JPH0548770B2 - - Google Patents
Info
- Publication number
- JPH0548770B2 JPH0548770B2 JP25096185A JP25096185A JPH0548770B2 JP H0548770 B2 JPH0548770 B2 JP H0548770B2 JP 25096185 A JP25096185 A JP 25096185A JP 25096185 A JP25096185 A JP 25096185A JP H0548770 B2 JPH0548770 B2 JP H0548770B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy
- resin composition
- type phenolic
- resins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25096185A JPS62112622A (ja) | 1985-11-11 | 1985-11-11 | 封止用樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25096185A JPS62112622A (ja) | 1985-11-11 | 1985-11-11 | 封止用樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62112622A JPS62112622A (ja) | 1987-05-23 |
| JPH0548770B2 true JPH0548770B2 (enFirst) | 1993-07-22 |
Family
ID=17215589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25096185A Granted JPS62112622A (ja) | 1985-11-11 | 1985-11-11 | 封止用樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62112622A (enFirst) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62135516A (ja) * | 1985-12-09 | 1987-06-18 | Polyplastics Co | 電気部品封止剤 |
| JPS6386758A (ja) * | 1986-09-30 | 1988-04-18 | Toho Rayon Co Ltd | 樹脂組成物 |
| JP4092790B2 (ja) * | 1998-09-30 | 2008-05-28 | 日立化成工業株式会社 | 回路板 |
| EP4610290A1 (en) * | 2022-10-24 | 2025-09-03 | Taiyo Holdings Co., Ltd. | Curable resin composition, multilayer structure, cured product and electronic component |
-
1985
- 1985-11-11 JP JP25096185A patent/JPS62112622A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62112622A (ja) | 1987-05-23 |
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