JPH0658584U - IC socket - Google Patents

Abstract

(57) [Abstract] [Purpose] In an open top type IC socket having a spring for pushing the cover upward, even if the spring is attached to the socket body, the socket body does not become too large and the assembly process does not become complicated. To do so. [Structure] The spring is made by punching out a metal plate having substantially the same shape as a contact pin having at least an action portion that comes into contact with the cover, and is attached by press-fitting into a slit provided in the socket body in the same manner as the contact pin. IC socket.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an open top type IC socket, which is an IC socket for mounting a flat IC package and connecting leads to an external circuit.

[0002]

[Prior art]

 FIG. 4 is a partial sectional view showing an example of a conventional open top type IC socket for a flat IC package. The cover 3 is vertically moved with respect to the socket body 1 in a state in which the contact pin working portion 2a formed by punching out a plurality of metal plates implanted in the socket body 1 has an elastic behavior in the upward direction. It is slidably attached. When the cover 3 is pressed from above, the contact pressing portion 3a pushes the contact pin acting portion 2a outwardly with respect to the socket body 1, and the contact pin spring portion 2c elastically deforms. The contact portion 2b of the contact pin is moved obliquely outward and upward with respect to the socket body 1. At this time, when the IC package 5 is placed at a predetermined position of the socket body 1 and the pressing of the cover 3 is released, the contact portion 2b of the contact pin tries to return to its original position by the elastic restoring force of the spring portion 2c, It comes into elastic contact with the lead 5a of the KC package.

[0003]

[Problems to be solved by the device]

 In the case of the IC socket shown in FIG. 4, when the contact portion 2b of the contact pin is in contact with the lead 5a of the IC package, the acting portion 2a of the contact pin and the pressing portion 3a of the cover are also in contact with each other. Therefore, when the contact portion 2b and the lead 5a are corroded and energized, if the cover 3 is accidentally contacted, the contact portion 2b and the lead 5a are released from contact with each other and the power cannot be supplied. was there.

Further, when assembling the IC socket, the tightening amounts of a plurality of rivets (not shown) that connect the socket body 1 and the cover 3 become uneven in each rivet, and the cover 3 is obliquely attached to the socket body 1. It was sometimes installed. If the inclination of the cover 3 is larger than a certain degree with respect to the socket body 1, even if some of the contact pins 2 do not press the cover 3, the pressing portion 3a of the cover causes the action portion 2a to move outwardly with respect to the socket body 1. Then, the contact portion 2b was moved to the diagonally upward direction and could not contact the lead 5a of the IC package.

If the inclination of the cover 3 is small, the contact portions 2b of all contact pins and the leads 5a of the IC package can contact each other, but the contact pressure of the contact pins 2 with respect to the leads 5a varies greatly depending on the position of the contact pin 2. It was very inconvenient for the IC package mounting test.

Therefore, by attaching a coil spring 6 as shown in FIG. 5 to the socket body 1 and elastically pressing the cover 3 upward by the coil spring 6, the contact portion 2b of the contact pin and the lead 5a of the IC package are separated. It has been conventionally performed to form a gap E 2 between the acting portion 2a of the contact pin and the pressing portion 3a of the cover in the contact state as shown in FIG.

By doing so, even if the cover 3 is accidentally brought into contact with the contact portion 2b of the contact pin and the lead 5a of the IC package in contact with each other, the cover 3 is still shown in FIG. The contact between the contact pin 2 and the lead 5a will not be released unless it moves downwards longer than the indicated E. Further, when the contact portion 2b of the contact pin and the lead 5a of the IC package are in contact with each other, the contact portion 2a of the contact pin and the pressing portion 3a of the cover are not in contact with each other. Since the pressure is determined only by the elastic force of the spring portion 2c of the contact pin, the contact pressure of the contact pin 2 with respect to the lead 5a does not differ depending on the position of the contact pin 2.

However, if the coil spring 6 as shown in FIG. 5 is to be attached to the socket body 1, the socket body 1 is inevitably large, which is against the market demand for miniaturization of the IC socket. In addition, there is a problem that the assembly process of the IC socket is complicated and the manufacturing cost is increased.

In view of the above problems, the present invention provides the operation of the contact pin in the open top type IC socket when the contact portion 2b of the contact pin and the lead 5a of the IC package are in contact with each other as shown in FIG. An object of the present invention is to provide an IC socket in which there is a certain amount of clearance between the portion 2a and the pressing portion 3a of the cover, the socket body 1 does not become too large, and the IC socket assembly process is not complicated. And

[0010]

[Means for Solving the Problems]

 The present invention can be made by punching out a metal plate like the contact pin, and lacks the contact part 2b that can be attached to the socket body by pressing it into the slit provided in the socket body like the contact pin. When the contact pin contact portion 2b and the IC package lead 5a are in contact with each other, the cover pin is elastically pressed upward by the push-up spring having substantially the same shape as the contact pin having only the acting portion 2a. The above problem is solved by providing a certain amount of clearance between the acting portion 2a of the contact pin and the pressing portion (push-up engaging portion) 3a of the cover.

[0011]

[Action]

 With the above configuration, the area of the push-up spring occupying in the socket body is smaller than that of the conventional coil spring, so it is not necessary to make the socket body so large, and the mounting method to the socket body is the same as the contact pin. Since the spring can be attached to the socket body in the same step as the step of attaching the contact pin to the socket body, the process of assembling the IC socket does not become complicated.

[0012]

【Example】

 FIG. 1 is a partial sectional view showing a state where a push-up spring is attached to an open top type IC socket according to the present invention, and FIG. 2 is a side view of the IC socket shown in FIG. In the figure, 1 is a socket body, 2 is a contact pin made by punching out a number of metal plates implanted in the socket body, and 3 is a cover attached to the socket body 2 so as to be vertically movable. These are the same as the configuration shown in the conventional example. A push-up spring 4 pushes the cover 3 upward by pushing it up. When the contact portion 2b of the contact pin and the lead 5a of the IC package are in contact with each other, the action portion 2a of the contact pin and the cover 2 A gap E is formed between the pressing portion 3a and the pressing portion 3a, as shown in FIG.

The push-up spring 4 is attached to the socket body 1 by being press-fitted into the slit 1 b provided in the socket body 1 in the same manner as the contact pins 2 implanted in the socket body 1. . Therefore, when a large number of contact pins 2 are press-fitted together with the slits 1 a provided in the socket body 1, they can be easily attached to the socket body 1. Further, the slit 1a for attaching the push-up spring 4 may be provided in the socket body 1 in the same process as the slit 1a for press-fitting the contact pin 2.

In the case of the IC sockets shown in FIG. 1 and FIG. 2, only one push-up spring is arranged on each side of the row of contact pins 2 that are implanted, but if this is the case, the force to push up the cover 3 is increased. When the force is weak, the width of the spring portion 4a of the push-up spring may be increased to deal with it.

In the above embodiment, the push-up spring 4 is formed in a shape different from that of the contact pin 2. However, the protrusion amount of the pressing portion 3 a of the cover corresponds to the portion corresponding to the contact pin 2 and the push-up spring 4. As shown in FIG. 3, it is possible to reduce the amount of protrusion of the portion 3a 'corresponding to the contact pin 2 downward from the push-up engaging portion 3b which is the contact portion with the push-up spring 4 by changing the dimension at the portion to be pushed. By doing so, the push-up spring 4 can be formed in the same shape as the contact pin 2. With this arrangement, when the contact corrosion portion 2b of the contact pin and the lead 5a of the IC package are in contact with each other, the pressing portion 3a 'and the pressing portion 3a' are pressed between the contact pin operating portion 2a and the cover pressing portion 3a '. There is a gap corresponding to the difference in the amount of protrusion with the lifting engagement portion 3b. In this case, since the contact pin 2 and the push-up spring 4 have the same shape, it is possible to save the labor of separately making the push-up spring.

[0016]

[Effect of device]

 Since the open top type IC socket of the present invention has the above-mentioned structure, even if the IC package cover is accidentally contacted with the IC package lead and the contact pin, they are lightly contacted. In that case, the electrical connection will not be released. Also, when assembling the IC socket, even if the tightening amount of the rivets that connect the socket body and the cover becomes uneven, and the cover becomes slanted with respect to the socket body, this causes each contact There is no difference in the contact pressure between the pins and the leads of the IC package.

Further, the socket body can be downsized and the IC socket can be easily manufactured, as compared with the case of pushing the cover upward by using the coil spring.

[Brief description of drawings]

FIG. 1 is a partial sectional view of an example of an open top type IC socket according to the present invention.

FIG. 2 is a side view of the IC socket shown in FIG.

FIG. 3 is a partial cross-sectional view showing another example of the pressing portion of the cover of the open top type IC socket according to the present invention.

FIG. 4 is a partial cross-sectional view of a conventional open top type IC socket.

FIG. 5 is a perspective view of a coil spring.

FIG. 6 is a partial cross-sectional view showing an example of an open top type IC socket in which a gap E is provided between an acting portion of a contact pin and a pressing portion of a cover.

[Explanation of symbols]

 1 Socket body 1a Slit 2 Contact pin 2a Working part 2b Contact part 2c Spring part 3 Cover 3a, 3a 'Pressing part 3b, (3a) Push-up engaging part 4 Push-up spring 5 IC package 5a Lead

Claims (1)

[Scope of utility model registration request] 1. When the cover is pushed down, the pressing portion of the cover contacts and presses the acting portion of the contact pin to elastically deform the spring portion of the contact pin, and the contact portion of the contact pin serves as a lead of the IC package. In an IC socket that can be attached to and detached from the socket body of the IC package by moving it from the contact position to the retracted position,
In the free state of the cover, the punched leaf spring is engaged with the push-up engaging portion of the cover and pushes up the cover so that the pressing portion of the cover and the operating portion of the contact pin are kept in a non-contact state. An IC socket characterized by being arranged in the main body.