JPH0557729A - Method for controlling temperature of mold - Google Patents
Method for controlling temperature of moldInfo
- Publication number
- JPH0557729A JPH0557729A JP21746891A JP21746891A JPH0557729A JP H0557729 A JPH0557729 A JP H0557729A JP 21746891 A JP21746891 A JP 21746891A JP 21746891 A JP21746891 A JP 21746891A JP H0557729 A JPH0557729 A JP H0557729A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- flow rate
- temperature
- temp
- cooling medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
- B29C33/04—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using liquids, gas or steam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/78—Measuring, controlling or regulating of temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/16—Cooling
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は金型を用いた樹脂成形加
工における金型温調法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold temperature control method in a resin molding process using a mold.
【０００２】[0002]
【従来の技術】成形工程中の金型温度の変化を少なくす
るために冷却機を使いかつ大量に冷却媒体を流す必要が
ある。あるいはヒーターを内蔵した温調機を使いヒータ
ーを入り切りする必要がある。2. Description of the Related Art It is necessary to use a cooling machine and flow a large amount of cooling medium in order to reduce the change in mold temperature during the molding process. Alternatively, it is necessary to turn on and off the heater using a temperature controller with a built-in heater.
【０００３】さらに２ヵ所以上の温度差を少なくするた
めに、各々の回路に絞り弁を用い開度に差をつけること
が必要である。Further, in order to reduce the temperature difference between two or more places, it is necessary to use throttle valves in the respective circuits to provide different opening degrees.
【０００４】図２に示す第１の従来例では、冷却機３か
ら金型１に冷却回路２を通じて冷却媒体４が金型温度の
変化の影響を少なくするように大量に流れている。In the first conventional example shown in FIG. 2, a large amount of cooling medium 4 flows from the cooler 3 to the mold 1 through the cooling circuit 2 so as to reduce the influence of changes in the mold temperature.
【０００５】図３に示す第２の従来例では、ヒーター１
２を内蔵した温調機５から金型１に冷却回路２を通じて
冷却媒体４がヒーターの入り切りに合わせ温度の変化を
つけて流れている。In the second conventional example shown in FIG. 3, the heater 1
A cooling medium 4 flows from a temperature controller 5 having a built-in 2 to a mold 1 through a cooling circuit 2 with a change in temperature depending on whether the heater is turned on or off.
【０００６】図４に示す第３の従来例では、絞り弁６の
開度に合わせ冷却媒体が流量差をつけて流れている。In the third conventional example shown in FIG. 4, the cooling medium flows with a flow rate difference according to the opening degree of the throttle valve 6.
【０００７】[0007]
【発明が解決しようとする課題】第１の従来例では樹脂
が金型内にある時とない時の金型熱量の差に対する影響
を少なくして金型温度を一定にする時には大量の冷却媒
体を必要とするが、樹脂が金型内にない時には、熱源が
なくなることから冷却だけが進み過冷却になる。また、
この過冷却を防止をしようとすると、冷却媒体の量を減
らさねばならず冷却時間が長くかかることになる。In the first conventional example, a large amount of cooling medium is used when the temperature of the mold is kept constant by reducing the influence on the difference in heat quantity of the mold when the resin is inside the mold and when it is not inside the mold. However, when the resin is not in the mold, there is no heat source, so only cooling proceeds and supercooling occurs. Also,
In order to prevent this supercooling, the amount of the cooling medium must be reduced and the cooling time will be long.
【０００８】第２の従来例では金型温度の変化に対応し
て細かくヒーターを入り切りする必要があるが、ヒータ
ーにより金型が加熱されることから冷却時間が延びる、
ヒーター電力が消費される、入り切りが頻繁になるとヒ
ーターの寿命を短くする。In the second conventional example, it is necessary to finely turn on and off the heater in response to changes in the die temperature, but since the die is heated by the heater, the cooling time is extended.
Heater power is consumed, and frequent switching shortens the life of the heater.
【０００９】第３の従来例では金型温度の変化への対応
ができない。などの問題点を有する。The third conventional example cannot cope with changes in mold temperature. There are problems such as.
【００１０】以上のことから、金型温度の変化に合わせ
て自動的に熱を奪う冷却方法が要求される。From the above, there is a demand for a cooling method that automatically removes heat in accordance with changes in mold temperature.
【００１１】[0011]
【課題を解決するための手段】この課題を解決するため
の本発明は、熱電対により読みとられた金型温度を変換
して流量調整弁を動作させ、設定温度幅内で金型温度差
の変化に合わせて冷却媒体の流量を調整して、冷却効率
を落とすこと無く過冷却を防止する金型温調法を生み出
すことである。According to the present invention for solving this problem, a mold temperature read by a thermocouple is converted to operate a flow rate adjusting valve, and a mold temperature difference is set within a set temperature range. Is to adjust the flow rate of the cooling medium in accordance with the change of, to create a mold temperature control method that prevents overcooling without lowering the cooling efficiency.
【００１２】[0012]
【作用】上記方法によれば、金型温度を制御範囲を設け
てあらかじめ設定しておき、樹脂材料が金型内に入って
きて設定制御温度以上になっている場合には流量調整弁
を開放し冷却媒体が多量に流れ、金型温度を下げる働き
をする。金型温度が制御範囲内にある場合には金型温度
の低下に合わせ流量調整弁の開度が減少して流量が減少
する。金型温度が設定温度以下になっている場合には、
流量調整弁が閉じ流量が０となり金型温度がさらに低下
することを防ぐ。According to the above method, the mold temperature is set in advance by setting the control range, and the flow rate adjusting valve is opened when the resin material enters the mold and is above the set control temperature. Then, a large amount of cooling medium flows, which serves to lower the mold temperature. When the mold temperature is within the control range, the opening of the flow rate adjusting valve is decreased and the flow rate is decreased according to the decrease of the mold temperature. If the mold temperature is below the set temperature,
The flow rate control valve is closed to prevent the flow rate from becoming 0 and further reducing the mold temperature.
【００１３】また、流路別に設定制御温度を決めること
により各々の流量を変化させることができる。Further, each flow rate can be changed by determining the set control temperature for each flow path.
【００１４】このようにして従来のような金型温度の変
化を少なくすることができ、金型の過冷却を防ぐことが
でき、金型内の場所に応じた冷却ができる。In this way, it is possible to reduce changes in mold temperature as in the conventional case, prevent overcooling of the mold, and perform cooling according to the location in the mold.
【００１５】[0015]
【実施例】図１は、本発明の一実施例の金型温調方法を
説明する図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a diagram for explaining a mold temperature control method according to an embodiment of the present invention.
【００１６】樹脂材料１０が金型キャビティー空間１１
に流れて来て金型温度を上昇させる。この上昇温度を金
型１に装着された熱電対７がひらい、その信号を金型温
度設定機能を有する金型温度−流量の変換器８により流
量調整弁９を動作させ冷却媒体４の流量をゼロから流量
調整弁９の許容流量までの間で増大させることができ
る。金型温度は冷却媒体４により低下していく。この低
下温度を金型１に装着された熱電対７がひらい、その信
号を金型温度−流量の変換器８により流量調整弁９を動
作させ冷却媒体４の流量を流量調整弁９の許容流量から
ゼロまでの間で減少させることができる。The resin material 10 is a mold cavity space 11
Flows into and raises the mold temperature. The thermocouple 7 attached to the mold 1 opens this rising temperature, and the signal thereof is operated by the mold temperature-flow rate converter 8 having a mold temperature setting function to operate the flow rate adjusting valve 9 to change the flow rate of the cooling medium 4. It can be increased from zero to the allowable flow rate of the flow rate adjusting valve 9. The mold temperature is lowered by the cooling medium 4. The thermocouple 7 attached to the mold 1 opens this lowering temperature, and the signal is used to operate the flow rate adjusting valve 9 by the mold temperature-flow rate converter 8 to change the flow rate of the cooling medium 4 to the allowable flow rate of the flow rate adjusting valve 9. It can be reduced from 0 to zero.
