JPWO2019163740A1 - Bio-vibration signal detector - Google Patents

Bio-vibration signal detector Download PDF

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JPWO2019163740A1
JPWO2019163740A1 JP2020501766A JP2020501766A JPWO2019163740A1 JP WO2019163740 A1 JPWO2019163740 A1 JP WO2019163740A1 JP 2020501766 A JP2020501766 A JP 2020501766A JP 2020501766 A JP2020501766 A JP 2020501766A JP WO2019163740 A1 JPWO2019163740 A1 JP WO2019163740A1
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layer
electrode
vibration
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vibration sensor
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JP7204233B2 (en
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正巳 鐘ヶ江
正巳 鐘ヶ江
修 池田
修 池田
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HEALTH SENSING CO., LTD.
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    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00Measuring for diagnostic purposes; Identification of persons
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00Measuring for diagnostic purposes; Identification of persons
    • A61B5/02Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
    • A61B5/024Detecting, measuring or recording pulse rate or heart rate
    • A61B5/0245Detecting, measuring or recording pulse rate or heart rate by using sensing means generating electric signals, i.e. ECG signals
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00Measuring for diagnostic purposes; Identification of persons
    • A61B5/103Detecting, measuring or recording devices for testing the shape, pattern, colour, size or movement of the body or parts thereof, for diagnostic purposes
    • A61B5/11Measuring movement of the entire body or parts thereof, e.g. head or hand tremor, mobility of a limb
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/30Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/88Mounts; Supports; Enclosures; Casings

Abstract

【課題】 より信頼性の高い接続部を備えた生体振動信号検出装置を提供する。
【解決手段】 圧電効果を有する材料を含むセンサ素材層と、センサ素材層の上面に形成された第1の電極層と、センサ素材層の下面に形成された第2の電極層と、を含むシート状の振動センサ本体と、振動センサ本体の全体を覆う外装保護層と、振動センサ本体の接続部に配置され、第1の電極層に接続された第1の取出し電極と、振動センサ本体の接続部に配置され、第2の電極層に接続された第2の取出し電極とを備え、第1の取出し電極の一端は、第1の電極層を貫通することなく第1の電極層の表面に接続され、第1の取出し電極の他端は外装保護層の外側に配置され、第2の取出し電極の一端は、第2の電極層を貫通することなく第2の電極層の表面に接続され、第1の取出し電極の他端は外装保護層の外側に配置されている。
【選択図】 図3
PROBLEM TO BE SOLVED: To provide a biological vibration signal detecting device provided with a more reliable connection portion.
A sensor material layer containing a material having a piezoelectric effect, a first electrode layer formed on the upper surface of the sensor material layer, and a second electrode layer formed on the lower surface of the sensor material layer are included. The sheet-shaped vibration sensor main body, the exterior protective layer that covers the entire vibration sensor main body, the first take-out electrode arranged at the connection portion of the vibration sensor main body and connected to the first electrode layer, and the vibration sensor main body. It is provided with a second take-out electrode arranged at the connection portion and connected to the second electrode layer, and one end of the first take-out electrode is a surface of the first electrode layer without penetrating the first electrode layer. The other end of the first extraction electrode is arranged outside the exterior protective layer, and one end of the second extraction electrode is connected to the surface of the second electrode layer without penetrating the second electrode layer. The other end of the first extraction electrode is arranged outside the exterior protective layer.
[Selection diagram] Fig. 3

Description

本発明は、生体の心拍数、呼吸、体動などの生体振動信号を検出する生体振動信号検出装置に関し、特に、シート状の振動センサを備えた生体振動信号検出装置に関する。 The present invention relates to a biological vibration signal detecting device for detecting a biological vibration signal such as a living body's heart rate, respiration, and body movement, and more particularly to a biological vibration signal detecting device provided with a sheet-shaped vibration sensor.

従来、ベッド及び床に敷く寝床において、人の肺の呼吸活動及び心臓の拍動による振動等を振動センサで検出し、人の健康状態を24時間検出できるようにした人の健康状態検出装置が知られている(特許文献1)。例えば、介護業務において、ベッドで睡眠中の患者の状態を把握することが必要であったが、介護者の負担を軽減するために患者の状態を自動的に監視して、異常があった時、外部に通知するシステムが望まれている。従来、睡眠中の患者の動きを束縛せずに、睡眠状態を把握するために指先に血圧計を取り付けたり、振動計を腰に巻くといった患者の身体に密着した方法を用いていた。これらの方法でも、身体にセンサを密着させるため、信号が常に得られる点で信頼性が高いが、患者が嫌がること、センサが外れると状態を把握できないことなどの問題があった。このため、非拘束タイプのシステムが提案されてきている(特許文献1)。 Conventionally, in a bed or a bed laid on the floor, a human health condition detection device that can detect a person's health condition for 24 hours by detecting the respiratory activity of a person's lungs and vibration due to the beating of the heart with a vibration sensor has been used. It is known (Patent Document 1). For example, in nursing care work, it was necessary to grasp the condition of a patient sleeping in bed, but in order to reduce the burden on the caregiver, the condition of the patient is automatically monitored and when there is an abnormality. , A system that notifies the outside is desired. Conventionally, a method closely attached to the patient's body, such as attaching a sphygmomanometer to the fingertip or wrapping a vibrometer around the waist, has been used without restricting the movement of the patient during sleep. These methods are also highly reliable in that a signal can always be obtained because the sensor is brought into close contact with the body, but there are problems such as dislike of the patient and the inability to grasp the state when the sensor is removed. Therefore, a non-binding type system has been proposed (Patent Document 1).

特許文献1には、非拘束タイプの振動センサを用いた人の存在不在を検出する人存在不在検出装置が開示されている。特許文献1の方法では、ベッドパッド又はマットレスの上部や下部に、人の身体から発生する振動を検出するシート状の振動センサ手段を設置し、振動センサによって検出した身体振動信号の有無で人の存在及び不在検を判定している。さらに、検出した身体振動信号をフィルタリング処理して呼吸振動、心拍振動、いびき、及び体動信号などの生体振動信号を取得している。 Patent Document 1 discloses a person presence / absence detection device that detects the presence / absence of a person using a non-restraint type vibration sensor. In the method of Patent Document 1, a sheet-shaped vibration sensor means for detecting vibration generated from the human body is installed on the upper or lower part of the bed pad or mattress, and the presence or absence of the body vibration signal detected by the vibration sensor is used to determine the person's vibration. Judgment of presence and absence. Further, the detected body vibration signal is filtered to obtain a biological vibration signal such as a respiratory vibration, a heartbeat vibration, a snoring, and a body movement signal.

特許文献1の振動センサ手段202は、図8(A)に示すように、振動センサ本体210の上に振動収集板221を配置し、振動センサ本体210の下にクッション部材222を介して底板223を配置した構造であり、振動センサ本体210には外部の信号処理装置(図示せず)と接続するための配線224が接続されている。振動センサ本体210は、図8(B)に示すように、フィルム状の振動センサ素材211の上下にフィルム状の正電極層212及び負電極層213(下部遮蔽層を兼ねる)が形成され、正電極層212の上を覆ってフィルム状の絶縁層214が形成され、絶縁層214の上に上部遮蔽層(電磁シールド用フィルム)215が形成されている。振動センサ素材211は、振動によって電荷を発生させる圧電材料であり、発生した電荷を上下に形成された正電極層212及び負電極層213によって取り出して振動を検出する。また、上部遮蔽層215は、外部からのノイズを防止するための導電体であり、定電位に保持されており、絶縁層214は、正電極層212と上部遮蔽層215とを絶縁している。 In the vibration sensor means 202 of Patent Document 1, as shown in FIG. 8A, a vibration collecting plate 221 is arranged on the vibration sensor main body 210, and a bottom plate 223 is placed under the vibration sensor main body 210 via a cushion member 222. The vibration sensor main body 210 is connected to a wiring 224 for connecting to an external signal processing device (not shown). As shown in FIG. 8B, the vibration sensor main body 210 has a film-shaped positive electrode layer 212 and a negative electrode layer 213 (also serving as a lower shielding layer) formed above and below the film-shaped vibration sensor material 211, and is positive. A film-like insulating layer 214 is formed over the electrode layer 212, and an upper shielding layer (electromagnetic shielding film) 215 is formed on the insulating layer 214. The vibration sensor material 211 is a piezoelectric material that generates electric charges by vibration, and the generated electric charges are taken out by the positive electrode layers 212 and the negative electrode layers 213 formed on the upper and lower sides to detect the vibration. Further, the upper shielding layer 215 is a conductor for preventing noise from the outside and is held at a constant potential, and the insulating layer 214 insulates the positive electrode layer 212 and the upper shielding layer 215. ..

振動センサ本体210の正電極層212、負電極層213及び上部遮蔽層215は、外部と電気的に接続させる必要があり、従来、シート状の振動センサ本体210においては、各層を厚さ方向に貫通する電極端子、例えばハトメ端子216、217が取出し電極の一部として使用されていた。図8(B)及び(C)に示すように、正電極層212の接続部には、負電極層213、絶縁層214及び上部遮蔽層215に開口が形成されており、ハトメ端子216が、正の取出し電極218とともに振動センサ素材211及び正電極層212を貫通し、正の取出し電極218を振動センサ本体とかしめて、正電極層212をハトメ端子216及び正の取出し電極218を介して外部と接続させている。また、負電極層213の接続部には、正電極層212に開口が形成されており、ハトメ端子217が、負の取出し電極219とともに負電極層213、振動センサ素材211、絶縁層214及び上部遮蔽層215を貫通し、負の取出し電極219を振動センサ本体210とかしめて、負電極層213及び上部遮蔽層215をハトメ端子217及び負の取出し電極219を介して外部と接続させている。 The positive electrode layer 212, the negative electrode layer 213, and the upper shielding layer 215 of the vibration sensor main body 210 need to be electrically connected to the outside. Conventionally, in the sheet-shaped vibration sensor main body 210, each layer is connected in the thickness direction. Penetrating electrode terminals, such as eyelet terminals 216 and 217, were used as part of the take-out electrode. As shown in FIGS. 8B and 8C, openings are formed in the negative electrode layer 213, the insulating layer 214, and the upper shielding layer 215 at the connection portion of the positive electrode layer 212, and the eyelet terminal 216 is formed. It penetrates the vibration sensor material 211 and the positive electrode layer 212 together with the positive extraction electrode 218, crimps the positive extraction electrode 218 to the vibration sensor main body, and connects the positive electrode layer 212 to the outside via the eyelet terminal 216 and the positive extraction electrode 218. It is connected. Further, an opening is formed in the positive electrode layer 212 at the connection portion of the negative electrode layer 213, and the eyelet terminal 217, together with the negative take-out electrode 219, has a negative electrode layer 213, a vibration sensor material 211, an insulating layer 214, and an upper portion. It penetrates the shielding layer 215, crimps the negative extraction electrode 219 to the vibration sensor main body 210, and connects the negative electrode layer 213 and the upper shielding layer 215 to the outside via the eyelet terminal 217 and the negative extraction electrode 219.

国際公開第2014/185397号International Publication No. 2014/185397

特許文献1によれば、ハトメ端子216、217等が複数の層を貫通することにより、かしめ部に外力がかかっても、複数の層が全体としてストレスを受けるので、電極層の切断に対しては十分な強度がとれるとされていた。しかしながら、実際に、振動センサ手段220をベッドパッド又はマットレスの上部や下部に配置して生体振動信号を検出しようと試みると、振動センサ本体の接続部における接続不良が多発した。これは、ハトメ端子等が貫通することによって各層には孔が形成されており、この孔が振動センサ手段220に加わる振動や、引き出し配線224を介して加わる機械的なストレスなどによって広げられ、ハトメ端子と各層との接続不良が発生したり、ハトメ端子によるかしめが緩んで接触不良が発生したりするためと考えられる。 According to Patent Document 1, the eyelet terminals 216, 217, etc. penetrate the plurality of layers, so that even if an external force is applied to the crimped portion, the plurality of layers are stressed as a whole, so that the electrode layer is cut. Was said to have sufficient strength. However, when an attempt was made to actually detect the biological vibration signal by arranging the vibration sensor means 220 on the upper part or the lower part of the bed pad or the mattress, connection failure occurred frequently at the connection portion of the vibration sensor main body. This is because holes are formed in each layer by penetrating eyelet terminals and the like, and these holes are widened by vibration applied to the vibration sensor means 220 and mechanical stress applied via the lead-out wiring 224, resulting in eyelets. It is considered that the connection failure between the terminal and each layer occurs, or the caulking by the eyelet terminal is loosened and the contact failure occurs.

また、特許文献1には記載されていないが、振動センサ本体210を実際に使用する際には、外部との接触、摩擦、摩耗による損傷を防止し、また、水分、ほこり、光などの外部環境から保護するための絶縁性の外装保護層によって全体が覆うことが好ましい。シート状の振動センサ本体の製造方法としては、一般的に、一連の長尺のフィルムを長手方向に搬送しつつ連続的に振動センサ本体を構成する各層を積層形成した後に、製品として所定寸法に裁断され、その後、接続部において取出し電極が接続される。これは、シート状の振動センサ本体が取り扱いにくく、振動センサ本体を構成する各層を積層形成する前に裁断したり、取出し電極を接続したりすると、製造効率が著しく低下し、また不良の原因ともなるため、全層を積層形成した後に裁断され、取出し電極が接続されていた。この点は、外装保護層で振動センサ本体210の全体を覆う場合においても、少なくとも搬送方向に対して幅方向について包んだ状態まで連続的に製造することが効率的である。外装保護層で覆われた状態で取出し電極を接続する場合、貫通式の接続構造は、外装保護層も貫通して接続することができるため簡便であるが、外装保護層の外側に配置された取出し電極と、外装保護層の内側に配置された正電極層、負電極層及び上部遮蔽層とが、貫通させたハトメ端子216、217等によって接続されることになり、ハトメ端子216、217等が正電極層212、負電極層213及び上部遮蔽層215を貫通した部分のハトメ端子216、217の外周面で接触することになり、接触面積が非常に狭く接続不良が発生しやすい構造となる。そして、このような貫通式の接続構造では、各層の孔が機械的なストレスなどにより広がることによって各層との接触不良が多発する。本発明は、上述した問題に鑑みて、より信頼性の高い接続部を備えた生体振動信号検出装置を提供することを課題とする。 Further, although not described in Patent Document 1, when the vibration sensor main body 210 is actually used, damage due to contact with the outside, friction, and wear is prevented, and external such as moisture, dust, and light are prevented. The entire surface is preferably covered with an insulating exterior protective layer to protect it from the environment. As a method for manufacturing a sheet-shaped vibration sensor main body, generally, after a series of long films are continuously conveyed in the longitudinal direction and each layer constituting the vibration sensor main body is continuously laminated and formed, the product is made into a predetermined size. It is cut and then the take-out electrode is connected at the connection. This is because the sheet-shaped vibration sensor body is difficult to handle, and if the layers constituting the vibration sensor body are cut before being laminated or the take-out electrodes are connected, the manufacturing efficiency is significantly reduced, and it is also a cause of defects. Therefore, all the layers were laminated and then cut, and the take-out electrode was connected. In this respect, even when the entire vibration sensor main body 210 is covered with the exterior protective layer, it is efficient to continuously manufacture the vibration sensor body 210 until it is wrapped at least in the width direction with respect to the transport direction. When connecting the take-out electrode while being covered with the exterior protective layer, the penetration type connection structure is convenient because the exterior protective layer can also be connected through the outer protective layer, but it is arranged outside the exterior protective layer. The take-out electrode and the positive electrode layer, the negative electrode layer, and the upper shielding layer arranged inside the exterior protective layer are connected by the penetrating eyelet terminals 216, 217, etc., and the eyelet terminals 216, 217, etc. Will come into contact with the outer peripheral surfaces of the eyelet terminals 216 and 217 in the portion penetrating the positive electrode layer 212, the negative electrode layer 213 and the upper shielding layer 215, and the contact area is very narrow and a connection failure is likely to occur. .. In such a through-type connection structure, poor contact with each layer frequently occurs due to the holes in each layer expanding due to mechanical stress or the like. In view of the above-mentioned problems, it is an object of the present invention to provide a biological vibration signal detection device provided with a more reliable connection portion.

また、図8(B)に示すように、上部遮蔽層215を設け、負電極層213と上部遮蔽層215とを設置し、定電位としたシールドで信号を検出する正電極層212を囲った構造としても、実際に使用すると、取得した信号に様々なノイズが重なっていた。本発明は、ノイズを低減し、より正確な信号を検出できる生体振動信号検出装置を提供することを他の課題とする。 Further, as shown in FIG. 8B, an upper shielding layer 215 is provided, a negative electrode layer 213 and an upper shielding layer 215 are provided, and a positive electrode layer 212 for detecting a signal is surrounded by a shield having a constant potential. As for the structure, when it was actually used, various noises overlapped with the acquired signal. Another object of the present invention is to provide a biological vibration signal detection device capable of reducing noise and detecting a more accurate signal.

上記課題を解決するため、本発明の生体振動信号検出装置は、圧電効果を有する材料を含むセンサ素材層と、前記センサ素材層の上面に形成された第1の電極層と、前記センサ素材層の下面に形成された第2の電極層と、を含むシート状の振動センサ本体と、前記振動センサ本体を覆う外装保護層と、前記振動センサ本体の接続部に配置され、前記第1の電極層に接続された第1の取出し電極と、前記振動センサ本体の前記接続部に配置され、前記第2の電極層に接続された第2の取出し電極とを備え、前記第1の取出し電極の一端は、前記第1の電極層を貫通することなく前記第1の電極層の表面に接続され、前記第1の取出し電極の他端は前記外装保護層の外側に配置され、前記第2の取出し電極の一端は、前記第2の電極層を貫通することなく前記第2の電極層の表面に接続され、前記第1の取出し電極の他端は前記外装保護層の外側に配置されていることを特徴とする。 In order to solve the above problems, the biological vibration signal detection device of the present invention includes a sensor material layer containing a material having a piezoelectric effect, a first electrode layer formed on the upper surface of the sensor material layer, and the sensor material layer. A sheet-shaped vibration sensor main body including a second electrode layer formed on the lower surface of the vibration sensor body, an exterior protective layer covering the vibration sensor main body, and the first electrode arranged at a connection portion of the vibration sensor main body. A first take-out electrode connected to the layer and a second take-out electrode arranged at the connection portion of the vibration sensor main body and connected to the second electrode layer are provided, and the first take-out electrode of the first take-out electrode is provided. One end is connected to the surface of the first electrode layer without penetrating the first electrode layer, and the other end of the first extraction electrode is arranged outside the exterior protective layer, and the second One end of the take-out electrode is connected to the surface of the second electrode layer without penetrating the second electrode layer, and the other end of the first take-out electrode is arranged outside the exterior protective layer. It is characterized by that.

さらに、上記生体振動信号検出装置において、前記振動センサ本体は、さらに、前記第1の電極層の上面に形成された絶縁層と、前記絶縁層の上面に形成された導電性の遮蔽層とを含み、前記絶縁層及び前記遮蔽層は、前記接続部において、前記第1の電極層の表面を露出させる開口部を有することが好ましく、さらに、上記生体振動信号検出装置において、前記接続部を覆って前記遮蔽層とは別の導電性の遮蔽部材を備えていることが好ましい。 Further, in the biological vibration signal detection device, the vibration sensor main body further includes an insulating layer formed on the upper surface of the first electrode layer and a conductive shielding layer formed on the upper surface of the insulating layer. Including, the insulating layer and the shielding layer preferably have an opening in the connecting portion that exposes the surface of the first electrode layer, and further covers the connecting portion in the biovibration signal detection device. It is preferable that a conductive shielding member different from the shielding layer is provided.

さらに、上記生体振動信号検出装置において、前記外装保護層は、前記接続部において、前記第1の電極層又は前記第2の電極層の少なくとも一方の表面を露出させる開口部を有することが好ましい。 Further, in the biological vibration signal detection device, it is preferable that the exterior protective layer has an opening in the connection portion that exposes at least one surface of the first electrode layer or the second electrode layer.

さらに、上記生体振動信号検出装置において、前記振動センサ本体を内包した前記外装保護層の一表面を下面に貼付した振動収集部材と、前記振動収集部材の下面に、前記接続部を覆うように、前記振動センサ本体から離間して配置された保護部材とを備えたことが好ましい。さらに、前記保護部材は弾性部材を介して前記振動収集部材の下面に結合されており、前記弾性部材の前記振動収集部材の下面から前記保護部材までの高さは、前記振動センサ本体の厚さよりも大きく、前記弾性部材は、前記振動センサ本体を内包した前記外装保護層とは接触していないことが好ましい。 これらの生体振動信号検出装置において、前記保護部材の下面から前記外装保護層の下面までの段差の高さが10mm以下であることが好ましい。 Further, in the biological vibration signal detection device, a vibration collecting member having one surface of the exterior protective layer including the vibration sensor main body attached to the lower surface and a lower surface of the vibration collecting member covering the connecting portion. It is preferable to provide a protective member arranged apart from the vibration sensor main body. Further, the protective member is coupled to the lower surface of the vibration collecting member via an elastic member, and the height of the elastic member from the lower surface of the vibration collecting member to the protective member is larger than the thickness of the vibration sensor main body. It is preferable that the elastic member is not in contact with the exterior protective layer including the vibration sensor main body. In these biological vibration signal detection devices, the height of the step from the lower surface of the protective member to the lower surface of the exterior protective layer is preferably 10 mm or less.

さらに、上記生体振動信号検出装置において、前記振動収集部材の下面、前記保護部材及び前記弾性部材で囲まれた空間内に前記振動センサ本体と電気的に接続された半導体素子が配置されていてもよく、さらに、前記半導体素子の少なくとも一部を覆う導電性の遮蔽部材を備えることが好ましい。 Further, in the biological vibration signal detection device, even if a semiconductor element electrically connected to the vibration sensor main body is arranged in a space surrounded by the lower surface of the vibration collecting member, the protective member, and the elastic member. It is preferable to further include a conductive shielding member that covers at least a part of the semiconductor element.

さらに、上記生体振動信号検出装置において、前記第1の取出し電極及び前記第2の取出し電極は、導電性のテープであり、それぞれ前記第1の電極層及び前記第2の電極層に導電性の接着剤で接着されていてもよい。 Further, in the biological vibration signal detection device, the first take-out electrode and the second take-out electrode are conductive tapes, which are conductive to the first electrode layer and the second electrode layer, respectively. It may be adhered with an adhesive.

本発明においては、振動センサ本体の全体が外装保護層に覆われており、振動センサ本体が外部との接触、摩擦、摩耗による損傷を防止し、また、水分、酸素、ほこり、光などの外部環境から内部を保護することができ、第1の取出し電極の一端が、シート状の振動センサ本体の第1の電極層を貫通することなく第1の電極層の表面に接続され、第2の取出し電極の一端が、振動センサ本体の第2の電極層を貫通することなく第2の電極層の表面に接続されており、振動センサ本体の電極層の表面と取出し電極の表面とで面接合しており、接触不良を減らすことができ信頼性を高めることができ、さらに第1及び第2の取出し電極の他端が、外装保護層の外側に配置され、振動センサ本体と外部との電気的接続を可能としている。 In the present invention, the entire vibration sensor main body is covered with an exterior protective layer, and the vibration sensor main body prevents damage due to contact with the outside, friction, and wear, and also externals such as moisture, oxygen, dust, and light. The inside can be protected from the environment, and one end of the first extraction electrode is connected to the surface of the first electrode layer without penetrating the first electrode layer of the sheet-shaped vibration sensor body, and the second One end of the extraction electrode is connected to the surface of the second electrode layer without penetrating the second electrode layer of the vibration sensor body, and the surface of the electrode layer of the vibration sensor body and the surface of the extraction electrode are surface-bonded. Therefore, poor contact can be reduced and reliability can be improved. Further, the other ends of the first and second extraction electrodes are arranged outside the exterior protective layer, and electricity between the vibration sensor main body and the outside is provided. Enables connection.

また、振動センサ本体が、第1の電極層の上面に形成された絶縁層と、前記絶縁層の上面に形成された導電性の遮蔽層とを含み、絶縁層及び遮蔽層が第1の電極層の表面を露出させる開口部を有する場合、遮蔽層が外部からの電磁シールドとなりノイズを低減することができ、絶縁層及び遮蔽層の開口部を介して第1の電極層と第1の取出し電極の一端とを接続させることができる。また、接続部を覆って導電性の遮蔽部材を備えることにより、接続部においても外部からの電磁場を遮蔽することができノイズを低減することができる。その他の作用効果については、以下の実施形態において説明する。 Further, the vibration sensor main body includes an insulating layer formed on the upper surface of the first electrode layer and a conductive shielding layer formed on the upper surface of the insulating layer, and the insulating layer and the shielding layer are the first electrodes. When the shielding layer has an opening that exposes the surface of the layer, the shielding layer becomes an electromagnetic shield from the outside and noise can be reduced, and the first electrode layer and the first extraction are taken out through the opening of the insulating layer and the shielding layer. It can be connected to one end of the electrode. Further, by covering the connecting portion with a conductive shielding member, the electromagnetic field from the outside can be shielded even at the connecting portion, and noise can be reduced. Other effects will be described in the following embodiments.

本発明の生体振動信号検出装置の概略ブロック図。The schematic block diagram of the biological vibration signal detection apparatus of this invention. 本発明の生体振動信号検出手段の分解概略構成図。The exploded schematic block diagram of the biological vibration signal detecting means of this invention. 本発明の生体振動信号検出手段の下面図(A)、断面図(B)、一部透過下面図(C)。A bottom view (A), a cross-sectional view (B), and a partially transmitted bottom view (C) of the biological vibration signal detecting means of the present invention. 本発明の生体振動信号検出手段の製造工程を示す図。The figure which shows the manufacturing process of the biological vibration signal detecting means of this invention. 本発明の生体振動信号検出手段の変形例。A modified example of the biological vibration signal detecting means of the present invention. 本発明の生体振動信号検出手段の他の実施形態。Another embodiment of the biological vibration signal detecting means of the present invention. 本発明の生体振動信号検出手段の製造工程を示す図。The figure which shows the manufacturing process of the biological vibration signal detecting means of this invention. 振動センサ手段の従来例。Conventional example of vibration sensor means.

本発明の「生体振動信号検出装置」は、少なくとも振動センサ本体と、振動センサ本体の各電極層を外部と接続するための取出し電極とを含む生体振動信号検出手段を備えたものである。生体振動信号検出装置は、必要に応じて、情報処理手段、電力供給手段、記憶手段、通信手段、表示出力手段、操作手段などの一つ又は複数を備えていてもよく、これらと、取出し電極を介して、例えば配線によって接続させる。また、生体振動信号検出手段は、振動センサ本体の全体を包む外装保護層、振動センサ本体が接着される振動収集部材、振動センサ本体の接続部を保護する保護部材などの振動センサ本体を含む生体振動信号検出手段の他の構成を含んでもよい。 The "biological vibration signal detection device" of the present invention includes at least a vibration sensor main body and a biological vibration signal detection means including an extraction electrode for connecting each electrode layer of the vibration sensor main body to the outside. The biological vibration signal detection device may include one or more information processing means, power supply means, storage means, communication means, display output means, operation means, and the like, if necessary, and these and an extraction electrode. For example, they are connected by wiring. Further, the biological vibration signal detecting means includes a biological body including a vibration sensor main body such as an exterior protective layer that wraps the entire vibration sensor main body, a vibration collecting member to which the vibration sensor main body is adhered, and a protective member that protects the connection portion of the vibration sensor main body. Other configurations of the vibration signal detecting means may be included.

本発明の「振動センサ本体」は、少なくともセンサ素材層と、第1の電極層と、第2の電極層とを含むものであり、振動に応じてセンサ素材層で発生した電荷を第1の電極層及び第2の電極層によって取り出し可能としたものである。振動センサ本体は、さらに外部の電磁場、静電気等によるノイズを低減するための遮蔽層及び遮蔽層と第1又は第2の電極層とを絶縁する絶縁層を含んでいてもよい。さらに、振動センサ本体は、最外層に保護層を設けてもよい。振動センサ本体は、基材となるフィルム(各層の一つでもよいし、別のものでもよい)上に各層を一体的に積層したものを含み、厚さに比べて平面寸法が広いシート状のものである。遮蔽層は定電位(例えば接地)とし、センサ素材層、第1の電極層及び第2の電極層の全体を囲うことが好ましい。振動センサ本体は、第1又は第2の電極層の一方を定電位(例えば接地)とし、他方の電極層の電位で信号を取り出す構成とすることが好ましく、この場合、一方の定電位の電極層を遮蔽層として利用することができ、他方の電極層についてのみ遮蔽層で覆えば足りる。なお、本明細書において上下は、厚さ方向の相対的な位置を示すものであり、絶対的なものではなく、例えば、実際に製造又は使用する際に上下を逆にすることを妨げるものではない。本発明の生体振動信号検出装置及びそれに使用される振動センサ本体は、生体振動信号を検出するために非常に微小な信号(例えばμVの電圧)についても検出できる高感度のものを採用することが好ましい。このように、生体振動信号検出装置のセンサは、高感度に信号を検出できることから、ノイズに非常に弱く、わずかなノイズでもμV単位の信号にとっては大きな影響があった。このため、生体振動信号検出装置において信号の精度を確保するために、ノイズを低減できる様々な解決手段を本明細書に開示した。また、生体振動信号検出装置及びそれに使用される振動センサ本体は、生体の近傍に配置され、様々な物理的な衝撃が加わる状況も想定される。このため、生体振動信号検出装置において機械的な強度を高め、壊れにくい装置を提供する様々な解決手段を本明細書に開示した。本明細書に開示した解決手段は、装置に求められる特性に応じて、適宜選択して採用することができる。例えば、強度よりも精度が求められる場合には、機械的な強度を高める解決手段ではなく、ノイズ低減の解決手段をより優先的に採用すればよく、反対に強度が求められる場合には、機械的な強度を高める解決手段を優先的に採用し、必要に応じてノイズ低減の解決手段を採用すればよい。 The "vibration sensor main body" of the present invention includes at least a sensor material layer, a first electrode layer, and a second electrode layer, and charges generated in the sensor material layer in response to vibration are first. It can be taken out by the electrode layer and the second electrode layer. The vibration sensor main body may further include a shielding layer for reducing noise due to an external electromagnetic field, static electricity, etc., and an insulating layer that insulates the shielding layer from the first or second electrode layer. Further, the vibration sensor main body may be provided with a protective layer on the outermost layer. The vibration sensor main body is in the form of a sheet in which each layer is integrally laminated on a film (which may be one of each layer or another) as a base material, and the plane dimension is wider than the thickness. It is a thing. It is preferable that the shielding layer has a constant potential (for example, grounding) and surrounds the entire sensor material layer, the first electrode layer, and the second electrode layer. The vibration sensor main body is preferably configured such that one of the first or second electrode layers has a constant potential (for example, grounding) and a signal is extracted at the potential of the other electrode layer. In this case, one of the constant potential electrodes The layer can be used as a shielding layer, and it is sufficient to cover only the other electrode layer with the shielding layer. In this specification, the top and bottom indicate relative positions in the thickness direction, and are not absolute. For example, they do not prevent the top and bottom from being turned upside down when actually manufactured or used. Absent. As the biological vibration signal detection device of the present invention and the vibration sensor main body used therein, it is possible to adopt a highly sensitive one that can detect even a very small signal (for example, a voltage of μV) in order to detect the biological vibration signal. preferable. As described above, since the sensor of the biological vibration signal detection device can detect the signal with high sensitivity, it is very vulnerable to noise, and even a slight noise has a great influence on the signal in μV unit. Therefore, in order to ensure the accuracy of the signal in the biological vibration signal detection device, various solutions capable of reducing noise are disclosed in the present specification. Further, the biological vibration signal detection device and the vibration sensor main body used therein are arranged in the vicinity of the biological body, and it is assumed that various physical impacts are applied. Therefore, various solutions for increasing the mechanical strength of the biological vibration signal detecting device and providing the device which is hard to break are disclosed in the present specification. The solutions disclosed in the present specification can be appropriately selected and adopted according to the characteristics required for the device. For example, when accuracy is required rather than strength, a noise reduction solution may be preferentially adopted instead of a solution for increasing mechanical strength. On the contrary, when strength is required, the machine The solution for increasing the strength may be preferentially adopted, and the solution for noise reduction may be adopted as necessary.

本発明の「取出し電極」は、振動センサ本体の第1又は第2の電極層と接続させる導電性部材であり、第1又は第2の電極層の信号を外部に取り出す端子となる。取出し電極は、第1又は第2の電極層とは別の部材であり、第1又は第2の電極層を貫通することなく、取出し電極の表面を第1又は第2の電極層の表面と対面させて接続させる。取出し電極としては、導電性接着剤が塗布された導電性接着テープ、または銅箔、アルミ箔、銀箔、金箔等の導電性を有する金属材料薄膜、あるいは印刷法等により形成された金属薄膜でもよいし、ITO等の透明導電材料でもよい。取出し電極は、数10nm〜数100μmの厚さを有する薄膜であることが好ましい。取出し電極としては、導電性のテープ又は薄片とすることが接続する面積が広いため好ましいが、導線であってもよい。あるいは、印刷法、スパッタ法、蒸着法などにより導電性を有する配線を併せて形成してもよい。また、接続には、導電性の接着剤によって第1又は第2の電極層の表面に接着させることが簡便で且つ影響が少ないため好ましいが、取出し電極の表面と第1又は第2の電極層の表面とを超音波、熱、圧力などによって接合してもよい。ただし、超音波、熱、圧力などが、電極層及び取出し電極自体を変質、損傷するだけではなく、周囲の層や外装保護層へも影響することから、使用に問題のない範囲の条件とする必要がある。これに対し、導電性の接着剤による接続は周囲への影響は少ないので好ましい。また、第1又は第2の電極層の表面と第1又は第2の取出し電極との間にMo、Ti、TiO2等のバリアメタル層を形成し、第1又は第2の電極層の表面との接続性を高めてもよい。さらに接続部に半田を用いることにより、接続をより強固にすることができる。なお、取出し電極を長く延在させて他の部材(情報処理手段等)と接続するための配線としてもよいし、振動センサ本体の近傍において、取出し電極を他の配線や、電気回路部を含む半導体素子等に接続してもよい。半導体素子の電気回路部としては、例えば、増幅器、信号処理回路、通信回路、電力供給回路、表示回路等であり、取出し電極の周辺に実装されていることが好ましい。The "take-out electrode" of the present invention is a conductive member connected to the first or second electrode layer of the vibration sensor main body, and serves as a terminal for taking out the signal of the first or second electrode layer to the outside. The take-out electrode is a member different from the first or second electrode layer, and the surface of the take-out electrode is the surface of the first or second electrode layer without penetrating the first or second electrode layer. Face to face and connect. The take-out electrode may be a conductive adhesive tape coated with a conductive adhesive, a thin metal material having conductivity such as copper foil, aluminum foil, silver foil, or gold foil, or a metal thin film formed by a printing method or the like. However, a transparent conductive material such as ITO may be used. The extraction electrode is preferably a thin film having a thickness of several tens of nm to several hundreds of μm. The take-out electrode is preferably a conductive tape or a thin piece because it has a large connecting area, but it may be a conducting wire. Alternatively, the wiring having conductivity may be formed together by a printing method, a sputtering method, a vapor deposition method or the like. Further, for connection, it is preferable to adhere to the surface of the first or second electrode layer with a conductive adhesive because it is easy and has little influence, but the surface of the take-out electrode and the first or second electrode layer are connected. The surface of the surface may be bonded by ultrasonic waves, heat, pressure, or the like. However, ultrasonic waves, heat, pressure, etc. not only deteriorate and damage the electrode layer and the extraction electrode itself, but also affect the surrounding layer and exterior protection layer, so the conditions should be within the range where there is no problem in use. There is a need. On the other hand, the connection with a conductive adhesive is preferable because it has little influence on the surroundings. Further, a barrier metal layer such as Mo, Ti, TiO 2 is formed between the surface of the first or second electrode layer and the first or second extraction electrode, and the surface of the first or second electrode layer is formed. You may improve the connectivity with. Further, by using solder for the connecting portion, the connection can be further strengthened. The take-out electrode may be extended for a long time and used as wiring for connecting to another member (information processing means, etc.), or the take-out electrode may include other wiring or an electric circuit portion in the vicinity of the vibration sensor main body. It may be connected to a semiconductor element or the like. The electric circuit portion of the semiconductor element is, for example, an amplifier, a signal processing circuit, a communication circuit, a power supply circuit, a display circuit, or the like, and is preferably mounted around the extraction electrode.

図1は、本発明の生体振動信号検出装置1の概略ブロック図である。生体振動信号検出装置1は、生体10の生体振動信号を検出可能な生体振動信号検出手段2(振動センサ本体を含む)を備え、生体振動信号検出手段2で取得した生体振動信号は配線3を介して情報処理装置4に入力される。情報処理装置4は、取得した生体振動信号に基づいて、様々な生体情報を取得する。例えば、生体情報として生体の存在・不存在を検出したり、生体の脈拍、呼吸数、いびき、体動などの生体情報を信号処理によって算出したりしてもよい。生体振動信号検出装置1は、必要に応じて、電力供給手段5、記憶手段6、通信手段7、表示出力手段8、操作手段9などの一つ又は複数を備えていてもよい。なお、生体10として、ヒトの例を示すが、ヒトに限定されず、他の動物にも利用可能である。さらに、生体以外でも、振動信号検出装置として、振動センサ本体によってモータなどの駆動体の回転状態の検出や建築物などの耐久消費財の経年劣化の検出手段にも利用可能である。 FIG. 1 is a schematic block diagram of the biological vibration signal detection device 1 of the present invention. The biological vibration signal detection device 1 includes a biological vibration signal detecting means 2 (including a vibration sensor main body) capable of detecting the biological vibration signal of the living body 10, and the biological vibration signal acquired by the biological vibration signal detecting means 2 is wired 3 It is input to the information processing device 4 via. The information processing device 4 acquires various biological information based on the acquired biological vibration signal. For example, the presence / absence of a living body may be detected as biological information, or biological information such as the pulse rate, respiratory rate, snoring, and body movement of the living body may be calculated by signal processing. The biological vibration signal detection device 1 may include one or a plurality of power supply means 5, storage means 6, communication means 7, display output means 8, operation means 9, and the like, if necessary. Although a human example is shown as the living body 10, the living body 10 is not limited to humans and can be used for other animals. Further, as a vibration signal detecting device other than the living body, it can also be used as a means for detecting the rotational state of a driving body such as a motor by the vibration sensor main body and for detecting aged deterioration of durable consumer goods such as buildings.

図2は、本発明の生体振動信号検出手段2の分解概略構成図であり、図3は、保護カバーを除いた生体振動信号検出手段2の構成図であり、図3(A)は生体振動信号検出手段2(保護カバー20を除いたもの)の下面図であり、図3(B)は図2(A)のB−B断面であり、図3(C)は一部の構成を透過させた下面図である。なお、図面における寸法は、各層の構成等を説明するために誇張したものであり、実際の寸法を示すものではない。 FIG. 2 is an exploded schematic configuration diagram of the biological vibration signal detecting means 2 of the present invention, FIG. 3 is a configuration diagram of the biological vibration signal detecting means 2 excluding the protective cover, and FIG. 3 (A) is a biological vibration. It is a bottom view of the signal detecting means 2 (excluding the protective cover 20), FIG. 3 (B) is a cross section taken along the line BB of FIG. 2 (A), and FIG. 3 (C) is transparent to a part of the configuration. It is a bottom view. The dimensions in the drawings are exaggerated to explain the configuration of each layer, and do not indicate the actual dimensions.

図2に示すように、本実施形態の生体振動信号検出手段2は、保護カバー20内に、振動収集部材21、振動センサ本体10(図3(B)参照)を内包した外装保護層22、保護部材23及び弾性部材24を備え、外装保護層22内の振動センサ本体10に取出し電極を介して接続された配線3が伸びている。ただし、図1に示すような情報処理手段4が振動センサ本体10の近傍に形成されるような場合、例えば、振動収集部材21や、保護部材23上に形成されるような場合には、配線3は必ずしも必要はなく、情報処理手段4によって処理された生体情報等は無線通信手段を用いることによって伝送されてもよい。 As shown in FIG. 2, the biological vibration signal detecting means 2 of the present embodiment includes an exterior protective layer 22 containing a vibration collecting member 21 and a vibration sensor main body 10 (see FIG. 3B) in a protective cover 20. A wiring 3 provided with a protective member 23 and an elastic member 24 and connected to the vibration sensor main body 10 in the exterior protective layer 22 via a take-out electrode extends. However, when the information processing means 4 as shown in FIG. 1 is formed in the vicinity of the vibration sensor main body 10, for example, when it is formed on the vibration collecting member 21 or the protective member 23, wiring is performed. 3 is not always necessary, and the biometric information or the like processed by the information processing means 4 may be transmitted by using the wireless communication means.

保護カバー20は、生体振動信号検出手段2の外側に全体を覆って設けられたフレキシブルなフィルム状の部材であり、外部との接触、摩擦、摩耗による損傷を防止し、また、水分、ほこり、光などの外部環境から内部を保護する。保護カバー20の材質は特に限定されないが、高分子プラスチック素材(例えば、ポリ塩化ビニル(PVC)、ポリエチレン(PE)、ポリプロピレン(PP)、ポリスチレン(PS)、ABS、AS、ポリエチレンテレフタレート(PET)、ポリメタクリル酸メチル(PMMA)、ポリエステル、ポリカーボネート(PC)、ポリウレタン(PUR)、ポリエチレンナフタレート(PEN))でもよいし、これらに金属層を積層した積層素材でもよい。金属層を積層した場合は、金属層を定電位(例えば接地)とすることにより、一番外側の遮蔽層(シールド層)として振動センサ本体10のノイズを低減させる機能を持たせることできる。一実施態様において、保護カバー20として、三層構造を有するプラスチック材料、具体的には、表面が塩化ビニル層で、中間層がポリエステルレーヨン層、及び 裏面がアクリル樹脂から構成された、三層合計の厚みが1mm以下の絶縁材料を用いた。これ以外にも、ポリエステル、ポリカーボネート、ポリウレタン等の単層膜や多層膜を用いても良い。 The protective cover 20 is a flexible film-like member provided on the outside of the biological vibration signal detecting means 2 so as to prevent damage due to contact with the outside, friction, and abrasion, and also to prevent moisture, dust, and the like. Protect the inside from the external environment such as light. The material of the protective cover 20 is not particularly limited, but a polymer plastic material (for example, polyvinyl chloride (PVC), polyethylene (PE), polypropylene (PP), polystyrene (PS), ABS, AS, polyethylene terephthalate (PET), etc. Polymethyl methacrylate (PMMA), polyester, polycarbonate (PC), polyurethane (PUR), polyethylene terephthalate (PEN)) may be used, or a laminated material obtained by laminating a metal layer on these may be used. When the metal layers are laminated, by setting the metal layer to a constant potential (for example, grounding), it is possible to provide a function of reducing the noise of the vibration sensor main body 10 as the outermost shielding layer (shield layer). In one embodiment, the protective cover 20 is a plastic material having a three-layer structure, specifically, a total of three layers in which the front surface is a vinyl chloride layer, the intermediate layer is a polyester rayon layer, and the back surface is an acrylic resin. An insulating material having a thickness of 1 mm or less was used. In addition to this, a single-layer film or a multilayer film such as polyester, polycarbonate, or polyurethane may be used.

振動収集部材21は、生体で発生した振動を振動センサ本体に伝達する部材であり、振動センサ本体に比べて硬度の高い部材である。振動収集部材21としては、ヤング率が高く、振動を伝達しやすいものがよく、プラスチックの板(例えばPET板、発砲スチロール板、PP板、アクリル板、硬化塩化ビニル板、発泡塩化ビニル板等)や、金属板(例えばアルミ板、ジュラルミン板、銅板、鉄板等)又はこれらの幾つかを組み合わせた多層膜板を用いることができる。振動収集部材21の下面には、振動センサ本体10又は振動センサ本体10を内包した外装保護層22、弾性部材24が固定されるが、さらに、情報処理装置4、電力供給手段5、記憶手段6、通信手段7、表示出力手段8、操作手段9、その他の電気回路部を含む半導体素子などの一つ又は複数を実装してもよい。また、振動収集部材21の下面の少なくとも一部をプリント基板としてもよく、例えば、振動収集部材21の下面又は内部に配線をプリントしてもよいし、配線がプリントされたプリント基板を振動収集部材21の下面に取り付けてもよい。なお、ベッド用センサのような大面積のセンサにおいては、各エリアから生体信号を取得するために振動収集部材21を設けることが好ましいが、椅子に内蔵させるような小型センサの場合は、必ずしも振動収集部材21は必要ではない。振動収集部材21を設けない場合、外装保護層22の少なくとも一面を厚くすることにより、外装保護層22の厚い面を振動収集部材21として機能させ、振動を伝達しやすくしてもよい。 The vibration collecting member 21 is a member that transmits vibration generated in a living body to the vibration sensor main body, and is a member having a higher hardness than the vibration sensor main body. The vibration collecting member 21 preferably has a high Young's modulus and easily transmits vibration, and is a plastic plate (for example, PET plate, foamed styrol plate, PP plate, acrylic plate, hardened vinyl chloride plate, foamed vinyl chloride plate, etc.). Alternatively, a metal plate (for example, an aluminum plate, a duralmin plate, a copper plate, an iron plate, etc.) or a multilayer film plate in which some of these is combined can be used. An exterior protective layer 22 and an elastic member 24 including the vibration sensor main body 10 or the vibration sensor main body 10 are fixed to the lower surface of the vibration collecting member 21, but further, an information processing device 4, a power supply means 5, and a storage means 6 are fixed. , Communication means 7, display / output means 8, operating means 9, and one or more semiconductor elements including other electric circuit units may be mounted. Further, at least a part of the lower surface of the vibration collecting member 21 may be used as a printed circuit board. For example, wiring may be printed on the lower surface or inside of the vibration collecting member 21, or the printed circuit board on which the wiring is printed may be used as the vibration collecting member. It may be attached to the lower surface of 21. In a large-area sensor such as a bed sensor, it is preferable to provide a vibration collecting member 21 in order to acquire a biological signal from each area, but in the case of a small sensor built in a chair, vibration is not always required. The collecting member 21 is not required. When the vibration collecting member 21 is not provided, at least one surface of the exterior protective layer 22 may be thickened so that the thick surface of the exterior protective layer 22 functions as the vibration collecting member 21 and vibration can be easily transmitted.

外装保護層22は、内側に振動センサ本体10を内包するものであり、フレキシブルなフィルム状の部材であり、外部との接触、摩擦、摩耗による損傷を防止し、また、水分、酸素、ほこり、光などの外部環境から内部を保護することが好ましい。外装保護層22の材質は特に限定されないが、防水機能を有し、水分や酸素を透過し難い材料が好ましい。外装保護層22として、高分子プラスチック素材(例えば、PVC、PE、PP、PS、ABS、AS、PET、PMMAポリエステル、PC、PUR、PEN)でもよいし、これらに金属層、バリア層等を積層した積層素材でもよい。金属層を積層した場合は、金属層を定電位(例えば接地)とすることにより、遮蔽層(シールド層)として振動センサ本体10のノイズを低減させる機能を持たせることできる。外装保護層22は、図2(C)の接着領域22aにおいて振動収集部材21の下面に接着固定されている。接着領域22aは、例えば、両面テープを貼ってもよいし、接着剤を塗布してもよい。外装保護層22の一部(接続部)は、保護部材23で覆われている。外装保護層22の厚さは数μm〜数100μmとすることが好ましい。 The exterior protective layer 22 contains the vibration sensor main body 10 inside, and is a flexible film-like member that prevents damage due to contact with the outside, friction, and abrasion, and also contains moisture, oxygen, dust, and the like. It is preferable to protect the inside from the external environment such as light. The material of the exterior protective layer 22 is not particularly limited, but a material having a waterproof function and hardly allowing moisture and oxygen to permeate is preferable. As the exterior protective layer 22, a polymer plastic material (for example, PVC, PE, PP, PS, ABS, AS, PET, PMMA polyester, PC, PUR, PEN) may be used, or a metal layer, a barrier layer, or the like is laminated thereto. It may be a laminated material. When the metal layers are laminated, by setting the metal layer to a constant potential (for example, grounding), it is possible to provide a function of reducing the noise of the vibration sensor main body 10 as a shielding layer (shield layer). The exterior protective layer 22 is adhesively fixed to the lower surface of the vibration collecting member 21 in the adhesive region 22a of FIG. 2C. For example, double-sided tape may be attached to the adhesive region 22a, or an adhesive may be applied to the adhesive region 22a. A part (connection portion) of the exterior protective layer 22 is covered with a protective member 23. The thickness of the exterior protective layer 22 is preferably several μm to several hundred μm.

保護部材23は、弾性部材24によって振動収集部材21の下面に結合されており、弾性部材24の高さ分だけ振動収集部材21の下面から離間して配置されている。保護部材23は、振動センサ本体10の接続部を保護するためのものであり、振動センサ本体に比べて硬度の高い部材である。振動センサ本体10の接続部は、振動センサ本体の周縁部に形成されることが多く、周縁部は、ベッドや椅子のフレームなど硬い部分に接触することが多く、保護部材23を設けないと接続部が損傷を受け、故障の原因となっていた。保護部材23は、図2及び図3においては、接続部を覆うように設けられ、センサ部には設けられていないが、センサ部に設けてもよい。保護部材23としては、プラスチックの板(例えばPET板、発砲スチロール板、PP板、アクリル板、硬化塩化ビニル板、発泡塩化ビニル板等)や、金属板(例えばアルミ板、ジュラルミン板、銅板、鉄板等)又はこれらの幾つかを組み合わせた多層膜板を用いることができる。保護部材23の厚さは数μm〜数mmとすることが好ましい。 The protective member 23 is connected to the lower surface of the vibration collecting member 21 by the elastic member 24, and is arranged so as to be separated from the lower surface of the vibration collecting member 21 by the height of the elastic member 24. The protective member 23 is for protecting the connection portion of the vibration sensor main body 10, and is a member having a higher hardness than the vibration sensor main body. The connection portion of the vibration sensor main body 10 is often formed on the peripheral edge portion of the vibration sensor main body, and the peripheral edge portion often comes into contact with a hard portion such as a bed or a chair frame, and is connected without a protective member 23. The part was damaged and caused a failure. In FIGS. 2 and 3, the protective member 23 is provided so as to cover the connection portion and is not provided in the sensor portion, but may be provided in the sensor portion. The protective member 23 includes a plastic plate (for example, PET plate, foamed styrol plate, PP plate, acrylic plate, hardened vinyl chloride plate, foamed vinyl chloride plate, etc.) and a metal plate (for example, aluminum plate, duralmin plate, copper plate, iron plate). Etc.) or a multilayer plate in which some of these are combined can be used. The thickness of the protective member 23 is preferably several μm to several mm.

弾性部材24は、ある程度の絶縁性を有する弾性体によって形成され、弾性部材24の高さ分だけ保護部材23を浮かせている。弾性部材24としては、例えばゴム系材料、ウレタン系材料又はこれらの積層膜が好ましい。弾性部材24の厚さは数mm〜数10mmとすることが好ましい。弾性部材24は、保護部材23の周縁部に沿って設けられているが、振動センサ本体10及び外装保護層22の部分は除かれており、振動センサ本体10には荷重が加わらないように構成されている。また、配線3を通す部分についても弾性部材24は除かれている。保護部材23に外力が加わると、弾性部材24は若干変形するが、振動センサ本体10の接続部に保護部材23が接触しないように弾性部材24によって保護部材23が支持されている。また、弾性部材24は、保護部材23と一体成型して作成することもできる。例えば、硬化塩化ビニル板や炭素材にゴム系の材料を積層することにより弾性部材24を備えた保護部材23を形成できる。 The elastic member 24 is formed of an elastic body having a certain degree of insulating property, and the protective member 23 is floated by the height of the elastic member 24. As the elastic member 24, for example, a rubber-based material, a urethane-based material, or a laminated film thereof is preferable. The thickness of the elastic member 24 is preferably several mm to several tens of mm. The elastic member 24 is provided along the peripheral edge of the protective member 23, but the parts of the vibration sensor main body 10 and the exterior protective layer 22 are removed so that no load is applied to the vibration sensor main body 10. Has been done. Further, the elastic member 24 is also removed from the portion through which the wiring 3 is passed. When an external force is applied to the protective member 23, the elastic member 24 is slightly deformed, but the protective member 23 is supported by the elastic member 24 so that the protective member 23 does not come into contact with the connection portion of the vibration sensor main body 10. Further, the elastic member 24 can also be integrally molded with the protective member 23. For example, the protective member 23 provided with the elastic member 24 can be formed by laminating a rubber-based material on a cured vinyl chloride plate or a carbon material.

振動収集部材21の下面において、弾性部材24と保護部材23とによって囲まれた空間には、少なくとも振動センサ本体10の接続部が配置されるが、かかる空間内に情報処理装置4、電力供給手段5、記憶手段6、通信手段7、表示出力手段8、操作手段9、その他の電気回路部を含む半導体素子を実装してもよい。また、接続部の物理的な強度を高めるために、振動収集部材21の下面において、弾性部材24と保護部材23とによって囲まれた空間内を樹脂で充填して接続部内の各構成を動けないようにしてもよい。 At least the connection portion of the vibration sensor main body 10 is arranged in the space surrounded by the elastic member 24 and the protective member 23 on the lower surface of the vibration collecting member 21, and the information processing device 4 and the power supply means are provided in such a space. 5. A semiconductor element including a storage means 6, a communication means 7, a display output means 8, an operation means 9, and other electric circuit units may be mounted. Further, in order to increase the physical strength of the connecting portion, the space surrounded by the elastic member 24 and the protective member 23 is filled with resin on the lower surface of the vibration collecting member 21, and each configuration in the connecting portion cannot be moved. You may do so.

振動収集部材21の下面には、振動センサ本体10を内包した外装保護層22、保護部材23及び弾性部材24が取り付けられているが、保護部材23及び弾性部材24が配置された接続部と、保護部材23及び弾性部材24が配置されていないセンサ部との間に段差が生じている。この状態で保護カバー20によって覆われると、段差に起因して保護カバー20に遊び(浮いた部分)が生じ、この遊びが外力によって微振動することが判明した。この微振動は、振動センサ本体に対し機械的なノイズを発生させる原因となる。よって、段差を小さくし、遊びを少なくし、微振動及びノイズを低減することが好ましい。保護部材23の下面から外装保護層22の下面までの高さ(すなわち、段差)を10mm以下とすることが好ましく、8mm以下とすることがさらに好ましく、5mm以下とすることがさらに好ましい。BBI(本センサで得られる心弾動脈波の二つのピークの間の時間)とRRI(心電図から得られる二つのR波ピーク間の時間)の連続計測時間3分間におけるBBI・RRIの一致度が、段差が20mm以上の場合は50%以下となり、20〜10mmの場合は80%を割り、10〜8mmの場合は80%以上となり、8〜5mmの場合は90%以上となり、5〜0mmの場合は平均95%となった。また、接続部を覆う保護部材23及び弾性部材24に代えて、接続部を覆って絶縁性テープを接着して接続部を物理的及び電気的に保護する構成を採用してもよい。この場合には接続部とセンサ部との間に段差はほとんど生じないため、保護カバー20の遊びもなく、ノイズを抑えることができた。 An exterior protective layer 22, a protective member 23, and an elastic member 24 including a vibration sensor main body 10 are attached to the lower surface of the vibration collecting member 21, but a connecting portion in which the protective member 23 and the elastic member 24 are arranged and a connecting portion are provided. There is a step between the protective member 23 and the sensor portion on which the elastic member 24 is not arranged. It was found that when the protective cover 20 is covered in this state, play (floating portion) is generated in the protective cover 20 due to the step, and this play is slightly vibrated by an external force. This micro-vibration causes mechanical noise to be generated in the vibration sensor main body. Therefore, it is preferable to reduce the step, reduce play, and reduce micro-vibration and noise. The height (that is, the step) from the lower surface of the protective member 23 to the lower surface of the exterior protective layer 22 is preferably 10 mm or less, more preferably 8 mm or less, and further preferably 5 mm or less. The degree of agreement between BBI and RRI in a continuous measurement time of 3 minutes between BBI (time between two peaks of cardiovascular arterial waves obtained by this sensor) and RRI (time between two R wave peaks obtained from an electrocardiogram) When the step is 20 mm or more, it is 50% or less, when it is 20 to 10 mm, it is divided by 80%, when it is 10 to 8 mm, it is 80% or more, when it is 8 to 5 mm, it is 90% or more, and it is 5 to 0 mm. In the case, the average was 95%. Further, instead of the protective member 23 and the elastic member 24 that cover the connecting portion, a configuration may be adopted in which the connecting portion is covered and an insulating tape is adhered to physically and electrically protect the connecting portion. In this case, since there is almost no step between the connection portion and the sensor portion, there is no play in the protective cover 20, and noise can be suppressed.

ここで、BBI・RRIの一致度について簡単に述べる。周知のように心電図(ECG)は体に電極を張り付けて、電極間の電位の変化を直接測定する手法であり、技術的に確立した技法である。その際、RRIは心拍間変動を表す指標であり、心電図のR波とR波の時間を示しており、RRIをフーリエ展開することにより、周波数で分類し、自律神経活動指標(LF, LF/HF)として用いられている。HFは副交感神経活動を表し、LFは交感神経活動を表している。他方、心弾動図(BCG)は、心臓の血液が心臓から押し出される際に生じる心臓の震えに起因する振動であり、体に接触させたり、拘束したりしなくても本センサを用いることにより測定できる。そして、RRIに相当する指標としてBBI(Beat by Beat Interval)を定義した。理論上、BBIはRRIに比べて、測定する時間差は0.2秒程度の遅れが生じるが、心拍間時間は一致するものである。しかし、現実的には、BBIは測定が極めて難しく、あらゆる微小なノイズが入るために、100%一致することはない。BBIとRRIの一致度は、同時に測定した心電図(ECG)と心弾動図(BCG)とからBBI及びRRIをそれぞれ求め、BBIを縦軸とし、RRIを横軸とした相関図から相関係数を求め、一致率を計算することができる。心電図(ECG)及び心弾動図(BCG)の測定時間としては100秒以上とすることが好ましく、180秒以上とすることがより好ましい。この一致率を高めることが、センサ開発においては最も重要な課題であり、本特許では、段差と一致度との関係性を見出し、段差を10mm以下にすることにより、一致率を実用可能なレベルである80%以上の高い一致率を実現させることに成功した。 Here, the degree of agreement between BBI and RRI will be briefly described. As is well known, electrocardiogram (ECG) is a technique in which electrodes are attached to the body and the change in electric potential between the electrodes is directly measured, which is a technically established technique. At that time, RRI is an index showing the fluctuation between heartbeats, and shows the time of R wave and R wave of the electrocardiogram. By Fourier-expanding RRI, it is classified by frequency and the autonomic nerve activity index (LF, LF / It is used as HF). HF represents parasympathetic nerve activity and LF represents sympathetic nerve activity. On the other hand, the cardiac motion chart (BCG) is a vibration caused by the tremor of the heart that occurs when the blood of the heart is pushed out from the heart, and this sensor should be used without contacting or restraining the body. Can be measured by. Then, BBI (Beat by Beat Interval) was defined as an index corresponding to RRI. Theoretically, the time difference between BBI and RRI is about 0.2 seconds, but the time between heartbeats is the same. However, in reality, BBI is extremely difficult to measure, and due to the inclusion of any minute noise, it does not match 100%. For the degree of agreement between BBI and RRI, BBI and RRI are obtained from the electrocardiogram (ECG) and the electrocardiogram (BCG) measured at the same time, respectively, and the correlation coefficient is obtained from the correlation diagram with BBI as the vertical axis and RRI as the horizontal axis. Can be obtained and the match rate can be calculated. The measurement time of the electrocardiogram (ECG) and the electrocardiogram (BCG) is preferably 100 seconds or longer, and more preferably 180 seconds or longer. Increasing this matching rate is the most important issue in sensor development. In this patent, we found the relationship between the step and the degree of matching, and by making the step 10 mm or less, the matching rate can be made practical. We succeeded in achieving a high concordance rate of 80% or more.

振動センサ本体10は、図3(B)に示すように、フィルム状の振動センサ素材層11の上下にフィルム状の第1の電極層12及び第2の電極層13が形成され、第1の電極層12の上を覆ってフィルム状の絶縁層14が形成され、絶縁層14の上に遮蔽層15が形成されている。さらに、遮蔽層15の一部には開口部15aが形成されており、遮蔽層15の開口部15a内において、絶縁層14にも開口部14aが形成され、第1の電極層12を露出させている。露出した第1の電極層12の表面に第1の取出し電極16を接合させている。また、第2の電極層13の下面に第2の取出し電極17を接合させており、遮蔽層15の表面に第3の取出し電極18を接合させている。これらの接続部はノイズに極めて敏感であり、ノイズ誘発の原因となるため、さらに、遮蔽部材19で接続部を覆っている。 In the vibration sensor main body 10, as shown in FIG. 3B, a film-shaped first electrode layer 12 and a second electrode layer 13 are formed above and below the film-shaped vibration sensor material layer 11, and the first A film-shaped insulating layer 14 is formed over the electrode layer 12, and a shielding layer 15 is formed on the insulating layer 14. Further, an opening 15a is formed in a part of the shielding layer 15, and an opening 14a is also formed in the insulating layer 14 in the opening 15a of the shielding layer 15 to expose the first electrode layer 12. ing. The first extraction electrode 16 is bonded to the surface of the exposed first electrode layer 12. Further, the second extraction electrode 17 is bonded to the lower surface of the second electrode layer 13, and the third extraction electrode 18 is bonded to the surface of the shielding layer 15. Since these connecting portions are extremely sensitive to noise and cause noise induction, the connecting portions are further covered with a shielding member 19.

振動センサ素材層11は、振動によって電荷を発生させる圧電材料であり、ピエゾ素子(圧電素子)が好適に用いられるが、振動を電気信号に変換するマイクロフォンを用いてもよい。ピエゾ素子材料としては、セラミックス系であっても、有機ポリマー系であってもよく、セラミックス系としては、PZTやBST等の高ε材料である強誘電体材料を用いることが好ましい。また、有機ポリマー系として、例えばポリオレフィン系材料を用いてもよく、具体的には、例えば、多孔性ポリプロピレンエレクトレットフィルム(Electro Mechanical Film(EMFI))、PVDF(ポリフッ化ビニリデンフィルム)、フッ化ビニリデンと三フッ化エチレン共重合体(P(VDF−TrFE))、又はフッ化ビニリデンと四フッ化エチレン共重合体(P(VDF−TFE))を用いてもよい。振動センサ素材層11としては、フィルム状(例えば、厚さ1mm以下、好ましくは、10〜200μm厚)であることが好ましく、さらにフレキシブルであることが好ましい。さらに、振動センサ素材層11として圧電センサを使用すると、生体を拘束せずに生体振動信号を取得することが可能であり、よりストレスフリーで測定できるので好ましい。ただし、圧電センサは、リストバンド、ベルト、腕時計、指輪、ヘッドバンド等に取り付けて、動物に装着してウェアラブルセンサとして利用することもできる。さらに、生体以外でも、振動信号検出装置として、振動センサ本体によってモータなどの駆動体の回転状態の検出や建築物などの耐久消費財の経年劣化の検出手段にも利用可能である。また、マイクロフォンとしては、例えば直径10mmφ程度やそれ以下の数mm程度の大きさの小型のものを用いることが好ましい。 The vibration sensor material layer 11 is a piezoelectric material that generates electric charges by vibration, and a piezo element (piezoelectric element) is preferably used, but a microphone that converts vibration into an electric signal may also be used. The piezo element material may be a ceramic material or an organic polymer material, and as the ceramic material, it is preferable to use a ferroelectric material which is a high ε material such as PZT or BST. Further, as the organic polymer system, for example, a polyolefin-based material may be used, and specifically, for example, a porous polypropylene electlet film (Electro Mechanical Film (EMFI)), PVDF (polyvinylidene fluoride film), vinylidene fluoride and the like. An ethylene trifluoride copolymer (P (VDF-TrFE)) or a vinylidene fluoride and a tetrafluoroethylene copolymer (P (VDF-TFE)) may be used. The vibration sensor material layer 11 is preferably in the form of a film (for example, 1 mm or less in thickness, preferably 10 to 200 μm in thickness), and more preferably flexible. Further, it is preferable to use the piezoelectric sensor as the vibration sensor material layer 11 because it is possible to acquire the biological vibration signal without restraining the living body and the measurement can be performed more stress-free. However, the piezoelectric sensor can also be attached to a wristband, belt, wristwatch, ring, headband, or the like and attached to an animal to be used as a wearable sensor. Further, as a vibration signal detecting device other than the living body, it can also be used as a means for detecting the rotational state of a driving body such as a motor by the vibration sensor main body and for detecting aged deterioration of durable consumer goods such as buildings. Further, as the microphone, for example, it is preferable to use a small microphone having a diameter of about 10 mmφ or less and a size of about several mm.

第1の電極層12及び第2の電極層13は、振動センサ素材層11に隣接して形成されており、金属(銅、アルミニウム、銀、金など)、導電性カーボン膜、透明導電材料(ITO、IZOなど)などの導電性材料が使用される。第1の電極層12及び第2の電極層13としては、フィルム状であることが好ましく、さらにフレキシブルであることが好ましい。特に、従来のアルミニウムではなく、薄い導電性カーボン膜、銀電極等の柔らかい素材を使用すると、振動センサ本体10自体を柔らかくすることができ、好ましい。本実施の形態においては、振動センサ本体10の下面に形成された第2の電極層13を接地して第1の電極層12から信号を取り出すようにしているため、第2の電極層13が下部遮蔽層としても機能する。これらの電極層は、印刷技術や接着剤を用いた薄膜貼り合わせ法、蒸着法やスパッタ法等の様々な方法で形成することができる。電極層の厚さは、数nm〜数100nmの厚みとすることが好ましい。 The first electrode layer 12 and the second electrode layer 13 are formed adjacent to the vibration sensor material layer 11, and are formed of a metal (copper, aluminum, silver, gold, etc.), a conductive carbon film, and a transparent conductive material (transparent conductive material). Conductive materials such as ITO, IZO, etc.) are used. The first electrode layer 12 and the second electrode layer 13 are preferably in the form of a film, and more preferably flexible. In particular, it is preferable to use a soft material such as a thin conductive carbon film or a silver electrode instead of the conventional aluminum because the vibration sensor body 10 itself can be softened. In the present embodiment, since the second electrode layer 13 formed on the lower surface of the vibration sensor main body 10 is grounded so as to take out a signal from the first electrode layer 12, the second electrode layer 13 is It also functions as a lower shielding layer. These electrode layers can be formed by various methods such as a printing technique, a thin film bonding method using an adhesive, a thin film deposition method, and a sputtering method. The thickness of the electrode layer is preferably several nm to several hundred nm.

絶縁層14は、第1の電極層12と遮蔽層15とを絶縁するものであり、有機又は無機の絶縁性の被膜が使用される。例えば、絶縁層14の素材としては、PET、PEN、ポリカーボネート、塩化ビニル、二酸化ケイ素、シリコンナイトライド等、又は複数種類の絶縁層を組み合わせた積層構造を使用してもよい。絶縁層14としては、フィルム状であることが好ましく、さらにフレキシブルであることが好ましい。絶縁層14の厚さは、数μm〜数100μmの厚みとすることが好ましい。絶縁層は、印刷技術や接着剤を用いた薄膜貼り合わせ法、蒸着法やスパッタ法等の様々な方法で形成することができる。絶縁層14は、第1の電極層12と遮蔽層15とに挟まれ、容量となるが、その静電容量は、鼾とか寝言の信号といった100乃至500Hz付近の周波数の振動を検出する場合には、振動センサ素材層11、第1の電極層12及び第2の電極層13の静電容量に比べて、10分の1以下とすることが好ましい。また、絶縁層14には、開口部14aが形成されているが、開口部14aが形成された絶縁層14を第1の電極層12の上に形成してもよいし、第1の電極層12の上に絶縁層14を形成した後に、開口部14aを形成してもよい。 The insulating layer 14 insulates the first electrode layer 12 and the shielding layer 15, and an organic or inorganic insulating coating is used. For example, as the material of the insulating layer 14, PET, PEN, polycarbonate, vinyl chloride, silicon dioxide, silicon nitride or the like, or a laminated structure in which a plurality of types of insulating layers are combined may be used. The insulating layer 14 is preferably in the form of a film, and more preferably in the form of a film. The thickness of the insulating layer 14 is preferably several μm to several hundred μm. The insulating layer can be formed by various methods such as a printing technique, a thin film bonding method using an adhesive, a thin film deposition method, and a sputtering method. The insulating layer 14 is sandwiched between the first electrode layer 12 and the shielding layer 15 and has a capacitance. The capacitance is used when detecting vibrations having a frequency of around 100 to 500 Hz, such as a signal of a finger or a sleeper. Is preferably 1/10 or less of the capacitance of the vibration sensor material layer 11, the first electrode layer 12, and the second electrode layer 13. Further, although the insulating layer 14 has an opening 14a formed, the insulating layer 14 having the opening 14a formed may be formed on the first electrode layer 12 or the first electrode layer. After forming the insulating layer 14 on the 12, the opening 14a may be formed.

遮蔽層15は、絶縁層14の上に形成されており、金属(アルミニウム、銀、金)、導電性カーボン膜などの導電性材料又は導電性材料と絶縁性材料の積層膜などが使用される。遮蔽層15としては、フィルム状であることが好ましく、さらにフレキシブルであることが好ましい。特に、従来のアルミニウムではなく、薄い導電性カーボン膜、銀電極等の柔らかい素材を使用すると、振動センサ本体10自体を柔らかくすることができ、好ましい。遮蔽層15は定電位(例えば接地)とすることにより、信号を取り出す第1の電極層に対する外部からの電磁場などの影響を遮蔽することができる。遮蔽層15には、開口部15aが形成されているが、開口部15aが形成された遮蔽層15を絶縁層14の上に形成してもよいし、絶縁層14の上に遮蔽層15を形成した後に、開口部15aを形成してもよい。後から開口部15aを設ける場合は、絶縁層14の開口部14aも続けて形成することが好ましい。遮蔽層15として、例えば、厚さ25μmのPET上に形成された厚さ10μmのアルミニウムを使用し、PET層を絶縁層14又はその一部とし、アルミニウム層を遮蔽層15として用いてもよい。 The shielding layer 15 is formed on the insulating layer 14, and a conductive material such as a metal (aluminum, silver, gold) or a conductive carbon film, or a laminated film of a conductive material and an insulating material is used. .. The shielding layer 15 is preferably in the form of a film, and more preferably in the form of a film. In particular, it is preferable to use a soft material such as a thin conductive carbon film or a silver electrode instead of the conventional aluminum because the vibration sensor body 10 itself can be softened. By setting the shielding layer 15 to a constant potential (for example, grounding), it is possible to shield the influence of an external electromagnetic field or the like on the first electrode layer from which a signal is taken out. Although the opening 15a is formed in the shielding layer 15, the shielding layer 15 in which the opening 15a is formed may be formed on the insulating layer 14, or the shielding layer 15 may be formed on the insulating layer 14. After forming, the opening 15a may be formed. When the opening 15a is provided later, it is preferable to continuously form the opening 14a of the insulating layer 14. As the shielding layer 15, for example, aluminum having a thickness of 10 μm formed on a PET having a thickness of 25 μm may be used, the PET layer may be used as the insulating layer 14 or a part thereof, and the aluminum layer may be used as the shielding layer 15.

第1の取出し電極16、第2の取出し電極17及び第3の取出し電極18は、導電性の材料である。取出し電極16、17、18としては、導電性テープを導電性接着剤で各層の表面に接着して接合させている。取出し電極としては、導電性接着剤が塗布された導電性接着テープ、または銅箔、アルミ箔、銀箔、金箔等の導電性を有する金属材料薄膜、あるいは印刷法等により形成された金属薄膜でもよいし、ITO等の透明導電材料でもよい。取出し電極の厚さは、数10nm〜数100μmまで幅広く選択することができる。取出し電極16、17、18は、電極層及び遮蔽層と面で接合させる。第1の取出し電極16は、遮蔽層15及び絶縁層14の開口部15a、14aにおいて、第1の電極層12と接合している。第2の取出し電極17は、第2の電極層13の下面と接合している。第3の取出し電極18は、遮蔽層15の上面と接合している。図3(C)に示すように、第3の取出し電極18は、第2の取出し電極17と配線で接続されており、同電位(接地)となっている。 The first take-out electrode 16, the second take-out electrode 17, and the third take-out electrode 18 are conductive materials. As the take-out electrodes 16, 17, and 18, a conductive tape is adhered to the surface of each layer with a conductive adhesive and bonded. The take-out electrode may be a conductive adhesive tape coated with a conductive adhesive, a thin metal material having conductivity such as copper foil, aluminum foil, silver foil, or gold foil, or a metal thin film formed by a printing method or the like. However, a transparent conductive material such as ITO may be used. The thickness of the take-out electrode can be widely selected from several tens of nm to several hundreds of μm. The extraction electrodes 16, 17, and 18 are joined in a surface with the electrode layer and the shielding layer. The first take-out electrode 16 is joined to the first electrode layer 12 at the openings 15a and 14a of the shielding layer 15 and the insulating layer 14. The second extraction electrode 17 is joined to the lower surface of the second electrode layer 13. The third take-out electrode 18 is joined to the upper surface of the shielding layer 15. As shown in FIG. 3C, the third take-out electrode 18 is connected to the second take-out electrode 17 by wiring and has the same potential (ground).

遮蔽部材19は、導電性のフィルム又は導電性接着フィルムであり、接続部を覆っている。遮蔽部材19としては、例えば、銅箔又はAl箔等の導電性テープを使用することができる。第1の取出し電極16は、遮蔽層15の開口部15a内に配置されていることから、そのままでは、外部の電磁場から遮蔽されておらず、肝心の信号を取り出す接続部においてノイズが第1の取出し電極16に発生してしまう。このため、遮蔽層15とは別の遮蔽部材19で少なくとも遮蔽層15の開口部15aを覆う。図3では、遮蔽部材19は、上面及び下面に設けられており、第1の取出し電極16だけではなく、第2の取出し電極17及び第3の取出し電極18も覆っている。遮蔽部材19は、第1の取出し電極16とは短絡しないように構成されている。遮蔽部材19は、導電性であることから、第2の取出し電極17及び第3の取出し電極18を接続するために使用してもよい。また、遮蔽部材19を設けることにより、例えば、生体振動信号検出装置の情報処理手段、記憶手段、通信手段などを振動センサ本体の近傍(例えば振動収集部材21上や、保護部材23上)に実装した際に、これらの回路から発生する電磁場を遮蔽することができ、ノイズを減らす効果がある。遮蔽部材19として、例えば、厚さ25μmのPETの上に形成された厚さ10μmのAl薄膜を使用したり、銅箔シートを使用してもよい。これらは、薄いシート膜で構成されるので、柔軟性が高く、半田付けされた接続部領域を安定に被覆し保護することができた。さらに、接続部だけではなく、振動センサ本体の近傍に情報処理手段を同一面内に形成する場合は、情報処理手段に用いられる半導体チップや受動素子やそれらの接続部も遮蔽部材で覆い、電磁場等を遮蔽し、ノイズを低減することが好ましい。前述したとおり、生体振動信号検出装置はμV単位の信号を扱うことから、振動センサ本体及びその接続部だけではなく、振動センサ本体からの振動信号が入力される情報処理手段についてもノイズの発生を防止することが好ましい。 The shielding member 19 is a conductive film or a conductive adhesive film, and covers the connecting portion. As the shielding member 19, for example, a conductive tape such as a copper foil or an Al foil can be used. Since the first take-out electrode 16 is arranged in the opening 15a of the shielding layer 15, it is not shielded from the external electromagnetic field as it is, and noise is generated in the connecting portion for extracting the important signal. It occurs on the take-out electrode 16. Therefore, at least the opening 15a of the shielding layer 15 is covered with the shielding member 19 different from the shielding layer 15. In FIG. 3, the shielding member 19 is provided on the upper surface and the lower surface, and covers not only the first extraction electrode 16 but also the second extraction electrode 17 and the third extraction electrode 18. The shielding member 19 is configured so as not to be short-circuited with the first extraction electrode 16. Since the shielding member 19 is conductive, it may be used to connect the second take-out electrode 17 and the third take-out electrode 18. Further, by providing the shielding member 19, for example, the information processing means, the storage means, the communication means, etc. of the biological vibration signal detection device are mounted in the vicinity of the vibration sensor main body (for example, on the vibration collecting member 21 or on the protective member 23). At that time, the electromagnetic field generated from these circuits can be shielded, which has the effect of reducing noise. As the shielding member 19, for example, an Al thin film having a thickness of 10 μm formed on a PET having a thickness of 25 μm may be used, or a copper foil sheet may be used. Since these are composed of a thin sheet film, they are highly flexible and can stably cover and protect the soldered connection area. Further, when the information processing means is formed in the same plane in the vicinity of the vibration sensor body as well as the connecting portion, the semiconductor chip and the passive element used for the information processing means and their connecting portions are also covered with a shielding member to form an electromagnetic field. Etc. are preferably shielded to reduce noise. As described above, since the biological vibration signal detection device handles signals in μV units, noise is generated not only in the vibration sensor main body and its connection portion but also in the information processing means to which the vibration signal from the vibration sensor main body is input. It is preferable to prevent it.

配線3は、固定ピン32によって振動収集部材21又は保護部材23に固定されており、配線3に力を加えても振動センサ本体10には伝わらないようにしている。配線3の一端は、取出し電極16、17に接続されており、他端は、プラグ31に接続されている。配線3と取出し電極とは、例えば結線用の基板を用いて接続してもよいし、導電性接着剤で接着してもよいし、半田等で接続してもよい。配線3と取出し電極との接続する部分も遮蔽部材19によって電磁場等を遮蔽し、ノイズを低減することが好ましい。例えば、厚さ25μmのPETの上に形成された厚さ10μmのAl薄膜を配線3と取出し電極との接続する部分の上にかぶせてもよい。固定ピン32は、例えば、コの字型の絶縁ステップルなどのように別部品でもよいし、振動収集部材21又は保護部材23に一体的に成形されたものでもよい。 The wiring 3 is fixed to the vibration collecting member 21 or the protective member 23 by the fixing pin 32 so that even if a force is applied to the wiring 3, the wiring 3 is not transmitted to the vibration sensor main body 10. One end of the wiring 3 is connected to the extraction electrodes 16 and 17, and the other end is connected to the plug 31. The wiring 3 and the take-out electrode may be connected using, for example, a substrate for connection, may be bonded with a conductive adhesive, or may be connected with solder or the like. It is preferable that the portion where the wiring 3 and the extraction electrode are connected is also shielded by the shielding member 19 to shield the electromagnetic field and the like to reduce noise. For example, an Al thin film having a thickness of 10 μm formed on a PET having a thickness of 25 μm may be placed over a portion connecting the wiring 3 and the extraction electrode. The fixing pin 32 may be a separate component such as a U-shaped insulating staple, or may be integrally molded with the vibration collecting member 21 or the protective member 23.

振動センサ本体10及び生体振動信号検出手段2の製造工程の一例は以下のとおりである。まず、薄いシートフィルム状のピエゾ素子材料11(例えば厚さ40μm程度又は110μm程度のPVDF)を準備し、このピエゾ素子材料11の表裏両面に電極層(例えば厚さ10μm程度の導電性カーボン膜)を全面に被着させることにより、第1及び第2の電極層12、13をピエゾ素子材料の表裏両面上に形成した。電極層形成には、接着剤を用いて導電性カーボン膜を被着させても良いし、インクジェット印刷方式や凸版反転方式を用いた印刷技術を用いて電極層を形成しても良い。 An example of the manufacturing process of the vibration sensor main body 10 and the biological vibration signal detecting means 2 is as follows. First, a thin sheet film-shaped piezo element material 11 (for example, PVDF having a thickness of about 40 μm or about 110 μm) is prepared, and electrode layers (for example, a conductive carbon film having a thickness of about 10 μm) are provided on both the front and back surfaces of the piezo element material 11. The first and second electrode layers 12 and 13 were formed on both the front and back surfaces of the piezo element material. For forming the electrode layer, a conductive carbon film may be adhered using an adhesive, or an electrode layer may be formed by using a printing technique using an inkjet printing method or a letterpress inversion method.

電極層を形成した後、第1の電極層12の上に開口部14aがパターン形成されている絶縁層(例えば厚さ20μm程度のPET(ポリエチレンテレフタレート)フィルム)14をラミネート処理し、絶縁層14を第1の電極層12の上に形成した。さらに、絶縁層14の上に開口部15aがパターン形成されている導電性の遮蔽層15(例えば厚さ10μm程度の導電性カーボン膜や厚さ10μm程度の導電性カーボン膜に25μm程度のPETの厚さ積層シートフィルム)を被着し、表面に電磁シールド層を形成し、振動センサ本体10を完成した。さらに、1枚の外装保護層22を折り返して、その間に振動センサ本体10を配置し、振動センサ本体10の上下両面に外装保護層22を被着させた。外装保護層22は袋状の筒でもよく、振動センサ本体10を袋状の外装保護層22に挿入した後、振動センサ本体10と外装保護層22とを熱、接着剤等で接着してもよい。また、2枚の外装保護層22を上下別々に振動センサ本体両面に接着剤を使って被着させても良いし、振動センサ本体両面にラミネート処理して被着してもよい。上記構成の振動センサ本体10は、電極層及び電磁シールド層を構成する材料として柔らかい導電性カーボン膜を使用しているため、センサ自体を柔らかくすることができ、リストバンド、ベルト、腕時計、指輪、ヘッドバンド、モータ回転体外装部の湾曲した部分、建築物の外壁等に違和感なく取り付けることができる。なお、カーボン材料のほか、数10〜200nmの厚さの銀電極又はAl系材料の電極を印刷技術等を用いて被着してもよいし、各層の材料及び形成方法は上記例に限定されるものではない。情報処理手段を形成する場合は、印刷技術を用いることにより、電極形成と同時に、情報処理手段を構成する半導体チップ等を配線する電気配線を外装保護層上に同時に形成することができる。 After forming the electrode layer, an insulating layer (for example, a PET (polyethylene terephthalate) film having a thickness of about 20 μm) 14 having an opening 14a patterned on the first electrode layer 12 is laminated, and the insulating layer 14 is formed. Was formed on the first electrode layer 12. Further, a conductive shielding layer 15 in which an opening 15a is patterned on the insulating layer 14 (for example, a conductive carbon film having a thickness of about 10 μm or a conductive carbon film having a thickness of about 10 μm and PET having a thickness of about 25 μm). A thick laminated sheet film) was attached to form an electromagnetic shield layer on the surface, and the vibration sensor main body 10 was completed. Further, one exterior protective layer 22 was folded back, a vibration sensor main body 10 was arranged between them, and the exterior protective layer 22 was adhered to both the upper and lower surfaces of the vibration sensor main body 10. The exterior protective layer 22 may be a bag-shaped cylinder, and after the vibration sensor main body 10 is inserted into the bag-shaped exterior protective layer 22, the vibration sensor main body 10 and the exterior protective layer 22 may be bonded with heat, an adhesive or the like. Good. Further, the two exterior protective layers 22 may be separately attached to the upper and lower surfaces of the vibration sensor body by using an adhesive, or may be adhered to both sides of the vibration sensor body by laminating. Since the vibration sensor main body 10 having the above configuration uses a soft conductive carbon film as a material constituting the electrode layer and the electromagnetic shield layer, the sensor itself can be softened, and the wristband, belt, wristwatch, ring, etc. It can be attached to the headband, the curved part of the exterior of the motor rotating body, the outer wall of the building, etc. without any discomfort. In addition to the carbon material, a silver electrode having a thickness of several 10 to 200 nm or an electrode made of an Al-based material may be adhered using printing technology or the like, and the material and forming method of each layer are limited to the above examples. It's not something. When forming the information processing means, by using the printing technique, it is possible to simultaneously form the electrical wiring for wiring the semiconductor chip or the like constituting the information processing means on the exterior protective layer at the same time as forming the electrodes.

図4は、生体振動信号検出手段2の製造工程の途中の段階を説明するための図であり、図3と同じ構成には同じ符号を付した。図4(A)に示すように、この振動センサ本体10を内包した外装保護層22の接着領域22aを振動収集部材21に接着し、外装保護層22の袋の入り口を開いて振動センサ本体10の端部を露出させる。端部には、絶縁層14の開口部14a及び遮蔽層15の開口部15aが配置されており、開口部14a、15aを介して第1の電極層12が露出している。そして、図4(B)に示すように、配線3が接続された第1の取出し電極16、第2の取出し電極17及び第3の取出し電極18をそれぞれ第1の電極層12、第2の電極層13及び遮蔽層15に導電性接着剤で接着する。配線3は、必要に応じてピン32で固定する。配線3と取出し電極との接続が振動センサ本体10に対して影響しない又は影響が少ない場合は、振動センサ本体10の各層と取出し電極とを先に接続した後に取出し電極と配線3とを接続してもよいが、配線3と取出し電極との接続が振動センサ本体10に対して影響する場合には、予め配線3が接続された取出し電極を振動センサ本体10の各層と接続させることが好ましい。なお、振動センサ本体10の端部はフレキシブルであり、上面側の第1の電極層12及び遮蔽層15との接着は、端部をめくって取出し電極を接着すればよい。その後、図4(C)に示すように、接続部を遮蔽部材19によって電磁シールドする。情報処理手段4が接続部近傍に形成されている場合は、情報処理手段4についても遮蔽部材19によって電磁シールドしてもよい。 FIG. 4 is a diagram for explaining a step in the middle of the manufacturing process of the biological vibration signal detecting means 2, and the same components as those in FIG. 3 are designated by the same reference numerals. As shown in FIG. 4A, the adhesive region 22a of the exterior protective layer 22 including the vibration sensor main body 10 is adhered to the vibration collecting member 21, and the entrance of the bag of the exterior protective layer 22 is opened to open the vibration sensor main body 10. Expose the end of the. An opening 14a of the insulating layer 14 and an opening 15a of the shielding layer 15 are arranged at the end portion, and the first electrode layer 12 is exposed through the openings 14a and 15a. Then, as shown in FIG. 4B, the first take-out electrode 16, the second take-out electrode 17, and the third take-out electrode 18 to which the wiring 3 is connected are connected to the first electrode layer 12 and the second take-out electrode 18, respectively. It is adhered to the electrode layer 13 and the shielding layer 15 with a conductive adhesive. The wiring 3 is fixed with a pin 32 as needed. If the connection between the wiring 3 and the take-out electrode does not affect or has little effect on the vibration sensor main body 10, connect each layer of the vibration sensor main body 10 and the take-out electrode first, and then connect the take-out electrode and the wiring 3. However, when the connection between the wiring 3 and the take-out electrode affects the vibration sensor main body 10, it is preferable to connect the take-out electrode to which the wiring 3 is connected in advance to each layer of the vibration sensor main body 10. The end of the vibration sensor main body 10 is flexible, and the first electrode layer 12 and the shielding layer 15 on the upper surface side may be adhered by turning over the end and adhering the take-out electrode. After that, as shown in FIG. 4C, the connection portion is electromagnetically shielded by the shielding member 19. When the information processing means 4 is formed in the vicinity of the connection portion, the information processing means 4 may also be electromagnetically shielded by the shielding member 19.

そして、外装保護層22の入り口を閉じ、弾性部材24を保護部材23の周囲に沿って略コの字状に両面テープで振動収集部材21の下面に接着し、さらに弾性部材24の下面を両面テープで保護部材23に接着して固定する。最後に、振動収集部材21、振動センサ本体10及び保護部材23を含めて全体を保護カバーで包み込み生体振動信号検出手段2を完成させた。 Then, the entrance of the exterior protective layer 22 is closed, the elastic member 24 is adhered to the lower surface of the vibration collecting member 21 with double-sided tape in a substantially U shape along the periphery of the protective member 23, and the lower surface of the elastic member 24 is further attached to both sides. It is fixed to the protective member 23 with tape. Finally, the biological vibration signal detecting means 2 was completed by wrapping the entire body including the vibration collecting member 21, the vibration sensor main body 10 and the protective member 23 with a protective cover.

図5は、振動センサ本体10の変形例である。図5(A)は、振動センサ本体10及び外装保護層22の断面図であり、(B)は外装保護層22の下面図である。図5の振動センサ本体10では、外装保護層22に3つの開口部22b、22c、22dが形成されており、外装保護層22の外側から取出し電極が振動センサ本体10の各層と開口部22b、22c、22dを介して接合されている。第1の取出し電極16は、外装保護層22の上面に形成された第1の開口部22bを介し、さらに遮蔽層15の開口部15a及び絶縁層14の開口部14aを介して第1の電極層12と接合している。第2の取出し電極17は、外装保護層22の下面に形成された第2の開口部22cを介して第2の電極層13と接合している。第3の取出し電極18は、外装保護層22の上面に形成された第3の開口部22dを介して遮蔽層14と接合している。さらに、接続部において、遮蔽部材19が外装保護層22の上面及び下面を覆っている。 FIG. 5 is a modified example of the vibration sensor main body 10. FIG. 5A is a cross-sectional view of the vibration sensor main body 10 and the exterior protective layer 22, and FIG. 5B is a bottom view of the exterior protective layer 22. In the vibration sensor main body 10 of FIG. 5, three openings 22b, 22c, and 22d are formed in the exterior protective layer 22, and the electrodes taken out from the outside of the exterior protective layer 22 are the respective layers of the vibration sensor main body 10 and the openings 22b. It is joined via 22c and 22d. The first take-out electrode 16 is the first electrode via the first opening 22b formed on the upper surface of the exterior protective layer 22, and further through the opening 15a of the shielding layer 15 and the opening 14a of the insulating layer 14. It is joined to the layer 12. The second take-out electrode 17 is joined to the second electrode layer 13 via the second opening 22c formed on the lower surface of the exterior protective layer 22. The third take-out electrode 18 is joined to the shielding layer 14 via the third opening 22d formed on the upper surface of the exterior protective layer 22. Further, in the connecting portion, the shielding member 19 covers the upper surface and the lower surface of the exterior protective layer 22.

図6は、本発明の生体振動信号検出手段2の他の実施形態である。図6(A)は、生体振動信号検出手段2の分解概略構成図であり、図6(B)は断面図である。図6に示すように、本実施形態の生体振動信号検出手段2は、保護カバー40内に、振動収集部材41、振動センサ本体50を内包した外装保護層42、保護部材43及び弾性部材44を備え、さらに、振動収集部材41から保護部材43までを包むように、遮蔽部材45を有し、その下面側にクッション材46が配置されている。また、外装保護層42内の振動センサ本体50に取出し電極を介して接続された配線3が伸びている。 FIG. 6 is another embodiment of the biological vibration signal detecting means 2 of the present invention. FIG. 6A is an exploded schematic configuration diagram of the biological vibration signal detecting means 2, and FIG. 6B is a cross-sectional view. As shown in FIG. 6, the biological vibration signal detecting means 2 of the present embodiment includes a vibration collecting member 41, an exterior protective layer 42 containing a vibration sensor main body 50, a protective member 43, and an elastic member 44 in the protective cover 40. Further, a shielding member 45 is provided so as to wrap the vibration collecting member 41 to the protective member 43, and a cushion material 46 is arranged on the lower surface side thereof. Further, the wiring 3 connected to the vibration sensor main body 50 in the exterior protective layer 42 via the take-out electrode extends.

本実施形態における振動センサ本体50は、図6(B)に示すように、フィルム状の振動センサ素材層51の上下にフィルム状の第1の電極層52及び第2の電極層53が形成されている。そして、振動センサ本体50を覆う外装保護層42には、第1の開口部42a及び第2の開口部42bが形成されており、第1の開口部42aを介して、第1の取出し電極54が第1の電極層52に接合され、第2の開口部42bを介して、第2の取出し電極55が第2の電極層53に接合されている。振動センサ本体50を内包した外装保護層42は、振動収集部材41の下面に接着されており、振動センサ本体50の少なくとも接続部を覆うように保護部材43が弾性部材44によって振動収集部材41の下面に固定されている。 In the vibration sensor main body 50 of the present embodiment, as shown in FIG. 6B, a film-shaped first electrode layer 52 and a second electrode layer 53 are formed above and below the film-shaped vibration sensor material layer 51. ing. A first opening 42a and a second opening 42b are formed in the exterior protective layer 42 covering the vibration sensor main body 50, and the first take-out electrode 54 is formed through the first opening 42a. Is bonded to the first electrode layer 52, and the second extraction electrode 55 is bonded to the second electrode layer 53 via the second opening 42b. The exterior protective layer 42 containing the vibration sensor main body 50 is adhered to the lower surface of the vibration collecting member 41, and the protective member 43 is formed by the elastic member 44 so as to cover at least the connection portion of the vibration sensor main body 50. It is fixed to the bottom surface.

遮蔽部材45は、導電性のフレキシブルなフィルム状の部材であり、定電位に保持され、外部からの電磁場などの影響を遮蔽することができる。本実施の形態では、振動センサ本体50には遮蔽層が形成されておらず、別途設けられた遮蔽部材45によって第1の電極層52及び第2の電極層53について外部からの電磁場の影響を遮蔽している。また、遮蔽部材45は、接続部についても覆っているため、第1の取出し電極54及び第2の取出し電極55についても外部からの電磁場の影響が遮蔽される。なお、図示していないが、遮蔽部材45は例えば、導電性のテープや導電性の接着剤などによって、配線3の定電位線(例えば、接地)と直接又は間接的に接続される。間接的に接続されるとは、配線3の定電位線に接続した他の導電部材(第2の電極層など)を介して接続される。 The shielding member 45 is a conductive and flexible film-like member, which is held at a constant potential and can shield the influence of an electromagnetic field or the like from the outside. In the present embodiment, the vibration sensor main body 50 is not formed with a shielding layer, and the first electrode layer 52 and the second electrode layer 53 are affected by an electromagnetic field from the outside by a separately provided shielding member 45. It is shielding. Further, since the shielding member 45 also covers the connecting portion, the influence of the electromagnetic field from the outside is shielded from the first extraction electrode 54 and the second extraction electrode 55 as well. Although not shown, the shielding member 45 is directly or indirectly connected to the constant potential line (for example, grounding) of the wiring 3 by, for example, a conductive tape or a conductive adhesive. Indirectly connected means that the wiring is connected via another conductive member (such as a second electrode layer) connected to the constant potential line of the wiring 3.

クッション部材46は、振動センサ本体50よりも下面側に配置される弾力性の高いスポンジ等であり、振動センサ本体50が検出する振動を振動収集部材41の配置されている上方からの振動を検知させるため、下方からの振動を吸収、除去するために設けることが好ましいが、必須のものではない。クッション部材46は、保護カバー40の外側に配置してもよい。 The cushion member 46 is a highly elastic sponge or the like arranged on the lower surface side of the vibration sensor main body 50, and detects the vibration detected by the vibration sensor main body 50 from above where the vibration collecting member 41 is arranged. It is preferable to provide it for absorbing and removing vibration from below, but it is not essential. The cushion member 46 may be arranged outside the protective cover 40.

図7は、図6の生体振動信号検出手段2の製造工程の途中の段階を説明するための下面図であり、図6と同じ構成には同じ符号を付した。図7(A)は、振動収集部材41の下面に振動センサ本体50を内包した外装保護層42が接着された状態である。外装保護層42の上面側に形成された第1の開口部42a(点線で示す)は、下面側に形成された開口部42bとは平面視で異なる位置に形成されている。このため、上面側の第1の取出し電極54と下面側の第2の取出し電極55を外装保護層42の外側まで同じ方向に延在させても短絡せずにそれぞれ取り出すことができる。第1の開口部42aにおいて振動センサ本体50の第1の電極層52が露出しており、第2の開口部42bにおいて振動センサ本体50の第2の電極層53が露出している。 FIG. 7 is a bottom view for explaining a step in the middle of the manufacturing process of the biological vibration signal detecting means 2 of FIG. 6, and the same configurations as those of FIG. 6 are designated by the same reference numerals. FIG. 7A shows a state in which the exterior protective layer 42 including the vibration sensor main body 50 is adhered to the lower surface of the vibration collecting member 41. The first opening 42a (indicated by the dotted line) formed on the upper surface side of the exterior protective layer 42 is formed at a position different from that of the opening 42b formed on the lower surface side in a plan view. Therefore, even if the first take-out electrode 54 on the upper surface side and the second take-out electrode 55 on the lower surface side extend in the same direction to the outside of the exterior protective layer 42, they can be taken out without short-circuiting. The first electrode layer 52 of the vibration sensor main body 50 is exposed in the first opening 42a, and the second electrode layer 53 of the vibration sensor main body 50 is exposed in the second opening 42b.

ここに、図7(B)で示すように、配線3が結線用基板33を介して信号用導線34が半田接続された導電性テープ54を第1の取出し電極として上面側に露出した第1の電極層52と導電性接着剤で接着した。また、配線3が結線用基板33を介して接地用導線35が半田接続された導電性テープ55を第2の取出し電極として下面側に露出した第2の電極層53と導電性接着剤で接着した。このように、予め半田接続されている導電性テープを使用して導電性接着剤で接着することにより取出し電極を接合させたので、振動センサ本体50、外装保護層42及び振動収集部材41への熱ダメージを防ぐことができた。さらに、結線用基板33からは、遮蔽部材用の接地用導線36が延びている。 Here, as shown in FIG. 7B, the first take-out electrode is exposed on the upper surface side of the conductive tape 54 in which the wiring 3 is solder-connected to the signal conducting wire 34 via the wiring substrate 33. Was adhered to the electrode layer 52 of the above with a conductive adhesive. Further, the wiring 3 is bonded to the second electrode layer 53 exposed on the lower surface side by using the conductive tape 55 to which the grounding conductor 35 is solder-connected via the wiring substrate 33 as the second extraction electrode with a conductive adhesive. did. In this way, since the take-out electrodes are joined by adhering with a conductive adhesive using a conductive tape that has been solder-connected in advance, the vibration sensor main body 50, the exterior protective layer 42, and the vibration collecting member 41 are bonded. I was able to prevent heat damage. Further, a grounding lead wire 36 for a shielding member extends from the wiring board 33.

次に、弾性部材44(図7では図示せず)を保護部材43の周縁に沿って配置し、振動収集部材41の下面に接着し、弾性部材44の下面に保護部材43を接着する。保護部材43の下面には、遮蔽部材用の接地用導線36が半田接続された導電性テープ37が接着され、導電性テープ37の中央付近に導電性両面テープ38が接着されている。導電性両面テープ38は、遮蔽部材45と保護部材43とを接着して固定し、さらに導電性テープ37及び接地用導線36を介して遮蔽部材45を確実に接地させる。 Next, the elastic member 44 (not shown in FIG. 7) is arranged along the peripheral edge of the protective member 43 and adhered to the lower surface of the vibration collecting member 41, and the protective member 43 is adhered to the lower surface of the elastic member 44. A conductive tape 37 to which a grounding conductor 36 for a shielding member is solder-connected is adhered to the lower surface of the protective member 43, and a conductive double-sided tape 38 is adhered to the vicinity of the center of the conductive tape 37. The conductive double-sided tape 38 adheres and fixes the shielding member 45 and the protective member 43, and further securely grounds the shielding member 45 via the conductive tape 37 and the grounding lead wire 36.

そして、導電性の遮蔽部材45を導電性両面テープ38に接着させつつ、振動収集部材41、振動センサ本体50を内包した外装保護層42、保護部材43及び弾性部材44の外側を遮蔽部材45によって覆った後、下面側にクッション部材を配置して全体を保護カバー40で包んで図6の生体振動信号検出手段2を完成させた。 Then, while adhering the conductive shielding member 45 to the conductive double-sided tape 38, the outside of the vibration collecting member 41, the exterior protective layer 42 containing the vibration sensor main body 50, the protective member 43, and the elastic member 44 is covered with the shielding member 45. After covering, a cushion member was arranged on the lower surface side and the whole was wrapped with a protective cover 40 to complete the biological vibration signal detecting means 2 of FIG.

本実施の形態においては、振動収集部材41の下面には、振動センサ本体50を内包した外装保護層42、保護部材43及び弾性部材44が取り付けられているが、保護部材43及び弾性部材44が配置された接続部と、保護部材43及び弾性部材44が配置されていないセンサ部との間に段差が生じている。この状態で遮蔽部材45によって覆われているので、段差に起因して遮蔽部材45に遊び(浮いた部分)が生じ、この遊びが外力によって微振動するためノイズを発生させる原因となる。よって、本実施の形態においても段差を小さくし、遊びを少なくし、微振動及びノイズを低減することが好ましく、保護部材43の下面から外装保護層42の下面までの高さ(すなわち、段差)を10mm以下とすることが好ましく、8mm以下とすることがさらに好ましく、5mm以下とすることがさらに好ましい。また、接続部を覆う保護部材43及び弾性部材44に代えて、接続部を覆って絶縁性テープを接着して接続部を物理的及び電気的に保護する構成を採用してもよい。この場合には接続部とセンサ部との間に段差はほとんど生じないため、遮蔽部材45の遊びもなく、ノイズを抑えることができた。さらに、図6のようにクッション部材46を設けることで、保護部材43及び弾性部材44ではなく絶縁性テープを覆っただけでも接続部を機械的な衝撃から保護することが期待される。 In the present embodiment, the outer protective layer 42, the protective member 43, and the elastic member 44 including the vibration sensor main body 50 are attached to the lower surface of the vibration collecting member 41, but the protective member 43 and the elastic member 44 are attached. There is a step between the arranged connecting portion and the sensor portion where the protective member 43 and the elastic member 44 are not arranged. Since it is covered by the shielding member 45 in this state, play (floating portion) is generated in the shielding member 45 due to the step, and this play causes slight vibration due to an external force, which causes noise. Therefore, also in the present embodiment, it is preferable to reduce the step, play less, and reduce micro-vibration and noise, and the height from the lower surface of the protective member 43 to the lower surface of the exterior protective layer 42 (that is, the step). Is preferably 10 mm or less, more preferably 8 mm or less, and even more preferably 5 mm or less. Further, instead of the protective member 43 and the elastic member 44 that cover the connecting portion, a configuration may be adopted in which the connecting portion is covered and an insulating tape is adhered to physically and electrically protect the connecting portion. In this case, since there is almost no step between the connection portion and the sensor portion, there is no play in the shielding member 45, and noise can be suppressed. Further, by providing the cushion member 46 as shown in FIG. 6, it is expected that the connecting portion is protected from mechanical impact even if the insulating tape is covered instead of the protective member 43 and the elastic member 44.

なお、本実施の形態において、振動収集部材41の下面において、弾性部材44と保護部材43とによって囲まれた空間内に情報処理装置4、電力供給手段5、記憶手段6、通信手段7、表示出力手段8、操作手段9、その他の電気回路部を含む半導体素子を実装した場合には、かかる半導体素子からの電磁場を遮蔽するため、弾性部材44と保護部材43とによって囲まれた空間内において、別の遮蔽部材(例えば、図4(C)の遮蔽部材19)によって接続部を覆って電磁シールドすることが好ましく、さらに周辺に実装した半導体素子も別の遮蔽部材で覆って電磁シールドすることが好ましい。 In the present embodiment, on the lower surface of the vibration collecting member 41, the information processing device 4, the power supply means 5, the storage means 6, the communication means 7, and the display are provided in the space surrounded by the elastic member 44 and the protective member 43. When a semiconductor element including an output means 8, an operating means 9, and other electric circuit parts is mounted, in a space surrounded by the elastic member 44 and the protective member 43 in order to shield the electromagnetic field from the semiconductor element. , It is preferable that the connection portion is covered with another shielding member (for example, the shielding member 19 in FIG. 4C) for electromagnetic shielding, and the semiconductor element mounted in the periphery is also covered with another shielding member for electromagnetic shielding. Is preferable.

1 生体振動信号検出装置
2 生体振動信号検出手段
3 配線
10 振動センサ本体
11 センサ素材層
12 第1の電極層
13 第2の電極層
14 絶縁層
15 遮蔽層
16 第1の取出し電極
17 第2の取出し電極
18 第3の取出し電極
19 遮蔽部材
21 振動収集部材
22 外装保護層
23 保護部材
24 弾性部材
1 Bio-vibration signal detection device 2 Bio-vibration signal detection means 3 Wiring 10 Vibration sensor body 11 Sensor material layer 12 First electrode layer 13 Second electrode layer 14 Insulation layer 15 Shielding layer 16 First extraction electrode 17 Second Extraction electrode 18 Third extraction electrode 19 Shielding member 21 Vibration collecting member 22 Exterior protective layer 23 Protective member 24 Elastic member

Claims (10)

圧電効果を有する材料を含むセンサ素材層と、前記センサ素材層の上面に形成された第1の電極層と、前記センサ素材層の下面に形成された第2の電極層と、を含むシート状の振動センサ本体と、
前記振動センサ本体を覆う外装保護層と、
前記振動センサ本体の接続部に配置され、前記第1の電極層に接続された第1の取出し電極と、
前記振動センサ本体の前記接続部に配置され、前記第2の電極層に接続された第2の取出し電極とを備え、
前記第1の取出し電極の一端は、前記第1の電極層を貫通することなく前記第1の電極層の表面に接続され、前記第1の取出し電極の他端は前記外装保護層の外側に配置され、
前記第2の取出し電極の一端は、前記第2の電極層を貫通することなく前記第2の電極層の表面に接続され、前記第1の取出し電極の他端は前記外装保護層の外側に配置されていることを特徴とする生体振動信号検出装置。
A sheet containing a sensor material layer containing a material having a piezoelectric effect, a first electrode layer formed on the upper surface of the sensor material layer, and a second electrode layer formed on the lower surface of the sensor material layer. Vibration sensor body and
The exterior protective layer that covers the vibration sensor body and
A first extraction electrode arranged at the connection portion of the vibration sensor main body and connected to the first electrode layer, and a first extraction electrode.
A second extraction electrode arranged at the connection portion of the vibration sensor main body and connected to the second electrode layer is provided.
One end of the first take-out electrode is connected to the surface of the first electrode layer without penetrating the first electrode layer, and the other end of the first take-out electrode is outside the exterior protective layer. Placed,
One end of the second take-out electrode is connected to the surface of the second electrode layer without penetrating the second electrode layer, and the other end of the first take-out electrode is outside the exterior protective layer. A biological vibration signal detection device characterized by being arranged.
前記振動センサ本体は、さらに、前記第1の電極層の上面に形成された絶縁層と、前記絶縁層の上面に形成された導電性の遮蔽層とを含み、
前記絶縁層及び前記遮蔽層は、前記接続部において、前記第1の電極層の表面を露出させる開口部を有することを特徴とする請求項1に記載の生体振動信号検出装置。
The vibration sensor main body further includes an insulating layer formed on the upper surface of the first electrode layer and a conductive shielding layer formed on the upper surface of the insulating layer.
The biological vibration signal detection device according to claim 1, wherein the insulating layer and the shielding layer have an opening in the connecting portion that exposes the surface of the first electrode layer.
前記接続部を覆って前記遮蔽層とは別の導電性の遮蔽部材を備えたことを特徴とする請求項2に記載の生体振動信号検出装置。 The biological vibration signal detection device according to claim 2, wherein a conductive shielding member different from the shielding layer is provided so as to cover the connecting portion. 前記外装保護層は、前記接続部において、前記第1の電極層又は前記第2の電極層の少なくとも一方の表面を露出させる開口部を有することを特徴とする請求項1乃至3の何れか1項に記載の生体振動信号検出装置。 Any one of claims 1 to 3, wherein the exterior protective layer has an opening in the connection portion that exposes at least one surface of the first electrode layer or the second electrode layer. The biological vibration signal detection device according to the section. 前記振動センサ本体を内包した前記外装保護層の一表面を下面に貼付した振動収集部材と、
前記振動収集部材の下面に、前記接続部を覆うように、前記振動センサ本体から離間して配置された保護部材とを備えたことを特徴とする請求項1乃至4の何れか1項に記載の生体振動信号検出装置。
A vibration collecting member having one surface of the exterior protective layer including the vibration sensor main body attached to the lower surface, and a vibration collecting member.
The invention according to any one of claims 1 to 4, wherein the lower surface of the vibration collecting member is provided with a protective member arranged apart from the vibration sensor main body so as to cover the connection portion. Bio-vibration signal detector.
前記保護部材は弾性部材を介して前記振動収集部材の下面に結合されており、
前記弾性部材の前記振動収集部材の下面から前記保護部材までの高さは、前記振動センサ本体の厚さよりも大きく、
前記弾性部材は、前記振動センサ本体を内包した前記外装保護層とは接触していないことを特徴とする請求項5に記載の生体振動信号検出装置。
The protective member is coupled to the lower surface of the vibration collecting member via an elastic member.
The height of the elastic member from the lower surface of the vibration collecting member to the protective member is larger than the thickness of the vibration sensor main body.
The biological vibration signal detection device according to claim 5, wherein the elastic member is not in contact with the exterior protective layer including the vibration sensor main body.
前記保護部材の下面から前記外装保護層の下面までの段差の高さが10mm以下であることを特徴とする請求項5又は6に記載の生体振動信号検出装置。 The biological vibration signal detection device according to claim 5 or 6, wherein the height of the step from the lower surface of the protective member to the lower surface of the exterior protective layer is 10 mm or less. 前記振動収集部材の下面、前記保護部材及び前記弾性部材で囲まれた空間内に前記振動センサ本体と電気的に接続された半導体素子が配置されていることを特徴とする請求項5乃至7の何れか1項に記載の生体振動信号検出装置。 A fifth to seventh aspect of the present invention, wherein the semiconductor element electrically connected to the vibration sensor main body is arranged in the space surrounded by the lower surface of the vibration collecting member, the protective member, and the elastic member. The biological vibration signal detection device according to any one item. 前記半導体素子の少なくとも一部を覆う導電性の遮蔽部材を備えたことを特徴とする請求項8に記載の生体振動信号検出装置。 The biological vibration signal detection device according to claim 8, further comprising a conductive shielding member that covers at least a part of the semiconductor element. 前記第1の取出し電極及び前記第2の取出し電極は、導電性のテープであり、それぞれ前記第1の電極層及び前記第2の電極層に導電性の接着剤で接着されていることを特徴とする請求項1乃至9の何れか1項に記載の生体振動信号検出装置。 The first take-out electrode and the second take-out electrode are conductive tapes, and are characterized in that they are adhered to the first electrode layer and the second electrode layer, respectively, with a conductive adhesive. The biological vibration signal detection device according to any one of claims 1 to 9.
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