting shown in FIG. 1 and the tank filled with the thermoplastic insulating resin, as shown in FIG.
The thermoplastic insulating resin 131 is applied to the inner surface of the through hole 34. Next, the thermoplastic insulating resin 131 squeezed out from the through hole 34 is ground with a polishing device (a grinder or the like). After that, the copper foil 33 is etched to form a wiring pattern,
Use a metal core printed wiring board. According to this embodiment, since the thermoplastic insulating resin 131 can be directly applied to the through holes 34 of the copper foil 33, the insulating property is further improved as compared with the embodiment of FIG.

【0019】尚、図1乃至図5に示した実施例におい
て、熱可塑性絶縁樹脂131を貫通孔に塗布する部材と
して、金属棒121を用いたが、他の棒状部材、例えば
FRP棒、セラミック棒等別のものを用いてもよい。ま
た、図5の実施例において、配線層33に直接端子を接
続しないのなら、貫通孔34から食み出した熱可塑性絶
縁樹脂131を研磨装置で削らなくてもよい。
In the embodiment shown in FIGS. 1 to 5, the metal rod 121 is used as the member for applying the thermoplastic insulating resin 131 to the through hole, but other rod-shaped members such as FRP rod and ceramic rod are used. You may use another thing. Further, in the embodiment of FIG. 5, if the terminals are not directly connected to the wiring layer 33, the thermoplastic insulating resin 131 protruding from the through holes 34 does not have to be scraped by a polishing device.

【0020】[0020]

【発明の効果】以上説明したようにこの発明によれば、
金属棒で溶融した熱可塑性絶縁樹脂を端子挿入用の貫通
孔に塗り付けることにより、端子挿入孔の絶縁を容易に
取ることができる。また、貫通孔に塗布される熱可塑性
絶縁樹脂は、熱硬化する必要がなく、冷却だけで絶縁層
が作れるので生産性が向上する。
As described above, according to the present invention,
By applying the thermoplastic insulating resin melted by the metal rod to the through hole for inserting the terminal, it is possible to easily insulate the terminal inserting hole. Further, the thermoplastic insulating resin applied to the through holes does not need to be thermoset, and the insulating layer can be formed only by cooling, thus improving the productivity.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明に係るメタルコアプリント配線板の製
造方法の一実施例を示す金属棒の先端に熱可塑性絶縁樹
脂付着させるまでの工程図。
FIG. 1 is a process drawing showing an embodiment of a method of manufacturing a metal core printed wiring board according to the present invention until a thermoplastic insulating resin is attached to the tip of a metal rod.

【図2】図1のメタルコアプリント配線板の製造方法の
熱可塑性絶縁樹脂付着を貫通孔に塗布する工程の工程
図。
FIG. 2 is a process drawing of a process of applying a thermoplastic insulating resin adhesion to a through hole in the method for manufacturing the metal core printed wiring board of FIG.

【図3】図1のメタルコアプリント配線板の製造方法の
端子挿入孔を形成する工程の工程図。
FIG. 3 is a process drawing of a process of forming a terminal insertion hole in the method of manufacturing the metal core printed wiring board of FIG.

【図4】この発明に係るメタルコアプリント配線板の製
造方法の他の実施例を示す工程図。
FIG. 4 is a process drawing showing another embodiment of the method for manufacturing a metal core printed wiring board according to the present invention.

【図5】この発明に係るメタルコアプリント配線板の製
造方法のもう一つの他の実施例を示す工程図。
FIG. 5 is a process drawing showing another embodiment of the method for manufacturing a metal core printed wiring board according to the present invention.

【図6】従来のメタルコアプリント配線板を示す断面
図。
FIG. 6 is a cross-sectional view showing a conventional metal core printed wiring board.

【図7】リード部品の端子挿入孔を設けた従来のメタル
コアプリント配線板の製造工程を示す工程図。
FIG. 7 is a process drawing showing a manufacturing process of a conventional metal core printed wiring board provided with terminal insertion holes for lead components.

【図8】従来のメタルコアプリント配線板に用いられる
絶縁樹脂を示す斜視図。
FIG. 8 is a perspective view showing an insulating resin used in a conventional metal core printed wiring board.

【図9】図8の絶縁樹脂を用いた従来のメタルコアプリ
ント配線板の製造工程を示す工程図。
FIG. 9 is a process drawing showing a manufacturing process of a conventional metal core printed wiring board using the insulating resin of FIG.

【符号の説明】[Explanation of symbols]

11 金属板 111 貫通孔 121 金属棒 131 熱可塑性絶縁樹脂 11 Metal Plate 111 Through Hole 121 Metal Rod 131 Thermoplastic Insulating Resin

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 金属板を芯として用い、この金属板にリ
ード部品の端子挿入用の貫通孔を形成し、その内面に絶
縁層を形成するメタルコアプリント配線板の製造方法に
おいて、 前記金属板に前記貫通孔を形成した後、前記貫通孔より
も小径の棒状部材の先端に溶融した熱可塑性絶縁樹脂を
付着させ、前記端子挿入孔に前記棒状部材の先端を通過
させて、熱可塑性絶縁樹脂を前記貫通孔に塗布するよう
にしたことを特徴とするメタルコアプリント配線板の製
造方法。
1. A method for manufacturing a metal core printed wiring board, comprising using a metal plate as a core, forming a through hole for inserting a terminal of a lead component in the metal plate, and forming an insulating layer on an inner surface of the through hole. After forming the through-hole, the molten thermoplastic insulating resin is attached to the tip of the rod-shaped member having a smaller diameter than the through-hole, and the tip of the rod-shaped member is passed through the terminal insertion hole to remove the thermoplastic insulating resin. A method for manufacturing a metal core printed wiring board, characterized in that the through hole is applied.
JP22452391A 1991-09-05 1991-09-05 Manufacture of metal core printed wiring board Pending JPH0563358A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22452391A JPH0563358A (en) 1991-09-05 1991-09-05 Manufacture of metal core printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22452391A JPH0563358A (en) 1991-09-05 1991-09-05 Manufacture of metal core printed wiring board

Publications (1)

Publication Number Publication Date
JPH0563358A true JPH0563358A (en) 1993-03-12

Family

ID=16815136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22452391A Pending JPH0563358A (en) 1991-09-05 1991-09-05 Manufacture of metal core printed wiring board

Country Status (1)

Country Link
JP (1) JPH0563358A (en)

Similar Documents

Publication Publication Date Title
TWI294757B (en) Circuit board with a through hole wire, and forming method thereof
JP2005142523A (en) Method of manufacturing printed circuit board including buried resistor
CN110012597B (en) Ceramic copper-clad circuit board and preparation method thereof
US6599617B2 (en) Adhesion strength between conductive paste and lands of printed wiring board, and manufacturing method thereof
US6459585B1 (en) Method of producing printed circuit boards and a heat sink arrangement produced in accordance with the method
KR100965341B1 (en) Method of Fabricating Printed Circuit Board
KR101018281B1 (en) Method for fabricating printed circuit board contaning embedded passive components
US10462911B2 (en) High-current transmitting method utilizing printed circuit board
KR100752017B1 (en) Manufacturing Method of Printed Circuit Board
JPH0563358A (en) Manufacture of metal core printed wiring board
JPH10284842A (en) Manufacture of multilayer wiring circuit board
KR101089923B1 (en) Manufacturing method of printed circuit board
KR100797669B1 (en) Printed Circuit Board and Fabricating Method of the same
JPS6153852B2 (en)
JPH05267062A (en) Chip-type hf magnetic coil apparatus and manufacture therefor
WO2022160459A1 (en) Circuit board, fabrication method therefor, and electronic apparatus
JPS5910770Y2 (en) printed wiring board
JPS5815957B2 (en) Manufacturing method of printed wiring board with contacts
CN215222596U (en) Circuit board and electronic device
JPH0563357A (en) Manufacture of metal core printed wiring board
WO2024095812A1 (en) Circuit board and electronic module
JPS60236279A (en) Plate for circuit
KR100871034B1 (en) Fabricating method of paste bump for printed circuit board
JP2005136043A (en) Wiring board and electric apparatus
CN115696747A (en) Manufacturing method of circuit board and circuit board