JPH0551543U - Printed circuit board collection device in printed circuit board processing machine - Google Patents

Abstract

(57) [Summary] [Purpose] To collect chips separately from the printed circuit board without stopping the dust collection. [Structure] Dust collector 8 connecting the dust collector 9 and the pressure foot
And a shutter 11 that branches from the dust collecting passage 8 and is connected to the inside of the pressure foot to block the other when the other is opened. The substrate collecting passage 10 has a filter 12 and a valve at the end. A pipe 14 provided with a branch 13 from the substrate collection path 10 and a substrate collection box 1 detachable from the pipe 14.
5 is provided.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a device for collecting a printed circuit board having a side of 20 mm or less which is externally processed by a printed circuit board processing machine.

[0002]

[Prior Art]

 The printed circuit board is a product that has been cut out into the required size after the specified processing is completed after undergoing processes such as drilling and etching.

As a printed circuit board processing machine for processing the outer shape of a printed circuit board, for example, one disclosed in Japanese Utility Model Laid-Open No. 2-15843 has been proposed. In this printed circuit board processing machine, immediately before the printed circuit board is separated from the base material, the connection between the pressure foot and the dust collector is cut off and the capturing means is connected to the dust collector. Then, the printed circuit board cut out from the base material is picked up by the capturing means and collected in the collection box. The pressure foot disclosed in Japanese Utility Model Laid-Open No. 61-5509 is used as the pressure foot that presses the printed board when cutting the printed board from the base material.

[0004]

[Problems to be solved by the device]

 In the above-mentioned printed circuit board processing machine, since the dust collector and the pressure foot are shut off immediately before the printed circuit board is cut off, the cutting chips when cutting are scattered around the processing section. Therefore, when the next printed circuit board is processed, chips may be pressed against the printed circuit board by the brush of the pressure foot, and the printed circuit board may be damaged such as indentations. Further, the separated printed circuit board is picked up by the capturing means and conveyed to the collection box. In view of the above situation, the purpose of the present invention is to separate the printed circuit board from the cutting circuit without stopping the dust collection of the cutting chips. It is an object of the present invention to provide a printed circuit board collection device in a printed circuit board processing machine that enables collection.

[0005]

[Means for Solving the Problems]

 In order to achieve the above object, in the present invention, there is provided a substrate collection path having a suction port installed in the pressure foot, which is branched from a dust collection path connecting a pressure collector and a dust collector attached to a printed circuit board processing machine. Provided with a valve at one end, provided with a pipe branched from the substrate recovery passage, provided a substrate recovery box connected to this pipe, and captured the printed circuit board on the dust collector side at the pipe branch position of the substrate recovery passage. A filter that allows chips to pass through is provided, and when one of the dust collection path and the substrate collection path is opened between this filter and the branch position of the dust collection path and the substrate collection path, the other is blocked. A shutter was provided, and the valve was opened and closed by the negative pressure acting on the substrate recovery path.

[0006]

[Action]

 Then, until just before the printed circuit board is separated from the base material, the chips are sucked through the dust collection path connecting the dust collector and the pressure foot. Immediately before separating the printed circuit board, the shutter is switched, and the chips are sucked through the substrate collection path with the suction port inside the pressure foot. At this time, the valve is sucked because the substrate recovery path becomes negative pressure, and the inlet of the substrate recovery box is closed. In this state, the printed circuit board separated from the base material is taken together with the cutting chips from the substrate recovery path toward the dust collector and captured by the suction filter. Then, by switching the shutter, suctioning chips again through the dust collection path eliminates the negative pressure in the board recovery path, and the printed circuit board captured by the filter is passed through the piping to be installed on the valve. It is dropped to and collected in the substrate collection box. At this time, the suction force to the valve is released, so the inlet of the substrate recovery box is open.

[0007]

【Example】

 An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. In the figure, the printed circuit board 1 is separated from the base material 2. A spindle 5 rotatably held by a spindle unit 3 of a printed circuit board processing machine holds a tool 5 for processing in a detachable manner. The pressure foot 6 is slidably fitted to the spindle unit 3, a brush 7 is fixed to the tip of the pressure foot 6, and a dust collecting path 8 is connected to the side surface.

The dust collector 9 is connected to the dust collecting passage 8. The substrate recovery path 10 is branched from the dust collection path 8, and its suction port is installed inside the pressure foot 6. The shutter 11 is arranged so as to cross the dust collecting path 8 and the substrate collecting path 10, and when one is opened, the other is shut off. The filter 12 is provided in the substrate recovery path 10. A hole having a size capable of capturing the printed circuit board 1 and allowing chips to pass therethrough is formed and provided in the substrate recovery path 10. A pipe 14 provided with a valve 13 at one end branches from the substrate recovery path 10. The substrate recovery box 15 is detachably connected to the pipe 14.

In the above structure, while the dust collector 9 is operated and the shutter 11 is set to the position where the dust collecting passage 8 is opened, the brush 7 of the pressure foot 6 holds down the base material 2 and the print substrate 1. Then, the tool 5 and the base material 2 are moved relative to each other along the trajectory of the outer shape of the printed board 1 to cut out the printed board 1. Then, just before the printed circuit board 1 is separated from the base material 2, the shutter 11 is switched, the dust collecting path 8 is shut off, and the board collecting path 10 is opened. Then, the chips generated in the processing section are sucked into the dust collector 9 through the substrate recovery path 10. At the same time, since the inside of the pipe 14 has a negative pressure, the valve 13 is sucked and closes the outlet of the pipe 14.

In this state, after the printed board 1 is separated from the base material 2, the pressure foot 6 is moved so that the printed board 1 remains inside the pressure foot 6, and the pressing by the brush 7 is removed. Then, the printed circuit board 1 is sucked into the substrate collecting path 10 and sent to the dust collector 9 together with the chips. Then, the printed circuit board 1 is captured by the filter 12. At this time, the chips pass through the filter 12 and are collected in the dust collector 9.

In this way, when the printed circuit board 1 is captured by the filter 12, the shutter 11 operates to shut off the substrate collecting path 10 and open the dust collecting path 8. Then, the negative pressure in the substrate collecting path 10 is released and the negative pressure in the pipe 14 is also released, so that the valve 13 is restored and the outlet of the pipe 14 is opened. At the same time, since the suction force acting on the printed circuit board 1 disappears, the printed circuit board 1 drops from the filter 12 onto the valve 13 and slides on the valve 13 to be recovered in the substrate recovery box 15.

[0012]

[Effect of the device]

 As described above, according to the present invention, a substrate collection path is provided which is branched from the dust collection path connecting the dust collector attached to the printed circuit board processing machine and the pressure foot, and the suction port is installed in the pressure foot. Provided with a valve, a pipe branched from the substrate collection passage, and a substrate collection box connected to this pipe were provided.The printed circuit board was captured on the dust collector side at the pipe branch position of the substrate collection passage to permeate chips. A filter is provided, and a shutter is provided between the filter and the branch position of the dust collection path and the substrate collection path so that when one of the dust collection path and the substrate collection path is opened, the other is shut off. Since the valve is opened and closed by the negative pressure acting on the substrate collecting path, the chips and the printed circuit board can be separated and collected without stopping the collection of the chips.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing a configuration on a dust collector side of a printed circuit board recovery device according to the present invention.

FIG. 2 is a configuration diagram showing a configuration of a processing machine side of a printed circuit board recovery device according to the present invention.

[Explanation of symbols]

1 printed circuit board, 6 pressure foot, 9
Dust collection path, 10 substrate recovery path, 11 shutter,
12 filters, 13 valves, 14 piping
15 PCB recovery box,

Claims (1)

[Scope of utility model registration request] 1. A substrate collection path is provided which is branched from a dust collection path connecting a pressure collector and a dust collector attached to a printed circuit board processing machine, and a suction port is installed in the pressure foot.
A valve is provided at one end, a pipe branched from the substrate collection path is provided, a substrate collection box connected to this pipe is provided, and the printed circuit board is captured on the dust collector side of the piping branch position of the substrate collection path to collect chips. A filter that allows light to pass through is provided between the branch position of the filter and the dust collecting path and the substrate collecting path, and a shutter that blocks the other of the dust collecting path and the substrate collecting path when the other is opened, A printed circuit board collecting device in a printed circuit board processing machine, wherein the valve is opened and closed by a negative pressure acting on the substrate collecting path.