JPH0558666B2 - - Google Patents
Info
- Publication number
- JPH0558666B2 JPH0558666B2 JP233287A JP233287A JPH0558666B2 JP H0558666 B2 JPH0558666 B2 JP H0558666B2 JP 233287 A JP233287 A JP 233287A JP 233287 A JP233287 A JP 233287A JP H0558666 B2 JPH0558666 B2 JP H0558666B2
- Authority
- JP
- Japan
- Prior art keywords
- container
- damper
- ceramic substrate
- ceramic
- flange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP233287A JPS63170946A (ja) | 1987-01-08 | 1987-01-08 | セラミツク基板の気密接合構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP233287A JPS63170946A (ja) | 1987-01-08 | 1987-01-08 | セラミツク基板の気密接合構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63170946A JPS63170946A (ja) | 1988-07-14 |
| JPH0558666B2 true JPH0558666B2 (cs) | 1993-08-27 |
Family
ID=11526353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP233287A Granted JPS63170946A (ja) | 1987-01-08 | 1987-01-08 | セラミツク基板の気密接合構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63170946A (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0332437U (cs) * | 1989-08-04 | 1991-03-29 |
-
1987
- 1987-01-08 JP JP233287A patent/JPS63170946A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63170946A (ja) | 1988-07-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |