JPH0548307U - coil - Google Patents

Abstract

(57) [Summary] (Corrected) [Purpose] To shorten the process time and improve the economic efficiency by manufacturing the coil without using plating solution or the like and without the troublesome work such as filling holes. . [Structure] Conductive patterns are formed on a first film 11 at a predetermined pitch, and conductive terminal patterns 13a, 1 are formed.
On the first printed coil board on which 3b is formed, a second printed coil board having conductive patterns formed on the second film 21 at a predetermined pitch is turned over and laminated with an insulating film in between. Then, the reference holes are made to coincide with each other, and in this state, the portions of the hole for pattern connection provided in the insulating film are heated from above and below to melt the cream solder printed on each conductive pattern and connect the end portions of the conductive pattern. . This is bent to form a coil.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a coil applied to, for example, a choke coil, a transformer, a current transformer and the like.

[0002]

[Prior Art]

 As a coil having a conductive pattern formed on an insulating film substrate to form a coil, for example, those disclosed in JP-B-54-41702 and JP-A-58-151006 are known. These form spiral conductive patterns on both surfaces of an insulating film substrate at a predetermined pitch, and connect the ends of the conductive patterns on both surfaces with through-hole conductors. In addition, a fusion resin coating or insulating coating is applied to insulate the conductive pattern.

For example, Japanese Patent Laid-Open No. 58-151006 has a structure shown in FIG. That is, as shown in FIG. 7A, an adhesive is applied to both front and back surfaces of the base film 1, and copper foils 2a and 2b are attached to both surfaces to manufacture the composite ribbon 3. Then, through holes 41, 42, ... Are opened on the longitudinal center line of the composite ribbon 3. Then, a conductive layer is formed on the inner surfaces of the through holes 41, 42, ..., Further, a metal plating layer is further formed on the surfaces of the copper foils 2a, 2b and the through hole conductive layers, and then solder is applied to the through holes. The front surface and the back surface of the composite ribbon 3 are smoothed by filling and polishing the solder surface. Next, as shown in FIGS. 7B and 7C, a spiral metal layer pattern is formed at a predetermined pitch on the front and back surfaces of the composite ribbon 3 by photoetching with reference to the through holes 41, 42, .... At this time, the conductors of the odd-numbered through holes 43, 45, ... Terminate the beginning of the coil pattern on the front side to the end of the coil pattern on the back side, and the conductors of the even-numbered through holes 42, 44, ... Terminate the coil pattern on the front side. Connect to the beginning of the coil pattern on the back.

Then, as shown in FIG. 7 (d), for every predetermined number of coil patterns, the terminal end portion of the coil pattern on the back surface and the starting end portion of the coil pattern located next to the coil pattern on the front surface are used for covering the terminal fixing portion. Then, the front and back of the composite ribbon 3 are covered with the insulating films 6a and 6b. Next, the entire front and back surfaces of the composite ribbon 3 are covered with the fusion bonding resins 7a and 7b. Further, as shown in FIG. 7 (e), the outer edge of the coil pattern of the composite ribbon 3 and the core hole are punched to form the composite ribbon 3 into a beaded shape to form a coil original shape.

[0005]

[Problems to be solved by the device]

 However, in such a conventional coil, electroless plating, electroplating, hole filling, etc. are performed in order to connect through-holes between conductive patterns, which requires a lot of time for the work, resulting in a long process time and Since the plating solution is used, large-scale equipment is required, and there is a problem of poor economic efficiency.

Therefore, the present invention provides a coil that can be manufactured without using any plating solution or the like and without any troublesome work such as filling holes, thus shortening the process time and improving the economical efficiency. It is the one we are trying to provide.

[0007]

[Means for Solving the Problems]

 The present invention provides a first printed coil board having a plurality of spiral conductive patterns and energizing terminal patterns formed on a first film at a predetermined pitch, and a first printed coil board on a second film. A plurality of coils are arranged at a predetermined pitch corresponding to the pitch of the spiral conductive pattern of the printed coil board and in the same winding direction when facing the corresponding spiral conductive pattern of the first printed coil board. A second printed coil board on which a spiral conductive pattern is formed and an energizing terminal pattern is formed, and at least an end portion of each spiral conductive pattern on the first and second printed coil boards is printed. An insulating foil interposed between the heat-melted solder and the first and second printed coil boards and having a hole formed at least at a position facing the end of the spiral conductive pattern on each board facing each other. The first and second printed coil substrates are stacked with the insulating film interposed therebetween so that the corresponding conductive patterns face each other, and the heat-melting solder is heat-melted and further bent. It is something.

[0008]

[Action]

 In the present invention having such a configuration, the conductive patterns of the first and second printed coil substrates are opposed to each other, and the conductive patterns are overlapped with each other with the insulating film interposed therebetween. The conductive patterns of the two printed coil boards are connected to each other. Then, by bending this, the conductive patterns of the first and second printed coil substrates become coils having the same winding direction.

[0009]

【Example】

 Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a first printed coil substrate. This substrate has a first film 11 having a spiral first conductive pattern 12a, a second conductive pattern 12b, and a third conductive pattern. 12c, the fourth conductive pattern 12d, and the fifth conductive pattern 12e are formed at a predetermined pitch. Each of the conductive patterns 12a to 12e has a right-handed spiral shape from the inside toward the outside. The outer end of the first conductive pattern 12a is connected to the first energizing terminal pattern 13a formed on the left side of the one end of the first film 11, and the outer end of the second conductive pattern 12b and the third end of the third conductive pattern 12b. The outer end of the fourth conductive pattern 12d and the outer end of the fifth conductive pattern 12e are connected, and the right end of the other end of the first film 11 is The second energizing terminal pattern 13b is formed.

Reference holes 14a and 14b are provided at the ends of the first film 11 on opposite sides of the current-carrying terminal patterns 13a and 13b. In addition, the boundary portions between the conductive patterns 12a to 12e of the first film 11, the boundary portion between the first conductive pattern 12a and one end portion, and the boundary portion between the fifth conductive pattern 12e and the other end portion are different from each other. .. and notches 16, 16 ... For facilitating bending of the film 11 are formed in the width direction of the film 11. Further, holes 17 are formed in the central portions of the conductive patterns 12a to 12e of the first film 11 for inserting the central legs of the ferrite core later.

Cream solder is printed as heat-melting solder on the inner ends of the energizing terminal patterns 13a and 13b and the conductive patterns 12a to 12e. The cream solder may be printed on the entire conductive patterns 12a to 12e.

FIG. 2 shows a second printed coil board. This board has a second film 21 of the same size as the first film 11 and a spiral-shaped sixth conductive pattern 22 a, and a second conductive pattern 22 a. The seventh conductive pattern 22b, the eighth conductive pattern 22c, the ninth conductive pattern 22d, and the tenth conductive pattern 22e are formed at a predetermined pitch. The conductive patterns 22a to 22e are located at positions facing the conductive patterns 12a to 12e of the first film 11 when the second film 21 is superposed on the first film 11. Each of the conductive patterns 22a to 22e has a right-handed spiral shape from the inner side toward the outer side. The outer end of the sixth conductive pattern 22a and the outer end of the seventh conductive pattern 22b are connected, and the outer end of the eighth conductive pattern 22c and the outer end of the ninth conductive pattern 22d are connected. It is connected.

One end right side and the other end left side of the second film 21 are cut out, and the second film 21 is overlapped with the first film 11 and a conductive pattern at each end. Reference holes 24a, 24b are provided at positions facing the reference holes 14a, 14b when combined. Further, a boundary portion between the conductive patterns 22a to 22e of the second film 21, a boundary portion between the sixth conductive pattern 22a and one end portion, and a boundary portion between the tenth conductive pattern 22e and the other end portion are respectively formed. Long holes 25, 25, ... And notches 26, 26 ... For facilitating bending of the film 21 are opened in the width direction of the film 21. Further, holes 27, 27 ... For inserting the central legs of the ferrite core later are formed in the central portions of the conductive patterns 22a to 22e of the second film 21.

Cream solder is printed on the inner end of each of the conductive patterns 12a to 12e and the outer end of the tenth conductive pattern 22e. The cream solder may be printed on the entire conductive patterns 22a to 22e.

As a method of forming the conductive patterns 12a to 12e and 22a to 22e on the first and second films 11 and 21, for example, a copper foil is placed on a mold having irregularities corresponding to the patterns. Overlap, depressurize this to make the copper foil on the recesses indented, then stack the film in this state, stack the pressing plate and press it to punch the copper foil at the uneven boundaries of the mold and project the mold on the film It is formed by bonding the copper foil on the part.

Further, FIG. 3 shows an insulating film 31, which has the same size as the first film 11 and has a notch formed on the side opposite to the second film 21. The insulating film 31 is provided with reference holes 34a and 34b, a long hole 35, a notch 36, and a hole 37 for inserting the central leg of the ferrite core. Further, when the first film 11 and the second film 21 are superposed on the insulating film 31 with the conductive patterns facing each other with the insulating film 31 interposed therebetween, the conductive patterns 12a to 12e are formed. , 22a to 22e are provided with holes 38 for pattern connection at the positions where the inner end portions thereof face each other. As the first and second films 11 and 21 and the insulating film 31, for example, a heat-resistant polyimide film is used.

After the first and second printed coil boards and the insulating film 31 are configured in this way, the insulating film 31 is placed on the first printed coil board, and the second printed coil board is turned upside down. That is, the conductive patterns 12a to 12e of the first printed coil board and the conductive patterns 22a to 22e of the second printed coil board are laminated so as to face each other. Then, the reference holes 14a, 24a, 34a and 14b, 24b, 34b of the films 11, 21, 31 are aligned with each other. As a result, the state shown in FIG. 4 is obtained. That is, not only the reference hole but also the long holes 15, 25, 35 and the notches 16, 26, 36 are aligned with each other, and the holes 17, 27, 37 are also aligned with each other.

In this state, the portion of the pattern connecting hole 38 provided in the insulating film 31 is heated from above and below. As a result, the cream solder printed on each of the conductive patterns 12a to 12e and 22a to 22e is melted to connect the ends of the conductive patterns. That is, the inner end of the first conductive pattern 12a and the inner end of the sixth conductive pattern 22a are connected, and the inner end of the second conductive pattern 12b and the inner end of the seventh conductive pattern 22b are connected. Are connected, the inner end of the third conductive pattern 12c and the inner end of the eighth conductive pattern 22c are connected, and the inner end of the fourth conductive pattern 12d and the inner end of the ninth conductive pattern 22d are connected. Are connected, the inner end of the fifth conductive pattern 12e and the inner end of the tenth conductive pattern 22e are connected, and the outer end of the tenth conductive pattern 22e and the second conducting terminal pattern 13b are connected. The coil base 41 is formed by the connection. The films 11, 21, and 31 are also heat-sealed as necessary.

The coil base body 41 configured as described above is bent in a zigzag shape at each of the long holes 15, 25, 35 and the notches 16, 26, 36 as shown in FIG. If heated at this time, the respective films are fused and fixed in a bent state.

Finally, as shown in FIG. 6, the ferrite core 42 is attached to the center of the bent coil base body 41. At this time, the central leg of the ferrite core 42 is inserted into the holes 17, 27 and 37.

As described above, since each pattern is connected by simply heating and melting the cream solder without using through holes, it is necessary to perform processing such as electroless plating, electrolytic plating, and hole filling. Work becomes easier. Therefore, the process time can be shortened. In addition, since no plating solution is used, large-scale equipment is not required and economic efficiency can be improved.

Further, since the film is used as the substrate, a long film, on which the conductive patterns 12a to 12e and 22a to 22e and the energizing terminal patterns 13a and 13b are repeatedly formed, is wound in a roll shape. Then, it is possible to easily realize automation by sequentially paying out this and manufacturing a product in which the coil bases 41 are connected as shown in FIG.

In the above embodiment, the holes 17, 27, 37 for inserting the central leg of the ferrite core were first opened, but the holes are not necessarily limited to this, and the holes may be opened by pressing after bending. May be.

[0025]

[Effect of the device]

 As described in detail above, according to the present invention, a coil can be manufactured without using any plating liquid or the like and without troublesome work such as filling holes, thus shortening the process time and improving the economical efficiency. It is possible to provide a coil that can be used.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a first printed coil board according to an embodiment of the present invention.

FIG. 2 is a configuration diagram of a second printed coil board in the embodiment.

FIG. 3 is a configuration diagram of an insulating film in the example.

FIG. 4 is a configuration diagram of a coil substrate in the example.

FIG. 5 is a perspective view showing a bent state of the coil base body according to the embodiment.

FIG. 6 is a perspective view showing a coil completed in the example.

FIG. 7 is a diagram showing a configuration of a conventional coil.

[Explanation of symbols]

11 ... 1st film, 12a-12e ... Conductive pattern, 13a, 13b ... Energizing terminal pattern, 21 ... 2nd
, 22a to 22e ... Conductive patterns, 31 ... Insulating film, 38 ... Pattern connecting holes.

Claims (1)

[Scope of utility model registration request] 1. A first printed coil board having a plurality of spiral conductive patterns and current-carrying terminal patterns formed on a first film at a predetermined pitch, and the first printed coil board on a second film. So as to have the same winding direction at a predetermined pitch corresponding to the pitch of the spiral conductive pattern of the printed coil board and when facing the corresponding spiral conductive pattern of the first printed coil board. A second printed coil board on which a plurality of spiral conductive patterns are formed and at the same time a current-carrying terminal pattern is formed;
The heat-melted solder printed on at least an end portion of each spiral conductive pattern on the second printed coil board and the spiral shape which is interposed between the first and second printed coil boards and which opposes at least on each board. And an insulating film having a hole formed at a position facing the end of the conductive pattern, the first and second printed coil boards having the corresponding conductive patterns facing each other with the insulating film interposed therebetween. A coil formed by stacking the layers, heating and melting the heat-melted solder, and further bending.