JPH054490U - Mounting structure of hybrid integrated circuit device - Google Patents
Mounting structure of hybrid integrated circuit deviceInfo
- Publication number
- JPH054490U JPH054490U JP5677791U JP5677791U JPH054490U JP H054490 U JPH054490 U JP H054490U JP 5677791 U JP5677791 U JP 5677791U JP 5677791 U JP5677791 U JP 5677791U JP H054490 U JPH054490 U JP H054490U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- holes
- resin
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】
【目的】 混成集積回路装置の樹脂封止パッケージにお
いて、実装素材と封止樹脂の剥離が生じにくく耐湿性を
向上にする点にある。
【構成】 電子部品３を搭載したセラミック基板２に上
下に貫通した穴７を形成する。セラミック基板２を接着
するリードフレームのアイランド１に、穴７に対応する
位置に貫通穴８を形成する。封止樹脂６が穴７及び８に
入り込むように樹脂封止する。
(57) [Abstract] [Purpose] In a resin-sealed package of a hybrid integrated circuit device, peeling of a mounting material and a sealing resin is less likely to occur, and moisture resistance is improved. [Structure] A hole 7 is formed vertically through a ceramic substrate 2 on which an electronic component 3 is mounted. Through holes 8 are formed at positions corresponding to the holes 7 in the island 1 of the lead frame to which the ceramic substrate 2 is bonded. Resin sealing is performed so that the sealing resin 6 enters the holes 7 and 8.
Description
【０００１】[0001]
本考案は、混成集積回路装置の実装構造におけるその樹脂封止に関する。 The present invention relates to resin sealing in a mounting structure of a hybrid integrated circuit device.
【０００２】[0002]
従来、混成集積回路装置の樹脂封止タイプに関し、その実装構造として、図２ に示すように、リードフレームのアイランド１へセラミック等から成る混成集積 回路基板２を接着し、前記基板２上には、能動部品、受動部品等の回路素子３を 搭載し、前記基板に組み込まれた回路装置の各端子は、各素子間及びリードフレ ームのインナーリード４と例えば金ヤイヤ５でワイヤボンディングされる。その 後、前記金ワイヤ５を含め樹脂６で気密封止してパッケージが形成される。 また、他の例として、実装体積を下げるために、前記リードフレームのアイラ ンドを排して回路基板とリードフレームのインナーリードとを接続して樹脂封止 するものもある。 Conventionally, regarding a resin sealing type of a hybrid integrated circuit device, as a mounting structure thereof, as shown in FIG. 2, a hybrid integrated circuit substrate 2 made of ceramic or the like is adhered to an island 1 of a lead frame, and the substrate 2 is mounted on the substrate 2. , Circuit elements 3 such as active components and passive components are mounted, and each terminal of the circuit device incorporated in the substrate is wire-bonded between each element and the inner lead 4 of the lead frame by, for example, gold ear 5. Then, the package including the gold wire 5 is hermetically sealed with the resin 6. Further, as another example, in order to reduce the mounting volume, there is one in which the eyeland of the lead frame is discharged and the circuit board and the inner lead of the lead frame are connected and resin-sealed.
【０００３】 しかし、前記実装構造のものは、実装体積が大きくなることで、パッケージ内 応力が大きくなり、リードフレームや回路基板等の実装素材と封止樹脂との剥離 が生じ易くなり、この剥離の進行によりパッケージにクラックが発生して耐湿性 が悪化する。However, in the case of the mounting structure described above, the mounting volume increases, so that the stress inside the package increases, and the mounting material such as the lead frame or the circuit board easily peels off from the sealing resin. As a result, the package will crack and the moisture resistance will deteriorate.
【０００４】[0004]
本考案は、混成集積回路装置の樹脂封止パッケージにおいて、実装素材と封止 樹脂との剥離が生じにくく耐湿性の向上を図る点にある。 The present invention aims at improving moisture resistance in a resin-sealed package of a hybrid integrated circuit device in which peeling between a mounting material and a sealing resin does not easily occur.
【０００５】[0005]
本考案は、混成集積回路基板とリードフレームの両者に貫通穴を形成して樹脂 封止することを特徴とするものである。 The present invention is characterized in that through-holes are formed in both the hybrid integrated circuit board and the lead frame for resin sealing.
【０００６】[0006]
図１は、本考案装置の実施例を示している。 図１において、３はセラミック基板２に搭載した集積回路等の電子部品である。 リードフレームのアイランド１に接着したセラミック基板２上に形成した回路装 置の各接続端子（図示せず）は、リードフレームのインナーリード４とワイヤボ ンディングで接続される。ここまでは従来の実装構造と変わるところはない。 FIG. 1 shows an embodiment of the device of the present invention. In FIG. 1, reference numeral 3 is an electronic component such as an integrated circuit mounted on the ceramic substrate 2. Each connection terminal (not shown) of the circuit device formed on the ceramic substrate 2 bonded to the island 1 of the lead frame is connected to the inner lead 4 of the lead frame by wire bonding. Up to this point, there is no difference from the conventional mounting structure.
【０００７】 前記セラミック基板２には、上下に貫通する貫通穴７を例えば２か所に形成し 、これら貫通穴７に対応するリードフレームのアイランド１の位置にも同様に貫 通穴８を形成する。前記貫通穴７は、セラミック基板２に電子部品を搭載する前 に形成しても良いし、基板回路上で予め貫通穴（スルーホール）を有するもので あれば、このスルーホール径を大きくして貫通穴に共有することもできる。 また、リードフレームのアイランド１には、リードフレームの製造の際に貫通 穴８を形成しても良いし、セラミック基板を接着する前に形成しても良い。The ceramic substrate 2 is formed with through holes 7 penetrating vertically at, for example, two places, and through holes 8 are also formed at the positions of the islands 1 of the lead frame corresponding to these through holes 7. To do. The through hole 7 may be formed before mounting the electronic component on the ceramic substrate 2, or if the through hole (through hole) is previously formed on the substrate circuit, the through hole diameter may be increased. It can also be shared with the through hole. Further, the through hole 8 may be formed in the island 1 of the lead frame at the time of manufacturing the lead frame, or may be formed before bonding the ceramic substrate.
【０００８】 前記アイランド１に形成した貫通穴８にセラミック基板２に形成した貫通穴７ を位置合わせして両者を接着し、然る後に樹脂６でインナーリード４の一部も含 めて全体を気密封止する。この時樹脂は前記貫通穴７及び８にも入り込み、樹脂 ６とセラミック基板２の接着力が高まり、同時に樹脂６は、前記貫通穴７及び８ を介して上下が一部一体になるので全体として封止樹脂６、セラミック基板２、 リードフレームのアイランド１が一体となって封止されるので、セラミック基板 ２とリードフレームのアイランド１は強く圧着され、且封止樹脂６とセラミック 基板２の界面の剥離が防止される。 なお、アイランドを排したリードフレームを採用する場合は、上下に貫通穴を 形成したセラミック基板の接続端子とインナーリードとを接続し、樹脂が前記貫 通穴に入り込むようにして全体を樹脂封止して実施することも可能である。The through holes 8 formed in the ceramic substrate 2 are aligned with the through holes 8 formed in the island 1, and the two are bonded together. Hermetically seal. At this time, the resin also enters the through holes 7 and 8, and the adhesive force between the resin 6 and the ceramic substrate 2 is enhanced. Since the sealing resin 6, the ceramic substrate 2 and the lead frame island 1 are integrally sealed, the ceramic substrate 2 and the lead frame island 1 are strongly pressure-bonded to each other, and the interface between the sealing resin 6 and the ceramic substrate 2 is strong. Peeling is prevented. When using a lead frame with islands removed, connect the connecting terminals of the ceramic substrate with through holes formed on the top and bottom to the inner leads, and seal the entire resin so that the resin enters the through holes. It is also possible to carry out.
【０００９】[0009]
本考案は、混成集積回路の基板にも貫通穴を形成して樹脂封止したから、封止 樹脂と基板との接着面積が大きくなるとともに、両者が機械的接着構造となるた め、接着力が高くなる。そのため、前記界面剥離やパッケージのクラックの発生 を防止でき、混成集積回路装置のパッケージの耐湿性が向上する。 According to the present invention, since the through hole is also formed in the substrate of the hybrid integrated circuit and the resin is encapsulated, the adhesive area between the encapsulating resin and the substrate is large, and the both have a mechanical adhesive structure. Becomes higher. Therefore, it is possible to prevent the interface peeling and the package crack from occurring, and the moisture resistance of the package of the hybrid integrated circuit device is improved.
【図１】本考案の実施例の説明図である。FIG. 1 is an explanatory view of an embodiment of the present invention.
【図２】従来例の説明図である。FIG. 2 is an explanatory diagram of a conventional example.
１・・リードフレームのアイランド ２・・セラミック
基板 ３・・電子部品 ６・・封止樹脂 ７、８・・貫通穴1 ... Island of lead frame 2 ... Ceramic substrate 3 ... Electronic component 6 ... Sealing resin 7, 8 ... Through hole
Claims (1)
数の貫通穴を形成した混成集積回路基板と、該混成集積
回路基板がその表面に接着される、前記複数の貫通穴の
位置に対応して貫通穴を形成したアイランドを具備する
リードフレームとを備え、前記アイランドに接着した前
記混成集積回路基板及び前記アイランド近傍を含め、且
封止樹脂が前記貫通穴に入り込むように樹脂封止したこ
とを特徴とする混成集積回路装置の実装構造。Claims for utility model registration: 1. A hybrid integrated circuit board on which electronic parts are mounted, and a plurality of through-holes are formed vertically through the hybrid integrated circuit board, and the hybrid integrated circuit board is adhered to the surface of the hybrid integrated circuit board. A lead frame having an island having through holes corresponding to the positions of a plurality of through holes, including the hybrid integrated circuit board and the vicinity of the island adhered to the island, and the sealing resin is used for the through holes. A mounting structure for a hybrid integrated circuit device, characterized in that it is resin-sealed so as to enter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5677791U JPH054490U (en) | 1991-06-26 | 1991-06-26 | Mounting structure of hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5677791U JPH054490U (en) | 1991-06-26 | 1991-06-26 | Mounting structure of hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH054490U true JPH054490U (en) | 1993-01-22 |
Family
ID=13036876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5677791U Pending JPH054490U (en) | 1991-06-26 | 1991-06-26 | Mounting structure of hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH054490U (en) |
-
1991
- 1991-06-26 JP JP5677791U patent/JPH054490U/en active Pending
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