JPH0559840U - Capillary holding structure for ultrasonic horn - Google Patents
Capillary holding structure for ultrasonic hornInfo
- Publication number
- JPH0559840U JPH0559840U JP005371U JP537192U JPH0559840U JP H0559840 U JPH0559840 U JP H0559840U JP 005371 U JP005371 U JP 005371U JP 537192 U JP537192 U JP 537192U JP H0559840 U JPH0559840 U JP H0559840U
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- ultrasonic horn
- mounting hole
- ultrasonic
- elastic force
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Abstract
(57)【要約】
【目的】超音波ホーンの振動効率の向上及び共振時の超
音波振動子のインピーダンス及び位相の安定化を図る。
【構成】超音波ホーン１０の一端にキヤピラリ２０を保
持するキヤピラリ取付け穴１１が形成され、超音波ホー
ン１０の先端面よりキヤピラリ取付け穴１１に直角にス
リット部１４を設け、かつキヤピラリ取付け穴１１の部
分に弾性力を持たせてなり、キヤピラリ２０を超音波ホ
ーン１０の弾性力のみで保持させてなる。
(57) [Abstract] [Purpose] To improve the vibration efficiency of the ultrasonic horn and to stabilize the impedance and phase of the ultrasonic vibrator during resonance. [Structure] A capillary mounting hole 11 for holding a capillary 20 is formed at one end of an ultrasonic horn 10, a slit portion 14 is provided at a right angle from the tip end surface of the ultrasonic horn 10 to the capillary mounting hole 11, and The portion is provided with an elastic force, and the capillary 20 is held only by the elastic force of the ultrasonic horn 10.
Description
【０００１】[0001]
本考案は超音波ホーンのキヤピラリ保持構造に関する。 The present invention relates to a capillary holding structure for an ultrasonic horn.
【０００２】[0002]
ワイヤボンデイング装置は、周知の如く、一端にキヤピラリを保持した超音波 ホーンを上下動及びＸＹ方向に移動させ、前記キヤピラリに挿通されたワイヤを 半導体ペレットの電極と外部リードのリードポストとの間に接続する。 As is well known, the wire bonding apparatus moves an ultrasonic horn holding a capillary at one end up and down and moves it in the XY directions so that the wire inserted through the capillary is between the electrode of the semiconductor pellet and the lead post of the external lead. Connecting.
【０００３】 従来の超音波ホーンのキヤピラリ保持構造は、図６及び図７に示すような構造 より成る。超音波ホーン１の一端には、キヤピラリ２を保持するキヤピラリ取付 け穴３が形成され、また超音波ホーン１の先端面よりキヤピラリ取付け穴３に直 角にスリット部４が設けられており、ボルト５でキヤピラリ２を超音波ホーン１ に保持させている。そこで、半導体ペレットの電極及び外部リードのリードポス トにキヤピラリ２に挿通されたワイヤ（図示せず）をボンデイングする時は、超 音波ホーン１に図示しない超音波振動子より超音波が伝えられてキヤピラリ２を 振動させる。A conventional capillary holding structure for an ultrasonic horn has a structure as shown in FIGS. 6 and 7. At one end of the ultrasonic horn 1, a capillary mounting hole 3 for holding the capillaries 2 is formed, and a slit portion 4 is formed at a right angle from the tip surface of the ultrasonic horn 1 to the capillary mounting hole 3 and the bolt is attached. In step 5, the capillary 2 is held by the ultrasonic horn 1. Therefore, when bonding the wire (not shown) inserted in the capillary 2 to the electrode of the semiconductor pellet and the lead post of the external lead, ultrasonic waves are transmitted from the ultrasonic transducer (not shown) to the ultrasonic horn 1 and the capillary is carried. Make 2 vibrate.
【０００４】[0004]
上記従来技術は、キヤピラリ２の近傍にボルト５があるため、超音波振動子か らの振動がボルト５によって抑えられて弱くなり、キヤピラリ２の先端に振動が 効率良く伝達されなく、また超音波振動子のインピーダンス及び位相が不安定で あった。またボルト５の締め付け力で共振時に、またボルト５の長さによっても 共振時に超音波振動子のインピーダンス及び位相が不安定であった。 In the above-mentioned conventional technique, since the bolt 5 is located near the capillary 2, the vibration from the ultrasonic transducer is suppressed by the bolt 5 and weakens, and the vibration is not efficiently transmitted to the tip of the capillary 2. The impedance and phase of the oscillator were unstable. Further, the impedance and phase of the ultrasonic transducer were unstable at the time of resonance due to the tightening force of the bolt 5 and also at the time of resonance due to the length of the bolt 5.
【０００５】 本考案の目的は、振動効率の向上及び共振時の超音波振動子のインピーダンス 及び位相の安定化が図れる超音波ホーンのキヤピラリ保持構造を提供することに ある。An object of the present invention is to provide a capillary holding structure for an ultrasonic horn capable of improving the vibration efficiency and stabilizing the impedance and phase of the ultrasonic vibrator at the time of resonance.
【０００６】[0006]
上記目的を達成するための本考案の構成は、超音波ホーンの一端にキヤピラリ を保持するキヤピラリ取付け穴が形成され、超音波ホーンの先端面より前記キヤ ピラリ取付け穴に直角にスリット部を設け、かつ前記キヤピラリ取付け穴の部分 に弾性力を持たせてなり、前記キヤピラリを超音波ホーンの弾性力で保持させて なることを特徴とする。 The configuration of the present invention for achieving the above object is such that a capillary mounting hole for holding a capillary is formed at one end of an ultrasonic horn, and a slit portion is provided at a right angle from the tip surface of the ultrasonic horn to the capillary mounting hole. Moreover, an elastic force is imparted to the portion for mounting the capillaries, and the capillaries are held by the elastic force of the ultrasonic horn.
【０００７】[0007]
キヤピラリは、超音波ホーンの弾性力のみで保持され、超音波振動子とキヤピ ラリ間には、ボルト等のような異物が存在しないため、超音波振動子の発振ロス が少なくなり、キヤピラリ先端の振動効率が向上する。また共振時の超音波振動 子のインピーダンス及び位相が安定化する。 The capillary is held only by the elastic force of the ultrasonic horn, and since there is no foreign matter such as bolts between the ultrasonic oscillator and the capillary, the oscillation loss of the ultrasonic oscillator is reduced and the tip of the capillary is reduced. Vibration efficiency is improved. Also, the impedance and phase of the ultrasonic oscillator at the time of resonance are stabilized.
【０００８】[0008]
以下、本考案の一実施例を図１及び図２により説明する。超音波ホーン１０の 一端には、キヤピラリ２０を保持させるためのキヤピラリ取付け穴１１が形成さ れている。キヤピラリ取付け穴１１は、キヤピラリ取付け穴部１２と該キヤピラ リ取付け穴部１２より小径のキヤピラリの高さ方向の位置決め穴部１３とよりな る段付き穴に形成されている。また超音波ホーン１０の先端面より前記キヤピラ リ取付け穴１１に直角にスリット部１４が設けられ、スリット部１４の一方側部 １５にはスリット部１４に対向してねじ部１６が形成されている。更に超音波ホ ーン１０のキヤピラリ取付け穴１１の部分は、弾性力を持たせてなり、キヤピラ リ２０は超音波ホーン１０の弾性力のみで保持されている。 An embodiment of the present invention will be described below with reference to FIGS. A capillary mounting hole 11 for holding the capillary 20 is formed at one end of the ultrasonic horn 10. The capillary mounting hole 11 is formed as a stepped hole composed of a capillary mounting hole 12 and a positioning hole 13 in the height direction of the capillary having a diameter smaller than that of the capillary mounting hole 12. Further, a slit portion 14 is provided at a right angle from the tip end surface of the ultrasonic horn 10 to the capillary mounting hole 11, and a screw portion 16 is formed on one side portion 15 of the slit portion 14 so as to face the slit portion 14. .. Further, the portion of the ultrasonic mounting hole 11 of the ultrasonic horn 10 has an elastic force, and the capillary 20 is held only by the elastic force of the ultrasonic horn 10.
【０００９】 次に超音波ホーン１０のキヤピラリ保持部分の製作方法及びキヤピラリ２０の 取付け方法を図３及び図４により説明する。図３に示すように、キヤピラリ取付 け穴部１２は、キヤピラリ２０の外径とほぼ同じ大きさに形成し、また前記した スリット部１４及びねじ部１６を形成する。次に超音波ホーン１０の一端をＡー Ａ方向より外力を加え、スリット部１４の先端の隙間Ｂが殆どない状態にして先 端部を塑性変形させる。これにより、キヤピラリ取付け穴１１は小さくなる。こ のように先端部を加工した超音波ホーン１０を製作する。Next, a method for manufacturing the capillary holding portion of the ultrasonic horn 10 and a method for mounting the capillary 20 will be described with reference to FIGS. 3 and 4. As shown in FIG. 3, the capillary mounting hole portion 12 is formed to have substantially the same size as the outer diameter of the capillary 20, and the slit portion 14 and the screw portion 16 are formed. Next, an external force is applied to one end of the ultrasonic horn 10 in the A--A direction so that there is almost no gap B at the tip of the slit portion 14 and the tip portion is plastically deformed. As a result, the capillary mounting hole 11 becomes smaller. The ultrasonic horn 10 whose tip is processed as described above is manufactured.
【００１０】 キヤピラリ２０を超音波ホーン１０に取り付ける時は、図４に示すように、ね じ部１６にボルト２１を螺合させ、ボルト２１を締めると他方側部１７がボルト ２１によって押されてキヤピラリ取付け穴１１が開く。そこで、キヤピラリ取付 け穴部１２をキヤピラリ２０より僅かに大きく開かせた後、キヤピラリ２０をキ ヤピラリ取付け穴部１２の段部１８に当接するまで挿入する。そして、ボルト２ １を緩めると、キヤピラリ取付け穴１１の部分は前記した塑性変形された状態に 復帰する弾性力が働き、キヤピラリ２０は超音波ホーン１０に該超音波ホーン１ ０の弾性力で保持される。その後、ボルト２１を取り外すと、図１及び図２のよ うにキヤピラリ２０は超音波ホーン１０に保持された状態となる。なお、前記し た塑性変形の大きさにより、キヤピラリ２０の保持力が変わるが、スリット部１ ４の幅寸法Ｂ及び長さ寸法Ｃを一定にすれば、同一の塑性変形が得られ、保持力 も一定となる。When the capillaries 20 are attached to the ultrasonic horn 10, as shown in FIG. 4, a bolt 21 is screwed into the screw portion 16, and when the bolt 21 is tightened, the other side portion 17 is pushed by the bolt 21. The capillaries mounting hole 11 opens. Therefore, after opening the capillarity mounting hole 12 slightly larger than the capillaries 20, the capillaries 20 are inserted until they come into contact with the stepped portions 18 of the capillary mounting holes 12. Then, when the bolt 21 is loosened, the elastic force of the capillary mounting hole 11 returns to the plastically deformed state, and the capillary 20 is held in the ultrasonic horn 10 by the elastic force of the ultrasonic horn 10. To be done. After that, when the bolt 21 is removed, the capillary 20 is held by the ultrasonic horn 10 as shown in FIGS. 1 and 2. The holding force of the capillary 20 changes depending on the magnitude of the plastic deformation described above. However, if the width dimension B and the length dimension C of the slit portion 14 are constant, the same plastic deformation can be obtained and the holding force Is also constant.
【００１１】 超音波ホーン１０よりキヤピラリ２０を取り外す時は、ボルト２１をねじ部１ ６に螺合させて締め付けると、キヤピラリ取付け穴１１が広がるので、キヤピラ リ２０を取り外すことができる。超音波ホーン１０の交換を繰り返して行うと、 超音波ホーン１０のボルト２１の当り面が変形するので、図５に示すようにスリ ット部１４に薄い当て板２２を挿入し、ボルト２１を締め付ければ、超音波ホー ン１０のボルト２１の当り面の変形は避けられる。When the capillaries 20 are removed from the ultrasonic horn 10, the bolts 21 are screwed into the threaded portions 16 and tightened so that the capillaries mounting holes 11 are widened, so that the capillaries 20 can be removed. When the ultrasonic horn 10 is repeatedly replaced, the contact surface of the bolt 21 of the ultrasonic horn 10 is deformed. Therefore, as shown in FIG. 5, insert a thin contact plate 22 into the slit portion 14 and attach the bolt 21. When tightened, the deformation of the contact surface of the bolt 21 of the ultrasonic horn 10 can be avoided.
【００１２】 なお、上記実施例においては、キヤピラリ取付け穴１１を段付き穴に形成した が、キヤピラリ取付け穴部１２が上端まで貫通したストレート状に形成してもよ い。しかし、本実施例に示すように、キヤピラリ取付け穴１１を段付き穴に形成 すると、キヤピラリ２０は段部１８（図２参照）で上端が位置決めされるので、 取付け位置が安定すると共に、ボンデイング中にキヤピラリ２０が上方に位置ず れ及び抜けることが防止される。Although the capillary mounting hole 11 is formed as a stepped hole in the above-described embodiment, the capillary mounting hole 12 may be formed in a straight shape that penetrates to the upper end. However, as shown in the present embodiment, when the capillary mounting hole 11 is formed as a stepped hole, the upper end of the capillary 20 is positioned by the stepped portion 18 (see FIG. 2), so that the mounting position is stable and during bonding. In addition, the capillaries 20 are prevented from being displaced upwards and coming off.
【００１３】 このように、キヤピラリ２０は、超音波ホーン１０の弾性力のみで保持され、 超音波振動子とキヤピラリ２０間には、ボルト等のような異物が存在しないため 、超音波振動子の発振ロスが少なくなり、キヤピラリ２０先端の振動効率が向上 する。また共振時の超音波振動子のインピーダンス及び位相が安定化する。また スリット部１４の一方側部１５にボルト２１を螺合させるねじ部１６を形成させ ておくと、キヤピラリ２０の取付け及び取外しを容易に行うことができる。As described above, the capillaries 20 are held only by the elastic force of the ultrasonic horn 10. Since foreign matter such as bolts does not exist between the ultrasonic vibrators and the capillaries 20, the ultrasonic vibrators 10 Oscillation loss is reduced, and the vibration efficiency at the tip of the capillary 20 is improved. Further, the impedance and phase of the ultrasonic transducer at the time of resonance are stabilized. Further, by forming the screw portion 16 into which the bolt 21 is screwed on the one side portion 15 of the slit portion 14, the capillaries 20 can be easily attached and detached.
【００１４】[0014]
本考案によれば、超音波ホーンの一端にキヤピラリを保持するキヤピラリ取付 け穴が形成され、超音波ホーンの先端面より前記キヤピラリ取付け穴に直角にス リット部を設け、かつ前記キヤピラリ取付け穴の部分に弾性力を持たせてなり、 前記キヤピラリを超音波ホーンの弾性力のみで保持させてなるので、振動効率の 向上及び共振時の超音波振動子のインピーダンス及び位相の安定化が図れる。 According to the present invention, a capillary mounting hole for holding the capillary is formed at one end of the ultrasonic horn, a slit portion is provided at a right angle from the tip surface of the ultrasonic horn to the capillary mounting hole, and the capillary mounting hole is formed. Since the portion has an elastic force and the capillaries are held only by the elastic force of the ultrasonic horn, it is possible to improve the vibration efficiency and stabilize the impedance and phase of the ultrasonic vibrator at the time of resonance.
【図面の簡単な説明】[Brief description of drawings]
【図１】本考案の一実施例を示す超音波ホーン先端部の
平面図である。FIG. 1 is a plan view of an ultrasonic horn tip according to an embodiment of the present invention.
【図２】図１の正面図である。FIG. 2 is a front view of FIG.
【図３】超音波ホーン先端部の塑性変形の平面である。FIG. 3 is a plane of plastic deformation of the tip of the ultrasonic horn.
【図４】キヤピラリの取付け方法を示す平面図である。FIG. 4 is a plan view showing a method of attaching the capillaries.
【図５】キヤピラリの取付け方法の他の例を示す平面図
である。FIG. 5 is a plan view showing another example of the method of attaching the capillaries.
【図６】従来の超音波ホーン先端部の平面図である。FIG. 6 is a plan view of a conventional ultrasonic horn tip portion.
【図７】図６の正面図である。FIG. 7 is a front view of FIG.
１０ 超音波ホーン １１ キヤピラリ取付け穴 １２ キヤピラリ取付け穴部 １３ キヤピラリ位置決め穴部 １４ スリット部 １６ ねじ部 ２０ キヤピラリ ２１ ボルト 10 Ultrasonic Horn 11 Capillary Mounting Hole 12 Capillary Mounting Hole 13 Capillary Positioning Hole 14 Slit 16 Threaded 20 Capillary 21 Bolt
Claims (3)
ードポストとの間をワイヤで接続するワイヤボンデイン
グ装置における超音波ホーンのキヤピラリ保持構造にお
いて、超音波ホーンの一端にキヤピラリを保持するキヤ
ピラリ取付け穴が形成され、超音波ホーンの先端面より
前記キヤピラリ取付け穴に直角にスリット部を設け、か
つ前記キヤピラリ取付け穴の部分に弾性力を持たせてな
り、前記キヤピラリを超音波ホーンの弾性力で保持させ
てなることを特徴とする超音波ホーンのキヤピラリ保持
構造。1. A capillary holding structure for an ultrasonic horn in a wire bonding apparatus for connecting an electrode of a semiconductor pellet and a lead post of an external lead with a wire, wherein a capillary mounting hole for holding the capillary is provided at one end of the ultrasonic horn. A slit portion is formed at a right angle to the capillary mounting hole from the tip surface of the ultrasonic horn, and elastic force is applied to the portion of the capillary mounting hole so that the capillary is held by the elastic force of the ultrasonic horn. Capable of holding a capillary of an ultrasonic horn.
ラリの上端を位置決めする段付き穴よりなることを特徴
とする請求項１記載の超音波ホーンのキヤピラリ保持構
造。2. The capillary holding structure for an ultrasonic horn according to claim 1, wherein the capillary mounting hole is a stepped hole for positioning an upper end of the capillary.
合させるねじ部が形成されていることを特徴とする請求
項１記載の超音波ホーンのキヤピラリ保持構造。3. The capillary holding structure for an ultrasonic horn according to claim 1, wherein a screw part for screwing a bolt is formed on one side of the slit part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1992005371U JP2552259Y2 (en) | 1992-01-17 | 1992-01-17 | Capillary holding structure of ultrasonic horn |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1992005371U JP2552259Y2 (en) | 1992-01-17 | 1992-01-17 | Capillary holding structure of ultrasonic horn |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0559840U true JPH0559840U (en) | 1993-08-06 |
| JP2552259Y2 JP2552259Y2 (en) | 1997-10-29 |
Family
ID=11609314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1992005371U Expired - Fee Related JP2552259Y2 (en) | 1992-01-17 | 1992-01-17 | Capillary holding structure of ultrasonic horn |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2552259Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6422448B2 (en) | 2000-04-06 | 2002-07-23 | Kabushiki Kaisha Shinkawa | Ultrasonic horn for a bonding apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61111944A (en) * | 1984-10-31 | 1986-05-30 | Nitto Electric Ind Co Ltd | Covering material for optical glass fiber |
| JPH02192139A (en) * | 1989-01-19 | 1990-07-27 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
-
1992
- 1992-01-17 JP JP1992005371U patent/JP2552259Y2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61111944A (en) * | 1984-10-31 | 1986-05-30 | Nitto Electric Ind Co Ltd | Covering material for optical glass fiber |
| JPH02192139A (en) * | 1989-01-19 | 1990-07-27 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6422448B2 (en) | 2000-04-06 | 2002-07-23 | Kabushiki Kaisha Shinkawa | Ultrasonic horn for a bonding apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2552259Y2 (en) | 1997-10-29 |
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