JPH0553175U - IC socket - Google Patents

Abstract

(57) [Abstract] [Purpose] An object of the present invention is to provide an IC socket which holds a J-vent lead type IC package from both sides and which can be inserted from both front and back sides. [Structure] Rectangular socket body 1 and socket body 1
A guide member 2 vertically implanted in the socket, and a cover 3 which is regulated in the horizontal direction by the guide member 2 and slidable in the vertical direction. The socket body 1 includes a pressing portion 5a, a first contact portion,
Contact pin 5 consisting of a second contact part, a spring part, and a connection part
Are arranged outside the IC mounting table 4 in the center of the socket body 1 at a constant interval to sandwich the inserted IC package from both upper and lower surfaces, and the cover 3 is pushed down to press the contact pin 5. It is configured by providing a sloped portion 7 that shifts the portion 5a outward.

Description

[Detailed description of the device]

[0001]

[Industrial application]

 The present invention relates to an open top type IC socket for PLCC or SOJ.

[0002]

[Prior Art]

 As shown in FIG. 9, an example of a conventional open top type IC socket for PLCC has contact pins 12 that are planted at regular intervals facing the four sides of a recess 11a in the center of the socket body 11 at the upper end toward the inside. This is an IC socket of a type in which a contact portion 12a is curved and the lead 8a of the IC package 8 is slidably inserted into the contact portion 12a.

In another example, as shown in FIG. 10, an IC package mounting table 13b is provided in the center of the recess 13a in the center of the socket body 13, and the four sides of the recess 13a are provided. The upper side serves as the first contact portion 14a, and the lower side has the contact pins 14 branching inward from the second contact portion 14b facing each other and planted at regular intervals.

The lead 8a of the IC package 8 is slidably inserted into the first contact portion 14a, the lead contact portion 8b presses the second contact portion 14b, and the lead shoulder portion 8c presses the first contact portion 14a. To engage with.

[0005]

[Problems to be solved by the device]

 However, in each of the above-mentioned examples, when the IC package 8 is attached or detached, the lead 8a slides with the contact pin 12 or 14 from the beginning, so the plating of the lead 8a is peeled off and transferred to the contact pin 12 or 14. Sometimes. The transferred plating layer is electrolyzed to cause poor contact between the contact pin 12 or 14 and the lead 8a.

Further, in the example of FIG. 10, the resin may squeeze out into the lead shoulder portion 8c during molding of the IC package 8, and the first contact portion 14a may not come into contact with the lead 8a.

It is an object of the present invention to solve the above problems and provide an IC socket that is easy to attach and detach and that does not cause poor contact.

[0008]

[Means for Solving the Problems]

 In order to solve the above-mentioned problems, a socket main body 1 capable of accommodating a J-vent lead type IC package 8 and a vertically elastic slidable holding with respect to the socket main body 1 having an upward pressure habit. In the IC socket including the frame-shaped cover 3 described above, an IC mounting table 4 is provided in the center of the socket body 1, and contact pins 5 are arranged on the outer side of the IC mounting table 4 at regular intervals. The contact pin 5 is provided with a pressing portion 5a having an upper end inclined outward, a first contact portion 5b branching inward under the pressing portion 5a, and a branch of the first contact portion 5b. A spring portion 5d formed below the point, a second contact portion 5c branched below the spring portion 5d in the same direction as the first contact portion 5b, and arranged on the socket body 1. And a base portion 5f that extends downward from the base portion 5f The cover 3 includes a connecting portion 5e connected to a road, and the cover 3 is provided with an outwardly inclined surface portion 7 that comes into contact with the pressing portion 5a at the upper end of the contact pin 5, and by pressing the cover 3, The inclined surface portion 7 presses the pressing portion 5a of the contact pin 5 to retract the first contact portion 5b to the outside, and by releasing the pressing, the lead 8a of the IC package 8 accommodated in the first contact portion 5b, or the IC The package 8 can be pressed into contact with the main body of the package 8.

In the vertical direction, the cover 3 is formed integrally with the elastic force of the contact pin 5 and the cover 3 or the socket body 1, or is formed separately from the cover 3 or the socket body 1 to be attached to the cover 3 or the socket body 1. The guide member 2 is configured to be restricted.

The contact pin 5 is formed by punching a single elastic plate or is formed by bending a strip-shaped elastic plate, and its spring portion 5d is curved and protrudes outward. It is either a straight line or a straight line.

[0011]

【Example】

 FIG. 1 is a sectional view of the IC socket of the present invention. The right half is a state diagram immediately after inserting the IC package 8 by pushing down the cover 3 (immediately before taking it out), the left half is a state diagram when the IC package is completely inserted, and FIG. It is a top view.

This IC socket is a frame shape in which a rectangular socket main body 1 and guide members 2 vertically implanted at four corners of the socket main body 1 regulate the horizontal direction and slidably retain the vertical direction. And a coil spring 9 that elastically presses the cover 3 onto the upper end of the guide member 2 along the guide member 2.

The socket body 1 is an upward box-shaped body having a wall 1 a on the periphery thereof, and has a rectangular IC mounting table 4 provided on the upper surface of the center of the bottom surface and each side of the IC mounting table 4. A plurality of contact pins 5 are provided on the outer side of, parallel to each side and planted at regular intervals.

Coil springs 9 are inserted into the guide members 2 along the respective guide members 2, and the cover 3 is elastically pressed onto the upper end of the guide member 2.

The cover 3 has holes 6 at the four corners through which the guide member 2 passes. As shown in FIG. 3, the hole 6 has a diameter at which the guide member 2 is loosely fitted on the lower side, and the head 2a of the guide member 2 is loosely fitted on the upper side. It is configured to regulate the upper limit even if it is suppressed by.

In addition, an inclined surface portion 7 is provided from the inside to the outside on the lower surface of each side of the frame shape, and is configured to come into contact with the pressing portion 5 a at the upper end of the contact pin 5.

As shown in FIG. 4A, an example of the contact pin 5 is a pressing portion 5a whose upper end is inclined outward, and a first contact portion branched inward under the pressing portion 5a. 5b and a lower side of the branch point of the first contact portion 5b form an outwardly curved spring portion 5d, and the lower side of the spring portion 5d branches in the same direction as the first contact portion 5b. It comprises a second contact portion 5c, a base portion 5f disposed in the socket body 1, and a connecting portion 5e extending downward from the base portion 5f and connected to an external circuit.

In addition, what is shown in FIG. 4B is a linear spring portion 5d instead of the curved spring portion 5d shown in FIG.

The contact pin 5 shown in (a) and (b) of FIG. 4 is formed by punching one elastic plate into a predetermined shape, but the contact pin 5 shown in FIG. The plate is bent to form the first contact portion 5b, the spring portion 5d, the second contact portion 5c and the connecting portion 5e, and the pressing portion 5a is joined by spot welding or the like with the same strip-shaped elastic plate. is there.

Next, the operation of the above IC socket will be described. As shown in the right half of FIG. 1, when the cover 3 is pushed down against the elastic force of the coil spring 9, the pressing portion 5a of the contact pin 5 is bent outward by bending the spring portion 5d by the inclined surface portion 7 of the cover 3. Transition. In this state, the first contact portion 5b moves to the diagonally outer side and is retracted from the insertion range of the IC package 8.

In this state, the IC package 8 is placed on the second contact portion 5c of the contact pin 5 along the positioning member (not shown) and the cover 3 is released when the pushing down state of the cover 3 is released. Rises to the upper end of the guide member 2 due to the elasticity of the coil spring 9, the pressing portion 5a of the contact pin 5 moves inward along the inclined surface portion 7, and the first contact portion 5b moves obliquely inwardly accordingly. The upper surface of the IC package 8 is pressed. This state is shown in the left half of FIG.

Further, when removing the IC package, the cover 3 may be pushed down in the same manner as when the IC package is inserted, and the state of the right half of FIG.

When the IC package 8 is inserted into this IC socket, the IC package 8 is configured so as to make regular contact with the IC package 8 facing up and down, so that the internal connection of the IC package 8 and the IC socket It is inserted in the direction determined by the external connection of.

An explanatory view of this state is shown in FIG. 5, in which (a) is an example in which the spring portion 5d of the contact pin 5 is curved, and the IC package 8 is inserted in the reverse direction, and (b) is the spring portion 5d. Is a linear type, and the IC package 8 is an example in which it is inserted face up. However, the IC package 8 can be inserted in the opposite direction to the above by the internal connection of the IC package 8 and the external connection of the IC socket.

As shown in FIGS. 6, 7 and 8, the guide member 2 may be integrally formed with the cover 3 and engaged with the socket body 1, or conversely, it may be integrally formed with the socket body 1. It may be engaged with the cover 3.

Further, the coil spring 9 does not have to be provided in particular, and the elastic force of the contact pin 5 pushes the inclined surface portion 7 in the direction of arrow F through the pressing portion 5a as shown in FIG. It is also possible to elastically press the cover 3 upward so that the above-mentioned operation of the socket is performed.

[0027]

[Effect of the device]

 As described above, since the IC package 8 is not fixed only by the leads 8a, the load on the leads 8a is reduced and problems such as deformation of the leads 8a do not occur.

Further, since the IC package 8 is clamped and fixed in the vertical direction, the IC package 8 does not come off from the IC socket due to vibration or shock.

Further, since the same IC socket can be used for mounting the front surface and the back surface of the IC package, it is possible to handle the IC package 8 in which the internal connection is reversed.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of an IC socket of the present invention, in which the right half is a state diagram immediately after inserting the IC package 8 by pushing down the cover 3 (immediately before taking it out), and the left half is a state diagram in which the IC package is completely inserted.

FIG. 2 is a plan view of the same.

FIG. 3 is an explanatory view of an engagement state between an upper end portion of a guide member and a cover.

FIG. 4 is a shape diagram of a contact pin, in which (a) a punched shape and a curved spring portion, (b) a linear spring portion, and (c) a bending It is a shape diagram having a linear spring portion.

FIG. 5 is an explanatory view of the insertion state of the IC package.
FIG. 4 is an explanatory diagram of the face-down insertion, and FIG.

FIG. 6 is a partially enlarged perspective view of another embodiment of the guide member of the present invention.

7 is a partially enlarged cross-sectional view showing engagement between the guide member and the socket body shown in FIG.

8 is a partial cross-sectional view of an IC socket having the guide member shown in FIG.

FIG. 9 is a cross-sectional view of an example of a conventional IC socket.

FIG. 10 is a cross-sectional view of another example of a conventional IC socket.

[Explanation of symbols]

 1 Socket Main Body 2 Guide Member 3 Cover 4 IC Placement Table 5 Contact Pin 5a Pressing Part 5b First Contact Part 5c Second Contact Part 5d Spring Part 5e Connection Part 5f Base Part 6 Hole 7 Slope Area 8 IC Package 8a Lead 9 Coil Spring

Claims (7)

[Scope of utility model registration request] 1. A socket main body capable of accommodating a J-vent lead type IC package, and a frame-shaped cover which is vertically slidably held by the socket main body so as to be elastically pressed upward. In the IC socket, an IC mounting table is provided in the central portion of the socket body, and contact pins are arranged at regular intervals on the outer side of the IC mounting table. Part, a first contact part that branches inward under the pressing part, a spring part formed below the branch point of the first contact part, and the first contact part under the spring part. The cover includes a second contact portion branched in the same direction as the contact portion, a base portion provided in the socket body, and a connection portion extending downward from the base portion and connected to an external circuit. Pressing the upper end of the contact pin A sloped portion facing outward is provided, and the sloped portion presses the pressing portion of the contact pin by pressing the cover to retract the first contact portion to the outside, An IC socket characterized in that one contact portion can be pressed into contact with a lead of an IC package housed therein or an IC package body. 2. The IC socket according to claim 1, wherein the cover is regulated in the vertical direction by an elastic force of the contact pin and a guide member integrally formed with the cover or the socket body. 3. The IC socket according to claim 2, wherein the guide member is formed separately from the cover and the socket body, and is attached to the cover or the socket body. 4. The IC socket according to claim 1, wherein the spring portion of the contact pin is curved and protrudes outward. 5. The IC socket according to claim 1, wherein the spring portion of the contact pin has a linear shape. 6. The contact pin is formed by stamping an elastic plate.
2, 3, 4 or 5 IC sockets. 7. The contact pin is formed by bending a strip-shaped elastic plate.
Or 5 IC socket.