JPH0549760B2 - - Google Patents
Info
- Publication number
- JPH0549760B2 JPH0549760B2 JP3415685A JP3415685A JPH0549760B2 JP H0549760 B2 JPH0549760 B2 JP H0549760B2 JP 3415685 A JP3415685 A JP 3415685A JP 3415685 A JP3415685 A JP 3415685A JP H0549760 B2 JPH0549760 B2 JP H0549760B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- bath
- tin
- seconds
- energization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007747 plating Methods 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 19
- 229910001174 tin-lead alloy Inorganic materials 0.000 claims description 15
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 230000002159 abnormal effect Effects 0.000 description 16
- 238000001556 precipitation Methods 0.000 description 14
- 239000002253 acid Substances 0.000 description 4
- 210000001787 dendrite Anatomy 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000009499 grossing Methods 0.000 description 3
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229940044654 phenolsulfonic acid Drugs 0.000 description 2
- 238000002203 pretreatment Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- -1 tin and lead Chemical class 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3415685A JPS61194196A (ja) | 1985-02-22 | 1985-02-22 | 電気錫−鉛合金メツキ法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3415685A JPS61194196A (ja) | 1985-02-22 | 1985-02-22 | 電気錫−鉛合金メツキ法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61194196A JPS61194196A (ja) | 1986-08-28 |
| JPH0549760B2 true JPH0549760B2 (ko) | 1993-07-27 |
Family
ID=12406339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3415685A Granted JPS61194196A (ja) | 1985-02-22 | 1985-02-22 | 電気錫−鉛合金メツキ法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61194196A (ko) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63118093A (ja) * | 1986-11-05 | 1988-05-23 | Tanaka Electron Ind Co Ltd | 電子部品の錫めつき方法 |
| JP2697773B2 (ja) * | 1991-03-11 | 1998-01-14 | 日本エレクトロプレイテイング・エンジニヤース 株式会社 | メッキ方法 |
| US5750017A (en) * | 1996-08-21 | 1998-05-12 | Lucent Technologies Inc. | Tin electroplating process |
| GB0106131D0 (en) * | 2001-03-13 | 2001-05-02 | Macdermid Plc | Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys |
| JP4725145B2 (ja) * | 2005-03-17 | 2011-07-13 | 日本電気株式会社 | 合金めっき方法および合金めっき装置 |
| JP5168555B2 (ja) * | 2008-04-01 | 2013-03-21 | 三菱マテリアル株式会社 | はんだめっき用アノード材 |
-
1985
- 1985-02-22 JP JP3415685A patent/JPS61194196A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61194196A (ja) | 1986-08-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3303111A (en) | Electro-electroless plating method | |
| JP4221064B2 (ja) | 銅層の電解析出方法 | |
| US20070158204A1 (en) | Tin and tin alloy electroplating method with controlled internal stress and grain size of the resulting deposit | |
| JP4812365B2 (ja) | 錫電気めっき液および錫電気めっき方法 | |
| US3940319A (en) | Electrodeposition of bright tin-nickel alloy | |
| US4681670A (en) | Bath and process for plating tin-lead alloys | |
| JPS6254397B2 (ko) | ||
| US3264199A (en) | Electroless plating of metals | |
| JPH0549760B2 (ko) | ||
| US3953624A (en) | Method of electrolessly depositing nickel-phosphorus alloys | |
| US5234572A (en) | Metal ion replenishment to plating bath | |
| US2397522A (en) | Process for the electrodeposition of tin alloys | |
| US3928147A (en) | Method for electroplating | |
| US4265715A (en) | Silver electrodeposition process | |
| US4069113A (en) | Electroplating gold alloys and electrolytes therefor | |
| US2435967A (en) | Bright alloy plating | |
| JPH0573837B2 (ko) | ||
| US4297179A (en) | Palladium electroplating bath and process | |
| US20040031694A1 (en) | Commercial process for electroplating nickel-phosphorus coatings | |
| US3003933A (en) | Electro-plating of metals | |
| US4615774A (en) | Gold alloy plating bath and process | |
| US5169692A (en) | Tin lead process | |
| JP7121390B2 (ja) | すず合金電気めっき浴及びそれを用いためっき方法 | |
| US5185076A (en) | Bath and method for electrodepositing tin, lead and tin-lead alloy | |
| US3984291A (en) | Electrodeposition of tin-lead alloys and compositions therefor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |