JPH0556679B2 - - Google Patents
Info
- Publication number
- JPH0556679B2 JPH0556679B2 JP17104784A JP17104784A JPH0556679B2 JP H0556679 B2 JPH0556679 B2 JP H0556679B2 JP 17104784 A JP17104784 A JP 17104784A JP 17104784 A JP17104784 A JP 17104784A JP H0556679 B2 JPH0556679 B2 JP H0556679B2
- Authority
- JP
- Japan
- Prior art keywords
- thin plate
- thin
- slot
- plates
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 claims description 54
- 239000012530 fluid Substances 0.000 claims description 30
- 239000004065 semiconductor Substances 0.000 claims description 23
- 239000000956 alloy Substances 0.000 claims description 12
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 230000001590 oxidative effect Effects 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 16
- 238000010586 diagram Methods 0.000 description 8
- 238000007740 vapor deposition Methods 0.000 description 7
- 238000009835 boiling Methods 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000010884 ion-beam technique Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 239000002826 coolant Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 241000446313 Lamella Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17104784A JPS6148999A (ja) | 1984-08-17 | 1984-08-17 | 半導体用積層構造冷却フィンの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17104784A JPS6148999A (ja) | 1984-08-17 | 1984-08-17 | 半導体用積層構造冷却フィンの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6148999A JPS6148999A (ja) | 1986-03-10 |
| JPH0556679B2 true JPH0556679B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-08-20 |
Family
ID=15916094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17104784A Granted JPS6148999A (ja) | 1984-08-17 | 1984-08-17 | 半導体用積層構造冷却フィンの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6148999A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112011105935T5 (de) | 2011-12-07 | 2014-10-30 | Intel Corporation | Vorrichtung und System für ein Gebläse mit volumetrischem Widerstand |
| US10545546B2 (en) | 2018-02-23 | 2020-01-28 | Intel Corporation | Reversible direction thermal cooling system |
| JP7178020B2 (ja) * | 2018-03-23 | 2022-11-25 | 株式会社小松精機工作所 | 金属薄板の表面清浄化方法及び接合方法 |
| EP3628872B1 (en) | 2018-09-27 | 2023-01-25 | INTEL Corporation | Volumetric resistance blowers |
-
1984
- 1984-08-17 JP JP17104784A patent/JPS6148999A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6148999A (ja) | 1986-03-10 |
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