JPH0563304B2 - - Google Patents
Info
- Publication number
- JPH0563304B2 JPH0563304B2 JP13190989A JP13190989A JPH0563304B2 JP H0563304 B2 JPH0563304 B2 JP H0563304B2 JP 13190989 A JP13190989 A JP 13190989A JP 13190989 A JP13190989 A JP 13190989A JP H0563304 B2 JPH0563304 B2 JP H0563304B2
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- resin
- metal plate
- hole
- flowability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011347 resin Substances 0.000 claims description 79
- 229920005989 resin Polymers 0.000 claims description 79
- 229910052751 metal Inorganic materials 0.000 claims description 78
- 239000002184 metal Substances 0.000 claims description 78
- 238000010438 heat treatment Methods 0.000 claims description 28
- 239000002131 composite material Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 description 21
- 239000011888 foil Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000011521 glass Substances 0.000 description 8
- 238000003475 lamination Methods 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 239000000945 filler Substances 0.000 description 7
- 238000001035 drying Methods 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 239000009719 polyimide resin Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000002966 varnish Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical class O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- -1 Lewis acid compound Chemical class 0.000 description 1
- 229920001494 Technora Polymers 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Inorganic materials O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 235000010216 calcium carbonate Nutrition 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000004950 technora Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- YEAUATLBSVJFOY-UHFFFAOYSA-N tetraantimony hexaoxide Chemical compound O1[Sb](O2)O[Sb]3O[Sb]1O[Sb]2O3 YEAUATLBSVJFOY-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Description
本発明は、金属板を基板として用いた多層の電
気積層板の製造方法に関するものである。
The present invention relates to a method for manufacturing a multilayer electrical laminate using a metal plate as a substrate.
金属板２を基板とする電気積層板においては、
スルーホール５を形成するために孔明きの金属板
２が用いられる。すなわち、第３図ａに示すよう
に金属板２にスルーホール５を形成すべき箇所に
おいてスルーホール５の径よりも大きな通孔１，
１…を設けておき、この複数枚の金属板２，２…
をプリプレグ３を介して重ねて加熱加圧成形をお
こなうことによつて、プリプレグ３に含浸した樹
脂を硬化させて各金属板２，２…を積層接着させ
ると共にプリプレグ３に含浸した樹脂を金属板２
の各通孔１，１…に流入充填させて硬化させる。
このとき各金属板２間には片面プリント配線板や
両面プリント配線板、多層プリント配線板などの
回路板１２，１２…を挟み込むと共に最外層に銅
箔などの金属箔１３を重ねて成形をおこなうもの
であり、第３図ｂのように回路板１２，１２…を
各金属板２，２…間に積層すると共に最外層に金
属箔１３を積層する。そして通孔１に充填させた
樹脂１４の部分において第３図ｃのようにスルー
ホール５を穿孔加工することによつて、樹脂１４
で金属板２との間の絶縁性が確保されたスルーホ
ール５を形成することができるのである。このの
ちに、金属箔１３をエツチング加工して回路形成
をすると共にスルーホール５内にスルーホールメ
ツキを施すことによつて、多層の金属板２をベー
スとし、回路板１２，１２…による内層回路と金
属箔１３による外層回路とで多層の回路を形成し
た多層の電気積層板に仕上げることができるので
ある。
しかし、第３図のような工程で成形をおこなつ
て電気積層板を製造するに際して、金属板２の通
孔１はプリプレグ３に含浸されている樹脂１４で
充填されるために、金属板２が薄い場合には問題
はないが金属板２の厚みが厚くなると、プリプレ
グ３のうち通孔１に対応する部分の樹脂が通孔１
内に多量に流入されて通孔１の部分で電気積層板
の表面にくぼみが生じ、電気積層板の表面に凹凸
が発生して回路形成が困難になる等の問題が生じ
るものであつた。
そこで、第１図ｂに示すように金属板２の片面
にプリプレグ３ａを重ねて加熱することによつて
金属板２にプリプレグ３ａを仮接着し、金属板２
に設けた通孔１の片側の開口を閉じた状態で第１
図ｃのように通孔１内に樹脂４を充填し、そして
第１図ｄのように、この通孔１に樹脂４を充填し
た金属板２を他のプリプレグ３ｂを介して重ね、
加熱加圧成形することによつて電気積層板を製造
することが検討されている。このものでは金属板
２の通孔１には予め樹脂４が充填されているため
に、通孔１の部分でくぼみが生じて電気積層板の
表面に凹凸が発生するようなことがなくなるので
ある。
In the electrical laminate using the metal plate 2 as a substrate,
A perforated metal plate 2 is used to form the through holes 5. In other words, as shown in FIG.
1... is provided, and the plurality of metal plates 2, 2...
By stacking them with the prepreg 3 interposed therebetween and performing heat and pressure molding, the resin impregnated in the prepreg 3 is cured and the metal plates 2, 2... are laminated and bonded, and the resin impregnated in the prepreg 3 is bonded to the metal plate. 2
It is made to flow into each of the through holes 1, 1, . . . and harden.
At this time, circuit boards 12, 12, such as a single-sided printed wiring board, a double-sided printed wiring board, a multilayer printed wiring board, etc., are sandwiched between each metal plate 2, and a metal foil 13 such as copper foil is layered on the outermost layer, and the molding is performed. As shown in FIG. 3B, the circuit boards 12, 12... are laminated between the respective metal plates 2, 2..., and a metal foil 13 is laminated on the outermost layer. Then, by drilling a through hole 5 in the part of the resin 14 filled in the through hole 1 as shown in FIG.
