JPH0558831B2 - - Google Patents
Info
- Publication number
- JPH0558831B2 JPH0558831B2 JP60268905A JP26890585A JPH0558831B2 JP H0558831 B2 JPH0558831 B2 JP H0558831B2 JP 60268905 A JP60268905 A JP 60268905A JP 26890585 A JP26890585 A JP 26890585A JP H0558831 B2 JPH0558831 B2 JP H0558831B2
- Authority
- JP
- Japan
- Prior art keywords
- jet
- soldering
- soldered
- solder
- oxide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26890585A JPS62127167A (ja) | 1985-11-29 | 1985-11-29 | 半田付装置及びロ−タリ−式自動半田付装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26890585A JPS62127167A (ja) | 1985-11-29 | 1985-11-29 | 半田付装置及びロ−タリ−式自動半田付装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62127167A JPS62127167A (ja) | 1987-06-09 |
| JPH0558831B2 true JPH0558831B2 (enExample) | 1993-08-27 |
Family
ID=17464895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26890585A Granted JPS62127167A (ja) | 1985-11-29 | 1985-11-29 | 半田付装置及びロ−タリ−式自動半田付装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62127167A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4926258A (en) * | 1987-10-20 | 1990-05-15 | Olympus Optical Co., Ltd. | Electronic endoscope apparatus capable of driving solid state imaging devices having different characteristics |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS442677Y1 (enExample) * | 1967-01-13 | 1969-01-31 | ||
| JPS591462U (ja) * | 1982-06-28 | 1984-01-07 | 松下電器産業株式会社 | はんだ付装置 |
-
1985
- 1985-11-29 JP JP26890585A patent/JPS62127167A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62127167A (ja) | 1987-06-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3865298A (en) | Solder leveling | |
| US4315042A (en) | Solder removal technique | |
| US4869418A (en) | Solder leveling method and apparatus | |
| JP2002080950A (ja) | ドロスから酸化物を分離する方法および噴流はんだ槽 | |
| JPH0558831B2 (enExample) | ||
| US5372293A (en) | Apparatus for degolding or tinning conductive portions of a microelectronic device | |
| CN108260299B (zh) | 一种全自动浸焊机 | |
| CN109365382B (zh) | 一种服务器清洗设备及其清洗方法 | |
| US4799616A (en) | Solder leveling method and apparatus | |
| EP0249168B1 (en) | Solder leveling method and apparatus | |
| JPS571542A (en) | Method and device for casting large sized ingot | |
| CN212573140U (zh) | 一种多尺寸式pcb线路板生产用喷锡装置 | |
| CN208540269U (zh) | 一种全自动浸焊机 | |
| JP2002043732A (ja) | 噴流はんだ槽 | |
| JPH0129794Y2 (enExample) | ||
| JPS57178129A (en) | Metallic mold seizure testing method | |
| JPH08176885A (ja) | 錫電気めっきのクエンチステイン防止方法 | |
| SU1461594A1 (ru) | Способ лужени и пайки волной припо | |
| GB1030967A (en) | Improvements in or relating to methods of and apparatus for coating wires with metal | |
| RU1816587C (ru) | Устройство дл лужени печатных плат | |
| JPS5562154A (en) | Hot dipping unit | |
| JPS6245812Y2 (enExample) | ||
| SU1258640A1 (ru) | Устройство дл пайки волной расплавленного припо | |
| KR910003702B1 (ko) | 자동 납땜장치 및 방법 | |
| JPS6023099Y2 (ja) | 静止はんだ浴 |