JPH0936097A - Temperature adjustment device - Google Patents
Temperature adjustment deviceInfo
- Publication number
- JPH0936097A JPH0936097A JP20279695A JP20279695A JPH0936097A JP H0936097 A JPH0936097 A JP H0936097A JP 20279695 A JP20279695 A JP 20279695A JP 20279695 A JP20279695 A JP 20279695A JP H0936097 A JPH0936097 A JP H0936097A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- heat exchange
- exchange medium
- equipment
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Landscapes
- Drying Of Semiconductors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は各種設備の温度調整を行
うための温度調整装置に係り、例えば、半導体製造装置
等のチャンバ内の温度調整を行う温度調整装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature adjusting device for adjusting the temperature of various types of equipment, for example, a temperature adjusting device for adjusting the temperature in a chamber of a semiconductor manufacturing apparatus or the like.
【０００２】[0002]
【従来の技術】半導体製造装置をはじめとする各種の設
備においては、その一部を、プロセス上必要とされる温
度に保持することを要求されることが多い。例えば、半
導体製造装置であるドライエッチング装置やＣＶＤ装置
等では、チャンバ内、あるいは電極等を所定温度に保持
する必要がある。2. Description of the Related Art In various kinds of equipment such as a semiconductor manufacturing apparatus, it is often required to maintain a part of the equipment at a temperature required for the process. For example, in a semiconductor manufacturing apparatus such as a dry etching apparatus or a CVD apparatus, it is necessary to maintain the inside of the chamber or the electrodes at a predetermined temperature.
【０００３】このような要求に応えるべく、従来より、
温度調整の対象である設備本体の外部に専用の温度調整
器（チラー等）を設け、これによって冷却または加熱し
た温度調整媒体としての水を設備本体に循環させて温度
調整を行うようになっている。この場合、温度調整器は
１台の設備本体に対して１台設けられていた。In order to meet such demands, conventionally,
A dedicated temperature controller (chiller, etc.) is installed outside the equipment body that is the target of temperature adjustment, and by doing this, water as a temperature adjustment medium that has been cooled or heated is circulated through the equipment body to perform temperature adjustment. There is. In this case, one temperature controller was provided for each equipment body.
【０００４】[0004]
【発明が解決しようとする課題】このように、従来、温
度調整器は１台の設備本体に対して１台設けられていた
ので、プロセス対象物の変更に伴って設備本体の設定温
度（プロセス温度）を変更する必要がある場合、温度調
整器から流出する循環水の温度の変更には所定の時間を
要することから、設備本体の設定温度変更の完了までに
長時間を要するという問題点があった。As described above, since one temperature controller is conventionally provided for one equipment body, the set temperature of the equipment body (process When it is necessary to change the temperature), it takes a certain amount of time to change the temperature of the circulating water flowing out from the temperature controller, so there is a problem that it takes a long time to change the set temperature of the equipment body. there were.
【０００５】例えば、図４に示すように、プロセス温度
を２５°Ｃから５０°Ｃに変更すべく時刻ｔ1 において
温度調整器によって循環水の加熱を開始した場合、これ
が設備本体内を循環して設備温度を上昇させるまでには
タイムラグがあり、時刻ｔ2で設定温度５０°Ｃに達す
る。同様に、プロセス温度を５０°Ｃから２５°Ｃに変
更すべく時刻ｔ3 において温度調整器によって循環水の
冷却を開始した場合、これが設備内を循環して設備温度
を下降させるまでにはタイムラグがあり、時刻ｔ4 で設
定温度２５°Ｃに達する。この場合、温度の上昇または
下降に要する時間は、設備の熱容量や温度調整器の加熱
・冷却能力にもよるが、例えば数十分に達することもあ
った。For example, as shown in FIG. 4, when the temperature controller starts heating the circulating water at time t 1 to change the process temperature from 25 ° C. to 50 ° C., this circulates in the equipment body. There is a time lag until the equipment temperature is raised by the temperature, and the set temperature reaches 50 ° C. at time t 2 . Similarly, when cooling of circulating water is started by the temperature controller at time t 3 to change the process temperature from 50 ° C to 25 ° C, it takes time lag until the circulating water circulates in the facility to lower the facility temperature. And the set temperature reaches 25 ° C. at time t 4 . In this case, the time required for raising or lowering the temperature depends on the heat capacity of the equipment and the heating / cooling capacity of the temperature controller, but it may reach several tens of minutes, for example.
【０００６】このように、従来の温度調整装置では、設
備本体のプロセス温度変更に多大の時間を要していたた
め、同一の設備で多品種の製造等を行う場合に、工程条
件の切り替えを円滑・迅速に行うことができず、時間ロ
スが大きいという問題点があった。As described above, in the conventional temperature adjusting device, it takes a long time to change the process temperature of the equipment body. Therefore, when manufacturing various kinds of products with the same equipment, the process conditions can be smoothly switched.・ There was a problem that it could not be done quickly and the time loss was large.
【０００７】本発明はかかる問題点に鑑みてなされたも
ので、その課題は、設備本体の設定温度の変更に要する
時間を短縮することができる温度調整装置を提供するこ
とにある。The present invention has been made in view of the above problems, and an object thereof is to provide a temperature adjusting device capable of shortening the time required for changing the set temperature of the equipment body.
【０００８】[0008]
【課題を解決するための手段】請求項１記載の温度調整
装置は、温度調整の対象である設備本体に対して並列接
続可能に配置され、各々保有する熱交換媒体をそれぞれ
異なる温度に維持する複数の温度調整器と、前記設備本
体と各温度調整器との間にそれぞれ設けられ、その選択
的な開閉によっていずれかの温度調整器が保有する熱交
換媒体を前記設備本体に循環させるバルブとを備えてい
る。The temperature control device according to the first aspect is arranged so that it can be connected in parallel to the equipment main body to be temperature-controlled, and maintains the heat exchange mediums respectively held at different temperatures. A plurality of temperature regulators, a valve provided between the equipment body and each temperature regulator, and a valve for circulating a heat exchange medium held by any of the temperature regulators to the equipment body by selectively opening and closing the temperature regulator; Is equipped with.
【０００９】請求項２記載の温度調整装置は、請求項１
記載の温度調整装置において、さらに、前記設備本体内
に流入する熱交換媒体の温度を検出する温度検出センサ
と、この温度検出センサによる検出温度に応じて前記各
バルブを開閉させ、設備本体内に流入する熱交換媒体の
温度が所定温度になるように制御するバルブ制御手段と
を備えている。According to a second aspect of the present invention, there is provided the temperature control device according to the first aspect.
In the temperature adjusting device described, further, a temperature detection sensor for detecting the temperature of the heat exchange medium flowing into the equipment body, and opening and closing each valve according to the temperature detected by this temperature detection sensor, in the equipment body And a valve control means for controlling the temperature of the inflowing heat exchange medium to a predetermined temperature.
【００１０】[0010]
【作用】請求項１記載の温度調整装置では、各バルブの
選択的な開閉により、いずれかの温度調整器が保有する
熱交換媒体が設備本体に循環し、設備本体がこの熱交換
媒体の温度によって定まる所定の温度に保持される。In the temperature control device according to the first aspect, by selectively opening and closing each valve, the heat exchange medium held by one of the temperature regulators circulates through the equipment body, and the equipment body causes the temperature of the heat exchange medium to rise. Is maintained at a predetermined temperature determined by.
【００１１】請求項２記載の温度調整装置では、温度検
出センサの出力に応じて各バルブの開度制御が行われ、
各温度調整器からの熱交換媒体の流量が調節される。こ
れにより、設備本体内に流入する熱交換媒体の温度が所
定温度になるように制御され、設備本体は、熱交換媒体
の温度に対応した所定の温度に保持される。In the temperature adjusting device according to the second aspect, the opening degree of each valve is controlled according to the output of the temperature detecting sensor,
The flow rate of the heat exchange medium from each temperature controller is adjusted. As a result, the temperature of the heat exchange medium flowing into the equipment body is controlled to reach the predetermined temperature, and the equipment body is maintained at the predetermined temperature corresponding to the temperature of the heat exchange medium.
【００１２】[0012]
【実施例】以下、本発明の実施例について図面を参照し
て詳細に説明する。Embodiments of the present invention will now be described in detail with reference to the drawings.
【００１３】図１は本発明の一実施例に係る温度調整装
置の概略構成を表すものである。本装置は、ドライエッ
チング装置やＣＶＤ装置等の半導体製造装置としての設
備本体１１の所定部分（例えば、チャンバ内または電極
等）の温度を一定に調整するためのもので、設備本体１
１に対して並列接続された２台の温度調整器１２、１３
を備えている。温度調整器１２、１３は、それぞれ互い
に異なる温度に設定された熱交換媒体（例えば水）を保
有しており、この熱交換媒体が設備本体１１内を循環す
ることにより設備本体１１の所定部分の温度を一定に保
持できるようになっている。ここでは、温度調整器１２
が保有する熱交換媒体は設備本体１１の所定部分を２５
°Ｃに保持するのに必要な温度（２５°Ｃ＋α）に設定
され、温度調整器１３が保有する熱交換媒体は設備本体
１１の所定部分を５０°Ｃに保持するのに必要な温度
（５０°Ｃ＋β）に設定されているものとする。ここ
で、α、βは、周囲温度や設備本体１１の温度調整対象
部の熱容量等を考慮して適宜定められる。FIG. 1 shows a schematic structure of a temperature adjusting apparatus according to an embodiment of the present invention. This apparatus is for adjusting the temperature of a predetermined portion (for example, in a chamber or an electrode) of an equipment main body 11 as a semiconductor manufacturing apparatus such as a dry etching apparatus or a CVD apparatus to be constant.
Two temperature controllers 12 and 13 connected in parallel to one
It has. Each of the temperature controllers 12 and 13 has a heat exchange medium (for example, water) set to a temperature different from each other, and the heat exchange medium circulates in the equipment main body 11 to cause a predetermined portion of the equipment main body 11 to circulate. The temperature can be kept constant. Here, the temperature controller 12
The heat exchange medium possessed by the
The temperature is set to the temperature (25 ° C + α) required to hold at 50 ° C, and the heat exchange medium held by the temperature controller 13 has a temperature (50 ° C required to hold a predetermined portion of the equipment body 11 at 50 ° C). It shall be set to ° C + β). Here, α and β are appropriately determined in consideration of the ambient temperature and the heat capacity of the temperature adjustment target portion of the equipment body 11.
【００１４】温度調整器１２の出力口（ＯＵＴ）と温度
調整器１３の出力口（ＯＵＴ）は、それぞれバルブ１
４、１６を介して共に設備本体１１の入力口（ＩＮ）に
接続され、温度調整器１２の帰還口（ＩＮ）と温度調整
器１３の帰還口（ＩＮ）は、それぞれバルブ１５、１７
を介して共に設備本体１１の出力口（ＯＵＴ）に接続さ
れている。バルブ１４〜１７は、手動または自動によっ
て、全閉または全開状態にすることができるようになっ
ている。The output port (OUT) of the temperature controller 12 and the output port (OUT) of the temperature controller 13 are respectively connected to the valve 1.
4 and 16 are both connected to the input port (IN) of the equipment main body 11, and the return port (IN) of the temperature controller 12 and the return port (IN) of the temperature controller 13 are valves 15 and 17 respectively.
Are both connected to the output port (OUT) of the equipment main body 11 via. The valves 14 to 17 can be fully closed or fully opened manually or automatically.
【００１５】以上のような構成の温度調整装置の動作を
説明する。ここでは、設備本体１１の所定部分（以下、
単に設備本体１１という。）の温度を２５°Ｃと５０°
Ｃとの間で相互に変更する場合について説明する。The operation of the temperature adjusting device having the above configuration will be described. Here, a predetermined portion of the equipment body 11 (hereinafter,
It is simply called the equipment body 11. ) Temperature of 25 ° C and 50 °
A case of mutually changing with C will be described.
【００１６】まず、当初の設備本体１１の設定温度が２
５°Ｃである場合において、これを５０°Ｃに変更する
場合について説明する。時刻ｔ1 以前は、温度調整器１
２のバルブ１４、１５が共に全開状態、温度調整器１３
のバルブ１６、１７が共に全閉状態になっている。この
ため、設備本体１１には温度調整器１２からの熱交換媒
体のみが循環し、設備本体１１は２５°Ｃに保持されて
いる。First, the initial set temperature of the equipment main body 11 is 2
A case where the temperature is 5 ° C and is changed to 50 ° C will be described. Before time t 1 , temperature controller 1
The valves 14 and 15 of No. 2 are both fully opened, and the temperature controller 13
Both valves 16 and 17 are fully closed. Therefore, only the heat exchange medium from the temperature controller 12 circulates in the equipment body 11, and the equipment body 11 is held at 25 ° C.
【００１７】この状態で、時刻ｔ1 において、温度調整
器１２のバルブ１４、１５を共に全閉状態にすると共
に、温度調整器１３のバルブ１６、１７を共に全開状態
にすると、温度調整器１２からの熱交換媒体の循環が停
止し、設備本体１１には温度調整器１３からの熱交換媒
体のみが循環するようになる。この場合、設備本体１１
には必要な温度（５０°Ｃ＋β）の熱交換媒体が直ちに
流入して循環するため、設備本体１１の温度は図２に示
すように速やかに上昇し、時刻ｔ2 ′において目標温度
（５０°Ｃ）に達する。ここで設備本体１１の温度上昇
所要時間（ｔ2 ′−ｔ1 ）は、熱交換媒体の流速、配管
の長さ、あるいは設備本体１１の熱容量等に依存する
が、これらのパラメータを最適化することにより、温度
上昇所要時間を数分程度にすることが可能である。In this state, at time t 1 , the valves 14 and 15 of the temperature controller 12 are both fully closed and the valves 16 and 17 of the temperature controller 13 are both fully opened. The circulation of the heat exchange medium is stopped, and only the heat exchange medium from the temperature controller 13 is circulated in the equipment body 11. In this case, the equipment body 11
Since the heat exchange medium of the required temperature (50 ° C + β) immediately flows into the device and circulates, the temperature of the equipment main body 11 rapidly rises as shown in FIG. 2, and at the time t 2 ′, the target temperature (50 ° C. Reach C). Here, the time required for the temperature rise of the equipment body 11 (t 2 ′ −t 1 ) depends on the flow rate of the heat exchange medium, the length of the pipe, the heat capacity of the equipment body 11, etc., but these parameters are optimized. As a result, it is possible to reduce the temperature rise time to about several minutes.
【００１８】一方、設備本体１１の温度が５０°Ｃに保
持されている場合に、時刻ｔ3 において、温度調整器１
３のバルブ１６、１７を共に全閉状態にすると共に、温
度調整器１２のバルブ１４、１５を共に全開状態にする
と、温度調整器１３からの熱交換媒体の循環が停止し、
設備本体１１には温度調整器１２からの熱交換媒体のみ
が循環するようになる。この場合も、設備本体１１には
必要な温度（２５°Ｃ＋α）の熱交換媒体が直ちに流入
して循環するため、設備本体１１の温度は図２に示すよ
うに速やかに下降し、時刻ｔ4 ′において目標温度（２
５°Ｃ）に達する。ここでも、設備本体１１の温度下降
所要時間（ｔ3 ′−ｔ4 ）は、熱交換媒体の流速、配管
の長さ、あるいは設備本体１１の熱容量等のパラメータ
を最適化することにより、温度下降所要時間を数分程度
にすることが可能である。On the other hand, when the temperature of the equipment main body 11 is maintained at 50 ° C., at the time t 3 , the temperature regulator 1
When the valves 16 and 17 of 3 are both fully closed and the valves 14 and 15 of the temperature controller 12 are both fully opened, the circulation of the heat exchange medium from the temperature controller 13 is stopped,
Only the heat exchange medium from the temperature controller 12 circulates in the equipment body 11. In this case, since the heat exchanging medium required temperature for the equipment main body 11 (25 ° C + α) is circulated from flowing immediately, the temperature of the equipment body 11 is quickly lowered as shown in FIG. 2, the time t 4 'At the target temperature (2
5 ° C) is reached. Again, the time required for the temperature decrease of the equipment body 11 (t 3 ′ −t 4 ) is determined by optimizing parameters such as the flow rate of the heat exchange medium, the length of the pipe, or the heat capacity of the equipment body 11. The time required can be reduced to a few minutes.
【００１９】このように、本実施例では、従来と異なり
温度調整器による熱交換媒体の加熱時間および冷却時間
がゼロであって、バルブの切り替えのみによって設備本
体１１内部を循環する熱交換媒体の温度を速やかに変更
することができるため、設備本体１１の温度変更を極め
て迅速に行うことができる。なお、本実施例では、２台
の温度調整装置を設ける場合について説明したが、３台
以上の温度調整装置を用意してそれぞれ異なる温度の熱
交換媒体を選択的に循環させるようにしてもよく、これ
によってより多くの品種の製造を１台の設備で行う場合
にも迅速に対応することができる。As described above, in the present embodiment, unlike the conventional case, the heating time and the cooling time of the heat exchange medium by the temperature controller are zero, and the heat exchange medium circulating inside the equipment body 11 is changed only by switching the valve. Since the temperature can be changed quickly, the temperature of the equipment main body 11 can be changed extremely quickly. In addition, although the case where two temperature adjusting devices are provided has been described in the present embodiment, three or more temperature adjusting devices may be prepared to selectively circulate the heat exchange medium having different temperatures. As a result, it is possible to promptly deal with the case where more kinds of products are manufactured by one facility.
【００２０】図３は本発明の他の実施例に係る温度調整
装置の概略構成を表すものである。ここで、上記実施例
（図１）と同一の構成要素には同一の符号を付すものと
する。FIG. 3 shows a schematic structure of a temperature adjusting apparatus according to another embodiment of the present invention. Here, the same components as those in the above-described embodiment (FIG. 1) are designated by the same reference numerals.
【００２１】この温度調整装置は、図１の装置に加え
て、設備本体１１の入力口付近に温度センサ２１と、こ
の温度センサ２１から出力される検出信号２４に応じ、
開度制御信号２５によってバルブ１４〜１７の開度制御
を行うバルブ制御部２２とを備えている。バルブ制御部
２２には、外部から、２５°Ｃと５０°Ｃの間の任意の
温度設定が可能となっている。バルブ１４〜１７は、全
開状態と全閉状態のほか、任意の開度状態を維持できる
構造を有している。その他は図１と同一構成である。In addition to the device shown in FIG. 1, this temperature adjusting device is provided with a temperature sensor 21 near the input port of the equipment main body 11 and a detection signal 24 output from the temperature sensor 21.
The valve control unit 22 controls the opening of the valves 14 to 17 by the opening control signal 25. The valve controller 22 can be set to an arbitrary temperature between 25 ° C. and 50 ° C. from the outside. The valves 14 to 17 have a structure that can maintain an arbitrary opening state in addition to the fully open state and the fully closed state. Other configurations are the same as those in FIG.
【００２２】以上のような構成の温度調整装置の動作を
説明する。まず、バルブ制御部２２に対し、外部から温
度設定を行う。入力された温度は、バルブ制御部２２内
の図示しないメモリに記憶され、その後の処理において
適宜参照される。この場合に設定可能な温度は、温度調
整器１２が保有する熱交換媒体のみを設備本体１１に循
環させた場合に設定可能な温度（２５°Ｃ）と、温度調
整器１３が保有する熱交換媒体のみを設備本体１１に循
環させた場合に設定可能な温度（５０°Ｃ）との間の温
度である。The operation of the temperature adjusting device having the above configuration will be described. First, the temperature of the valve control unit 22 is set from the outside. The input temperature is stored in a memory (not shown) in the valve control unit 22 and appropriately referred to in the subsequent processing. In this case, the temperature that can be set is the temperature (25 ° C) that can be set when only the heat exchange medium held by the temperature controller 12 is circulated in the equipment body 11, and the heat exchange held by the temperature controller 13. It is a temperature between a temperature (50 ° C.) that can be set when only the medium is circulated in the equipment main body 11.
【００２３】温度設定が完了すると、バルブ制御部２２
は、温度センサ２１からの検出信号２４が示す温度とメ
モリに設定された設定温度とを比較し、両者が等しくな
るようにバルブ１４〜１７の開閉を制御する。具体的に
は、温度センサ２１から得られた温度が設定温度以上の
ときは、温度調整器１３のバルブ１６、１７の開度を小
さくして高温（５０°Ｃ＋β）の熱交換媒体の流量を絞
ると共に、温度調整器１２のバルブ１４、１５の開度を
大きくして低温（２５°Ｃ＋α）の熱交換媒体の流量を
増加させる。一方、温度センサ２１から得られた温度が
設定温度以下の１きは、温度調整器１２のバルブ１４、
１５の開度を小さくして低温（２５°Ｃ＋α）の熱交換
媒体の流量を絞ると共に、温度調整器１３のバルブ１
６、１７の開度を大きくして高温（５０°Ｃ＋β）の熱
交換媒体の流量を増加させる。このような制御を繰り返
し行うことにより、設備本体１１の入力口（ＩＮ）から
流入する熱交換媒体の温度が設定温度に保持され、設備
本体１１はこれに対応した温度に保持されることとな
る。この場合、バルブの開度制御を短い周期で行うこと
により、熱交換媒体の設備本体１１への流入温度が設定
温度に達するまでの時間を十分短くすることが可能であ
る。When the temperature setting is completed, the valve control unit 22
Compares the temperature indicated by the detection signal 24 from the temperature sensor 21 with the set temperature set in the memory, and controls the opening / closing of the valves 14 to 17 so that they are equal. Specifically, when the temperature obtained from the temperature sensor 21 is equal to or higher than the set temperature, the openings of the valves 16 and 17 of the temperature controller 13 are reduced to reduce the flow rate of the high temperature (50 ° C + β) heat exchange medium. Along with the throttling, the openings of the valves 14 and 15 of the temperature controller 12 are increased to increase the flow rate of the low temperature (25 ° C + α) heat exchange medium. On the other hand, when the temperature obtained from the temperature sensor 21 is equal to or lower than the set temperature, the valve 14 of the temperature controller 12
The flow rate of the heat exchange medium at low temperature (25 ° C + α) is reduced by decreasing the opening of 15 and the valve 1 of the temperature controller 13 is
The openings of 6 and 17 are increased to increase the flow rate of the high temperature (50 ° C + β) heat exchange medium. By repeating such control, the temperature of the heat exchange medium flowing in from the input port (IN) of the equipment body 11 is maintained at the set temperature, and the equipment body 11 is maintained at the temperature corresponding thereto. . In this case, by controlling the opening degree of the valve in a short cycle, it is possible to sufficiently shorten the time until the temperature at which the heat exchange medium flows into the equipment main body 11 reaches the set temperature.
【００２４】なお、温度センサ２１を配置した配管部分
の温度と設備本体１１の温度との間には、配管の長さや
設備本体１１の熱容量等に依存する温度差が生ずること
が考えられるので、この差分を予め実験等によって求め
ておき、この差分を考慮した温度設定を行うようにする
ことでより正確な温度管理が可能となる。また、温度セ
ンサ２１を設備本体１１内に配置するようにすれば、よ
り直接的かつ正確に温度管理を行うことができる。Since there may be a temperature difference between the temperature of the pipe portion where the temperature sensor 21 is arranged and the temperature of the equipment main body 11, a temperature difference depending on the length of the pipe, the heat capacity of the equipment main body 11, etc. may occur. By obtaining this difference in advance by experiments or the like and setting the temperature in consideration of this difference, more accurate temperature management becomes possible. Further, by disposing the temperature sensor 21 in the equipment main body 11, the temperature can be managed more directly and accurately.
【００２５】なお、本実施例では、２台の温度調整器に
よって２５°Ｃと５０°Ｃの間の温度を任意に設定でき
るようにしたが、これには限られず、それぞれ異なる温
度の熱交換媒体を保有する３台以上の温度調整器を用意
して、これらを適宜組合せて使用することにより、より
広い温度範囲での温度設定が可能となる。例えば、単独
で使用した場合に設備本体１１をそれぞれ２５°Ｃ、５
０°Ｃ、７５°Ｃに設定することができるような温度調
整器を３台（Ａ，Ｂ，Ｃとする）用意し、２５°Ｃ〜５
０°Ｃの範囲ではＡおよびＢを使用し、５０°Ｃ〜７５
°Ｃの場合ではＢおよびＣを使用するようにすれば、２
５°Ｃ〜７５°Ｃという広い範囲での任意の温度設定が
可能となる。In this embodiment, the temperature between 25 ° C. and 50 ° C. can be arbitrarily set by the two temperature controllers, but the present invention is not limited to this, and the heat exchange of different temperatures is possible. It is possible to set the temperature in a wider temperature range by preparing three or more temperature controllers that hold the medium and using them in appropriate combination. For example, when used alone, the equipment main body 11 is set at 25 ° C and 5 ° C, respectively.
Prepare three temperature controllers (A, B, and C) that can be set to 0 ° C and 75 ° C, and 25 ° C to 5 ° C.
A and B are used in the range of 0 ° C and 50 ° C to 75 ° C.
In case of ° C, if B and C are used, 2
Any temperature can be set in a wide range of 5 ° C to 75 ° C.
【００２６】[0026]
【発明の効果】以上説明したように、請求項１記載の温
度調整装置によれば、それぞれ異なる温度の熱交換媒体
を保有する複数の温度調整器を設備本体に並列接続可能
に配置すると共に、バルブの選択的な開閉により、いず
れかの温度調整器が保有する熱交換媒体を設備本体に循
環させるようにしたので、従来と異なり温度調整器によ
る熱交換媒体の加熱時間および冷却時間がゼロとなる。
したがって、バルブの切り替えのみによって設備本体内
部を循環する熱交換媒体の温度を速やかに変更すること
ができ、設備本体の温度変更を極めて迅速に行うことが
できる。特に、１台の設備で多品種の製品を製造する場
合のように、工程条件を頻繁に変更する必要がある場
合、変更に要するロスタイムを効果的に低減することが
できる。As described above, according to the temperature control device of the first aspect, a plurality of temperature control devices, each having a heat exchange medium of a different temperature, are arranged in parallel to the equipment main body, and By selectively opening and closing the valve, the heat exchange medium held by one of the temperature regulators is circulated in the main body of the equipment, so unlike the conventional method, the heating time and cooling time of the heat exchange medium by the temperature regulator is zero. Become.
Therefore, the temperature of the heat exchange medium circulating inside the equipment main body can be rapidly changed only by switching the valve, and the temperature of the equipment main body can be changed extremely quickly. In particular, when it is necessary to frequently change the process conditions, such as when manufacturing a wide variety of products with one equipment, the loss time required for the change can be effectively reduced.
【００２７】請求項２記載の温度調整装置によれば、そ
れぞれ異なる温度の熱交換媒体を保有する複数の温度調
整器を設備本体に並列接続可能に配置すると共に、温度
検出センサの出力に応じた各バルブの開度制御によって
各温度調整器からの熱交換媒体の流量を調節するように
したので、設備本体内に流入する熱交換媒体の温度を迅
速に任意の温度に設定できる。このため、設備本体の設
定温度を迅速かつ任意に変更することが可能となる。According to the temperature control device of the second aspect, a plurality of temperature control devices, each having a heat exchange medium of a different temperature, are arranged in parallel to the equipment main body, and the temperature control device responds to the output of the temperature detection sensor. Since the flow rate of the heat exchange medium from each temperature regulator is adjusted by controlling the opening degree of each valve, the temperature of the heat exchange medium flowing into the equipment main body can be quickly set to an arbitrary temperature. Therefore, the set temperature of the equipment body can be changed quickly and arbitrarily.
【図１】本発明の一実施例に係る温度調整装置の概略構
成を表すブロック図である。FIG. 1 is a block diagram showing a schematic configuration of a temperature adjusting device according to an embodiment of the present invention.
【図２】この温度調整装置により設備本体を温度調整す
る場合の様子を表す特性図である。FIG. 2 is a characteristic diagram showing how the temperature of the equipment body is adjusted by this temperature adjusting device.
【図３】本発明の他の実施例に係る温度調整装置の概略
構成を表すブロック図である。FIG. 3 is a block diagram showing a schematic configuration of a temperature adjusting device according to another embodiment of the present invention.
【図４】従来の温度調整装置により設備本体を温度調整
する場合の様子を表す特性図である。FIG. 4 is a characteristic diagram showing a state in which the temperature of the equipment main body is adjusted by a conventional temperature adjusting device.
１１ 設備本体 １２ 温度調整器（低温側） １３ 温度調整器（高温側） １４，１５ バルブ（低温側） １６，１７ バルブ（高温側） ２１ 温度センサ ２２ バルブ制御部 ２５ 開度制御信号 11 Equipment Main Body 12 Temperature Controller (Low Temperature Side) 13 Temperature Controller (High Temperature Side) 14,15 Valve (Low Temperature Side) 16,17 Valve (High Temperature Side) 21 Temperature Sensor 22 Valve Control Section 25 Opening Control Signal
Claims (2)
並列接続可能に配置され、各々保有する熱交換媒体をそ
れぞれ異なる温度に維持する複数の温度調整器と、 前記設備本体と各温度調整器との間にそれぞれ設けら
れ、その選択的な開閉によっていずれかの温度調整器が
保有する熱交換媒体を前記設備本体に循環させるバルブ
とを備えたことを特徴とする温度調整装置。1. A plurality of temperature regulators, which are arranged so as to be able to be connected in parallel to the equipment body to be temperature-controlled, and maintain the respective heat exchange media at different temperatures, respectively, and the equipment body and the respective temperature adjustments. And a valve which is respectively provided between the temperature control device and the device to circulate the heat exchange medium held by any one of the temperature control devices to the equipment main body.
換媒体の温度を検出する温度検出センサと、 この温度検出センサによる検出温度に応じて前記各バル
ブを開閉させ、設備本体内に流入する熱交換媒体の温度
が所定温度になるように制御するバルブ制御手段とを備
えたことを特徴とする請求項１記載の温度調整装置。2. A temperature detection sensor for detecting the temperature of a heat exchange medium flowing into the equipment main body, and the valves are opened and closed according to the temperature detected by the temperature detection sensor to flow into the equipment main body. The temperature control device according to claim 1, further comprising valve control means for controlling the temperature of the heat exchange medium to a predetermined temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20279695A JPH0936097A (en) | 1995-07-18 | 1995-07-18 | Temperature adjustment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20279695A JPH0936097A (en) | 1995-07-18 | 1995-07-18 | Temperature adjustment device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0936097A true JPH0936097A (en) | 1997-02-07 |
Family
ID=16463340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20279695A Pending JPH0936097A (en) | 1995-07-18 | 1995-07-18 | Temperature adjustment device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0936097A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002059953A1 (en) * | 2001-01-23 | 2002-08-01 | Tokyo Electron Limited | Conductor treating single-wafer type treating device and method for semi-conductor treating |
| JP2002246359A (en) * | 2001-02-20 | 2002-08-30 | Tokyo Electron Ltd | Waste heat recovery system of semiconductor manufacturing equipment, waste heat recovery method and heat exchanger used for waste heat recovery of the semiconductor manufacturing equipment |
| WO2004093167A3 (en) * | 2003-03-31 | 2005-06-09 | Lam Res Corp | Substrate support having temperature controlled surface |
| US7810506B2 (en) | 2001-05-04 | 2010-10-12 | Philip Morris Usa Inc. | Apparatus and method for delaminating parcels of tobacco |
| JP2011522438A (en) * | 2008-06-03 | 2011-07-28 | アプライド マテリアルズ インコーポレイテッド | High-speed substrate support temperature control |
-
1995
- 1995-07-18 JP JP20279695A patent/JPH0936097A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002059953A1 (en) * | 2001-01-23 | 2002-08-01 | Tokyo Electron Limited | Conductor treating single-wafer type treating device and method for semi-conductor treating |
| JP2002217178A (en) * | 2001-01-23 | 2002-08-02 | Tokyo Electron Ltd | Equipment and method of processing |
| US7235137B2 (en) | 2001-01-23 | 2007-06-26 | Tokyo Electron Limited | Conductor treating single-wafer type treating device and method for semi-conductor treating |
| KR100842948B1 (en) * | 2001-01-23 | 2008-07-01 | 도쿄엘렉트론가부시키가이샤 | Conductor treating single-wafer type treating device and method for semi-conductor treating |
| JP2002246359A (en) * | 2001-02-20 | 2002-08-30 | Tokyo Electron Ltd | Waste heat recovery system of semiconductor manufacturing equipment, waste heat recovery method and heat exchanger used for waste heat recovery of the semiconductor manufacturing equipment |
| JP4601029B2 (en) * | 2001-02-20 | 2010-12-22 | 東京エレクトロン株式会社 | Semiconductor processing equipment |
| US7810506B2 (en) | 2001-05-04 | 2010-10-12 | Philip Morris Usa Inc. | Apparatus and method for delaminating parcels of tobacco |
| WO2004093167A3 (en) * | 2003-03-31 | 2005-06-09 | Lam Res Corp | Substrate support having temperature controlled surface |
| JP2006522452A (en) * | 2003-03-31 | 2006-09-28 | ラム リサーチ コーポレーション | Substrate support having temperature controlled substrate support surface |
| JP2011522438A (en) * | 2008-06-03 | 2011-07-28 | アプライド マテリアルズ インコーポレイテッド | High-speed substrate support temperature control |
| US8596336B2 (en) | 2008-06-03 | 2013-12-03 | Applied Materials, Inc. | Substrate support temperature control |
| KR101492414B1 (en) * | 2008-06-03 | 2015-02-12 | 어플라이드 머티어리얼스, 인코포레이티드 | Fast substrate support temperature control |
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