JPH0547888A - System for detecting mismount of package group - Google Patents

System for detecting mismount of package group

Info

Publication number
JPH0547888A
JPH0547888A JP23082891A JP23082891A JPH0547888A JP H0547888 A JPH0547888 A JP H0547888A JP 23082891 A JP23082891 A JP 23082891A JP 23082891 A JP23082891 A JP 23082891A JP H0547888 A JPH0547888 A JP H0547888A
Authority
JP
Japan
Prior art keywords
package
group
information
mismount
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23082891A
Other languages
Japanese (ja)
Inventor
Hiroyuki Yasui
宏幸 安井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP23082891A priority Critical patent/JPH0547888A/en
Publication of JPH0547888A publication Critical patent/JPH0547888A/en
Pending legal-status Critical Current

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To detect mismount of a package group with a simple mechanism by changing for every package the terminal position of signal where packages are series-connected in a device where package groups are mounted each by connectors on a back wiring board. CONSTITUTION:In a device where package groups are mounted each by connectors on a back wiring board, terminal numbers of input terminals of mount information ranging from a first package 11 to an Nth package 20 are made different. In the case where any different package is inserted or none is inserted, ground information 12 latched by the first package 11 is not transmitted to a monitor circuit 23, so that the monitor circuit 23 outputs package mount information 24. This process facilitates detection of mismount of package groups with no firm wares by devising connection of a back wiring board.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、パッケ−ジ群誤実装検
出方式に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package group erroneous mounting detection method.

【0002】[0002]

【従来の技術】従来、この種のパッケ−ジ群誤実装検出
方式は、パッケ−ジ毎にパッケ−ジの種別情報を与え、
情報収集部が各パッケ−ジからデ−タを集める際にパッ
ケ−ジの実装位置と得られたパッケ−ジ種別とを照合す
ることにより行われていた。
2. Description of the Related Art Conventionally, this type of package group erroneous mounting detection method gives package type information for each package,
When the information collecting unit collects data from each package, the package mounting position is compared with the obtained package type.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、従来の
パッケ−ジ群誤実装検出方式は、拡張性の点で有利では
あるが、必ずファ−ムウエアが必要となるため、簡単な
装置に適用する場合、コストの点で問題があった。
However, although the conventional package group erroneous mounting detection method is advantageous in terms of expandability, it always requires firmware, and therefore is applied to a simple device. , There was a problem in terms of cost.

【0004】したがって本発明は、前述した従来の問題
を解決するためになされたものであり、その目的は、パ
ッケ−ジ群の誤実装を簡単な仕組みで検出することがで
きるパッケ−ジ群誤実装検出方式を提供することにあ
る。
Therefore, the present invention has been made in order to solve the above-mentioned conventional problems, and an object thereof is a package group error which can detect an erroneous mounting of the package group by a simple mechanism. It is to provide a mounting detection method.

【0005】[0005]

【課題を解決するための手段】このような目的を達成す
るために本発明によるパッケ−ジ群誤実装検出方式は、
バックワイアリングボ−ドにパッケ−ジ群が各々コネク
タで実装される装置において、パッケ−ジの実装状態を
監視する監視回路と、この監視回路に実装情報を転送す
るパッケ−ジ群を直列接続する情報収集線とを有し、各
パッケ−ジおいて直列接続された信号の端子位置をパッ
ケ−ジ毎に変えるようにしたものである。
In order to achieve such an object, the package group erroneous mounting detection method according to the present invention is
In a device in which each package group is mounted on the back wiring board by a connector, a monitoring circuit that monitors the mounting state of the package and a package group that transfers mounting information to this monitoring circuit are connected in series. The information collecting line is provided, and the terminal positions of signals connected in series in each package are changed for each package.

【0006】[0006]

【作用】本発明においては、第1のパッケ−ジで取り込
んだ地気情報が各パッケ−ジを介して監視回路に伝えら
れないと、監視回路からパッケ−ジ誤実装情報が出力さ
れることになる。
In the present invention, if the ground information taken in by the first package is not transmitted to the monitoring circuit through each package, the monitoring circuit outputs erroneous package information. become.

【0007】[0007]

【実施例】以下、図面を用いて本発明の実施例を詳細に
説明する。図1は本発明によるパッケ−ジ群誤実装検出
方式の一実施例を説明するパッケ−ジ群誤実装検出回路
のブロック図である。同図において、第1のパッケ−ジ
11は実装を確認すための地気情報12を端子13から
パッケ−ジ内に取り込み、端子14に出力する。第2の
パッケ−ジ15は第1のパッケ−ジ11の端子14の出
力を端子16からパッケ−ジ内に取り込み、端子17に
出力する。第N番目のパッケ−ジ20は第N−1番目の
パッケ−ジ18の端子19に出力された情報を端子21
でパッケ−ジ内に取り込み、端子22に出力する。監視
回路23は第N番目のパッケ−ジ20の端子22の出力
を実装情報として取り込む。
Embodiments of the present invention will be described in detail below with reference to the drawings. 1 is a block diagram of a package group erroneous mounting detection circuit for explaining an embodiment of a package group erroneous mounting detection method according to the present invention. In the figure, the first package 11 takes in the ground information 12 for confirming the mounting from the terminal 13 into the package and outputs it to the terminal 14. The second package 15 takes the output of the terminal 14 of the first package 11 from the terminal 16 into the package and outputs it to the terminal 17. The Nth package 20 outputs the information output to the terminal 19 of the N-1th package 18 to the terminal 21.
It is taken into the package with and output to the terminal 22. The monitoring circuit 23 takes in the output of the terminal 22 of the Nth package 20 as mounting information.

【0008】このとき、第1のパッケ−ジ11から第N
番目のパッケ−ジ20までの間での実装情報の入力端子
の端子番号を、すべて異なる番号にすることにより、第
1番のパッケージ11から第N番目のパッケージ20ま
でのパッケ−ジのうち、いずれか1つでも異なるパッケ
−ジが挿入された場合または1つでも挿入されていない
パッケ−ジがある場合には第1のパッケ−ジ11で取り
込んだ地気情報12は監視回路23に伝えられないた
め、監視回路23はパッケ−ジ誤実装情報24を出力す
ることができる。
At this time, from the first package 11 to the Nth package
By making the terminal numbers of the mounting information input terminals up to the 20th package 20 all different, among the packages from the 1st package 11 to the Nth package 20, If any one of the different packages is inserted, or if any of the packages is not inserted, the geographic information 12 acquired by the first package 11 is transmitted to the monitoring circuit 23. Therefore, the monitoring circuit 23 can output the package erroneous mounting information 24.

【0009】[0009]

【発明の効果】以上、説明したように本発明によるパッ
ケ−ジ群誤実装検出方式によれば、バックワイアリング
ボ−ドの接続を工夫することにより、ファ−ムウエア当
を持たずに容易にパッケ−ジ群の誤実装を検出すること
ができるという極めて優れた効果が得られる。
As described above, according to the package group erroneous mounting detection method according to the present invention, the connection of the back wiring board is devised so that it can be easily carried out without having a firmware strike. An extremely excellent effect that the erroneous mounting of the package group can be detected is obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明によるパッケ−ジ群誤実装検出方式の
一実施例を説明するパッケ−ジ群誤実装検出回路のブロ
ック図である。
FIG. 1 is a block diagram of a package group erroneous mounting detection circuit for explaining an embodiment of a package group erroneous mounting detection method according to the present invention.

【符号の説明】[Explanation of symbols]

11 第1のパッケ−ジ 12 地気情報 13 端子 14 端子 15 第2のパッケ−ジ 16 端子 17 端子 18 第N−1番目のパッケ−ジ 19 端子 20 第N番目のパッケ−ジ 21 端子 22 端子 23 監視回路 24 誤実装情報 11 First Package 12 Ground Information 13 Terminals 14 Terminals 15 Second Package 16 Terminals 17 Terminals 18th N-1st Package 19 Terminals 20 Nth Package 21 Terminals 22 Terminals 23 Monitoring circuit 24 Mis-mounting information

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 バックワイアリングボ−ドにパッケ−ジ
群が各々コネクタで実装されるパッケ−ジ群誤実装検出
回路において、前記パッケ−ジの実装状態を監視する監
視回路と、前記監視回路に実装情報を転送する前記パッ
ケ−ジ群を直列接続する情報収集線とを有し、前記各パ
ッケ−ジおいて直列接続された信号の端子位置をパッケ
−ジ毎に変えることを特徴とするパッケ−ジ群誤実装検
出方式。
1. A monitoring circuit for monitoring a mounting state of a package in a package group erroneous mounting detection circuit, wherein each package group is mounted on a back wiring board by a connector, and the monitoring circuit. And an information collecting line for serially connecting the package group for transferring mounting information, and changing the terminal position of the serially connected signal in each package for each package. Package group erroneous mounting detection method.
JP23082891A 1991-08-19 1991-08-19 System for detecting mismount of package group Pending JPH0547888A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23082891A JPH0547888A (en) 1991-08-19 1991-08-19 System for detecting mismount of package group

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23082891A JPH0547888A (en) 1991-08-19 1991-08-19 System for detecting mismount of package group

Publications (1)

Publication Number Publication Date
JPH0547888A true JPH0547888A (en) 1993-02-26

Family

ID=16913916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23082891A Pending JPH0547888A (en) 1991-08-19 1991-08-19 System for detecting mismount of package group

Country Status (1)

Country Link
JP (1) JPH0547888A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010098582A (en) * 2008-10-17 2010-04-30 Nec Commun Syst Ltd Output stop control circuit and communication apparatus, and output stop control method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010098582A (en) * 2008-10-17 2010-04-30 Nec Commun Syst Ltd Output stop control circuit and communication apparatus, and output stop control method

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