JPH0563196U - Ultrasonic sensor - Google Patents

Ultrasonic sensor

Info

Publication number
JPH0563196U
JPH0563196U JP422792U JP422792U JPH0563196U JP H0563196 U JPH0563196 U JP H0563196U JP 422792 U JP422792 U JP 422792U JP 422792 U JP422792 U JP 422792U JP H0563196 U JPH0563196 U JP H0563196U
Authority
JP
Japan
Prior art keywords
piezoelectric element
shield member
case
ultrasonic sensor
flexible substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP422792U
Other languages
Japanese (ja)
Other versions
JP2509454Y2 (en
Inventor
利治 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Spark Plug Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP422792U priority Critical patent/JP2509454Y2/en
Publication of JPH0563196U publication Critical patent/JPH0563196U/en
Application granted granted Critical
Publication of JP2509454Y2 publication Critical patent/JP2509454Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Transducers For Ultrasonic Waves (AREA)

Abstract

(57)【要約】 (修正有) 【目的】コストを低く抑えることができ、しかも残響の
影響のない高感度の超音波センサーを提供する。 【構成】圧電素子を利用した超音波センサにおいて、音
響整合特性と共に電磁ノイズの影響を改善するために、
本考案の超音波センサは、プラスチック材料から成るケ
ース(1)と、ケース(1)内の底面に装着された圧電
素子(3)と、この圧電素子(3)の周囲を囲んで設け
られ、内側に絶縁体層(7a、14a )を外側に導体層(7
b、14b )をそれぞれ備えたフレキシブル基板から成る
シールド部材(7、14)とを有することを特徴とする。
(57) [Summary] (Modified) [Purpose] To provide a high-sensitivity ultrasonic sensor that can keep costs down and is free from reverberation. [Structure] In an ultrasonic sensor using a piezoelectric element, in order to improve the influence of electromagnetic noise as well as acoustic matching characteristics,
The ultrasonic sensor of the present invention is provided with a case (1) made of a plastic material, a piezoelectric element (3) mounted on the bottom surface of the case (1), and surrounding the piezoelectric element (3). Insulator layers (7a, 14a) on the inside and conductor layers (7a, 14a) on the outside
b, 14b) and a shield member (7, 14) made of a flexible substrate, respectively.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、圧電素子を利用した超音波センサに関するものである。 The present invention relates to an ultrasonic sensor using a piezoelectric element.

【0002】[0002]

【従来の技術】[Prior Art]

この種の超音波センサとしては例えば実用新案登録第1778125 号に提案されて いるように発泡性プラスチック材料から成るケースの内底面の中央部に圧電素子 を取付け、圧電素子の上下両面に設けられた電極を外部へ通じた接続端子に接続 すると共にケースの開口部を蓋部材で閉じた形式ものが知られている。同様な形 式のものは実開平1−41279 号公報にも開示されている。 このような公知の装置においてはケースにQ値の低い発泡性プラスチック材料 を用いることによって高い音響減衰効果が得られ、その結果残響時間を大幅に短 縮して高い感度のセンサを提供することができるようになった。 ところで残響問題の他にセンサの感度に影響を及ぼすものとしては周知のよう に外部からの電磁波によるノイズの問題がある。この問題はケースを金属製にし て内部の圧電素子を磁気シールドすることによって解決できるが、そうすると上 述のような残響の問題が生じるだけでなく、金属部分がケースの外周面に露出し ていると感電防止の観点からも問題がある。 As an ultrasonic sensor of this type, for example, as proposed in Utility Model Registration No. 1778125, a piezoelectric element is attached to the center of the inner bottom surface of a case made of foamable plastic material, and it is provided on both upper and lower surfaces of the piezoelectric element. There is known a type in which an electrode is connected to a connection terminal which communicates with the outside and an opening of a case is closed by a lid member. A similar type is also disclosed in Japanese Utility Model Application Laid-Open No. 1-41279. In such a known device, by using a foamed plastic material having a low Q value for the case, a high acoustic attenuation effect can be obtained, and as a result, the reverberation time can be significantly shortened and a sensor having high sensitivity can be provided. I can do it. In addition to the reverberation problem, there is a problem of noise caused by electromagnetic waves from the outside, as is well known that affects the sensitivity of the sensor. This problem can be solved by making the case metallic and magnetically shielding the internal piezoelectric element.However, in addition to the reverberation problem described above, the metal part is exposed on the outer peripheral surface of the case. There is also a problem from the viewpoint of electric shock prevention.