This makes it possible to form a through hole 5 with guaranteed insulation between it and the metal plate 2. Thereafter, by etching the metal foil 13 to form a circuit and plating the insides of the through holes 5, an inner layer circuit formed by the circuit boards 12, 12, etc. is formed using the multilayer metal plate 2 as a base. A multilayer electrical laminate can be completed in which a multilayer circuit is formed by the outer layer circuit formed by the metal foil 13 and the outer layer circuit formed by the metal foil 13. However, when manufacturing an electrical laminate by molding in the process shown in FIG. There is no problem if the metal plate 2 is thin, but if the thickness of the metal plate 2 becomes thick, the resin in the portion of the prepreg 3 corresponding to the through hole 1
This caused problems such as a large amount flowing into the interior of the electrical laminate, causing depressions on the surface of the electrical laminate at the through holes 1, and unevenness on the surface of the electrical laminate, making it difficult to form circuits. Therefore, as shown in FIG. 1b, the prepreg 3a is overlapped on one side of the metal plate 2 and heated to temporarily bond the prepreg 3a to the metal plate 2.
With the opening on one side of the through hole 1 closed,
The through hole 1 is filled with resin 4 as shown in FIG.
It has been considered to produce electrical laminates by hot pressing. In this case, since the through holes 1 of the metal plate 2 are filled with resin 4 in advance, there is no possibility that depressions would be formed at the through holes 1 and unevenness would occur on the surface of the electrical laminate. .
しかし、上記のように金属板２の片面にプリプ
レグ３ａを仮接着した後に、積層成形をおこなつ
て電気積層板を製造する場合には、積層板の成形
性が低下し、積層板内にボイドが発生し易いとい
う問題があつた。これは、第１図ｄのようにプリ
プレグ３ａを金属板１に仮接着するにあたつて加
熱をおこなう必要があるために、仮接着の際の加
熱でプリプレグ３ａに含浸されている樹脂の硬化
が進行することになり、従つて第１図ｄのように
積層成形をおこなう際にこのプリプレグ３ａに含
浸されている樹脂の流れが不十分になつて、ボイ
ドが発生するものと考えられる。このようにボイ
ドが発生すると湿気が浸入して絶縁信頼性が低下
したりするおそれがある。
本発明は上記の点に鑑みて為されたものであ
り、ボイドが発生するようなことなく成形性良く
積層成形をおこなうことができる電気積層板の製
造方法を提供することを目的とするものである。
However, when producing an electrical laminate by laminating the prepreg 3a on one side of the metal plate 2 after temporarily adhering it to one side of the metal plate 2 as described above, the formability of the laminate decreases and voids are formed within the laminate. There was a problem that this was likely to occur. This is because it is necessary to heat the prepreg 3a to the metal plate 1 as shown in Fig. 1d, so the resin impregnated in the prepreg 3a hardens due to the heating during the temporary bonding. Therefore, it is thought that when lamination molding is performed as shown in FIG. 1d, the flow of the resin impregnated into the prepreg 3a becomes insufficient and voids are generated. When voids are generated in this way, there is a risk that moisture may infiltrate and the insulation reliability may deteriorate. The present invention has been made in view of the above points, and an object of the present invention is to provide a method for manufacturing an electrical laminate that can be laminated with good moldability without producing voids. be.
上記課題を解決するために本発明は、通孔１を
設けた金属板２の片面にプリプレグ３ａを重ねて
仮接着することによつてプリプレグ３ａで通孔１
の片側の開口を閉じ、樹脂４を通孔１内に充填し
た後に、この金属板２とプリプレグ３ａとの複合
体６を他のプリプレグ３ｂを介して重ねると共に
加熱加圧して積層成形し、しかる後に通孔１内の
樹脂４の部分でスルーホール５を穿孔加工するこ
とによつて電気積層板を製造するにあたつて、金
属板２に仮接着した後のプリプレグ３ａの170℃、
20Kg／cm2、10分間の条件での樹脂流れ性が20％以
上になる条件で、金属板２へのプリプレグ３ａの
仮接着をおこなうことを特徴とするものである。
以下本発明を詳細に説明する。
金属板２は銅板やアルミニウム板などで形成さ
れるものであり、スルーホール５を形成する箇所
において第１図ａに示すように通孔１が穿孔加工
してある。通孔１はスルーホール５の直径よりも
大きな直径で形成されるものである。通孔１を形
成したのちに金属板２には樹脂との密着性を高め
るために表面処理を施しておくのが好ましい。表
面処理としては、酸化処理液などを用いる黒化処
理やブラウン処理、電解メツキによる表面こぶ付
け処理などを採用することができる。
一方、プリプレグ３ａはガラス繊維の織布や不
織布、紙などを基材とし（特にガラス繊維の不織
布が望ましい）、これにエポキシ樹脂やポリイミ
ドなどの熱硬化性樹脂のワニスを固形分換算量で
40〜90重量％程度含浸して、これを乾燥すること
によつて調製されるものである。このプリプレグ
３ａにおいて、含浸した樹脂の樹脂流れ性（グリ
ニスと称される）が30〜90％になるように、乾燥
条件等を調整するものである。本出願において、
樹脂流れ性とは、JIS C6487（1980年）に規定さ
れる試験法に準拠して、170℃、20Kg／cm2、10分
間の条件で測定した樹脂流れ性であると定義され
るものである。すなわち、約20gの試験片を秤量
した後に170℃のプレスに入れて20Kg／cm2の圧力
を10分間加え、次いで試験片をプレスから取り出
して冷却し、その試験片から流れ出した樹脂を取
り除いて再び試験片を秤量し、プレス前の試験片
の重量W1からプレス後の試験片の重量W2を差し
引いた数値をプレス前の試験片の重量W1で除し
た値の100分率として次式より求めた数値である。
樹脂流れ性（％）＝〔（W1−W2）／W1〕×100
プリプレグ３ａを作成するにあたつて上記のよ
うに樹脂流れ性が30〜90％になるようにする乾燥
条件は、プリプレグ３ａに含浸する樹脂の種類等
によつて異なるが、例えば加熱温度を130〜170
℃、加熱時間を２〜10分程度に設定するのが一般
的である。尚、このプリプレグ３ａは金属板２の
通孔１の底の開口を閉塞する作用をなせばよいの
で、厚みが0.1mm程度の薄いもので十分である。
そしてまず、金属板２の片面（下面）にプリプ
レグ３ａを重ねて第１図ｂのように仮接着させ
る。一体化は金属板２にプリプレグ３ａを重ねる
と共にさらにその上下に離型紙などを重ね、この
状態で熱を加えて熱溶着させたり、あるいは加熱
加圧成形したりすることによつておこなうことが
できる。このようにプリプレグ３ａを仮接着する
にあたつて、プリプレグ３ａに含浸した樹脂の樹
脂流れ性が20％未満にならないように、加熱温
度、加熱時間、加圧力を調整しておこなうもので
ある。樹脂流れ性が20％以上であれば、後述の積
層成形の際においてもこのプリプレグ３ａに含浸
した樹脂の流動性を十分に確保することができ、
ボイドが発生することなく成形性良く積層成形を
おこなうことができるのである。つまり、本発明
はこのように、金属板２に仮接着した後のプリプ
レグ３ａの樹脂の樹脂流れ性が20％以上であれ
ば、積層成形の際の成形性が悪くならないという
知見を得て完成されたのである。プリプレグ３ａ
に含浸した樹脂の樹脂流れ性が20％未満にならな
いように仮接着できる、加熱温度、加熱時間、加
圧力の条件は、プリプレグ３ａに含浸した樹脂の
種類や配合等に左右されるために、特定の数値範
囲で規定することはできないが、プリプレグ３ａ
に含浸した樹脂がエポキシ樹脂やポリイミド樹脂
の場合には、加熱温度は80〜130℃、加熱時間は
30秒〜５分、加圧力は接触圧（すなわち０Kg／
cm2）〜10Kg／cm2の範囲が一般的である。これらの
条件の上限を超えると、プリプレグ３ａに含浸し
た樹脂の樹脂流れ性が20％未満になるおそれがあ
る。逆に下限以下の条件であれば金属板２へのプ
リプレグ３ａの接着が不十分になるおそれがあ
る。尚、金属板２に仮接着した後のプリプレグ３
ａの樹脂の樹脂流れ性の上限は特に限定されない
が、樹脂流れ性が大き過ぎると積層成形の際の樹
脂の流出量が多くなるために、70％を上限として
設定するのが好ましい。
また、金属板２にプリプレグ３ａを仮接着する
にあたつて、多段成形によつて生産性良く作業を
おこなうことができる。すなわち第２図に示すよ
うに、金属板２とプリプレグ３ａとを重ねたもの
を１組とし、これを離型紙や金属プレートなどの
スペーサ１４を介して複数組み重ねて熱盤１５間
にセツトし、そしてこれをさらに複数段に重ねて
加熱成形することによつて、多数組みの金属板２
とプリプレグ３ａとの仮接着を同時に生産性良く
おこなうことができるのである。しかしこの場
合、各段において熱盤１５に近い組みのプリプレ
グ３ａには高温度で熱が加わると共に熱盤１５か
ら遠い中央部の組みのプリプレグ３ａには熱は低
い温度で加わることになり、各組みでプリプレグ
３ａに加わる熱履歴は異なつてくる。そして各段
での熱盤１５間の組み数が多くなるとこの熱履歴
の差も大きくなり、熱盤１５から遠い組みのプリ
プレグ３ａの樹脂流れ性は20％以上でも、熱盤１
５に近い組みのプリプレグ３ａの樹脂流れ性は20
％未満になるおそれがある。このために各プリプ
レグ３ａでの熱履歴に差が大きく生じないように
して樹脂流れ性が総て20％以下になるようにする
ためには、各段の熱盤１５間にセツトする組み数
を４組以下に設定するのが好ましい。
上記のように金属板２の片面にプリプレグ３ａ
を仮接着した後に、樹脂４を金属板２の通孔１に
流し込んで第１図ｃのように充填する。この樹脂
４としては特に限定されるものではないが、エポ
キシ樹脂やポリイミドなどプリプレグ３ａに含浸
した樹脂と同種のものを用いるのが好ましい。ま
たこの樹脂には充填剤を配合しておくのが好まし
い。充填剤としては、Al2O3、Al2O3・H2O、
Al2O3・3H2O、タルク、MgO、CaCO3、Sb2O3、
Sb2O5などの球状粉末や、ＥガラスやＤガラス、
Ｔガラス、Ｒガラス、Ｑガラスなどのガラス繊維
や、ケプラー（デユポン社製）、テクノーラ（帝
人社製）などのアラミド繊維等を細かく切断して
すりつぶした針状粉末を例示することができる。
通孔１への樹脂４の充填は、樹脂４をワニス状な
ど液状に調製して流し込むようにする他、粉末状
に調製して流し込むようにしたり、予め通孔１の
形に成形しておいて固形の状態で嵌め込んでおこ
なうことができる。そして必要に応じて減圧脱気
しつつ加熱することによつて通孔１内の樹脂を硬
化させる。
次に、上記のように金属板２とプリプレグ３ａ
とを仮接着すると共に通孔１に樹脂４を充填して
形成される複合体６を用いて電気積層板を製造す
るにあたつては、第１図ｄのようにプリプレグ３
ｂを介して複合体６を数枚重ねると共に最外層の
複合体６の外面にプリプレグ３ｂを介して銅箔な
どの金属箔１３を重ねる。このとき各複合体６間
にはプリプレグ３ｂを介して片面プリント配線板
や両面プリント配線板、多層プリント配線板など
の内層用回路を形成した回路板１２，１２…がセ
ツトしてある。このプリプレグ３ｂとしては、前
記プリプレグ３ａと同様にガラス布や紙などを基
材とし、これにエポキシ樹脂やポリイミドなどの
熱硬化性樹脂を含浸して乾燥することによつて調
製されるものが用いられるものであり、この樹脂
としてはプリプレグ３ａの調製に用いる樹脂と同
種のものを使用するのが好ましく、プリプレグ３
ａとプリプレグ３ｂとは同じものを用いるように
することもできる。
そして加熱加圧成形をおこなうことによつて、
プリプレグ３ａとプリプレグ３ｂに含浸した樹脂
をそれぞれ一旦溶融させると共に硬化させて金属
板２と回路板１２とを交互に積層接着させ、第３
図ｂの場合と同様な層構成で金属板２と回路板１
０とを交互に積層すると共に最外層に金属箔１３
を積層接着した電気積層板を得ることができる。
このとき、金属板２の通孔１には樹脂４が予め充
填されているために、通孔１に対応する部分でく
ぼみが生じるようなおそれはなく、くぼみによつ
て金属箔１３の表面に凹凸が生じるようなおそれ
もない。そして、この積層成形にあたつてプリプ
レグ３ａに含浸した樹脂は樹脂流れ性が20％以上
であるために、この成形の際にも十分な溶融流動
性が確保されるものであり、ボイドが発生するよ
うなことなく良好な成形性で成形をおこなうこと
ができるものである。
以上のようにして金属板２と回路板１２とを交
互に積層すると共に表面に金属箔１３を積層した
のちに、ドリル加工やパンチ加工などでスルーホ
ール５を穿孔加工する。スルーホール５は第３図
ｃに示すと同様に、通孔１に充填した樹脂４の部
分において通孔１の直径よりも小さい直径で形成
されるものであり、従つてスルーホール５の内周
と金属板２との間の電気絶縁性は樹脂４によつて
確保されることになる。尚、スルーホール５のう
ち一部のものはアースなどのために金属板２を貫
通して形成されている。そしてスルーホール５を
加工したのちに、スルーホール５の内周に銅メツ
キなどでスルーホールメツキを形成したり、金属
箔１３をエツチング処理して外層回路を形成した
りして、多層の金属板２をベースとし回路板１２
による内層回路と金属箔１３による外層回路とを
設けた多層の電気積層板として仕上げるのであ
る。このものにあつて、金属板２の通孔１に充填
した樹脂４には充填剤が配合されているので、ス
ルーホール５を加工する際にスルーホール５の内
周面に充填剤が露出してスルーホール５の内周面
が凹凸面となり、凹凸面のアンカー効果などでス
ルーホール５の内周面に施すスルーホールメツキ
の密着性が高まるものである。
In order to solve the above-mentioned problems, the present invention has a structure in which a prepreg 3a is overlapped and temporarily bonded to one side of a metal plate 2 provided with a through hole 1.
After closing the opening on one side and filling the resin 4 into the through hole 1, the composite body 6 of the metal plate 2 and the prepreg 3a is stacked with another prepreg 3b interposed therebetween, and is laminated by heating and pressurizing. When producing an electrical laminate by later drilling through holes 5 in the resin 4 in the through holes 1, the prepreg 3a is heated at 170°C after being temporarily bonded to the metal plate 2.
The prepreg 3a is temporarily bonded to the metal plate 2 under conditions such that resin flowability is 20% or more at 20 kg/cm 2 for 10 minutes. The present invention will be explained in detail below. The metal plate 2 is made of a copper plate, an aluminum plate, or the like, and has through holes 1 drilled therein as shown in FIG. 1A at locations where through holes 5 are to be formed. The through hole 1 is formed with a diameter larger than that of the through hole 5. After forming the through holes 1, it is preferable that the metal plate 2 is subjected to a surface treatment in order to improve its adhesion to the resin. As the surface treatment, blackening treatment or browning treatment using an oxidizing treatment liquid or the like, surface bumping treatment using electrolytic plating, etc. can be adopted. On the other hand, prepreg 3a is made of glass fiber woven fabric, non-woven fabric, paper, etc. (glass fiber non-woven fabric is particularly desirable), and a thermosetting resin varnish such as epoxy resin or polyimide is applied to this in the solid content equivalent amount.
It is prepared by impregnating about 40 to 90% by weight and drying it. In this prepreg 3a, the drying conditions etc. are adjusted so that the resin flowability (referred to as Glinnis) of the impregnated resin is 30 to 90%. In this application,
Resin flowability is defined as the resin flowability measured at 170℃, 20Kg/cm 2 for 10 minutes in accordance with the test method specified in JIS C6487 (1980). . That is, after weighing approximately 20g of a test piece, it was placed in a press at 170°C and a pressure of 20Kg/ cm2 was applied for 10 minutes, then the test piece was removed from the press and cooled, and the resin that flowed from the test piece was removed. Weigh the test piece again, and calculate the value obtained by subtracting the weight W 2 of the test piece after pressing from the weight W 1 of the test piece before pressing, divided by the weight W 1 of the test piece before pressing, as follows: This is a numerical value obtained from the formula. Resin flowability (%) = [(W 1 - W 2 ) / W 1 ] × 100 When creating prepreg 3a, the drying conditions to make the resin flowability between 30 and 90% as described above are as follows: Although it varies depending on the type of resin impregnated into the prepreg 3a, for example, the heating temperature may be set to 130 to 170.
It is common to set the temperature and heating time to about 2 to 10 minutes. Incidentally, since this prepreg 3a only has to function to close the opening at the bottom of the through hole 1 of the metal plate 2, a thin one having a thickness of about 0.1 mm is sufficient. First, a prepreg 3a is overlapped on one side (lower side) of the metal plate 2 and temporarily bonded as shown in FIG. 1b. Integration can be carried out by stacking the prepreg 3a on the metal plate 2, and then layering release paper or the like on top and bottom of the prepreg 3a, and applying heat in this state to thermally weld them, or by heating and press forming. . When temporarily bonding the prepreg 3a in this way, the heating temperature, heating time, and pressure are adjusted so that the resin flowability of the resin impregnated into the prepreg 3a does not become less than 20%. If the resin flowability is 20% or more, sufficient fluidity of the resin impregnated into this prepreg 3a can be ensured even during lamination molding described later.
Lamination molding can be performed with good moldability without generating voids. In other words, the present invention was completed based on the knowledge that if the flowability of the resin of the prepreg 3a after temporarily adhering to the metal plate 2 is 20% or more, the moldability during lamination molding will not deteriorate. It was done. prepreg 3a
The conditions of heating temperature, heating time, and pressure that can be temporarily bonded so that the resin flowability of the resin impregnated in the prepreg 3a does not become less than 20% depend on the type and composition of the resin impregnated into the prepreg 3a. Although it cannot be specified in a specific numerical range, prepreg 3a
If the impregnated resin is epoxy resin or polyimide resin, the heating temperature is 80 to 130℃ and the heating time is
30 seconds to 5 minutes, the pressure is contact pressure (i.e. 0 kg/
cm 2 ) to 10 Kg/cm 2 is common. If the upper limits of these conditions are exceeded, the flowability of the resin impregnated into the prepreg 3a may be less than 20%. On the other hand, if the conditions are below the lower limit, there is a possibility that the adhesion of the prepreg 3a to the metal plate 2 will be insufficient. In addition, the prepreg 3 after being temporarily bonded to the metal plate 2
The upper limit of the resin flowability of the resin a is not particularly limited, but if the resin flowability is too high, the amount of resin flowing out during lamination molding will increase, so it is preferable to set the upper limit to 70%. Further, when temporarily adhering the prepreg 3a to the metal plate 2, the work can be carried out with high productivity by multi-stage molding. That is, as shown in FIG. 2, one set is made by stacking the metal plate 2 and the prepreg 3a, and a plurality of sets are stacked with spacers 14 such as release paper or metal plates interposed therebetween and set between the heating platens 15. , and by further stacking them in multiple stages and heat forming them, a large number of sets of metal plates 2 are made.
Temporary adhesion of the prepreg 3a and the prepreg 3a can be simultaneously performed with good productivity. However, in this case, in each stage, heat is applied at a high temperature to the set of prepregs 3a close to the heating plate 15, and heat is applied at a low temperature to the set of prepregs 3a in the central part far from the heating plate 15. The thermal history applied to the prepreg 3a differs depending on the assembly. As the number of sets between the heating plates 15 in each stage increases, the difference in thermal history also increases, and even if the resin flowability of the prepreg 3a of the set far from the heating plate 15 is 20% or more, the heating plate 15
The resin flowability of prepreg 3a, which is similar to 5, is 20.
%. For this reason, in order to prevent large differences in the thermal history of each prepreg 3a and to keep the resin flowability to 20% or less, the number of sets to be set between the heating plates 15 in each stage must be adjusted. It is preferable to set the number to 4 or less. Prepreg 3a on one side of the metal plate 2 as described above.
After temporary adhesion, resin 4 is poured into the through hole 1 of the metal plate 2 to fill it as shown in FIG. 1c. The resin 4 is not particularly limited, but it is preferable to use the same type of resin as the resin impregnated into the prepreg 3a, such as epoxy resin or polyimide. Further, it is preferable to add a filler to this resin. As fillers, Al 2 O 3 , Al 2 O 3・H 2 O,
Al2O3 ・ 3H2O , talc, MgO, CaCO3 , Sb2O3 ,
Spherical powder such as Sb 2 O 5 , E glass and D glass,
Examples include acicular powder obtained by finely cutting and grinding glass fibers such as T glass, R glass, and Q glass, and aramid fibers such as Kepler (manufactured by Dupont) and Technora (manufactured by Teijin).
The resin 4 can be filled into the through hole 1 by preparing the resin 4 in a liquid form such as varnish and pouring it in, or by preparing it in a powder form and pouring it in, or by molding it into the shape of the through hole 1 in advance. It can be done by inserting it in a solid state. Then, the resin in the through hole 1 is cured by heating while depressurizing and degassing as necessary. Next, as described above, the metal plate 2 and the prepreg 3a are
When manufacturing an electrical laminate using a composite 6 formed by temporarily adhering the prepreg 3 and filling the through holes 1 with the resin 4, as shown in FIG.
Several sheets of the composite body 6 are stacked via the prepreg 3b, and a metal foil 13 such as copper foil is stacked on the outer surface of the outermost composite body 6 via the prepreg 3b. At this time, circuit boards 12, 12, . . . on which internal layer circuits are formed, such as a single-sided printed wiring board, a double-sided printed wiring board, or a multilayer printed wiring board, are set between each composite body 6 via prepregs 3b. As with the prepreg 3a, this prepreg 3b is prepared by using glass cloth or paper as a base material, impregnating it with a thermosetting resin such as epoxy resin or polyimide, and drying it. It is preferable to use the same kind of resin as the resin used for preparing prepreg 3a.
It is also possible to use the same material as the prepreg a and the prepreg 3b. Then, by performing heating and pressure molding,
The resin impregnated into the prepreg 3a and the prepreg 3b is melted and cured, and the metal plate 2 and the circuit board 12 are laminated and bonded alternately.
Metal plate 2 and circuit board 1 with the same layer configuration as in Figure b.
0 and metal foil 13 on the outermost layer.
An electrical laminate can be obtained by laminating and bonding.
At this time, since the through holes 1 of the metal plate 2 are filled with the resin 4 in advance, there is no fear that dents will be formed in the portion corresponding to the through holes 1, and the dents will cause unevenness on the surface of the metal foil 13. There is no fear that this will occur. In addition, since the resin impregnated into the prepreg 3a during this laminated molding has resin flowability of 20% or more, sufficient melt flowability is ensured during this molding, and voids occur. It is possible to perform molding with good moldability without causing any damage. After the metal plates 2 and circuit boards 12 are alternately laminated and the metal foil 13 is laminated on the surface as described above, through holes 5 are formed by drilling, punching, or the like. As shown in FIG. 3c, the through hole 5 is formed with a smaller diameter than the diameter of the through hole 1 in the portion of the resin 4 filled in the through hole 1, and therefore the inner circumference of the through hole 5 Electrical insulation between the metal plate 2 and the metal plate 2 is ensured by the resin 4. Note that some of the through holes 5 are formed to penetrate through the metal plate 2 for grounding and the like. After processing the through-holes 5, through-hole plating is formed on the inner periphery of the through-holes 5 using copper plating or the like, and the metal foil 13 is etched to form an outer layer circuit, thereby forming a multilayer metal plate. 2 as a base and circuit board 12
It is finished as a multilayer electrical laminate with an inner layer circuit made of the metal foil 13 and an outer layer circuit made of the metal foil 13. In this case, since the resin 4 filled in the through hole 1 of the metal plate 2 contains a filler, the filler is not exposed on the inner peripheral surface of the through hole 5 when processing the through hole 5. The inner circumferential surface of the through hole 5 becomes an uneven surface, and the adhesion of the through hole plating applied to the inner circumferential surface of the through hole 5 is enhanced due to the anchor effect of the uneven surface.
次に、本発明を実施例によつて具体的に説明す
る。
末端官能型イミド樹脂（住友化学社製TMS−
20）200重量部、液状エポキシ樹脂149重量部、ブ
ロム化ノボラツク樹脂136重量部、ルイス酸化合
物82重量部、不飽和ビスマレイミド20重量部を混
合し、90℃で50分間加熱したのちに常温にまで冷
却して30分間撹拌下反応させることによつてエポ
キシ変性ポリイミド樹脂ワニスを調製した。次に
このエポキシ変性ポリイミド樹脂ワニスに基材と
してガラス不織布（日本バイリーン製EP−
4075：75g／m2）を浸漬し、次いで乾燥すること
によつて、780g／m2のプリプレグ３ａを作成し
た。ここで乾燥の条件は140℃、５分に設定し、
プリプレグ３ａに含浸した樹脂の樹脂流れ性が45
％になるように調整した。
一方、金属板２として500mm×400mm×0.5mmの
銅板を用い、直径が1.5mmの通孔１を1.8mmピツチ
で縦100×横60の個数設けた。そしてこの金属板
２の下面に上記プリプレグ３ａを重ね、これを第
２図に示すように熱盤１５間に複数組みセツト
し、さらに多段に重ねて加熱することによつて金
属板２にプリプレグ３ａを仮接着した。この仮接
着の際の熱盤１５による加熱温度と加熱時間を次
表に示す。また加圧力は２Kg／cm2になるように調
整した。さらにこの仮接着の際の各段の熱盤１５
間にセツトした金属板２とプリプレグ３ａの組み
数を次表に示す。このように金属板２の下面にプ
リプレグ３ａを仮接着した後に、上記のエポキシ
変性ポリイミド樹脂ワニスに充填剤としてＥガラ
ス微粉末を配合して調製した充填剤入り樹脂を流
し込んで充填した。Ｅガラス微粉末としては平均
長さが35μ、平均直径が13μのものを、300PHRの
配合量で配合して用いた。
そしてこの金属板２とプリプレグ３ａとを仮接
着した複合体６を３枚、両面銅張ポリイミド樹脂
積層板の銅箔をエツチング加工して回路を設ける
ことによつて形成した両面プリント配線板を回路
板１２として２枚用い、プリプレグ３ｂとして上
記プリプレグ３ａと同じものを用い、これらを第
１図ｄのように重ねると共に上下にプリプレグ３
ｂを介して35μ厚の銅箔１３を重ね、まず20Kg／
cm2の加圧条件を維持しつつ140℃で20分間、170℃
で90分間加熱すると共に20分間を要して冷却して
積層成形をおこなうことによつて、金属板２と回
路板１２とを交互に積層し表面に銅箔１３を張つ
た多層積層板を得た。こののちに金属板２の通孔
１の部分において多層積層板に直径が0.9mmのス
ルーホールをドリル加工し、次いで銅メツキをお
こなつてスルーホールの内周にスルーホールメツ
キを施すことによつて電気積層板を得た。
上記のようにして電気積層板を製造するにあた
つて、金属板２に仮接着した後のプリプレグ３ａ
の樹脂の樹脂流れ性を測定した。結果を次表の
「樹脂流れ性」の欄に示す。また得られた電気積
層板において各プリプレグ３ａの部分にボイドが
発生しているか否かを検査し、結果を次表の「成
形性」の欄に示す。表において、熱盤１５間にセ
ツトした複数組みのプリプレグ３ａのうち、上端
のものから順に「１組目」〜「７組目」として示
した。また「成形性」の欄において、「〇」はボ
イドの発生無し、「△」は30cm四方の範囲内にボ
イド10個以下発生、「×」は30cm四方の範囲内に
ボイド11個以上発生、をそれぞれ示す。
Next, the present invention will be specifically explained using examples. Terminal functional imide resin (TMS- manufactured by Sumitomo Chemical Co., Ltd.)
20) Mix 200 parts by weight, 149 parts by weight of liquid epoxy resin, 136 parts by weight of brominated novolak resin, 82 parts by weight of Lewis acid compound, and 20 parts by weight of unsaturated bismaleimide, heat at 90°C for 50 minutes, and then cool to room temperature. An epoxy-modified polyimide resin varnish was prepared by cooling the mixture to a temperature of 100.degree. C. and reacting with stirring for 30 minutes. Next, this epoxy-modified polyimide resin varnish was coated with a glass nonwoven fabric (EP-
4075: 75 g/m 2 ) and then drying to prepare a prepreg 3a of 780 g/m 2 . Here, the drying conditions were set at 140℃ for 5 minutes.
Resin flowability of resin impregnated into prepreg 3a is 45
Adjusted to be %. On the other hand, a copper plate measuring 500 mm x 400 mm x 0.5 mm was used as the metal plate 2, and a number of through holes 1 each having a diameter of 1.5 mm were provided at a pitch of 1.8 mm, measuring 100 in length and 60 in width. Then, the prepreg 3a is stacked on the lower surface of the metal plate 2, a plurality of sets are set between the heating plates 15 as shown in FIG. I temporarily attached it. The heating temperature and heating time by the heating plate 15 during this temporary bonding are shown in the following table. Further, the pressing force was adjusted to 2 kg/cm 2 . Furthermore, the heating plate 15 of each stage during this temporary adhesion
The number of sets of metal plate 2 and prepreg 3a set between them is shown in the following table. After the prepreg 3a was temporarily bonded to the lower surface of the metal plate 2 in this manner, a filler-containing resin prepared by blending E glass fine powder as a filler into the above-mentioned epoxy-modified polyimide resin varnish was poured and filled. E-glass fine powder having an average length of 35 μm and an average diameter of 13 μm was used in a blended amount of 300 PHR. Then, a double-sided printed wiring board is formed by etching the copper foil of the double-sided copper-clad polyimide resin laminate and forming a circuit using three composites 6 in which the metal plate 2 and the prepreg 3a are temporarily bonded together. Two plates are used as the plate 12, and the same prepreg as the prepreg 3a is used as the prepreg 3b, and these are stacked as shown in FIG.
Layer the copper foil 13 with a thickness of 35μ through b, and first put 20Kg/
170°C for 20 min at 140°C while maintaining pressure conditions of cm2 .
By heating for 90 minutes and cooling for 20 minutes to perform lamination molding, a multilayer laminate in which metal plates 2 and circuit boards 12 are alternately laminated and copper foil 13 is stretched on the surface is obtained. Ta. After this, a through hole with a diameter of 0.9 mm is drilled in the multilayer laminate at the through hole 1 part of the metal plate 2, and then copper plating is performed to plate the inner periphery of the through hole. An electrical laminate was obtained. In manufacturing the electrical laminate as described above, the prepreg 3a after being temporarily bonded to the metal plate 2
The resin flowability of the resin was measured. The results are shown in the "Resin flowability" column of the following table. In addition, the obtained electrical laminate was inspected to see whether or not voids were generated in each prepreg 3a, and the results are shown in the "Moldability" column of the following table. In the table, among the plural sets of prepregs 3a set between the heating plates 15, the prepregs 3a are shown as "1st set" to "7th set" in order from the top. In addition, in the "Moldability" column, "〇" indicates that no voids occur, "△" indicates that 10 or less voids occur within a 30 cm square area, and "×" indicates that 11 or more voids occur within a 30 cm square area. are shown respectively.
【表】
表のNo.１、No.２、No.３にみられるように、プリ
プレグ３ａの樹脂流れ性が20％以上になる条件で
金属板２にプリプレグ３ａを仮接着することによ
つて、積層成形の際にボイドが発生することなく
成形性を高めることができることが確認される。
またNo.６にみられるように、仮接着する際に段内
の組み数が多いと段内の中央部ではプリプレグ３
ａの樹脂流れ性は20％以上になつて成形性も良好
になるが、熱盤１５に近い端部ではプリプレグ３
ａの樹脂流れ性が20％未満になつて成形性が悪く
なるということも確認できる。尚、No.３では段内
の総てのプリプレグ３ａの樹脂流れ性が20％以上
であり、しかも総てのものにおいて成形性が良好
であつたが、段内の組み数が多いためにプリプレ
グ３ａの樹脂流れ性が27〜34％の範囲で大きくバ
ラツクために、積層成形した後の電気積層板の板
厚のバラツキの原因になるおそれがあり、好まし
くない。[Table] As shown in No. 1, No. 2, and No. 3 of the table, by temporarily adhering the prepreg 3a to the metal plate 2 under the conditions that the resin flowability of the prepreg 3a is 20% or more. It is confirmed that moldability can be improved without generating voids during laminated molding.
In addition, as seen in No. 6, when temporarily gluing, if there are many sets in a row, the prepreg 3
The resin flowability of a is 20% or more, and the moldability is also good, but at the end near the hot platen 15, the prepreg 3
It can also be confirmed that when the resin flowability of sample a becomes less than 20%, the moldability deteriorates. In addition, in No. 3, the resin flowability of all the prepregs 3a in the stage was 20% or more, and the moldability was good in all of them, but because of the large number of sets in the stage, Since the resin flowability of 3a varies widely within the range of 27 to 34%, it may cause variations in the thickness of the electrical laminate after lamination molding, which is not preferable.
上述のように本発明にあつては、通孔を設けた
金属板の片面にプリプレグを重ねて仮接着するこ
とによつてプリプレグで通孔の片側の開口を閉
じ、樹脂を通孔内に充填した後に、この金属板と
プリプレグとの複合体を他のプリプレグを介して
重ねると共に加熱加圧して積層成形するようにし
たので、金属板の通孔に樹脂を充填した状態で成
形をおこなうことができ、プリプレグに含浸した
樹脂は通孔内に流入されることがないものであつ
て、通孔に対応する部分でプリプレグにくぼみが
生じて積層板の表面に凹凸が発生することを防ぐ
ことができるものである。そして本発明ではさら
に、金属板に仮接着した後のプリプレグの170℃、
20Kg／cm2、10分間の条件での樹脂流れ性が20％以
上になる条件で、金属板へのプリプレグの仮接着
をおこなうようにしたので、積層成形にあたつて
プリプレグに含浸した樹脂は十分な流動性が確保
されるものであり、ボイドが発生するようなこと
なく良好な成形性で成形をおこなうことができる
ものである。
As described above, in the present invention, the opening on one side of the through hole is closed by overlapping the prepreg on one side of the metal plate provided with the through hole and temporarily bonding it, and the resin is filled into the through hole. After that, the composite of this metal plate and prepreg is layered with other prepregs interposed between them, and is then heated and pressurized for laminated molding. This makes it possible to perform molding with the resin filled in the holes in the metal plate. This prevents the resin impregnated into the prepreg from flowing into the through holes, which prevents depressions from forming in the prepreg in areas corresponding to the through holes and unevenness on the surface of the laminate. It is possible. In the present invention, the prepreg is further heated at 170°C after being temporarily bonded to the metal plate.
The prepreg was temporarily bonded to the metal plate under conditions such that the resin flowability was 20% or more at 20Kg/cm 2 for 10 minutes, so the resin impregnated into the prepreg during lamination molding was Sufficient fluidity is ensured, and molding can be performed with good moldability without generating voids.
第１図ａ乃至ｄは本発明に係る電気積層板の製
造の各工程を示す断面図、第２図は同上の金属板
へのプリプレグの仮接着の工程を示す断面図、第
３図ａ，ｂ，ｃは従来例の断面図である。
１は通孔、２は金属板、３ａ，３ｂはプリプレ
グ、４は充填剤入り樹脂、５はスルーホール、６
は複合体である。
Figures 1a to d are cross-sectional views showing each step of manufacturing an electrical laminate according to the present invention, Figure 2 is a cross-sectional view showing the process of temporarily adhering the prepreg to the metal plate, and Figures 3a, b and c are cross-sectional views of the conventional example. 1 is a through hole, 2 is a metal plate, 3a and 3b are prepregs, 4 is a resin containing a filler, 5 is a through hole, 6
is a complex.
Claims (1)
ねて仮接着することによつてプリプレグで通孔の
片側の開口を閉じ、樹脂を通孔内に充填した後
に、この金属板とプリプレグとの複合体を他のプ
リプレグを介して重ねると共に加熱加圧して積層
成形し、しかる後に通孔内の樹脂の部分でスルー
ホールを穿孔加工することによつて電気積層板を
製造するにあたつて、金属板に仮接着した後のプ
リプレグの170℃、20Kg／cm2、10分間の条件での
樹脂流れ性が20％以上になる条件で、金属板への
プリプレグの仮接着をおこなうことを特徴とする
電気積層板の製造方法。1 Overlap prepreg on one side of a metal plate with a through hole and temporarily adhere it to close the opening on one side of the through hole with the prepreg, fill the through hole with resin, and then connect the metal plate and the prepreg. In producing an electrical laminate by layering the composite with another prepreg interposed therebetween, heating and pressurizing it to form a laminate, and then punching a through hole in the resin part of the through hole, The prepreg is temporarily bonded to the metal plate under conditions such that the resin flowability of the prepreg after temporary bonding to the metal plate is 20% or more at 170℃, 20Kg/cm 2 for 10 minutes. A method for manufacturing electrical laminates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13190989A JPH02310040A (en) | 1989-05-25 | 1989-05-25 | Preparation of electric laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13190989A JPH02310040A (en) | 1989-05-25 | 1989-05-25 | Preparation of electric laminated sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02310040A JPH02310040A (en) | 1990-12-25 |
| JPH0563304B2 true JPH0563304B2 (en) | 1993-09-10 |
Family
ID=15069013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13190989A Granted JPH02310040A (en) | 1989-05-25 | 1989-05-25 | Preparation of electric laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02310040A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5581218B2 (en) * | 2008-12-25 | 2014-08-27 | 三菱電機株式会社 | Method for manufacturing printed wiring board |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4591181B2 (en) * | 2005-04-25 | 2010-12-01 | 三菱電機株式会社 | Printed wiring board |
-
1989
- 1989-05-25 JP JP13190989A patent/JPH02310040A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5581218B2 (en) * | 2008-12-25 | 2014-08-27 | 三菱電機株式会社 | Method for manufacturing printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02310040A (en) | 1990-12-25 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |