JP2586940Y2 - IC socket - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket for mounting a flat type IC package and connecting leads to an external circuit, and relates to a so-called open top type IC socket.

[0002]

2. Description of the Related Art FIG. 4 is a partial sectional view showing an example of a conventional open top type IC socket for a flat type IC package. The cover 3 is slid up and down with respect to the socket body 1 in a state where the cover 3 has elasticity in an upward direction by a contact pin operating portion 2a formed by punching a large number of metal plates implanted in the socket body 1. It is movably mounted. When the cover 3 is pressed from above, the pressing portion 3a of the cover causes the action portion 2a of the contact pin.
Is pushed outward with respect to the socket body 1 and moves,
The spring portion 2c of the contact pin is elastically deformed.
The contact portion 2b of the contact pin is moved obliquely outward and upward with respect to the socket body 1. At this time, when the IC package 5 is placed at a predetermined position on the socket body 1 and the cover 3 is released from the pressing, the contact portion 2b of the contact pin is released.
Tries to return to the original position by the elastic restoring force of the spring portion 2c, and comes into elastic contact with the lead 5a of the KC package.

[0003]

In the case of the IC socket shown in FIG. 4, when the contact portion 2b of the contact pin is in contact with the lead 5a of the IC package, the action portion 2a of the contact pin and the pressing portion 3a of the cover are also provided. In contact. Therefore, when the contact portion 2b and the lead 5a come into contact with each other and are in an energized state, if the contact portion 2b contacts the cover 3 by mistake, the contact portion 2b
In some cases, contact between the lead 5a and the lead 5a is released, and the power cannot be supplied.

Further, when assembling the IC socket, the tightening amounts of a plurality of rivets (not shown) connecting the socket body 1 and the cover 3 become non-uniform for each rivet.
May be attached to the socket body 1 at an angle. When the inclination of the cover 3 is larger than a certain angle with respect to the socket body 1, some of the contact pins 2
Without pressing, the action portion 2a is moved outward with respect to the socket body 1 by the pressing portion 3a of the cover, and the contact portion 2b is moved obliquely upward.
In some cases, contact with the lead 5a of the C package could not be achieved.

If the inclination of the cover 3 is small, the contact portions 2b of all the contact pins and the leads 5 of the IC package
Although a can be contacted, the contact pressure of the contact pin 2 against the lead 5a greatly varies depending on the position of the contact pin 2, which is very inconvenient in performing an IC package mounting test or the like.

Therefore, a coil spring 6 as shown in FIG. 5 is attached to the socket body 1 and the cover 3 is pressed upward by the coil spring 6 so that the contact portion 2b of the contact pin and the lead 5 of the IC package are pressed.
When a is in a contact state, as shown in FIG. 6, a gap E is conventionally formed between the action portion 2a of the contact pin and the pressing portion 3a of the cover.

With the above arrangement, if the contact portion 2b of the contact pin and the lead 5a of the IC package are in contact with each other and the cover 3 is inadvertently brought into contact with the cover 3, the cover 3 is moved to the position shown in FIG. The contact between the contact pin 2 and the lead 5a will not be released unless it moves downward longer than E shown. Also, the contact portion 2 of the contact pin
b and the lead portion 5a of the IC package are in contact with each other, the contact pin operating portion 2a and the cover pressing portion 3a
Contact with the lead 5 of the contact pin 2
Since the contact pressure with respect to a is determined only by the elastic force of the spring portion 2c of the contact pin, the contact pressure of the contact pin 2 with respect to the lead 5a does not differ depending on the position of the contact pin 2.

However, if the coil spring 6 as shown in FIG. 5 is to be mounted on the socket body 1, the socket body 1 is inevitably large, which is against the market demand for downsizing the IC socket. In addition, there has been a problem that the assembling process of the IC socket is complicated and the manufacturing cost is increased.

In view of the above problems, the present invention relates to an open-top type IC socket, as shown in FIG.
a is in contact with the contact pin operating portion 2
a and a gap between the pressing portion 3a of the cover and the socket body 1 is not so large.
The socket assembly process has not been complicated.
It is intended to provide a C socket.

[0010]

The present invention can be made by punching a metal plate in the same manner as a contact pin.
The cover is formed by a push-up spring having substantially the same shape as a contact pin having only an action portion 2a lacking a contact portion 2b that can be attached to the socket body by press-fitting into a slit provided in the socket body in the same manner as a contact pin. When the contact portion 2b of the contact pin and the lead 5a of the IC package are in contact with each other, the action portion 2a of the contact pin and the pressing portion (push-up engaging portion) 3a of the cover are pressed. The above problem is solved by providing a certain gap between them.

[0011]

According to the above construction, the area of the push-up spring occupying in the socket body is smaller than that of the conventional coil spring, so that the socket body does not need to be so large. Since the spring is attached to the socket body in the same step as the step of attaching the contact pin to the socket body, the assembly process of the IC socket does not become complicated.

[0012]

FIG. 1 is a partial sectional view showing a state in which a push-up spring is mounted on an open-top type IC socket according to the present invention, and FIG. 2 is a side view of the IC socket shown in FIG. In the figure, 1 is a socket body, 2 is a contact pin formed by punching a metal plate implanted in the socket body, 3 is a cover attached to the socket body 2 so as to be vertically movable, These are the same as the configuration shown in the conventional example. Reference numeral 4 denotes a push-up spring, which presses up the cover 3 by elastically pressing the cover upward, and when the contact portion 2b of the contact pin is in contact with the lead 5a of the IC package, the action portion 2a of the contact pin is pressed against the cover. Part 3a
6, a gap E is formed as shown in FIG.

The push-up springs 4 are attached to the socket body 1 by press-fitting into slits 1b provided in the socket body 1 in the same manner as the contact pins 2 planted in the socket body 1. For this reason, when a large number of contact pins 2 are press-fitted together with the slits 1a provided in the socket main body 1, they are easily attached to the socket main body 1. Also, the push-up spring 4
The slit 1a for attaching the contact pin 2
May be provided in the socket main body 1 in the same process as the slit 1a for press-fitting.

In the case of the IC socket shown in FIGS. 1 and 2, only one push-up spring is arranged on each side of a row of a large number of contact pins 2 which are planted. Is weak, the spring portion 4 of the push-up spring
What is necessary is just to respond by making the width of a large.

In the above embodiment, the push-up spring 4 is formed in a shape different from that of the contact pin 2. However, the amount of protrusion of the pressing portion 3a of the cover corresponds to the portion corresponding to the contact pin 2 and the push-up spring 4. The dimensions are changed at the portions, and as shown in FIG.
The push-up spring 4 can be made to have the same shape as the contact pin 2 by reducing the amount of protrusion below the push-up engaging portion 3b which is a contact portion with the contact pin 2. In this manner, when the contact portion 2b of the contact pin and the lead 5a of the IC package are in contact with each other, the pressing portion 3 is located between the operating portion 2a of the contact pin and the pressing portion 3a 'of the cover.
A gap is created corresponding to the difference in the amount of protrusion between a 'and the push-up engaging portion 3b. In this case, the contact pin 2 and the push-up spring 4
Since they have the same shape, it is possible to save the trouble of separately forming the push-up spring.

[0016]

[Effect of the Invention] The open-top type IC socket of the present invention has the above-described configuration, and therefore, when the leads and the contact pins of the IC package are in an electrically connected state,
Even if the cover contacts the IC socket accidentally, if the contact is made lightly, the electrical connection state is not released. Also, when assembling the IC socket, even if the tightening amounts of the plurality of rivets connecting the socket body and the cover are not uniform and the cover is inclined with respect to the socket body, the contact pins and the IC The contact pressure with the package leads does not differ.

Further, as compared with the case where the cover is pushed upward by using a coil spring, the size of the socket body can be reduced, and the manufacture of the IC socket is easy.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional view of an example of an open top type IC socket according to the present invention.

FIG. 2 is a side view of the IC socket shown in FIG.

FIG. 3 is a partial cross-sectional view showing another example of the pressing portion of the cover of the open top type IC socket according to the present invention.

FIG. 4 is a partial sectional view of a conventional open top type IC socket.

FIG. 5 is a perspective view of a coil spring.

FIG. 6 is a partial cross-sectional view showing an example of an open top type IC socket in which a gap E is provided between a working portion of a contact pin and a pressing portion of a cover.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Socket body 1a Slit 2 Contact pin 2a Working part 2b Contact part 2c Spring part 3 Cover 3a, 3a 'Pressing part 3b, (3a) Push-up engaging part 4 Push-up spring 5 IC package 5a Lead

Claims (4)

(57) [Scope of request for utility model registration] The base is press-fitted and fixed to the socket body.
And lead the IC package from the base through the spring.
Contacting with the contact part that contacts the cover and the pressing part of the cover.
Multiple contact pins with integrated parts
When the cover is pressed down, the pressing portion of the cover comes into contact with and presses against the action portion of the contact pin, thereby elastically deforming the spring portion of the contact pin, and connecting the contact portion of the contact pin to the lead of the IC package. In the IC socket which is moved from the contact position to the retreat position so that the IC package can be attached to and detached from the socket body, the cover has substantially the same shape as the pressing portion of the cover.
A push-up engagement portion formed side by side with the base portion;
To the socket body and push up the free end of the cover.
The contact pin is adapted to engage with an engagement portion.
A push-up spring member having substantially the same shape as the sprung portion is provided, and when the cover is in a free state, the push-up spring member is provided on the cover.
Lifting engagement portion engaged with, IC, characterized in that the pressing portion of the cover and the working portion of the co <br/> Ntakutopin constituted the cover so as to maintain the non-contact state to push up so socket. 2. A push-up engaging portion of the cover is formed by a pressing portion.
Also form an engaging surface protruding toward the action part side of the contact pin.
The IC socket according to claim 1, wherein 3. The push-up spring comprises a stamped leaf spring.
The IC socket according to claim 1, wherein: 4. The width of a spring portion of the spring member is set to
The tact pin must be wider than the spring
The IC socket according to claim 1, wherein: