JPH0548062A - Method for cutting substrate end sections of image sensor substrate - Google Patents

Abstract

PURPOSE:To improve the cutting accuracy by forming the groove section on the upper side of translucent substrate or the lower side of insulation substrate by means of the first blade and then cutting the translucent and insulation substrates from the bottom face of the groove section by means of the second cutting blade that is smaller in blade width than the first cutting blade. CONSTITUTION:A groove section is formed by using a dicing blade 31 in the direction crossing orthogonally the lengthwise direction of transparent substrate 2 between the formation side of warp filter 21 on the substrate 2 in a color image sensor and the right above position of a light receiving element 10a in an insulation substrate 1 end section. Next, while the stage with a color image sensor mounted is being inclined by 5 to 10 degrees, the remaining section of the substrate 2 and the substrate 1 are cut off along the cutting mark line 15 prepared just when respective electrodes comprising the element 10a are subject to patterning, from the bottom section by means of a dicing blade 32 smaller in blade width than that of the blade 31 in such a way that a cutting edge face will be inclined inward. Thus, both sides on which the elements 10 are formed can be cut off at optional positions.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of cutting an end portion of an image sensor substrate, for example, a translucent substrate having a color filter or the like laminated on an insulating substrate having a large number of light receiving elements formed in a line. The present invention relates to a method for cutting an image sensor substrate.

[0002]

2. Description of the Related Art Conventionally, a solid-state image pickup device used in a facsimile or the like has, for example, a plurality of individual electrodes on an insulating substrate.
There is proposed a thin film structure in which a photoelectric conversion layer and a common electrode are sequentially laminated to form a light receiving element array, and image information of a document or the like is projected one-to-one and converted into an electric signal. The width of the thin-film light-receiving element array is limited by the film deposition device that deposits a metal film or a semiconductor film. Therefore, in order to be able to read a wide original, for example, a plurality of light-receiving element arrays formed Are arranged so as to be connected and connected to each other to obtain one long light receiving element array. When connecting a plurality of sensor substrates, it is necessary to increase the cutting accuracy so that the pixel pitch of the adjacent light receiving elements at the connection connection point becomes uniform with the pixel pitch of the light receiving element array.

Conventionally, as shown in FIG. 4, an individual electrode 11 made of a metal film discretely formed on an insulating substrate 1 and a photoelectric conversion layer 1 made of a semiconductor film striped in the left-right direction in the drawing.
2. When a band-shaped common electrode 13 made of a transparent conductive film is sequentially laminated to form a light-receiving element array in which a large number of light-receiving elements 10 are arranged in a row, and a sensor substrate formed by coating a protective film 14 is cut off. For example, by aligning the cutting blade 16 from above the sensor substrate with the cutting mark line 15 formed at the same time as the patterning of the individual electrode 11 and cutting along the cutting mark line 15, the edge light receiving element 10 of the sensor substrate is obtained.
It can be cut at a desired distance (1/2 of the pixel pitch) from a.

[0004]

Recently, with the development of an image sensor capable of reading a color image, for example, as shown in FIG. 5, a red, green or blue filter 2 is provided.
A color image sensor having a structure in which 1 is formed on a transparent substrate 2 and the transparent substrate 2 is arranged on an insulating substrate 1 via an adhesive 17 so that the filter 21 corresponds to each light receiving element 10 is proposed. There is. However, if the end portion of the color image sensor substrate having the above structure is to be cut by the above-mentioned conventional method, the thickness required to be cut is increased by the thickness of the transparent substrate 2, so that the stress applied to the cutting blade is increased, and as shown in FIG. The cut surface may tilt like this. As a result, the lowermost surface of the insulating substrate 1 becomes longer than the end surface of the light receiving element array, and the uppermost surface of the transparent substrate 2 becomes longer than the end surface of the light receiving array.

When such color image sensor substrates are connected and connected to each other on the sensor support substrate 3 with the adhesive 18, as shown in FIG. 6, the pixel pitch in the connection portion changes and the connection in the connection portion is changed. The accuracy deteriorates and the pixel pitch in the light receiving element array cannot be uniform. Particularly, in a color image sensor, since the light receiving elements are generally high in density, higher cutting accuracy has been required.

The present invention has been made in view of the above circumstances, and when cutting a substrate end portion of an image sensor substrate formed by arranging a transparent substrate on an insulating substrate having a large number of light receiving elements formed in a line, An object of the present invention is to provide a cutting method capable of improving the cutting accuracy.

[0007]

In order to solve the above-mentioned problems of the conventional example, the method of the present invention is an image sensor substrate in which a light-transmissive substrate is arranged on an insulating substrate having a large number of light receiving elements formed in a line. In the method of cutting a substrate end part, a groove portion forming step of forming a groove portion with a first cutting blade on the upper side of the translucent substrate or the lower side of the insulating substrate; A substrate cutting step of cutting the translucent substrate and the insulating substrate along the groove with a narrow second cutting blade;
It is characterized by having.

[0008]

According to the method of the present invention, the groove is formed by the first cutting blade on the upper side of the translucent substrate or the lower side of the insulating substrate in the groove forming step, and the width of the blade is narrower than that of the first cutting blade. Since the translucent substrate and the insulating substrate are cut from the bottom surface of the groove by the narrow second cutting blade, the cutting thickness of the first cutting blade and the second cutting blade is inclined by the stress received by the cutting blade. The cutting accuracy can be improved.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the method of the present invention will be described with reference to FIGS. The color image sensor includes a sensor substrate in which a light receiving element 10 formed by laminating discrete electrodes, a photoelectric conversion layer, and a common electrode that are discretely formed is formed on an insulating substrate 1 made of glass, and a red, green, or blue color. And the transparent substrate 2 on which the filter 21 of
Each filter 21 is arranged so as to correspond to each light receiving element 10 with an adhesive 30 interposed therebetween. The same parts as those in FIG. 4 showing the conventional example are designated by the same reference numerals.

Then, a dicing blade (cutting blade) 31 is used from the side opposite to the filter 21 forming side of the transparent substrate 2 of the color image sensor, and the light receiving element 1 at the end of the insulating substrate 1 is used.
The groove 40 is formed in a direction orthogonal to the lengthwise direction of the transparent substrate 2 up to a position directly above 0a. Next, the stage (not shown) on which the color image sensor is mounted is replaced by 5 to 10
The dicing blade 32, which has a smaller blade width than the dicing blade 31, tilts inward from the bottom of the groove 40 along the cutting mark line 15 formed at the same time when the individual electrodes constituting the light receiving element 10 are patterned. The remaining portion of the transparent substrate 2 and the insulating substrate 1 are inclined.
Disconnect. By this cutting, the surface side on which the light receiving element 10 is formed can be cut at a position at a desired distance (1/2 of the distance between pixels) from the end light receiving element 10a. Also,
The lower surface side of the insulating substrate 1 can be made shorter than the length of the surface on which the light receiving element 10 is formed. In the above cutting method, the groove 40 is formed on the transparent substrate 2 side, but the groove may be provided on the back surface side of the insulating substrate 1 in FIG. 1 and then cut.

According to the above method, the dicing blade 3
The cutting thickness at the time of cutting by 1 is thinner than the thickness of the transparent substrate 2, and the cutting thickness by the dicing blade 32 is the thickness of the insulating substrate 1 from the thickness of the transparent substrate 2 to the depth of the groove portion 40. Therefore, the stress applied to the dicing blades 31 and 32 at the time of cutting can be reduced as compared with the conventional method, and the dicing blades 31 and 32 can be cut without inclining from a desired cutting surface to improve the cutting accuracy. You can

Next, a method of connecting and connecting a plurality of color image sensors cut in the above steps will be described. The adhesive 50 is applied on the sensor support substrate 3, the color image sensors are arranged so that their cut surfaces face each other, and the adhesive 50 is also applied to the wedge-shaped space 60 between the cut surfaces of the color image sensors. To fill. Therefore, since the wedge-shaped space 60 is provided between the color image sensors, even if burrs or the like occur at the cut portions of the color image sensors, the influence of the burrs is not affected and the deterioration of the connection accuracy can be prevented.

Further, the adhesive 50 is filled and applied also on the recesses 61 formed between the respective groove portions 40 of the color image sensors and on the transparent substrate 2, and the transparent member 4 is arranged on the color image sensors connected and connected. To do. By disposing the transparent member 4, the adhesive 50 at the connecting portion is flattened. That is, in the case where the transparent member 4 is not provided, as shown in FIG. 3, the adhesive 50 squeezes out at the connecting portion, and incident light is diffusely reflected by the protruding portion, resulting in variations in the sensitivity of the light receiving element in the vicinity of the connecting portion. Let In this embodiment, the unevenness of the sensitivity can be prevented by flattening the protrusion of the adhesive 50 at the connection portion. As the adhesive 50 filled in the wedge-shaped space 60 and the recess 61, and the transparent member 4 arranged on the transparent substrate 2, a resin or glass plate having substantially the same refractive index as the insulating substrate 1 and the transparent substrate 2 is used. As a result, the light transmitted through this portion is prevented from being greatly refracted so that variations in the sensitivity of the light receiving element in the vicinity of the connection portion do not occur.
The adhesive that fills the wedge-shaped space 60 has the same refractive index as that of the insulating substrate 1 because the flare light transmitted between the light receiving elements 10 and reflected by the lower surface of the insulating substrate 1 is evenly distributed to each light receiving element 10. This is to prevent variations in sensitivity by making the light incident.

In the above embodiment, the method of cutting when the thickness of the sensor substrate is increased by placing the transparent substrate 2 on which the color filter 21 is formed on the insulating substrate 1 has been described. It can be applied to the case where a protective substrate provided with a filter for blocking infrared rays or ultraviolet rays is mounted on the.

[0015]

According to the method of the present invention, the first groove is formed on the upper side of the transparent substrate or the lower side of the insulating substrate by the groove forming step.
The groove portion is formed by the first cutting blade and the second cutting blade having a narrower blade width than the first cutting blade cuts the transparent substrate and the insulating substrate from the bottom surface of the groove portion. Since the cutting thickness of the second cutting blade can be set so that the cutting surface does not tilt due to the stress received by the cutting blade, it is possible to prevent the cutting surface from tilting from a desired cutting surface and improve the cutting accuracy. it can.

[Brief description of drawings]

1 (a) to 1 (c) are explanatory views of a process showing an embodiment of the method of the present invention.

FIG. 2 is an explanatory cross-sectional view showing a connected connection state of the color image sensor cut in this embodiment.

FIG. 3 is a cross-sectional explanatory view showing a connected state when a transparent member is not installed in FIG.

FIG. 4 is a cross-sectional explanatory diagram illustrating a conventional method for cutting a sensor substrate.

5 is a cross-sectional explanatory view showing a cut state by the method of FIG.

FIG. 6 is an explanatory cross-sectional view showing a connected state of a conventional color image sensor.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Insulating substrate, 2 ... Transparent substrate, 3 ... Sensor support substrate, 4 ... Transparent member, 10 ... Light receiving element, 21 ... Filter, 31 ... Dicing blade (first cutting blade),
32 ... Dicing blade (second cutting blade), 40 ...
Groove, 50 ... Adhesive 60 ... Wedge-shaped space, 61 ...
Recess

Claims (1)

[Claims] 1. A method of cutting a substrate end portion of an image sensor substrate, comprising a transparent substrate arranged on an insulating substrate having a large number of light-receiving elements formed in a line, wherein the upper side of the transparent substrate or the transparent substrate is cut off. A groove forming step of forming a groove on the lower side of the insulating substrate by a first cutting blade, and a translucent substrate and an insulating substrate along the groove by a second cutting blade having a blade width narrower than that of the first cutting blade. And a substrate cutting step of cutting the substrate.