JPH055108A - Production of copper powder - Google Patents
Production of copper powderInfo
- Publication number
- JPH055108A JPH055108A JP3154767A JP15476791A JPH055108A JP H055108 A JPH055108 A JP H055108A JP 3154767 A JP3154767 A JP 3154767A JP 15476791 A JP15476791 A JP 15476791A JP H055108 A JPH055108 A JP H055108A
- Authority
- JP
- Japan
- Prior art keywords
- copper powder
- powder
- copper
- solvent
- stored
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 54
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000463 material Substances 0.000 claims abstract description 10
- 239000002904 solvent Substances 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 5
- 239000000843 powder Substances 0.000 abstract description 12
- 239000004020 conductor Substances 0.000 abstract description 6
- 230000003647 oxidation Effects 0.000 abstract description 5
- 238000007254 oxidation reaction Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 5
- -1 Cu (NO 2 ) Chemical compound 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical class [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
- Conductive Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、各種導体材料として使
用される銅粉の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing copper powder used as various conductor materials.
【０００２】[0002]
【従来の技術】各種電子部品の電極、回路基板の導体な
どの導体材料として銅が広く使用されている。銅は各種
導体材料の中で銀に次いで電気抵抗が小さく、また比較
的安価であるという利点を備えている。2. Description of the Related Art Copper is widely used as a conductive material for electrodes of various electronic parts and conductors of circuit boards. Copper has the second lowest electrical resistance of silver among various conductor materials, and has the advantage of being relatively inexpensive.
【０００３】そのような用途に銅を使用するには、銅を
銅粉の形で用意し、これをバインダー，ガラススリット
などに混合させ分散させてペースト状にした後、スクリ
ーン印刷法などで必要個所に導電厚膜を塗布することが
行われる。ここで、導電厚膜の膜厚を制御し易くするた
めに、使用する銅粉は高充填性のものが望ましい。In order to use copper for such an application, it is necessary to prepare copper in the form of copper powder, mix this with a binder, glass slit, etc. to disperse it into a paste, and then use a screen printing method or the like. The conductive thick film is applied to the spot. Here, in order to facilitate control of the thickness of the conductive thick film, it is desirable that the copper powder used has a high filling property.
【０００４】図２は従来の銅粉の製造方法を工程順に説
明するものである。先ず、工程Ａで、銅を含んだ原材料
例えばＣｕ（ＮＯ2 ），ＣｕＳＯ4 ，ＣｕＯなどを用意
する。次に、工程Ｂで溶液還元、電解還元などの還元処
理を施して反応させることにより、銅粉を形成する。続
いて、工程Ｃのように銅粉を乾燥させた後、工程Ｄのよ
うに大気中、あるいは真空中又は不活性ガス中で保管す
る。次に工程Ｅのようにその銅粉を取出して、ボールミ
ル，スタンプミルなどでたたいて、リン片形状に変形さ
せ、銅リン片粉の形で得る。この銅リン片粉は前記よう
に、導電厚膜の材料として用いられる。FIG. 2 illustrates a conventional method for producing copper powder in the order of steps. First, in step A, raw materials containing copper, such as Cu (NO 2 ), CuSO 4 , CuO, etc., are prepared. Next, in step B, a reduction treatment such as solution reduction or electrolytic reduction is performed and reacted to form copper powder. Subsequently, after the copper powder is dried as in step C, it is stored in the atmosphere as in step D, or in vacuum or in an inert gas. Next, as in the step E, the copper powder is taken out and tapped with a ball mill, a stamp mill or the like to be deformed into a scaly piece shape to obtain a copper scaly powder. As described above, this copper flake powder is used as the material for the conductive thick film.
【０００５】[0005]
【発明が解決しようとする課題】ところで従来の銅粉の
製造方法では、反応工程からリン片化工程までの間に、
乾燥，保管している間に銅粉が酸化してしまうという問
題がある。このため、リン片化工程で銅粉が付着しにく
くなってしまうので、充填性の高いものを得るのが不可
能になる。銅粉の酸化は、真空中又は不活性ガス中で保
管したとしても、これらの中に微量の酸素が存在してい
るため避けることができない。By the way, in the conventional method for producing copper powder, between the reaction step and the descaling step,
There is a problem that copper powder is oxidized during drying and storage. For this reason, it becomes difficult for copper powder to adhere in the scaly process, so that it becomes impossible to obtain the one having high filling property. Oxidation of copper powder cannot be avoided even if it is stored in a vacuum or in an inert gas because a trace amount of oxygen is present in them.
【０００６】本発明は以上のような問題に対処してなさ
れたもので、高充填性の銅粉が得られるようにした銅粉
の製造方法を提供することを目的とするものである。The present invention has been made in consideration of the above problems, and an object of the present invention is to provide a method for producing a copper powder capable of obtaining a highly-filled copper powder.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に本発明は、銅含有材料を還元処理して銅粉を形成する
工程と、この銅粉を溶剤中で保管する工程と、この銅粉
をリン片化処理する工程とを含むことを特徴とするもの
である。In order to achieve the above object, the present invention provides a step of reducing a copper-containing material to form copper powder, a step of storing the copper powder in a solvent, and a step of storing the copper powder. And a step of subjecting the powder to scaly treatment.
【０００８】[0008]
【作用】還元処理して得た銅粉を溶剤中で保管する。こ
の溶剤には酸素が存在していないため、銅粉の酸化は防
止されて表面が活性化される。従って、この銅粉はリン
片化処理する際付着し易くなるので、充填性の高いもの
を得ることができる。Function: The copper powder obtained by the reduction treatment is stored in a solvent. Since oxygen is not present in this solvent, oxidation of the copper powder is prevented and the surface is activated. Therefore, this copper powder easily adheres during the scaly treatment, and thus a highly filling material can be obtained.
【０００９】[0009]
【実施例】以下図面を参照して本発明の実施例を説明す
る。Embodiments of the present invention will be described below with reference to the drawings.
【００１０】図１は本発明の銅粉の製造方法を示す工程
図である。以下この工程順に沿って説明する。FIG. 1 is a process diagram showing a method for producing copper powder according to the present invention. The steps will be described below in order.
【００１１】先ず、工程Ａで、銅を含んだ原材料例えば
Ｃｕ（ＮＯ2 ），ＣｕＳＯ4 ，ＣｕＯなどを用意する。
次に、工程Ｂで溶液還元，電解還元のなどの還元処理を
施して反応させることにより、銅粉を形成する。この銅
粉は粒径が０．２乃至０．３μｍの球状に形成される。First, in step A, raw materials containing copper, such as Cu (NO 2 ), CuSO 4 , CuO, etc., are prepared.
Next, in step B, a reduction treatment such as solution reduction or electrolytic reduction is performed and reacted to form copper powder. The copper powder is formed into a spherical shape having a particle size of 0.2 to 0.3 μm.
【００１２】続いて、工程Ｃのように銅粉を溶剤中、例
えばトルエン溶剤に浸漬することにより保管する。これ
によって銅粉に対する酸素の反応を遮断することができ
る。次に、工程Ｄのようにその銅粉を取出して、ボール
ミル，スタンプミルなどでたたいて、リン片形状に形成
させ、銅リン片粉の形で得る。この場合のリン片化処理
の条件は、 ボールミル 直径４００ｍｍ，内容積５０ｌ メディア スレンレスボール１３０ｋｇ 投入物 銅粉１０ｋｇ，トルエン２０ｋｇ 回転条件 ４３ｒｐｍ，４０時間 で行った。Subsequently, as in the step C, the copper powder is stored by being immersed in a solvent, for example, a toluene solvent. This can block the reaction of oxygen with the copper powder. Next, as in the step D, the copper powder is taken out and tapped with a ball mill, a stamp mill or the like to form a scaly piece, which is obtained in the form of copper scaly powder. In this case, the conditions for the flaking treatment were a ball mill diameter of 400 mm, an internal volume of 50 l, a media slenless ball of 130 kg, a copper powder of 10 kg, a toluene of 20 kg, and a rotation condition of 43 rpm for 40 hours.
【００１３】続いて、この銅リン片粉は前記のように、
導電厚膜の材料として用いられ、バインダー，ガラスス
リットなどに混合してペーストにされる。Subsequently, this copper phosphorus powder is, as described above,
It is used as a material for the conductive thick film and is mixed with a binder, glass slit, etc. to form a paste.
【００１４】このような本実施例によれば、反応工程か
らリン片化工程までの間に、銅粉は溶剤中で保管される
ので、銅粉の酸化は防止されて表面が活性化される。従
って、銅粉はリン片化処理する際付着し易くなるので、
充填性の高いものを得ることができる。According to this embodiment, since the copper powder is stored in the solvent between the reaction step and the flaking step, the copper powder is prevented from being oxidized and the surface is activated. .. Therefore, since the copper powder easily adheres during the scaly treatment,
It is possible to obtain a product having a high filling property.
【００１５】これにより、この銅粉をバインダー，ガラ
ススリットなどに混合してペーストにしたものを導電厚
膜として塗布するとき、導電厚膜の膜厚の制御がし易く
なる。よって余分なペーストを消費することが避けら
れ、また微細パターンを形成する場合でも側面への広が
りが抑えられるので、高密度パターンの形成が可能とな
る。Thus, when a paste obtained by mixing the copper powder with a binder, a glass slit or the like is applied as a conductive thick film, the thickness of the conductive thick film can be easily controlled. Therefore, it is possible to avoid consuming extra paste, and even when forming a fine pattern, it is possible to suppress the spread to the side surface, so that it is possible to form a high-density pattern.
【００１６】表１は、従来による乾燥保管後及び本実施
例による保管後に、各々得られたリン片化処理済みの銅
粉のタップ密度の測定結果を示すものである。Table 1 shows the measurement results of the tap density of the copper powder subjected to the flaking treatment obtained after the conventional dry storage and after the storage according to this embodiment.
【００１７】[0017]
【表１】 [Table 1]
【００１８】タップ密度は充填性の指標を表わしてお
り、この値が大きいほど銅粉の充填性が高いことを示し
ている。表１から明らかなように、従来例に対して本実
施例では、タップ密度を約７５％向上することができ
る。The tap density represents an index of filling property, and the larger this value is, the higher the filling property of copper powder is. As is clear from Table 1, in this embodiment, the tap density can be improved by about 75% as compared with the conventional example.
【００１９】このように本実施例によれば、銅粉をペー
スト状にして各種導体材料として使用する場合、製造工
程の途中で品質に影響を与えないように安定に保管する
ことができるようになるので、品質管理上も有利とな
り、銅粉の劣化を気にして必要以上に処理を急ぐ制約が
なくなり、余裕を持って製造することができるようにな
る。As described above, according to the present embodiment, when the copper powder is used in the form of a paste and used as various conductor materials, it can be stably stored so as not to affect the quality during the manufacturing process. Therefore, it is advantageous in terms of quality control, and there is no restriction to rush the treatment more than necessary due to deterioration of the copper powder, and it is possible to manufacture with a margin.
【００２０】[0020]
【発明の効果】以上述べたように本発明によれば、銅粉
を製造する際途中工程で溶剤中で銅粉を保管するように
したので、酸化を防止して高充填性の銅粉を得ることが
できる。As described above, according to the present invention, since the copper powder is stored in the solvent in the intermediate step when the copper powder is produced, it is possible to prevent the oxidation and prevent the copper powder from having a high filling property. Obtainable.
【図１】本発明の銅粉の製造方法を示す工程図である。FIG. 1 is a process drawing showing a method for producing copper powder according to the present invention.
【図２】従来の銅粉の製造方法を示す工程図である。FIG. 2 is a process diagram showing a conventional method for producing copper powder.
Claims (1)
る工程と、この銅粉を溶剤中で保管する工程と、この銅
粉をリン片化処理する工程とを含むことを特徴とする銅
粉の製造方法。 【請求項２】 前記溶剤中で保管する工程が、トルエン
溶剤に浸漬する工程から成る請求項１記載の銅粉の製造
方法。Claim: What is claimed is: 1. A step of reducing copper-containing material to form copper powder, a step of storing the copper powder in a solvent, and a step of exfoliating the copper powder. A method for producing copper powder, comprising: 2. The method for producing copper powder according to claim 1, wherein the step of storing in the solvent comprises a step of immersing in a toluene solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3154767A JPH055108A (en) | 1991-06-26 | 1991-06-26 | Production of copper powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3154767A JPH055108A (en) | 1991-06-26 | 1991-06-26 | Production of copper powder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH055108A true JPH055108A (en) | 1993-01-14 |
Family
ID=15591451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3154767A Withdrawn JPH055108A (en) | 1991-06-26 | 1991-06-26 | Production of copper powder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH055108A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002015622A (en) * | 2000-06-30 | 2002-01-18 | Fukuda Metal Foil & Powder Co Ltd | Copper powder for electro-conductive paste and its manufacturing method |
| US9931283B2 (en) | 2004-11-09 | 2018-04-03 | Cupron Inc. | Methods and materials for skin care |
-
1991
- 1991-06-26 JP JP3154767A patent/JPH055108A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002015622A (en) * | 2000-06-30 | 2002-01-18 | Fukuda Metal Foil & Powder Co Ltd | Copper powder for electro-conductive paste and its manufacturing method |
| US9931283B2 (en) | 2004-11-09 | 2018-04-03 | Cupron Inc. | Methods and materials for skin care |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100480863B1 (en) | Copper fine powder and method for preparing the same | |
| JP4660701B2 (en) | Silver-coated copper powder, method for producing the same, and conductive paste | |
| JP5394084B2 (en) | Silver-plated copper fine powder, conductive paste produced using silver-plated copper fine powder, and method for producing silver-plated copper fine powder | |
| US4735676A (en) | Method for forming electric circuits on a base board | |
| JPWO2008059789A1 (en) | Silver-plated copper fine powder, conductive paste produced using silver-plated copper fine powder, and method for producing silver-plated copper fine powder | |
| EP1839784A1 (en) | Nickel powder, process for producing the same, and conductive paste | |
| JP2005267900A (en) | Conductive paste and its manufacturing method | |
| JPS6381706A (en) | Composition for copper based thick film | |
| JP5453598B2 (en) | Silver-coated copper powder and conductive paste | |
| JP2007188845A (en) | Conductive powder, conductive paste and electrical circuit | |
| JPH055108A (en) | Production of copper powder | |
| KR100729211B1 (en) | Composite substance containing metal particles, conductive paste and manufacturing method thereof | |
| JP2003342621A (en) | Method for manufacturing copper powder and copper powder obtained thereby | |
| CN113242774B (en) | Silver paste | |
| JP3656558B2 (en) | Conductive paste and electronic component using the same | |
| JP6175304B2 (en) | Copper composite particles, copper paste containing the same, and circuit board manufacturing method using the same | |
| US4160284A (en) | Capacitors and process for making same | |
| JP6332124B2 (en) | Copper powder and conductive paste, conductive paint, conductive sheet using the same | |
| JP3396640B2 (en) | Copper fine powder for solventless thermosetting conductive paste for via holes and solventless thermosetting conductive paste for via holes | |
| TWI829835B (en) | Silver paste | |
| WO2017179524A1 (en) | Silver-coated copper powder and method for producing same | |
| CN113226595B (en) | Silver paste | |
| JP2004183060A (en) | Polyaniline-based resin coated copper powder, its manufacturing method, and conductive paste obtained by using the powder | |
| JP3130676B2 (en) | Copper fine powder for filling via holes | |
| JP3203492B2 (en) | Paint and multilayer inductor using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980903 |