JPH0543549U - LSI package - Google Patents

Abstract

(57) [Abstract] [Purpose] To improve the heat dissipation of the LSI package and avoid the need for an expensive heat sink. [Structure] The upper part 1 of the main body 2 of the LSI package for radiating heat is provided with a means for increasing the surface area for radiating heat by making a corrugated irregular shape, preferably a sawtooth irregularity.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to heat dissipation of an LSI package.

[0002]

[Prior Art]

 In the conventional LSI package, the upper portion 1 of the LSI package is flat as shown in FIG. Further, as the heat generated by the LSI increases, the reliability of the LSI deteriorates. Therefore, as shown in FIG. 4, an expensive heat sink 4 is provided in the LSI package body 2 to improve the heat dissipation.

[0003]

[Problems to be solved by the device]

 In the past, this type of LSI package had insufficient heat dissipation because the upper part of the LSI package was flat. Further, there is a disadvantage that an expensive heat sink must be provided when the heat generated by the LSI increases.

An object of the present invention is to provide an LSI package that enhances the heat dissipation of the LSI package and does not require an expensive heat sink.

[0005]

[Means for Solving the Problems]

 The upper surface of the LSI package has a wavy concavo-convex structure, and preferably the upper surface has a serrated concavo-convex structure.

[0006]

[Action]

 Since the upper part of the LSI package has a wavy concavo-convex structure, the surface area is larger than when the upper part of the package (the part on the side opposite to the pins) is flat, thus increasing the amount of heat radiation. Further, by making the upper structure of the package into a saw-tooth-like concavo-convex shape, the surface area of the upper part of the package changes and the amount of heat radiation also changes depending on how the top angle of the triangle of the saw tooth is taken.

[0007]

【Example】

 Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a front view of an embodiment of the present invention, and FIG. 2 is a perspective view of an embodiment of the present invention. When the upper part 1 of the main body 2 of the LSI package has a triangular irregular shape and the angle 3 of the triangle is 90 degrees, the upper part 1 of the LSI package is more flat than when it is flat.

[0009]

[Equation 1] Becomes the surface area of. Further, when the angle 3 is 60 degrees, the surface area of the LSI package upper part 1 is twice as large as when the angle is 3 degrees, and the heat dissipation is increased compared to when the angle 3 is 90 degrees.

In the above description, the angle 3 of the triangle is 60 degrees and 90 degrees, respectively, but the angle is not limited to this, and any angle may be used as long as the surface area increases and the heat radiation increases.

[0011]

[Effect of the device]

 As is clear from the above description, according to the LSI package of the present invention, the heat radiation area of the LSI package is increased to enhance the heat radiation performance of the LSI package, and the effect that an expensive heat sink is not required can be obtained.

In addition, the heat dissipation surface is provided with irregularities having a saw-tooth cross section and the base angle of the triangle is changed, whereby the heat dissipation area can be arbitrarily changed and the heat dissipation amount can be correspondingly changed. There is.

[Brief description of drawings]

FIG. 1 is a sectional view showing the structure of an embodiment of the present invention.

FIG. 2 is a perspective view showing the structure of an embodiment of the present invention.

FIG. 3 is an LS in which a conventional package has a flat upper surface.
It is a perspective view of an I package.

FIG. 4 is a perspective view of a conventional LSI package with a heat sink.

[Explanation of symbols]

 1 LSI package upper part 2 LSI package body 3 Triangle angle 4 Heat sink

Claims (2)

[Scope of utility model registration request] 1. An LSI package, characterized in that the upper surface of the package that dissipates heat generated inside the LSI package is formed in a wavy concavo-convex shape. 2. The LSI package according to claim 1, wherein an upper surface of the LSI package is uneven with a sawtooth cross section.