【0003】 このような金属製のケースを用いた装置に伴う感電の問題を解決した例として 実公平2−27676 号公報に記載のものを挙げることができる。この公報に開示さ れたものでは、ケース本体を絶縁材料で構成し、その内周面全体に電磁シールド 用の金属被膜が形成されている。An example of solving the problem of electric shock associated with a device using such a metal case is disclosed in Japanese Utility Model Publication 2-27676. In the one disclosed in this publication, the case body is made of an insulating material, and a metal coating for electromagnetic shielding is formed on the entire inner peripheral surface thereof.

【0004】[0004]

【考案が解決しようとする課題】[Problems to be solved by the device]

ところで、実公平2−27676 号公報に記載されたような内周面全体に電磁シー ルド用の金属被覆を施した絶縁材料製のケースを用いた構造では、外部からの電 磁波によるノイズの影響や感電の問題は解決できるが、残響の影響を実質的に取 り除くことができない。またこの種のセンサは通常非常に小型であり、しかも絶 縁材料のケース本体の内周面における金属被膜は通常スパッタリングや蒸着法を 利用して形成されるため、高価な成膜装置を用いなければならず、センサのコス トが高くつくという問題点もある。さらに、ケース本体の内周面に金属被膜を形 成した構造では、センサ本体との電気的絶縁を保証するため、センサ本体の圧電 素子の周囲と金属被膜との間に十分な隙間をあけておく必要があり、圧電素子の 大きさに比べてケースの大きさを大きく設計する必要がある。 By the way, in the structure using an insulating material case in which a metal coating for an electromagnetic shield is applied to the entire inner peripheral surface as described in Japanese Utility Model Publication No. 27676/1990, the influence of noise due to electromagnetic waves from the outside The problem of electric shock and electric shock can be solved, but the effect of reverberation cannot be virtually eliminated. In addition, this type of sensor is usually very small, and since the metal coating on the inner surface of the case body made of insulating material is usually formed by sputtering or vapor deposition, an expensive film forming apparatus must be used. There is also the problem that the cost of the sensor is high. Furthermore, in the structure in which a metal coating is formed on the inner surface of the case body, in order to ensure electrical insulation from the sensor body, leave a sufficient gap between the periphery of the piezoelectric element of the sensor body and the metal coating. The size of the case must be designed larger than the size of the piezoelectric element.

【0005】 そこで、本考案は、このような従来の問題点を解決して、コストを低く抑える ことができしかも残響の影響や外部電磁ノイズの影響のない高感度の超音波セン サを提供することを目的としている。Therefore, the present invention solves such conventional problems, and provides a high-sensitivity ultrasonic sensor which can keep costs down and is free from the effects of reverberation and external electromagnetic noise. The purpose is to

【0006】[0006]

【課題を解決するための手段】[Means for Solving the Problems]

