JPH055678Y2 - - Google Patents
Info
- Publication number
- JPH055678Y2 JPH055678Y2 JP1985059034U JP5903485U JPH055678Y2 JP H055678 Y2 JPH055678 Y2 JP H055678Y2 JP 1985059034 U JP1985059034 U JP 1985059034U JP 5903485 U JP5903485 U JP 5903485U JP H055678 Y2 JPH055678 Y2 JP H055678Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal film
- metal
- decorative board
- hot
- grounding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 57
- 239000002184 metal Substances 0.000 claims description 57
- 239000011888 foil Substances 0.000 claims description 15
- 230000006378 damage Effects 0.000 claims description 6
- 230000003068 static effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000005611 electricity Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Description
【考案の詳細な説明】
(イ) 産業上の利用分野
本考案は、ホツトスタンプ金属膜の静電破壊防
止構造に関する。[Detailed description of the invention] (a) Industrial application field The present invention relates to a structure for preventing electrostatic damage of hot-stamped metal films.
(ロ) 従来の技術
人体は、高電位の静電気を帯びることが知られ
ている。この場合に、使用者が電子機器の操作ス
イツチに触ると、人体に帯電した静電電荷が放電
により電子機器の内部に流れ込み内部回路に対し
て破壊・劣化などの悪影響を及ぼす。(b) Prior Art It is known that the human body is charged with high potential static electricity. In this case, when the user touches the operating switch of the electronic device, the electrostatic charges on the human body are discharged and flow into the electronic device, causing adverse effects such as destruction and deterioration of the internal circuitry.
そこで、実開昭59−88837号及び実開昭57−
146379号に示される様に、従来はアース用金属体
を操作スイツチ近傍に配置し、このアース用金属
体を接地している。このため、静電気は、アース
用金属体を介してアースレベルに流される。 Therefore, Utility Model Application No. 59-88837 and Utility Model Application No. 57-
As shown in No. 146379, conventionally, a grounding metal body is placed near an operating switch, and this grounding metal body is grounded. Therefore, static electricity is conducted to the ground level via the grounding metal body.
しかし、このような構成では、アース用金属体
が操作スイツチの近くに必要となり、部品点数及
び組立作業性が悪かつた。 However, in such a configuration, a grounding metal body is required near the operating switch, resulting in a poor number of parts and poor assembly workability.
(ハ) 考案が解決しようとする問題点
ところで、電子機器の表側に使われる化粧板で
は、所望の色・模様を形成するために、ホツトス
タンプを用いることがある。（尚、このホツトス
タンプについては特公昭56−9708号等に示され周
知である。）又、このホツトスタンプにより化粧
板の裏面に圧着されるホツトスタンプ箔を金属に
より形成することもある。(c) Problems to be solved by the invention By the way, hot stamps are sometimes used in decorative boards used on the front side of electronic devices to form desired colors and patterns. (This hot stamp is well-known as disclosed in Japanese Patent Publication No. 56-9708, etc.) Also, a hot stamp foil which is pressed onto the back surface of the decorative board using this hot stamp may be formed of metal.
そこで、本件考案者はこのホツトスタンプによ
り化粧板の裏面に形成された金属膜（金属製のホ
ツトスタンプ箔）をアース用金属体として使用し
て静電破壊を防止することを考えついた。 Therefore, the present inventor came up with the idea of using the metal film (metallic hot stamp foil) formed on the back side of the decorative board by hot stamping as a grounding metal body to prevent electrostatic damage.
この様にホツトスタンプによる金属膜を接地す
れば、従来の様に操作スイツチの近傍にアース用
金属体を必要とせず組立作業性が向上する。 By grounding the metal film by hot stamping in this manner, there is no need for a grounding metal body near the operating switch as in the conventional case, and the assembly work efficiency is improved.
この様な例を第３図乃至第５図を参照しつつ説
明する。第３図はVTRの前面外装板の裏面図、
第４図はこの前面外装板の表面図、第５図は側断
面図である。 Such an example will be explained with reference to FIGS. 3 to 5. Figure 3 is a back view of the front exterior plate of the VTR.
FIG. 4 is a surface view of this front exterior plate, and FIG. 5 is a side sectional view.
主に第５図を参照しつつ各部を説明する。図に
於いて、１０は前面外装板、１２は化粧板であ
る。この化粧板１２は次のものを備えている。つ
まり透明樹脂板１４、操作スイツチ（図示せず）
挿入用の操作用孔１６、ホツトスタンプにより裏
面に設けられた例えば厚さ0.5μm又は0.7μmの金
属膜１８、前記金属膜１８が形成されないため透
明のままの透明窓部分２０である。この化粧板１
２は前面外装板１０に接着されている。２２はア
ースされた金属片であり金属膜１８の近傍に配置
されている。 Each part will be explained mainly with reference to FIG. In the figure, 10 is a front exterior panel, and 12 is a decorative panel. This decorative board 12 includes the following: In other words, a transparent resin plate 14, an operation switch (not shown)
These include an operation hole 16 for insertion, a metal film 18 with a thickness of, for example, 0.5 μm or 0.7 μm provided on the back surface by hot stamping, and a transparent window portion 20 that remains transparent because the metal film 18 is not formed. This decorative board 1
2 is bonded to the front exterior plate 10. A grounded metal piece 22 is placed near the metal film 18 .
このようにすれば、使用者が操作スイツチ（図
示せず）に触れた時、人体に帯電した高電位の静
電気は、操作スイツチ→金属膜１８→金属片２２
を介してアースレベルへ流れる。このため、内部
回路（図示せず）が悪影響を受けることがない。 In this way, when the user touches the operating switch (not shown), the high potential static electricity charged on the human body will be transferred from the operating switch to the metal film 18 to the metal piece 22.
flows to earth level through the Therefore, the internal circuit (not shown) is not adversely affected.
ところで、前述した様にこのホツトスタンプに
よる金属膜１８は極めて薄い。このため人体の帯
電電圧が極めて高い場合（例えば25KV）、操作
スイツチから金属膜１８に静電電荷が流れて大き
いスパークが発生し、このスパークにより金属膜
１８にクラツク〔又はスパークによる金属膜１８
の蒸発〕が生ずることがある。 By the way, as mentioned above, the metal film 18 formed by this hot stamping is extremely thin. Therefore, when the charged voltage of the human body is extremely high (for example, 25 KV), electrostatic charge flows from the operation switch to the metal film 18 and a large spark is generated.
evaporation] may occur.
これを第６図を参照しつつ説明する。第６図は
化粧板１２を表面側から見た図であり、２４は操
作スイツチ、１８は透明樹脂板１４を通して見え
る裏面の銀色の金属膜、２６は金属膜１８に生じ
たクラツクである。 This will be explained with reference to FIG. FIG. 6 is a view of the decorative board 12 viewed from the front side, where 24 is an operating switch, 18 is a silver metal film on the back side visible through the transparent resin plate 14, and 26 is a crack that has occurred in the metal film 18.
このクラツク２６はさらにスパークが発生する
と拡がり、外観上好ましくない。 This crack 26 will spread if further sparks occur, which is undesirable in terms of appearance.
(ニ) 問題点を解決するための手段
本考案は、ホツトスタンプにより裏面に金属膜
を形成する化粧板と、前記金属膜の近傍に設けら
れたアース用金属片と、前記化粧板の操作用孔近
傍に前記裏面側より貼付された金属箔とを、備え
るホツトスタンプ金属膜の静電破壊防止構造であ
る。(d) Means for solving the problems The present invention provides a decorative board on which a metal film is formed on the back surface by hot stamping, a grounding metal piece provided near the metal film, and a device for operating the decorative board. This is a structure for preventing electrostatic damage of a hot-stamped metal film, which includes a metal foil pasted from the back surface side near the hole.
(ホ) 作用
本考案は上記の様な構成なので、静電気は金属
箔によつても、アースレベルに流れる。(E) Effect Since the present invention has the above-mentioned configuration, static electricity flows to the ground level even through the metal foil.
(ヘ) 実施例
第１図及び第２図を参照しつつ本考案の一実施
例を説明する。第１図は化粧板の側断面図であ
り、第２図は化粧板の裏側からの図である。尚、
第３図乃至第６図と同一部分には同一符号を付し
て説明を省略する。第１図及び第２図に於いて２
８は厚さ15μmのアルミ製の銀色の金属箔であり、
この金属箔２８は操作用孔１６の周辺に絶縁接着
層（図示せず）を介して接着されている。尚、こ
の金属箔２８も金属膜１８と同様に第５図の金属
片２２により静電気をアースレベルに流す働きを
する。尚、この金属箔２８はクラツク等が問題と
なる操作用孔１６の近傍に貼付されればよい。
尚、この金属箔２８の形状は作成能率及び貼付作
業能率が良好になるような形状とすればよいの
で、例えばクラツク等が問題とならない操作用孔
の近傍に設けられることもある。(f) Embodiment An embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a side sectional view of the decorative board, and FIG. 2 is a view from the back side of the decorative board. still,
Components that are the same as those in FIGS. 3 to 6 are designated by the same reference numerals, and their explanation will be omitted. In Figures 1 and 2, 2
8 is a silver metal foil made of aluminum with a thickness of 15 μm,
This metal foil 28 is adhered to the periphery of the operation hole 16 via an insulating adhesive layer (not shown). Incidentally, like the metal film 18, this metal foil 28 also functions to cause static electricity to flow to the ground level by the metal piece 22 in FIG. 5. Note that this metal foil 28 may be attached near the operating hole 16 where cracks and the like are a problem.
Note that the shape of the metal foil 28 may be such that it improves production efficiency and pasting work efficiency, so it may be provided near the operation hole where cracks and the like will not be a problem, for example.
この実施例の効果を述べる。つまり静電破壊防
止用として化粧板１２の裏面のホツトスタンプの
金属膜１８を使用する場合、この金属膜１８が例
えば0.7μmと極めて薄いために、静電気がこの金
属膜１８に飛び移る時のスパークでクラツクが生
じてしまう。そして、このクラツクは化粧板１２
の正面より見えるため、外観上好ましくない。そ
こで本願では、金属膜１８に金属箔２８を貼付し
て、この金属箔２８によつて静電破壊防止構造を
形成する。この様にすることにより、静電電荷は
主として金属膜１８の20〜30倍の厚さの金属箔２
８の方へ流れるようになり、金属膜１８のクラツ
ク等の拡がりが防止され、金属膜１８が保護され
て、外観上の劣化が防止されることを本考案者は
確認した。 The effects of this embodiment will be described. In other words, when using the hot-stamped metal film 18 on the back side of the decorative board 12 to prevent electrostatic damage, this metal film 18 is extremely thin, for example, 0.7 μm, so sparks occur when static electricity jumps to the metal film 18. This will cause a crack. And this crack is decorative board 12
It is unfavorable in terms of appearance because it is visible from the front. Therefore, in the present application, a metal foil 28 is attached to the metal film 18, and the electrostatic breakdown prevention structure is formed by this metal foil 28. By doing this, the electrostatic charge is mainly absorbed by the metal foil 2, which is 20 to 30 times thicker than the metal film 18.
The present inventor has confirmed that the metal film 18 is prevented from spreading, and the metal film 18 is protected and deterioration in appearance is prevented.
尚、この金属膜１８の色と、金属箔２８の色
が、略同じ色であれば、前記クラツクが発生して
も目立つことはない。 Note that if the color of the metal film 18 and the color of the metal foil 28 are substantially the same, even if the cracks occur, they will not be noticeable.
(ト) 考案の効果
上記の如く、本考案によれば、ホツトスタンプ
の裏面の金属膜を静破壊防止に用いるものに於い
て、この金属膜にクラツク等が発生すること又は
拡がることを防止して、この金属膜を保護出来
る。(g) Effects of the invention As described above, according to the invention, when the metal film on the back side of a hot stamp is used to prevent static breakdown, cracks, etc. can be prevented from occurring or spreading in the metal film. This can protect this metal film.
第１図及び第２図は本考案の一実施例に係り、
第１図は化粧板の側断面図、第２図は化粧板の裏
側からの図である。第３図乃至第６図は本考案の
効果を説明するための図であり、第３図はVTR
の前面外装板の裏面図、第４図はこの前面外装板
の表面図、第５図はこの前面外装板の側断面図、
第６図はクラツクを説明するための図である。
１２……化粧板、１６……操作用孔、１８……
金属膜、２２……金属片（アース用金属片）、２
８……金属箔。
FIG. 1 and FIG. 2 relate to an embodiment of the present invention,
FIG. 1 is a side sectional view of the decorative board, and FIG. 2 is a view from the back side of the decorative board. Figures 3 to 6 are diagrams for explaining the effects of the present invention, and Figure 3 is a diagram for explaining the effects of the present invention.
4 is a surface view of this front exterior plate, and Figure 5 is a side sectional view of this front exterior plate.
FIG. 6 is a diagram for explaining cracks. 12... Decorative board, 16... Operation hole, 18...
Metal film, 22...Metal piece (grounding metal piece), 2
8...Metal foil.
Claims (1)
化粧板と、前記金属膜の近傍に設けられたアース
用金属片と、前記化粧板の操作用孔近傍に前記裏
面側より前記金属膜に重ねて貼付された金属箔と
を、備えるホツトスタンプ金属膜の静電破壊防止
構造。 A decorative board on which a metal film is formed on the back surface by hot stamping, a grounding metal piece provided near the metal film, and a grounding metal piece pasted from the back side over the metal film near the operation hole of the decorative board A structure for preventing electrostatic damage of a hot-stamped metal film, comprising a metal foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985059034U JPH055678Y2 (en) | 1985-04-19 | 1985-04-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985059034U JPH055678Y2 (en) | 1985-04-19 | 1985-04-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61196499U JPS61196499U (en) | 1986-12-08 |
| JPH055678Y2 true JPH055678Y2 (en) | 1993-02-15 |
Family
ID=30585085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985059034U Expired - Lifetime JPH055678Y2 (en) | 1985-04-19 | 1985-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH055678Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0126078Y2 (en) * | 1980-11-20 | 1989-08-03 |
-
1985
- 1985-04-19 JP JP1985059034U patent/JPH055678Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61196499U (en) | 1986-12-08 |
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