JPH0439777B2 - - Google Patents
Info
- Publication number
- JPH0439777B2 JPH0439777B2 JP59117129A JP11712984A JPH0439777B2 JP H0439777 B2 JPH0439777 B2 JP H0439777B2 JP 59117129 A JP59117129 A JP 59117129A JP 11712984 A JP11712984 A JP 11712984A JP H0439777 B2 JPH0439777 B2 JP H0439777B2
- Authority
- JP
- Japan
- Prior art keywords
- thermal expansion
- container
- terminal plate
- ceramic terminal
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59117129A JPS60261158A (ja) | 1984-06-07 | 1984-06-07 | セラミック端子板の気密接合方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59117129A JPS60261158A (ja) | 1984-06-07 | 1984-06-07 | セラミック端子板の気密接合方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60261158A JPS60261158A (ja) | 1985-12-24 |
| JPH0439777B2 true JPH0439777B2 (cs) | 1992-06-30 |
Family
ID=14704155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59117129A Granted JPS60261158A (ja) | 1984-06-07 | 1984-06-07 | セラミック端子板の気密接合方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60261158A (cs) |
-
1984
- 1984-06-07 JP JP59117129A patent/JPS60261158A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60261158A (ja) | 1985-12-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |