JPH0555416A - Semiconductor device with temperature sensor - Google Patents
Semiconductor device with temperature sensorInfo
- Publication number
- JPH0555416A JPH0555416A JP3237285A JP23728591A JPH0555416A JP H0555416 A JPH0555416 A JP H0555416A JP 3237285 A JP3237285 A JP 3237285A JP 23728591 A JP23728591 A JP 23728591A JP H0555416 A JPH0555416 A JP H0555416A
- Authority
- JP
- Japan
- Prior art keywords
- temperature sensor
- semiconductor device
- package body
- temperature
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は温度センサ付半導体装置
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device with a temperature sensor.
【０００２】[0002]
【従来の技術】マイクロプロセッサ等の半導体装置は半
導体素子の高集積化とともに消費電力が増大し発熱量が
増大している。このため、半導体装置では放熱板に半導
体チップを接合したり、大きな放熱面積を有する放熱フ
ィンを別体に設けたりして熱放散性を向上させる方策を
とっている。また、半導体装置を実装する機器では、冷
却ファンを設置して強制的に冷却するようにしたり、冷
却装置を用いて装置が過熱しないようにしている。な
お、最近では半導体装置にペルチェ素子を付設して強制
的に放熱させることも行われている。2. Description of the Related Art In a semiconductor device such as a microprocessor, the power consumption is increased and the amount of heat generated is increased with the high integration of semiconductor elements. Therefore, in the semiconductor device, measures are taken to improve the heat dissipation by joining the semiconductor chip to the heat dissipation plate or by providing the heat dissipation fin having a large heat dissipation area separately. Further, in a device in which a semiconductor device is mounted, a cooling fan is installed to forcibly cool the device, and a cooling device is used to prevent the device from overheating. In recent years, a Peltier element has been attached to a semiconductor device to forcibly dissipate heat.
【０００３】[0003]
【発明が解決しようとする課題】ところで、上記のよう
に冷却ファンや冷却装置を作動させる場合、従来装置で
は冷却ファンおよび冷却装置は機器を作動させる場合に
常にON状態のまま継続的に作動させるようにしており、
機器の電力消費の点からみた場合、無駄になっている場
合があるという問題点があった。そこで、本発明は上記
問題点を解消し得るものとしてなされたものであり、そ
の目的とするところは、半導体装置の冷却を効果的に行
うことができ、機器の取り扱いも容易になる温度センサ
付半導体装置を提供しようとするものである。By the way, when the cooling fan or the cooling device is operated as described above, in the conventional device, the cooling fan and the cooling device are continuously operated in the ON state at all times when the device is operated. And
In terms of power consumption of the device, there is a problem that it may be wasted. Therefore, the present invention has been made to solve the above problems, and an object of the present invention is to provide a temperature sensor with which a semiconductor device can be effectively cooled and the device can be easily handled. It is intended to provide a semiconductor device.
【０００４】[0004]
【課題を解決するための手段】本発明は上記目的を達成
するため次の構成を備える。すなわち、半導体パッケー
ジのパッケージ本体に温度センサを取り付け、該温度セ
ンサと実装基板へ接続する接続ピンとを電気的に接続し
てなることを特徴とする。The present invention has the following constitution in order to achieve the above object. That is, the temperature sensor is attached to the package body of the semiconductor package, and the temperature sensor is electrically connected to the connection pin connected to the mounting board.
【０００５】[0005]
【作用】パッケージ本体に温度センサを設けたことによ
り、パッケージ本体の温度をじかに検知することがで
き、より精度のよい温度制御が可能になる。半導体装置
を実装することによって温度センサと外部回路が接続で
き装置の取り扱いが容易になる。温度センサの検知結果
に基づいて冷却ファン等を作動させることにより効率的
に作動させて省エネルギーを図ることができる。By providing the temperature sensor on the package body, the temperature of the package body can be directly detected, and more accurate temperature control can be performed. By mounting the semiconductor device, the temperature sensor and the external circuit can be connected, and the device can be easily handled. By operating the cooling fan or the like on the basis of the detection result of the temperature sensor, it is possible to operate efficiently and save energy.
【０００６】[0006]
【実施例】以下、本発明について好適な実施例について
詳細に説明する。図１は本発明に係る温度センサ付半導
体装置の一実施例を示す側面図、図２は平面図である。
実施例はＰＧＡ（ピングリッドアレイ）型パッケージで
温度センサを付設した半導体装置の例である。図で１０
はパッケージ本体であり、１２は実装用の接続ピン、１
４はパッケージ本体１０とは別体に形成してパッケージ
本体１０に取り付けた放熱フィンである。１６は温度セ
ンサでパッケージ本体１０の上面に取り付ける。１８は
パッケージ本体１０の上面に設けた端子部である。温度
センサ１６は端子部１８にはんだ付け等することによっ
てパッケージ本体１０に搭載する。The preferred embodiments of the present invention will be described in detail below. 1 is a side view showing an embodiment of a semiconductor device with a temperature sensor according to the present invention, and FIG. 2 is a plan view.
The embodiment is an example of a semiconductor device provided with a temperature sensor in a PGA (pin grid array) type package. 10 in the figure
Is a package body, 12 is a connecting pin for mounting, 1
Reference numeral 4 denotes a radiating fin formed separately from the package body 10 and attached to the package body 10. A temperature sensor 16 is attached to the upper surface of the package body 10. Reference numeral 18 denotes a terminal portion provided on the upper surface of the package body 10. The temperature sensor 16 is mounted on the package body 10 by soldering or the like to the terminal portion 18.
【０００７】端子部１８はビア２０によって外部接続用
の接続ピン２２に導通し、半導体装置を実装することに
よってこの接続ピン２２を介して温度センサ１６と外部
回路とが接続される。実施例の温度センサ付半導体装置
は、パッケージ本体１０にじかに温度センサ１６が搭載
されていること、半導体装置を実装することによって温
度センサ１６と外部回路が接続されることから、パッケ
ージ本体１０の温度を直接温度センサ１６で検知して信
号として取り出すことが可能である。The terminal portion 18 is electrically connected to the connection pin 22 for external connection by the via 20, and by mounting the semiconductor device, the temperature sensor 16 and the external circuit are connected via the connection pin 22. In the semiconductor device with the temperature sensor of the embodiment, the temperature sensor 16 is directly mounted on the package body 10, and the temperature sensor 16 and the external circuit are connected by mounting the semiconductor device. Can be directly detected by the temperature sensor 16 and taken out as a signal.
【０００８】そして、上記温度センサ１６によって検知
された温度に基づいて冷却ファンや各種冷却装置を制御
することにより、パッケージ本体１０の温度にしたがっ
て冷却ファンや冷却装置を効果的に作動させることがで
き、省エネルギーを図ることができる。とくに、実施例
の半導体装置の場合は、パッケージ本体１０自体に温度
センサ１６を搭載可能であるから、パッケージ本体１０
そのものの温度をじかに検知することができ、よりきめ
の細かい制御が可能になる。また、パッケージ本体１０
に温度センサが搭載されているから、外部回路に温度セ
ンサ用の回路を設けておくことによって簡単に装置の温
度制御ができ、半導体装置が一定温度以上に過熱した場
合にアラーム信号などを出させるようにすることができ
る等、種々の利用方法が可能となる。By controlling the cooling fan and various cooling devices based on the temperature detected by the temperature sensor 16, the cooling fan and the cooling device can be effectively operated according to the temperature of the package body 10. It is possible to save energy. Particularly, in the case of the semiconductor device of the embodiment, since the temperature sensor 16 can be mounted on the package body 10 itself, the package body 10
It is possible to directly detect the temperature of the device itself, which enables finer control. In addition, the package body 10
Since the temperature sensor is installed in the device, the temperature of the device can be easily controlled by providing a temperature sensor circuit in the external circuit, and an alarm signal is output when the semiconductor device overheats above a certain temperature. Various usage methods are possible.
【０００９】上記実施例はＰＧＡタイプの半導体装置に
温度センサを取り付けた例であるが、もちろん他のタイ
プの半導体装置にも同様に適用することが可能である。
また、パッケージ本体に搭載する温度センサには種々タ
イプのものが使用可能であり、パッケージ本体に設ける
端子部も温度センサに応じて適宜設定することができ
る。なお、上記実施例ではパッケージ本体１０に端子部
１８を形成して、温度センサ１６を搭載可能にしたが、
かりにパッケージ本体にペルチェ素子を用いた冷却装置
を搭載するような場合には、上記端子部１８を冷却装置
の接続端子（電力供給用端子）として利用することがで
きる。端子部１８を接続ピン２２に導通させておくこと
によって種々の利用が可能である。The above embodiment is an example in which the temperature sensor is attached to the PGA type semiconductor device, but it is of course applicable to other types of semiconductor devices as well.
Further, various types of temperature sensors mounted on the package body can be used, and the terminal portion provided on the package body can be appropriately set according to the temperature sensor. In the above-described embodiment, the terminal portion 18 is formed on the package body 10 so that the temperature sensor 16 can be mounted.
When a cooling device using a Peltier device is mounted on the package body, the terminal portion 18 can be used as a connection terminal (power supply terminal) of the cooling device. Various uses are possible by connecting the terminal portion 18 to the connection pin 22 in advance.
【００１０】[0010]
【発明の効果】本発明に係る温度センサ付半導体装置に
よれば、上述したように、パッケージ本体の温度を直接
的に検知して、冷却ファン等の冷却機構の作動を制御す
ることが可能である。これにより、半導体装置の温度に
応じて冷却機構を効果的に作動させることができ、より
きめの細かい制御が可能になり効果的な省エネルギーを
図ることができる。また、半導体装置に温度センサを取
り付けたことによって半導体装置の温度制御に容易に使
用することができ装置の取り扱いが容易になる等の著効
を奏する。As described above, according to the semiconductor device with the temperature sensor of the present invention, it is possible to directly detect the temperature of the package body and control the operation of the cooling mechanism such as the cooling fan. is there. As a result, the cooling mechanism can be effectively operated according to the temperature of the semiconductor device, finer control can be performed, and effective energy saving can be achieved. Further, by attaching the temperature sensor to the semiconductor device, it can be easily used for temperature control of the semiconductor device, and the handling of the device is facilitated.
【図１】温度センサ付半導体装置の一実施例の側面図で
ある。FIG. 1 is a side view of an embodiment of a semiconductor device with a temperature sensor.
【図２】温度センサ付半導体装置の一実施例の平面図で
ある。FIG. 2 is a plan view of an embodiment of a semiconductor device with a temperature sensor.
１０ パッケージ本体 １２ 接続ピン １４ 放熱フィン １６ 温度センサ １８ 端子部 ２０ ビア 10 Package Body 12 Connection Pin 14 Heat Dissipation Fin 16 Temperature Sensor 18 Terminal 20 Via
Claims (1)
度センサを取り付け、該温度センサと実装基板へ接続す
る接続ピンとを電気的に接続してなることを特徴とする
温度センサ付半導体装置。1. A semiconductor device with a temperature sensor, wherein a temperature sensor is attached to a package body of a semiconductor package, and the temperature sensor and a connection pin connected to a mounting board are electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3237285A JPH0555416A (en) | 1991-08-23 | 1991-08-23 | Semiconductor device with temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3237285A JPH0555416A (en) | 1991-08-23 | 1991-08-23 | Semiconductor device with temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0555416A true JPH0555416A (en) | 1993-03-05 |
Family
ID=17013122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3237285A Pending JPH0555416A (en) | 1991-08-23 | 1991-08-23 | Semiconductor device with temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0555416A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004044982A1 (en) * | 2002-11-12 | 2004-05-27 | Fujitsu Limited | Packaging structure |
-
1991
- 1991-08-23 JP JP3237285A patent/JPH0555416A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004044982A1 (en) * | 2002-11-12 | 2004-05-27 | Fujitsu Limited | Packaging structure |
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