上記の目的を達成するために、本考案による超音波センサは、プラスチック材 料から成るケースの内底面に、上下両面にそれぞれ電極を備えた圧電素子を取付 け、この圧電素子の両電極を接続端子に接続してケースの外部へ導き、またこの 圧電素子とケースの内周面との間で圧電素子を囲んで、導体層と絶縁体層とを備 えフレキシブル基板から成るシールド部材を、それの絶縁体層側を圧電素子に対 向させて挿置し、上記シールド部材の導体層をアースに接続したことを特徴とし ている。 シールド部材は帯状のフレキシブル基板を環状に形成したものから成ることが できる。 代わりに、シールド部材は、フレキシブル基板から環状の側周部と円形の蓋部 とを一体に打ち抜き成形したものから成ることができる。 さらに、シールド部材の導体層の一部は圧電素子の一方の電極に圧接させるこ ともできる。 In order to achieve the above object, the ultrasonic sensor according to the present invention mounts a piezoelectric element having electrodes on both upper and lower surfaces on the inner bottom surface of a case made of plastic material, and connects both electrodes of this piezoelectric element. A shield member consisting of a flexible substrate with a conductor layer and an insulator layer, which is connected to the terminals and guided to the outside of the case, surrounds the piezoelectric element between the piezoelectric element and the inner peripheral surface of the case, and It is characterized in that the insulating layer side is placed so as to face the piezoelectric element, and the conductor layer of the shield member is connected to the ground. The shield member may be formed by forming a belt-shaped flexible substrate into an annular shape. Alternatively, the shield member may be formed by integrally punching an annular side peripheral portion and a circular lid portion from a flexible substrate. Further, a part of the conductor layer of the shield member may be pressed against one electrode of the piezoelectric element.

【0007】[0007]

【作用】[Action]

このように構成した本考案による超音波センサにおいては、シールド部材はフ レキシブル基板から成っているので、ケース内に容易に装着することができ、組 立が簡単にできる。 また、シールド部材は圧電素子の外周面と対向した内側に絶縁体層を備えてい るので、圧電素子との間の絶縁は何ら問題ではなく、従って圧電素子とシールド 部材との間の隙間は動作時の圧電素子の振動を妨げない程度にあけておけば十分 であり、ケースの寸法を最小限度に抑えることができる。 さらに、ケース本体はプラスチック材料から成っているので、高い音響減衰効 果が得られ、動作時の残響の影響は実質的に防止され得る。 さらにまた、シールド部材として、フレキシブル基板から環状の周側部と円形 の蓋部とを一体に打ち抜き成形したものを使用した場合には、圧電素子の全外周 を覆うことができ、シールド効果を一層高めることができる。 In the ultrasonic sensor according to the present invention having such a configuration, since the shield member is made of the flexible substrate, it can be easily mounted in the case and can be easily assembled. Also, since the shield member has an insulator layer on the inside facing the outer peripheral surface of the piezoelectric element, the insulation between the piezoelectric element does not cause any problem, and therefore the gap between the piezoelectric element and the shield member does not work. It is enough to leave the vibration of the piezoelectric element so as not to interfere with it, and the size of the case can be minimized. Moreover, since the case body is made of a plastic material, a high acoustic damping effect can be obtained and the influence of reverberation during operation can be substantially prevented. Furthermore, when the shield member is formed by punching and molding an annular peripheral side portion and a circular lid portion integrally from a flexible substrate, the entire outer periphery of the piezoelectric element can be covered, and the shield effect is further improved. Can be increased.

【0008】[0008]

【実施例】【Example】

以下添付図面を参照して本考案の実施例について説明する。 図1には本考案の一実施例を示し、図示装置において、1は筒状のケースで、 このケース1は発泡性プラスチック材料、例えばエポキシ樹脂中にガラスマイク ロバルーンを分散、混合させた材料から成っている。このケース1の底の外側中 央部2は隆起しており、この隆起部分を含めたケースの肉厚が使用したケース材 料の音速の1/4の波長とほぼ等しい寸法に成るように寸法決めされ、それによ りケース1の底面での損失が少なくなるようにしている。 ケース1の内底面の中央部には円板状の圧電素子3が固着されており、この圧 電素子3は、その上下両面にそれぞれ図示したように電極4、5が設けられてい る。これらの電極4、5は接続コード6のそれぞれの導線6a、6bに接続されてい る。 また、圧電素子3の周囲には、図2に示すような帯状のフレキシブル基板を図 3に示すように環状に形成したシールド部材7が配置されており、このシールド 部材7は、ポリアミド等の絶縁体層7aと銅箔等の導体層7bとを熱圧着等の適当な 手段により張り合わせた構造であり、図3に示すように絶縁体層7aを内側にして 湾曲すると共に両端縁を重合することにより環状に形成される。それによりケー ス1内に装着した時、圧電素子3の周囲に対向した内側に絶縁体層7aが位置し、 圧電素子3との絶縁を保証するようにしている。シールド部材7はまたリード端 子7cを備え、このリード端子7cはアースに接続される。これによりシールド部材 7は圧電素子3に対する外部からの電磁波によるノイズの影響を防止する働きを している。 また、前記シールド部材7の両端を固着せず、湾曲させた状態でケース1内に 挿入した後、緩めることによってシールド部材自体の復元力によってケース1内 面に弾着するようにしてもよい。 ケース1内に圧電素子3及びシールド部材7を装着した後、ケース1の開口部 はウレタン樹脂、シリコンゴム等のモールド材料8によって密封され、圧電素子 3の各電極に接続された接続コード6及びシールド部材7のリード端子7cはこの モールド材料8を通して外部へ伸ばされる。 Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 shows an embodiment of the present invention. In the illustrated apparatus, 1 is a cylindrical case, and this case 1 is made of a foamable plastic material, for example, a material in which glass microballoons are dispersed and mixed in epoxy resin. Made of The outer central part 2 of the bottom of the case 1 is bulged, and the thickness of the case including this bulged portion is dimensioned so that it is approximately equal to the wavelength of 1/4 of the sound velocity of the case material used. It is decided so that the loss at the bottom of Case 1 is reduced. A disk-shaped piezoelectric element 3 is fixed to the central portion of the inner bottom surface of the case 1, and the piezoelectric element 3 is provided with electrodes 4 and 5 on both upper and lower surfaces thereof as shown in the figure. These electrodes 4, 5 are connected to the respective conductors 6a, 6b of the connection cord 6. Around the piezoelectric element 3, there is arranged a shield member 7 in which a band-shaped flexible substrate as shown in FIG. 2 is formed in an annular shape as shown in FIG. 3, and the shield member 7 is made of an insulating material such as polyamide. It has a structure in which the body layer 7a and the conductor layer 7b such as a copper foil are bonded together by an appropriate means such as thermocompression bonding. As shown in FIG. 3, the insulator layer 7a is curved inside and both edges are polymerized. To form a ring. As a result, when mounted in the case 1, the insulating layer 7a is positioned inside the piezoelectric element 3 so as to face the periphery of the piezoelectric element 3 and ensure insulation from the piezoelectric element 3. The shield member 7 also includes a lead terminal 7c, and the lead terminal 7c is connected to the ground. As a result, the shield member 7 serves to prevent the influence of noise from electromagnetic waves from the outside on the piezoelectric element 3. Alternatively, both ends of the shield member 7 may be inserted into the case 1 in a curved state without being fixed, and then loosened so that the shield member 7 is elastically attached to the inner surface of the case 1 by the restoring force of the shield member itself. After mounting the piezoelectric element 3 and the shield member 7 in the case 1, the opening of the case 1 is sealed with a molding material 8 such as urethane resin or silicon rubber, and the connection cord 6 connected to each electrode of the piezoelectric element 3 and The lead terminal 7c of the shield member 7 is extended to the outside through the molding material 8.

【0009】 図4には本考案の別の実施例が示されており、図1の実施例と対応した部分は 同じ符号で示す。この実施例では、ケース1は底部に突起のない平坦な構造であ り、また圧電素子3の電極4、5はリード線9、10を介して封止板13に植設され た外部に伸びる端子ピン11、12にそれぞれ接続されている。その他の構成は図1 の実施例の場合と同じである。FIG. 4 shows another embodiment of the present invention, and parts corresponding to the embodiment of FIG. 1 are designated by the same reference numerals. In this embodiment, the case 1 has a flat structure with no protrusions on the bottom, and the electrodes 4 and 5 of the piezoelectric element 3 extend to the outside implanted in the sealing plate 13 via the lead wires 9 and 10. Connected to terminal pins 11 and 12, respectively. The other structure is the same as that of the embodiment of FIG.

【0010】 図5にはさらに別の実施例を示し、この場合も図1に示す実施例と対応した部 分は同じ符号で示す。 この実施例は、シールド部材14の構成及び配置の点において図1の実施例と相 違している。すなわち、この実施例では、シールド部材14は図6に示すように、 ポリアミド等の絶縁体層14a と銅箔等の導体層14b とを熱圧着等の適当な手段に より張り合わせたフレキシブル基板を打ち抜き成形により円形の蓋部15と側周部 16とアース端子部17とを一体成形し、そして仮想線で示すように絶縁体層14a が 内側となるように側周部16を環状に曲げ、蓋部15を環状に曲げた側周部16に向か って折り曲げ、さらにアース端子部17を側周部16に対して折り畳むことによって 構成される。蓋部14の中央部には接続コード6を通す孔18が設けられ、アース端 子部17の導体層14b は組み立て時に、圧電素子3の上面に設けられた電極4の延 伸部分4aに圧接される。圧電素子3の周囲にシールド部材14を装着した後、その 外側には図示したようにウレタン樹脂、シリコンゴム等のモールド材料8によっ て密封される。 この実施例では、シールド部材14に設けたアース端子部17の導体層14b を圧電 素子3の上面に設けられた電極4すなわち負電極に圧接させているので、図1や 図4に示すようにシールド部材14に対して外部へ通じたアース接続端子を設ける 必要がなくなり、電気的接続作業を簡略化させることができる。 また、この実施例の構成は、シールド部材14が圧電素子3の全外周を覆うこと になるので、電波に対するシールド効果を一層高くできることが認められる。FIG. 5 shows still another embodiment, and in this case also, parts corresponding to those of the embodiment shown in FIG. This embodiment differs from the embodiment of FIG. 1 in the configuration and arrangement of the shield member 14. That is, in this embodiment, as shown in FIG. 6, the shield member 14 is formed by punching out a flexible substrate in which an insulating layer 14a made of polyamide or the like and a conductor layer 14b made of copper foil or the like are bonded together by an appropriate means such as thermocompression bonding. The circular lid portion 15, the side peripheral portion 16 and the ground terminal portion 17 are integrally formed by molding, and the side peripheral portion 16 is bent into an annular shape so that the insulating layer 14a is inside as shown by the phantom line, and the lid is closed. It is configured by bending the portion 15 toward the side peripheral portion 16 that is bent in an annular shape, and further by folding the ground terminal portion 17 with respect to the side peripheral portion 16. A hole 18 through which the connection cord 6 is passed is provided in the center of the lid portion 14, and the conductor layer 14b of the ground terminal portion 17 is pressed against the extended portion 4a of the electrode 4 provided on the upper surface of the piezoelectric element 3 during assembly. To be done. After the shield member 14 is mounted around the piezoelectric element 3, the outside is sealed with a molding material 8 such as urethane resin or silicon rubber as shown in the figure. In this embodiment, since the conductor layer 14b of the ground terminal portion 17 provided on the shield member 14 is brought into pressure contact with the electrode 4 provided on the upper surface of the piezoelectric element 3, that is, the negative electrode, as shown in FIGS. It is not necessary to provide a ground connection terminal that communicates with the outside to the shield member 14, and the electrical connection work can be simplified. Further, in the configuration of this embodiment, since the shield member 14 covers the entire outer circumference of the piezoelectric element 3, it is recognized that the shield effect against radio waves can be further enhanced.

【0011】 ところで、図1の実施例では、圧電素子の電極に対する接続端子として接続コ ードが用いられているが、代わりに図4に示すようなリード線と端子ピンとから 成る接続端子を用いることができ、また同様に、図4の実施例においても図1の 場合のように接続コードを用いて圧電素子の電極を外部へ接続するようにするこ とができる。 また、ケースの形状やシールド部材の形状、寸法等についても使用する圧電素 子に応じて任意に変更することが可能である。 さらに、図1または図4に示す実施例においてシールド部材のリード端子を図 5の実施例のように折り曲げて圧電素子3の電極4に圧接させることもできる。By the way, in the embodiment of FIG. 1, the connection cord is used as the connection terminal for the electrode of the piezoelectric element, but instead, the connection terminal composed of the lead wire and the terminal pin as shown in FIG. 4 is used. Similarly, in the embodiment shown in FIG. 4, the electrode of the piezoelectric element can be connected to the outside by using the connecting cord as in the case of FIG. Further, the shape of the case, the shape and size of the shield member, etc. can be arbitrarily changed according to the piezoelectric element used. Further, in the embodiment shown in FIG. 1 or 4, the lead terminal of the shield member may be bent as in the embodiment of FIG. 5 and brought into pressure contact with the electrode 4 of the piezoelectric element 3.

【0012】[0012]

【考案の効果】[Effect of the device]

以上説明してきたように、本考案の超音波センサにおいては、ケースをプラス チック材料で構成し、圧電素子の周囲にフレキシブル基板から成るシールド部材 を設けているので、音響整合効果と共に電磁ノイズの影響を防止して所望の高感 度を得ることができ、またシールド部材はケース内に挿入するだけであるので、 従来のケース内面にシールド用の金属被膜を施した構造に比べて、装置の製造コ ストを大幅に低減することができ、しかも、圧電素子の周囲はシールド部材の絶 縁体層で囲まれているので、圧電素子の周囲の隙間はそれの動作時の振動に必要 な極僅かなスペースだけで十分であり、ケースの寸法を小さくすることができ、 センサを小型化することもできる。 As described above, in the ultrasonic sensor of the present invention, the case is made of a plastic material and the shield member made of a flexible substrate is provided around the piezoelectric element. It is possible to obtain the desired high sensitivity, and since the shield member is only inserted into the case, compared with the conventional structure in which a metal coating for shielding is applied to the inner surface of the case, the device manufacturing The cost can be significantly reduced, and since the periphery of the piezoelectric element is surrounded by the insulator layer of the shield member, the gap around the piezoelectric element is as small as that required for vibration during its operation. Space is enough, the size of the case can be reduced, and the sensor can be downsized.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本考案の一実施例による超音波センサを示す
縦断面図。
FIG. 1 is a vertical sectional view showing an ultrasonic sensor according to an embodiment of the present invention.

【図2】 図1の装置に用いられる帯状フレキシブル基
板を示す概略斜視図。
2 is a schematic perspective view showing a strip-shaped flexible substrate used in the apparatus of FIG.

【図3】 図2の帯状フレキシブル基板を環状に形成し
たシールド部材を示す概略斜視図。
3 is a schematic perspective view showing a shield member in which the strip-shaped flexible substrate of FIG. 2 is formed in an annular shape.

【図4】 本考案の別の実施例を示す縦断面図。FIG. 4 is a vertical sectional view showing another embodiment of the present invention.

【図5】 本考案のさらに別の実施例による超音波セン
サを示す縦断面図。
FIG. 5 is a vertical sectional view showing an ultrasonic sensor according to still another embodiment of the present invention.

【図6】 図5の装置に用いられるシールド部材を構成
する打ち抜き成形したフレキシブル基板を示す概略斜視
図。
6 is a schematic perspective view showing a stamped and formed flexible substrate which constitutes a shield member used in the apparatus of FIG.

【符号の説明】[Explanation of symbols]

1:ケース 2:外側中央部 3:圧電素子 4:電極 5:電極 6:コード 7:シールド部材 8:モールド材料 14:シールド部材 1: Case 2: Outer central part 3: Piezoelectric element 4: Electrode 5: Electrode 6: Code 7: Shield member 8: Mold material 14: Shield member

Claims (4)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】プラスチック材料から成るケースの内底面
に、上下両面にそれぞれ電極を備えた圧電素子を取付
け、この圧電素子の両電極を接続端子に接続してケース
の外部へ導き、またこの圧電素子とケースの内周面との
間で圧電素子を囲んで、内側に絶縁体層を外側に導体層
をそれぞれ備えたフレキシブル基板から成るシールド部
材を挿置し、シールド部材の導体層をアースに接続した
ことを特徴とする超音波センサ。
1. A piezoelectric element having electrodes on both upper and lower surfaces is attached to an inner bottom surface of a case made of a plastic material, and both electrodes of the piezoelectric element are connected to connection terminals to lead to the outside of the case. Enclose the piezoelectric element between the element and the inner surface of the case, insert a shield member consisting of a flexible substrate with an insulator layer inside and a conductor layer outside, and ground the conductor layer of the shield member. An ultrasonic sensor characterized by being connected.
【請求項2】シールド部材が帯状のフレキシブル基板を
環状に構成したものから成る請求項1に記載の超音波セ
ンサ。
2. The ultrasonic sensor according to claim 1, wherein the shield member comprises a belt-shaped flexible substrate formed in an annular shape.
【請求項3】シールド部材がフレキシブル基板から環状
の側周部と円形の蓋部とを一体に打ち抜き成形したもの
から成る請求項1に記載の超音波センサ。
3. The ultrasonic sensor according to claim 1, wherein the shield member is formed by punching and molding an annular side peripheral portion and a circular lid portion integrally from a flexible substrate.
【請求項4】シールド部材の導体層の一部が圧電素子の
一方の電極に圧接されている請求項1に記載の超音波セ
ンサ。
4. The ultrasonic sensor according to claim 1, wherein a part of the conductor layer of the shield member is pressed against one electrode of the piezoelectric element.
JP422792U 1991-11-25 1992-02-06 Ultrasonic sensor Expired - Fee Related JP2509454Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP422792U JP2509454Y2 (en) 1991-11-25 1992-02-06 Ultrasonic sensor

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP9654691 1991-11-25
JP3-96546 1991-11-25
JP422792U JP2509454Y2 (en) 1991-11-25 1992-02-06 Ultrasonic sensor

Publications (2)

Publication Number Publication Date
JPH0563196U true JPH0563196U (en) 1993-08-20
JP2509454Y2 JP2509454Y2 (en) 1996-09-04

Family

ID=26337960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP422792U Expired - Fee Related JP2509454Y2 (en) 1991-11-25 1992-02-06 Ultrasonic sensor

Country Status (1)

Country Link
JP (1) JP2509454Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2019163740A1 (en) * 2018-02-20 2021-03-04 ヘルスセンシング株式会社 Bio-vibration signal detector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2019163740A1 (en) * 2018-02-20 2021-03-04 ヘルスセンシング株式会社 Bio-vibration signal detector

Also Published As

Publication number Publication date
JP2509454Y2 (en) 1996-09-04

Similar Documents

Publication Publication Date Title
US8009855B2 (en) Speaker
JP3244448B2 (en) Small microphone assembly using conductive rubber contacts
US6307300B1 (en) Piezoelectric acoustic component
US4424419A (en) Electret microphone shield
US5195142A (en) Piezoelectric transducer
CA1165859A (en) Electret microphone shield
US6704430B2 (en) Electroacoustic transducer
US20020170772A1 (en) One-piece speaker assembly
US5440630A (en) Telephone receiver with electrostatic discharge prevention
JP2509454Y2 (en) Ultrasonic sensor
JPH0818390A (en) Surface acoustic wave device
US11879758B2 (en) Mobile device including improved electro-acoustic conversion chip
JP3201180B2 (en) Electronic component seal structure
JP3748810B2 (en) Microphone
JP3011048U (en) Condenser microphone unit
JP2002045791A (en) Attachment structure of magnetic induction type actuator device
JP3641573B2 (en) Electroacoustic conversion unit
JPH0332155Y2 (en)
JP3639784B2 (en) Electroacoustic transducer
JPH02312399A (en) Piezoelectric sounder
JPH0546395Y2 (en)
JP2003014568A (en) Semiconductor pressure sensor
JPS626400B2 (en)
JPH0744157Y2 (en) Piezoelectric electroacoustic transducer
JP4443059B2 (en) Ultrasonic sensor

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees