JPH054548U - Heater chip for electrode heating soldering - Google Patents

Abstract

(57) [Abstract] [Purpose] Obtaining a heater chip for electrode heating soldering for soldering the lead wire of the electronic component to be soldered without displacement due to the pressing load of the heater chip for electrode heating soldering. .. [Structure] A stepped structure is formed at an interval equal to the interval between lead wires of an electronic component to be soldered. [Effect] By using a heater chip having a force applied in the width direction of the lead wire, the lead wire is corrected in position misalignment and soldering can be performed without protruding from the pattern.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a heater chip for reflow soldering a lead wire of an electronic component on a printed wiring board by an electrode heating soldering method.

[0002]

[Prior Art]

 FIG. 3 is a view showing a conventional heater chip for electrode heating and soldering. In the figure, 4 is a heater chip for electrode heating and soldering.

A conventional heater chip for electrode heating and soldering is aligned with, for example, a lead wire of an electronic component to be soldered on a printed wiring board, and the pressing load of the heater chip causes the lead wire and the printed wiring board to be soldered. After the patterns are brought into close contact with each other, the heater chip temperature is raised above the melting point of the solder to melt the solder and complete the soldering.

[0004]

[Problems to be solved by the device]

 In the conventional heater chip for electrode heating and soldering as described above, the bottom surface of the heater chip that presses the lead wire of the electronic component is flat.Therefore, when pressing the lead wire of the electronic component, the force is applied in the width direction of the lead wire. There was a problem in that there was no force and the lead wire easily protruded from the pattern and soldering failure occurred.

The present invention has been made in order to solve the above problems, and when the lead wire and the pattern on the printed wiring board are brought into close contact with each other by soldering by the pressing load of the heater chip for electrode heating and mounting. In addition, the purpose is to solder the lead wire without sticking it out of the pattern by using a heater chip with a forcing force in the width direction of the lead wire.

[0006]

[Means for Solving the Problems]

 In the heater chip for electrode heating soldering according to the present invention, a stepped structure is provided at an interval equal to the interval between the lead wires of the electronic component to be soldered.

[0007]

[Action]

 Lead wires of electronic parts are reflow-soldered without misalignment from the pattern on the printed wiring board to obtain good solder joints.

[0008]

【Example】

 Example 1. FIG. 1 is a diagram showing an embodiment of the present invention, and 2 is a heater chip for electrode heating soldering having a stepped structure equivalent to the lead line spacing of electronic parts to be soldered. 2 (a), (b), (c), and (d) are diagrams showing a process of soldering a lead wire of an electronic component to a pattern on a printed wiring board using the embodiment of FIG. is there.

2A, 2B, 2C, and 2D show a process of soldering a lead wire of an electronic component to a pattern on a printed wiring board using the embodiment of FIG. The soldering step is as follows: (a) First step (see FIG. 2 (a)): Step of aligning the lead wire 2 of the electronic component with the pattern 3 on the printed wiring board, (b) Second step (see FIG. 2 (b)): Step of aligning the electrode heating soldering heater chip 1 having a stepped structure at an interval equivalent to the lead wire interval of the electronic component, (c) 3 steps (see FIG. 2 (c)): Steps of pressing the heater chip 1 for electrode heating and soldering, forcibly correcting the positional deviation of the lead wire 2 and bringing the lead wire 2 into close contact with the pattern 3 on the printed wiring board. ) Fourth step (see FIG. 2D): After that, the temperature of the heater chip is higher than the melting point of the solder. The process consists of ascending, melting the solder and soldering.

[0010]

EFFECTS OF THE INVENTION Since the present invention is configured as described above, it has the following effects.

By using a heater chip having a forcing force in the width direction of the lead wire, the lead wire is misaligned and soldering can be performed without protruding from the pattern.

[Brief description of drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention.

FIG. 2 is a diagram showing an electrode heating reflow soldering process using Example 1 of the present invention.

FIG. 3 is a conventional heater chip diagram for electrode heating and soldering.

[Explanation of symbols]

 1 Stepped heater chip for electrode heating and soldering 2 Lead wire for electronic parts 3 Pattern on printed wiring board 4 Heater chip for electrode heating and soldering

Claims (1)

[Claims for utility model registration] 1. In a heater chip of a device for reflow soldering a lead wire of an electronic component on a printed wiring board by an electrode heating soldering method, a surface of the heater chip facing the printed wiring board. A heater chip for electrode heating and soldering, characterized in that it is formed in steps at intervals equal to the lead wire intervals of the electronic component to be soldered.