JPH0548351U - Lead mount type semiconductor device - Google Patents
Lead mount type semiconductor deviceInfo
- Publication number
- JPH0548351U JPH0548351U JP9875491U JP9875491U JPH0548351U JP H0548351 U JPH0548351 U JP H0548351U JP 9875491 U JP9875491 U JP 9875491U JP 9875491 U JP9875491 U JP 9875491U JP H0548351 U JPH0548351 U JP H0548351U
- Authority
- JP
- Japan
- Prior art keywords
- mounting plate
- resin
- plate portion
- lead
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】
【目的】電気回路部を被覆封止するモールド樹脂に未充
填部が生じないよう製造できるような構成を備えたリー
ドマウント型半導体装置を提供する。
【構成】半導体素子が搭載される取付板部を先端に一体
に備えた一体型リード端子部と該取付板部との間に、取
付板部と略同じ幅を有し該取付板部および一体型リード
端子部に対し各々略直交方向に位置するガイド接続部
を、屈曲手段により一体に形成する。取付板部全体およ
びガイド接続部を含む電気回路部をモールド樹脂で被覆
封止する。従って、製造過程の樹脂注入工程において、
各リード端子部側の樹脂注入口から注入された樹脂が、
比較的幅の広いガイド接続部で一旦堰き止められた後に
ガイド接続部に沿って取付板部と下側モールド金型との
間に導かれ、この狭い注入空間に樹脂が先ず充填される
ので、モールド樹脂に未充填部が生じるのを防止するこ
とができる。
(57) [Abstract] [PROBLEMS] To provide a lead mount type semiconductor device having a structure that can be manufactured so that an unfilled portion does not occur in a molding resin that covers and seals an electric circuit portion. A mounting plate portion on which a semiconductor element is mounted is integrally provided at a front end thereof and an integrated lead terminal portion having a width substantially the same as that of the mounting plate portion. Guide connecting portions located substantially orthogonal to the body type lead terminal portion are integrally formed by bending means. The entire mounting plate portion and the electric circuit portion including the guide connection portion are covered and sealed with a molding resin. Therefore, in the resin injection process of the manufacturing process,
The resin injected from the resin injection port on each lead terminal side
Since it is once dammed by the relatively wide guide connecting portion and then guided along the guide connecting portion between the mounting plate portion and the lower molding die, the resin is first filled in this narrow injection space. It is possible to prevent the unfilled portion from being generated in the molding resin.
Description
【０００１】[0001]
本考案は、複数個分の構成を一体に有するリードフレームに、複数個の半導体 素子を所定箇所に搭載し且つ電気的配線を施した後に、各電気回路部分を個々に モールド樹脂で被覆封止してリードフレームを所定の切断線に沿い切断すること により、複数個を同時に製作できるリードマウント型半導体装置に関するもので ある。 According to the present invention, a plurality of semiconductor elements are mounted at predetermined locations on a lead frame integrally having a plurality of components, and electrical wiring is provided, and then each electric circuit portion is individually covered and sealed with a molding resin. The present invention relates to a lead mount type semiconductor device in which a plurality of lead frames can be manufactured simultaneously by cutting the lead frame along a predetermined cutting line.
【０００２】[0002]
この種のリードマウント型半導体装置を、その製作手順に基づき説明する。先 ず図５に示すように、リードフレーム（１）は、装置複数個分（図では２個分の み図示）の構成を一体に備えており、装置１個分の構成について見ると、一体型 リード端子部（３）およびこれの両側の別体型リード端子部（４），（５）が互 いに平行に位置して基帯部（２）から直交方向に一体に突設され、一体型リード 端子部（３）の先端部に図６に示すような屈曲部（６）を介在して矩形状の取付 板部（６）が一体に延設され、各リード端子部（３）〜（５）が、基帯部（２） に対し平行な連結帯部（８）で連結され、また、取付板部（７）には透孔（９） が穿設された形状になっている。 A lead mount type semiconductor device of this type will be described based on its manufacturing procedure. First, as shown in FIG. 5, the lead frame (1) is integrally provided with a plurality of devices (only two devices are shown in the figure). The body type lead terminal portion (3) and the separate body type lead terminal portions (4) and (5) on both sides of the body type lead terminal portion (3) are positioned in parallel with each other and integrally project from the base band portion (2) in an orthogonal direction. A rectangular mounting plate portion (6) is integrally extended to the tip portion of the body type lead terminal portion (3) with a bent portion (6) as shown in FIG. (5) is connected by a connecting strip (8) parallel to the base strip (2), and the mounting plate (7) is formed with a through hole (9). .
【０００３】 そして、リードフレーム（１）における各取付板部（７）に半導体素子（１０ ）がダイボンドによりそれぞれ搭載され、更に、この各半導体素子（１０）がボ ンディングワイヤ（１１）により両側の別体型リード端子部（４），（５）に電 気的接続されて所要の電気回路部が各々構成される。Then, the semiconductor element (10) is mounted on each mounting plate portion (7) of the lead frame (1) by die bonding, and further, each semiconductor element (10) is mounted on both sides by a bonding wire (11). Electrically connected to the separate lead terminal portions (4) and (5) to form required electric circuit portions, respectively.
【０００４】 その後に、取付板部（７）全体を含む電気回路部分が図１に１点鎖線で示すよ うにモールド樹脂（１２）で被覆封止される。図７は樹脂（１２）の注入状態の 縦断面図を示し、この樹脂（１２）の注入に際し、前述の電気回路部分を下側モ ールド金型（１３）内にセットした後に、この下側モールド金型（１３）に上側 モールド金型（１４）を合体させることにより樹脂（１２）の注入空間および樹 脂注入口（１５）がそれぞれ形設され、各リード端子部（３）〜（５）が樹脂注 入口（１５）から外部に導出された状態となる。この時、両モールド金型（１３ ），（１４）に挿通された各位置決めピン（１６），（１７）が取付板部（７） の先端部を両面から挟持するとともに、上側モールド金型（１４）の軸部（１８ ）が透孔（９）に挿通されて電気回路部を有するリードフレーム（１）が位置決 めされる。After that, the electric circuit portion including the entire mounting plate portion (7) is covered and sealed with a mold resin (12) as shown by a chain line in FIG. FIG. 7 shows a vertical cross-sectional view of a resin (12) injecting state. When injecting the resin (12), after setting the above-mentioned electric circuit portion in the lower mold (13), the lower side By injecting the upper mold die (14) into the mold die (13), an injection space for the resin (12) and a resin injection port (15) are respectively formed, and the lead terminal portions (3) to (5) are formed. ) Is led out from the resin injection port (15). At this time, the positioning pins (16) and (17) inserted into both molds (13) and (14) clamp the tip of the mounting plate (7) from both sides and the upper mold ( The shaft portion (18) of 14) is inserted into the through hole (9) to position the lead frame (1) having an electric circuit portion.
【０００５】 続いて、図７に矢印で示すように、樹脂注入口（１５）から注入空間に向かっ てトランスファモールド法により樹脂（１２）が射出されるとともに、図８に示 すように、樹脂（１２）が硬化する以前に両位置決めピン（１６），（１７）が 各々の先端面が対応するモールド金型（１３），（１４）の対向面と面一になる まで引き抜かれ、この状態で注入空間に充填された樹脂（１２）を硬化する。最 後に、図１に一点鎖線で示す各リード端子部（３）〜（５）と基帯部（２）およ び連結帯部（８）との各境界線に沿って切断して各リード端子部（３）〜（５） を基帯部（２）および連結帯部（８）から分離することにより、複数個のリード マウント型半導体装置が同時に完成する。Subsequently, as shown by the arrow in FIG. 7, the resin (12) is injected from the resin injection port (15) toward the injection space by the transfer molding method, and as shown in FIG. Before the (12) is hardened, the positioning pins (16) and (17) are pulled out until their tip surfaces are flush with the facing surfaces of the corresponding molds (13) and (14). The resin (12) filled in the injection space is cured by. Finally, each lead is cut along each boundary line between the lead terminal portions (3) to (5) and the base strip portion (2) and the connecting strip portion (8) shown by the dashed line in FIG. By separating the terminal parts (3) to (5) from the base band part (2) and the connection band part (8), a plurality of lead mount type semiconductor devices are simultaneously completed.
【０００６】[0006]
ところで、前述のリードマウント型半導体装置は、図７および図８に明示して いるように、モールド樹脂（１２）が、取付板部（７）における半導体素子（１ ０）の搭載部分の下方よりも上方に厚く形成された形状になっている。そのため 、両モールド金型（１３），（１４）間の注入空間に樹脂（１２）を充填する場 合、樹脂注入口（１５）からの注入樹脂が、図７に矢印で示すように屈曲部（６ ）の両側を通ってリードフレーム（１）と上側モールド金型（１４）との間の容 積の大きい注入空間に先に充填されていき、その後に、リードフレーム（１）と 下側モールド金型（１３）との間の注入空間に充填されていく。このリードフレ ーム（１）と下側モールド金型（１３）との間の注入空間は、他の注入空間に比 較して狭いために樹脂（１２）が流入され難く、完成した半導体装置の裏面に樹 脂（１２）の未充填部分が生じ易く、装置の不良原因になっている。 By the way, in the lead mount type semiconductor device described above, as clearly shown in FIGS. 7 and 8, the mold resin (12) is applied from below the mounting portion of the mounting plate portion (7) of the semiconductor element (10). Also has a shape thickly formed above. Therefore, when the resin (12) is filled in the injection space between the mold dies (13) and (14), the resin injected from the resin injection port (15) is bent at the bent portion as shown by the arrow in FIG. The injection space having a large volume between the lead frame (1) and the upper mold die (14) is first filled through both sides of (6) and then the lead frame (1) and the lower side are filled. The injection space between the mold and the mold (13) is filled. Since the injection space between the lead frame (1) and the lower mold die (13) is narrower than the other injection spaces, it is difficult for the resin (12) to flow into the injection space, so that the completed semiconductor device has a An unfilled portion of the resin (12) is likely to occur on the back surface, which is a cause of device failure.
【０００７】 そこで本考案は、樹脂をモールドする場合に注入樹脂がリードフレームと下側 モールド金型との間の狭い注入空間に先に充填されるような構成を備えたリード マウント型半導体装置を提供することを技術的課題とするものである。Therefore, the present invention provides a lead mount type semiconductor device having a structure in which, when a resin is molded, the injected resin is first filled in a narrow injection space between the lead frame and the lower molding die. It is a technical issue to provide.
【０００８】[0008]
本考案は、上記した課題を達成するための技術的手段として、リードマウント 型半導体装置を次のように構成した。即ち、先端に取付板部が一体に延設された 単一の一体型リード端子部と複数本の別体型リード端子部とが、間隔を存して並 設され、前記取付板部に搭載された半導体素子と前記各別体型リード端子部の各 々の先端部とがボンディングワイヤで電気的接続されて電気回路部が構成され、 前記取付板部全体を含む前記電気回路部がモールド樹脂により被覆封止されてな るリードマウント型半導体装置において、前記一体型リードフレーム端子部の先 端と前記取付板部とが、前記取付板部と略同じ幅を有し該取付板部および前記一 体型リード端子部に対し各々略直交方向に位置するよう屈曲形成されたガイド接 続部を介在して一体に連設されたことを特徴として構成されている。 According to the present invention, as a technical means for achieving the above-mentioned object, a lead mount type semiconductor device is configured as follows. That is, a single integrated type lead terminal portion having a mounting plate portion integrally extended at the tip and a plurality of separate type lead terminal portions are arranged side by side at a distance and mounted on the mounting plate portion. The semiconductor element and the respective tip portions of the separate-type lead terminal portions are electrically connected by a bonding wire to form an electric circuit portion, and the electric circuit portion including the entire mounting plate portion is covered with a mold resin. In a lead mount type semiconductor device which is sealed, a front end of the integrated lead frame terminal portion and the mounting plate portion have substantially the same width as the mounting plate portion, and the mounting plate portion and the integrated type It is characterized in that the lead terminals are integrally connected to each other via guide connecting portions that are formed to be bent so as to be positioned substantially orthogonal to the lead terminals.
【０００９】[0009]
このような構成を備えたリードマウント型半導体装置の製造過程において、半 導体素子を搭載してこの半導体素子をボンディングワイヤで電気的接続した電気 回路部分をモールド樹脂で被覆封止する工程において、各リード端子部が外部導 出される樹脂注入口から樹脂を注入すると、一体型リード端子部と取付板部との 間に介在するガイド接続部が、取付板部と略同じの広い幅を有しているとともに 各リード端子部や取付板部に対し略直交方向に位置しているので、注入された樹 脂が、ガイド接続部を恰も堰として流動を一旦堰き止められた後に、ガイド接続 部に沿って取付板部と下側モールド金型との間に流入する。従って、比較的容積 の小さい取付板部と下側モールド金型と間の注入空間に樹脂が先ず充填され、そ の後に、容積の広い取付板部と上側モールド金型との間の注入空間に樹脂が充填 されていく。そのため、注入空間の各部に均等に樹脂が充填されてモールド樹脂 に未充填部分が生じることがない。 In the process of manufacturing a lead mount type semiconductor device having such a structure, in the process of mounting a semiconductor element and covering the electric circuit portion electrically connecting the semiconductor element with a bonding wire with a molding resin, When the resin is injected from the resin injection port through which the lead terminal section is externally guided, the guide connection section that is interposed between the integrated lead terminal section and the mounting plate section has a wide width that is almost the same as the mounting plate section. In addition, since it is located in a direction substantially orthogonal to each lead terminal part and mounting plate part, the injected resin is temporarily blocked by the guide connection part as a weir, and then flows along the guide connection part. Flow between the mounting plate and the lower mold. Therefore, the injection space between the mounting plate part having a relatively small volume and the lower molding die is first filled with resin, and then the injection space between the mounting plate part having a large volume and the upper molding die is filled. The resin is being filled. Therefore, the resin is evenly filled in each part of the injection space, and the molding resin does not have an unfilled portion.
【００１０】[0010]
以下、本考案の好適な実施例について図面を参照しながら詳述する。図１乃至 図４はそれぞれ本考案のリードマウント型半導体装置の一実施例におけるリード フレームの平面図、同リードフレームの一部の斜視図、製造過程の樹脂充填工程 における縦断面図、同樹脂充填状態における位置決めピンを引き抜いた状態の縦 断面図を示す。これらの図において、図５乃至図８と同等のものに説明を簡略化 するために同一の符号を附してその説明を省略する。そして、相違する点は、リ ードフレーム（１）の一体型リード端子部（３）と取付板部（７）との間に、図 ２に示すように、取付板部（７）と同一幅を有し取付板部（７）および一体型リ ード端子部（３）に対し各々略直交方向に位置ガイド接続部（１９）を、屈曲手 段により一体に介設した構成のみである。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. 1 to 4 are a plan view of a lead frame, a perspective view of a part of the lead frame, a vertical sectional view in a resin filling step of a manufacturing process, and a resin filling in a lead mount type semiconductor device according to an embodiment of the present invention, respectively. The longitudinal cross-sectional view of the state in which the positioning pin is pulled out is shown. In these figures, the same parts as those in FIGS. 5 to 8 are designated by the same reference numerals to simplify the description, and the description thereof will be omitted. The difference lies in that the same width as the mounting plate portion (7) is provided between the integrated lead terminal portion (3) and the mounting plate portion (7) of the lead frame (1) as shown in FIG. Only the structure in which the position guide connecting portion (19) is integrally provided by a bending step in a direction substantially orthogonal to the mounting plate portion (7) and the integrated lead terminal portion (3).
【００１１】 従って、製作手順は既存装置と同様である。即ち、取付板部（７）に半導体素 子（１０）をボンディングして搭載し、この半導体素子（１０）と両別体型リー ド端子部（４），（５）の各先端部とをボンディングワイヤ（１１）により電気 的接続して電気回路部を構成し、この電気回路部を、図３に示すように両モール ド金型（１３），（１４）の合体によ形設された注入空間内にセットし、樹脂注 入口（１５）から樹脂を注入する。この時、ガイド接続部（１９）が、取付板部 （７）と同一の広い幅を有しているとともに各リード端子部（３）〜（５）や取 付板部（７）に対し略直交方向に位置しているので、注入された樹脂（１２）が 、図３で矢印で示すように、ガイド接続部（１９）を恰も堰として流動を一旦堰 き止められた後に、ガイド接続部（１９）に沿って取付板部（７）と下側モール ド金型（１３）との間に流入する。従って、比較的容積の小さいリードフレーム （１）と下側モールド金型（１３）と間の注入空間に樹脂（１２）が先ず充填さ れ、その後に、容積の広いリードフレーム（１）と上側モールド金型（１４）と の間の注入空間に樹脂（１２）が充填されていく。そのため、注入空間の各部に 均等に樹脂（１２）が充填されてモールド樹脂（１２）に未充填部分が生じるこ とがない。尚、図４は図８と同様に樹脂（１２）が硬化する以前に両位置決めピ ン（１６），（１７）を対応する各モールド金型（１３），（１４）の対向面に 面一になるまで引き抜いた状態を示している。Therefore, the manufacturing procedure is similar to that of the existing device. That is, the semiconductor element (10) is bonded and mounted on the mounting plate portion (7), and the semiconductor element (10) and the respective tip portions of the separate type lead terminal portions (4) and (5) are bonded. An electric circuit portion is formed by electrically connecting the wires (11), and the electric circuit portion is formed by combining the two mold dies (13) and (14) as shown in FIG. Set in the space and inject resin from the resin injection port (15). At this time, the guide connecting portion (19) has the same wide width as the mounting plate portion (7), and is substantially different from the lead terminal portions (3) to (5) and the mounting plate portion (7). Since the resin (12) is positioned in the orthogonal direction, the injected resin (12) is temporarily blocked by the guide connecting portion (19) as a weir, as shown by the arrow in FIG. It flows along between (19) and between the mounting plate part (7) and the lower mold die (13). Therefore, the resin (12) is first filled in the injection space between the lead frame (1) having a relatively small volume and the lower molding die (13), and then the lead frame (1) having a large volume and the upper side are filled. The resin (12) is filled into the injection space between the molding die (14). Therefore, the resin (12) is not evenly filled in each part of the injection space, and an unfilled part is not generated in the mold resin (12). Incidentally, in FIG. 4, as in FIG. 8, before positioning the resin (12), the positioning pins (16) and (17) are flush with the facing surfaces of the corresponding molding dies (13) and (14). It shows the state of being pulled out until.
【００１２】[0012]
以上のように本考案のリードマウント型半導体装置によると、一体型リード端 子部と取付板部との間に、取付板部と略同じ幅のガイド接続部を直交方向に位置 するよう屈曲形成して一体に設けた構成としたので、製造に際しモールド樹脂の 注入工程において、注入された樹脂が比較的幅の広いガイド接続部により一旦堰 き止められた後にこのガイド接続部に沿って取付板と下側モールド金型との狭い 空間に導かれるので、モールド樹脂に未充填部が生じることがなく、信頼性の高 い装置を得ることができる。 As described above, according to the lead mount type semiconductor device of the present invention, the guide connection portion having substantially the same width as the mounting plate portion is formed by bending between the integrated lead terminal portion and the mounting plate portion. In the process of injecting the mold resin during manufacturing, the injected resin is once dammed by the relatively wide guide connection part and then installed along the guide connection part. Since it is guided to a narrow space between the lower molding die and the lower molding die, an unfilled portion does not occur in the molding resin, and a highly reliable device can be obtained.
【００１３】 しかも、リードフレームの一部形状を変更するだけであって部品点数が増加し ないので、コスト高となることもない。Moreover, since only a part of the shape of the lead frame is changed and the number of parts does not increase, the cost does not increase.
【図１】本考案の一実施例における電気回路部を形成し
た製造過程の平面図である。FIG. 1 is a plan view of a manufacturing process of forming an electric circuit unit according to an embodiment of the present invention.
【図２】同上、要部の斜視図である。FIG. 2 is a perspective view of a main part of the same.
【図３】同上、樹脂注入工程の縦断面図である。FIG. 3 is a vertical sectional view of a resin injection step of the same.
【図４】同上、樹脂注入工程で位置決めピンを引き抜い
た状態の縦断面図である。FIG. 4 is a vertical sectional view showing a state in which a positioning pin is pulled out in the resin injection step.
【図５】従来装置における電気回路部を形成した製造過
程の平面図である。FIG. 5 is a plan view of a manufacturing process in which an electric circuit unit is formed in a conventional device.
【図６】同上、一部の斜視図である。FIG. 6 is a partial perspective view of the same.
【図７】同上、樹脂注入工程の縦断面図である。FIG. 7 is a vertical sectional view of the resin injection step of the same.
【図８】同上、樹脂注入工程で位置決めピンを引き抜い
た状態の縦断面図である。FIG. 8 is a vertical sectional view showing a state in which a positioning pin is pulled out in the resin injection step of the above.
３ 一体型リード端子部 ４，５ 別体型リード端子部 ７ 取付板部 １０ 半導体素子 １１ ボンディングワイヤ １２ モールド樹脂 １９ ガイド接続部 3 Integrated lead terminal 4, 5 Separate lead terminal 7 Mounting plate 10 Semiconductor element 11 Bonding wire 12 Mold resin 19 Guide connection
Claims (1)
の一体型リード端子部と複数本の別体型リード端子部と
が、間隔を存して並設され、前記取付板部に搭載された
半導体素子と前記各別体型リード端子部の各々の先端部
とがボンディングワイヤで電気的接続されて電気回路部
が構成され、前記取付板部全体を含む前記電気回路部が
モールド樹脂により被覆封止されてなるリードマウント
型半導体装置において、前記一体型リードフレーム端子
部の先端と前記取付板部とが、前記取付板部と略同じ幅
を有し該取付板部および前記一体型リード端子部に対し
各々略直交方向に位置するよう屈曲形成されたガイド接
続部を介在して一体に連設されたことを特徴とするリー
ドマウント型半導体装置。1. A single integrated lead terminal portion having a mounting plate portion integrally extended at a tip thereof and a plurality of separate lead terminal portions are arranged side by side with a space therebetween, and the mounting plate portion is provided. The semiconductor element mounted on the substrate and the tip of each of the separate type lead terminal portions are electrically connected by a bonding wire to form an electric circuit portion, and the electric circuit portion including the entire mounting plate portion is molded resin. In the lead mount type semiconductor device which is covered and sealed by the above, the tip of the integrated lead frame terminal portion and the mounting plate portion have substantially the same width as the mounting plate portion, and the mounting plate portion and the integral type A lead-mount type semiconductor device, wherein the lead-mount type semiconductor device is integrally provided with a guide connection portion formed in a bent manner so as to be located in a direction substantially orthogonal to the lead terminal portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9875491U JPH0548351U (en) | 1991-11-29 | 1991-11-29 | Lead mount type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9875491U JPH0548351U (en) | 1991-11-29 | 1991-11-29 | Lead mount type semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0548351U true JPH0548351U (en) | 1993-06-25 |
Family
ID=14228237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9875491U Pending JPH0548351U (en) | 1991-11-29 | 1991-11-29 | Lead mount type semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0548351U (en) |
-
1991
- 1991-11-29 JP JP9875491U patent/JPH0548351U/en active Pending
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