JPH0545066B2 - - Google Patents
Info
- Publication number
- JPH0545066B2 JPH0545066B2 JP61105372A JP10537286A JPH0545066B2 JP H0545066 B2 JPH0545066 B2 JP H0545066B2 JP 61105372 A JP61105372 A JP 61105372A JP 10537286 A JP10537286 A JP 10537286A JP H0545066 B2 JPH0545066 B2 JP H0545066B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- frame
- outer frame
- horizontal
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61105372A JPS62261163A (ja) | 1986-05-07 | 1986-05-07 | サ−デイツプ型半導体装置用リ−ドフレ−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61105372A JPS62261163A (ja) | 1986-05-07 | 1986-05-07 | サ−デイツプ型半導体装置用リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62261163A JPS62261163A (ja) | 1987-11-13 |
| JPH0545066B2 true JPH0545066B2 (enExample) | 1993-07-08 |
Family
ID=14405866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61105372A Granted JPS62261163A (ja) | 1986-05-07 | 1986-05-07 | サ−デイツプ型半導体装置用リ−ドフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62261163A (enExample) |
-
1986
- 1986-05-07 JP JP61105372A patent/JPS62261163A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62261163A (ja) | 1987-11-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0545066B2 (enExample) | ||
| JPS639093Y2 (enExample) | ||
| JPS5822332Y2 (ja) | 圧電素子の保持バネ | |
| JPS6119555Y2 (enExample) | ||
| JPS6334275Y2 (enExample) | ||
| JPS62162844U (enExample) | ||
| JPS61158732U (enExample) | ||
| JPS623898Y2 (enExample) | ||
| JPH0173933U (enExample) | ||
| JPS6444635U (enExample) | ||
| JPH04137064U (ja) | 半導体装置の構造 | |
| JPS5841656Y2 (ja) | 端子板を有する気密端子 | |
| JP2603551Y2 (ja) | 圧電振動子の支持構造 | |
| JPS61134046U (enExample) | ||
| JPS63159843U (enExample) | ||
| JPS6397246U (enExample) | ||
| JPS6314385U (enExample) | ||
| JPH05164776A (ja) | 半導体加速度センサ及びその組立方法 | |
| JPH0472639U (enExample) | ||
| JPH02291152A (ja) | 半導体素子収納用パッケージ | |
| JPS62182559U (enExample) | ||
| JPS5923553A (ja) | 半導体装置の製造方法 | |
| JPH02146448U (enExample) | ||
| JPS621361U (enExample) | ||
| JPH01177609U (enExample) |