【００１７】[0017]
【発明の効果】冷却媒体の温度変化を少なくして、熱電
対と温度−流量変換器と流量調整弁を用いて金型温度の
変化に合わせて冷却媒体の流量を自動調整する方法のた
めに、冷却効率を落とすことがなく、消費電力が少な
く、また金型温度の変化が少なくかつ過冷却が防げる金
型の温調が可能となる。The present invention provides a method for automatically adjusting the flow rate of the cooling medium according to the change of the mold temperature by using the thermocouple, the temperature-flow rate converter and the flow rate adjusting valve by reducing the temperature change of the cooling medium. Therefore, it is possible to control the temperature of the mold without lowering the cooling efficiency, reducing the power consumption, changing the mold temperature little, and preventing overcooling.
【図１】本発明の一実施例の金型温調方法を説明する図FIG. 1 is a diagram illustrating a mold temperature control method according to an embodiment of the present invention.
【図２】第１の従来の温調方法を説明する図FIG. 2 is a diagram illustrating a first conventional temperature control method.
【図３】第２の従来の温調方法を説明する図FIG. 3 is a diagram illustrating a second conventional temperature control method.
【図４】第３の従来の温調方法を説明する図FIG. 4 is a diagram illustrating a third conventional temperature control method.
１ 金型 ２ 冷却回路 ３ 冷却機 ４ 冷却媒体 ５ ヒーター付き温調機 ６ 絞り弁 ７ 熱電対 ８ 金型温度設定機能付き金型温度−流量の変換器 ９ 流量調整弁 １０ 樹脂材料 １１ キャビティー空間 １２ ヒーター 1 Mold 2 Cooling Circuit 3 Cooling Machine 4 Cooling Medium 5 Temperature Controller with Heater 6 Throttle Valve 7 Thermocouple 8 Mold Temperature-Flow Rate Converter with Mold Temperature Setting Function 9 Flow Control Valve 10 Resin Material 11 Cavity Space 12 heater
Claims (1)
媒体の流れる流路の一部を自動的に、かつ連続的または
段階的に開放と閉鎖の間の状態を繰り返すことにより、
設定温度幅の中で、金型温度が低い場合には流量を少な
くし、金型温度が高い場合には流量を多くして、金型温
度の変化に対応して冷却媒体の流量を逐次変化するよう
にしたことを特徴とする金型温調法。1. A part of a flow path of a cooling medium, which communicates with a temperature control hole formed in a mold, is automatically and continuously or stepwise by repeating a state between opening and closing,
Within the set temperature range, the flow rate is decreased when the mold temperature is low and increased when the mold temperature is high, and the flow rate of the cooling medium is changed sequentially in response to changes in the mold temperature. A mold temperature control method characterized in that
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21746891A JPH0557729A (en) | 1991-08-28 | 1991-08-28 | Method for controlling temperature of mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21746891A JPH0557729A (en) | 1991-08-28 | 1991-08-28 | Method for controlling temperature of mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0557729A true JPH0557729A (en) | 1993-03-09 |
Family
ID=16704707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21746891A Pending JPH0557729A (en) | 1991-08-28 | 1991-08-28 | Method for controlling temperature of mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0557729A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003035362A1 (en) * | 2001-10-25 | 2003-05-01 | Efi Limited | Controlling injection moulding processes |
| EP1473135A2 (en) * | 2003-04-28 | 2004-11-03 | Technotrans AG | Device for the supply of temperature control media to channels of an injection mold |
-
1991
- 1991-08-28 JP JP21746891A patent/JPH0557729A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003035362A1 (en) * | 2001-10-25 | 2003-05-01 | Efi Limited | Controlling injection moulding processes |
| EP1473135A2 (en) * | 2003-04-28 | 2004-11-03 | Technotrans AG | Device for the supply of temperature control media to channels of an injection mold |
| EP1473135A3 (en) * | 2003-04-28 | 2005-02-09 | Technotrans AG | Device for the supply of temperature control media to channels of an injection mold |
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