JPH0541597A - Various mechanisms for composing electronic component placing apparatus and electronic component placing apparatus using the same mechanisms - Google Patents

Abstract

PURPOSE:To accurately and stably place an electronic component formed at an electrode surface of fine spherical solders on a board. CONSTITUTION:The electronic component placing apparatus comprises a flux coating mechanism 1 which can uniformly apply a predetermined quantity of flux, a flux drying mechanism 2 for improving flux viscosity, an alignment pawl 21 for aligning a component by a low impact, an optical system 5 which can accurately detect an electrode position of an electronic component, and a placing head 4 for applying a predetermined back pressure to the electronic component and placing the electronic component on a board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to various mechanisms constituting an electronic component mounting apparatus and an electronic component mounting apparatus using these mechanisms, and particularly to a liquid such as flux on a substrate on which electronic components are mounted. A mechanism for quantitatively and uniformly supplying and applying a flux, and a mechanism for drying the flux in order to prevent positional deviation of electronic components caused by vibration generated when the substrate is transported,
A mechanism that allows mechanical alignment of electronic components with low impact, an electrode position detection mechanism for electronic components whose electrode surface is made of spherical solder, and an electronic component for electronic components when mounted on a board. And a mechanism for applying an appropriate constant back pressure, and an electronic component mounting apparatus including these mechanisms.

[0002]

2. Description of the Related Art As a conventional technique relating to a method of applying a liquid such as an adhesive or a solder paste to a substrate in an electronic component mounting device, for example, "Electronic Technology, December 1986, Supplement,""Joining Technology for Printed Circuits" As described in the above, techniques such as a dispenser method, a transfer method, a screen printing method, etc. are known.

In the dispenser system, an adhesive such as a solder paste is put in a small nozzle, air pressure is applied to this, and the adhesive is extruded from the tip of the nozzle to apply a liquid such as an adhesive. In the transfer method, the tips of thin pins are placed in an adhesive, and the adhesive attached to the tips of the pins is applied onto a substrate. Further, the screen printing method is a method of printing and applying an adhesive at a predetermined position using a screen having a predetermined pattern.

Further, as a conventional technique relating to an electronic component alignment method in an electronic component mounting apparatus, for example,
The technique described in Japanese Patent Application Laid-Open No. 1-122199 is known. In this conventional technique, an electronic component is placed on a positioning table, and two sets of positioning pieces, which move in the X and Y directions relative to each other, are brought into direct contact with a workpiece such as the electronic component for positioning. is there.

Further, as a method of detecting the electrode position of the electronic component in the electronic component mounting apparatus, a fluorescence detection method of detecting fluorescence emitted from the electrode surface, and illumination light used at the time of detection is irradiated onto the electrode surface from the upper surface for detection. Techniques such as a bright field detection method, a dark field detection method in which illumination light used at the time of detection is irradiated from the entire side surface of a component for detection, or a bright / dark field detection method in which a bright field and a dark field are combined are known.

Further, as a conventional technique relating to a method of mounting an electronic component on a substrate in an electronic component mounting apparatus, after the electronic component is position-corrected in the XYθ (θ is rotation) direction, the electronic component is driven by a cam. A technique is known in which the sucked head is lowered toward the substrate by a constant stroke, and a constant back pressure is applied by this to mount the electronic component on the substrate.

[0007]

The prior art relating to the above-mentioned liquid application onto the substrate is such that the liquid applied onto the substrate has a high viscosity such as solder paste, and is applied to the substrate once. The solder paste can be applied only to a narrow range such as one point or several points of the electrode points on the substrate. And, even if this conventional technology mounts electronic components on the substrate immediately after applying this solder paste and carries the substrate to move the mounted substrate to the next step, the viscosity of the solder paste is very high. As a result, it is less likely that the electronic parts will move due to the impact during transportation and the deviation will occur.

However, when the electrode surface of the electronic component is composed of minute spherical solder, it is necessary to apply the solder paste over a wide range, and a flux with low viscosity must be used instead of the solder paste. Therefore, the conventional coating method cannot cope with such a case, and there is a problem that a treatment for increasing the viscosity of the flux after coating must be performed.

Further, in the conventional technique for detecting the electrode position of the electronic component, it is impossible to detect the electrode position when the electrode surface of the electronic component is composed of a minute spherical solder. Have a point.

Further, in the work alignment method according to the prior art, electronic parts are placed on a positioning table,
Since alignment is performed by the positioning piece in the X and Y directions, there are many factors of mechanical stress applied to the electronic component, which causes a problem such as chipping or cracking of the electronic component. ..

Further, in the prior art in which the back pressure can be controlled at the time of mounting the component, the electronic component is mounted on the substrate by moving the electronic component vertically by a constant stroke by the cam drive to mount the electronic component on the substrate. At the same time, the mechanical load applied to the electronic parts changes due to the change in the thickness of the board and the electronic parts. Moreover, since the mounting surface of the board is coated with flux, the mounting accuracy of the parts is improved. There is a problem that it is difficult to improve.

An object of the present invention is to solve the above-mentioned problems of the prior art and to provide an electronic component mounting apparatus capable of mounting electronic components on a substrate with high accuracy. Various mechanisms that make up the electronic component mounting device,
That is, a flux coating mechanism that can perform a fixed amount of coating over a wide area, a drying mechanism for the applied flux, an alignment mechanism that does not damage electronic components with low impact, and a spherical solder electrode position detection mechanism for electronic components. ,
It is to provide a back pressure adjusting mechanism when mounting a component on a board.

[0013]

According to the present invention, the above object can be achieved by configuring various mechanisms constituting the electronic component mounting apparatus as follows.

The flux application mechanism is a mechanism for uniformly applying the flux over a predetermined wide area on the substrate, and controls the application head having a coating surface of a predetermined size, the flux injection syringe, and the discharge of the flux. A flux discharge controller is provided, and a sponge material for impregnating flux is further provided in the coating head portion, and the flux coating surface of the head portion is formed in a mesh shape.

The flux drying mechanism is for preventing the electronic parts from being displaced when the substrate on which the electronic parts are mounted is conveyed, and increases the viscosity of the flux to increase the adhesive force between the electronic parts and the substrate. This is a mechanism for drying the flux in order to raise it. The drying mechanism is composed of a heater, for example, a far-infrared heater, which is provided during the transportation of the substrate.

The substrate is not conveyed as it is, but the substrate is set on a dedicated conveying jig and conveyed, and further, the conveying jig when the conveying jig is conveyed in the apparatus. The rail surface to receive is mirror-finished.

The alignment mechanism vacuum-sucks an electronic component from a pallet for exclusive use of electronic components in which electronic components are aligned and housed by a suction head, and the electronic component is vacuum-sucked at a point on the extension taken out in the XY directions. The driven V-shaped alignment claw is configured to perform alignment in each of the XYθ directions of the electronic component.

The electrode position detection mechanism using the spherical solder illuminates the electrode surface of the electronic component obliquely and image-processes the shadow of the spherical solder electrode projected on the base material.
It is configured to detect the center position of each spherical solder electrode.

The back pressure adjusting mechanism is provided with a landing detection unit for detecting that the electronic component has come into contact with the substrate at the upper end of the shaft to which the suction head for vacuum-sucking the electronic component is attached. Therefore, the electronic component sucked in vacuum is pressed onto the substrate by a predetermined amount by a spring force.
The landing of the electronic component is detected by a mechanism configured such that, when the electronic component lands, the head mounting shaft pushes up a contact for landing detection.

[0020]

[Function] The sponge material built into the flux coating head is
Since a cotton-like substance is used, the flux to be applied, which has been injected into the head, can be impregnated inside and held therein. As a result, flux is accumulated in the head, and the balance between the air pressure for ejecting the liquid inside the head and the vacuum pressure for preventing liquid dripping can be easily maintained. As a result, in the coating head of the present invention, the liquid liquor is improved, and in particular, it is possible to carry out the quantitative supply of a highly viscous liquid.

Further, since the flux application surface of the head is formed in a mesh shape, a certain amount of the flux accumulated inside the sponge material can be discharged onto the application surface and applied onto the substrate. At this time, the application amount of the flux and the amount remaining on the head portion are appropriately proportioned, so that the flux can be applied with a constant and uniform film thickness.

The drying mechanism heats the flux-supplied and coated substrate using a far-infrared heater, and can increase the viscosity of the flux in a short time. It is possible to increase the adhesive strength of. In addition, when the board is transferred, the board is set on a dedicated board transfer jig and transferred on a rail that has its boundary surface finished, so it is possible to reduce the impact on electronic components mounted on the board. It is possible to prevent the deviation of the electronic components.

The alignment mechanism performs alignment by sliding the electronic parts in the XY directions by V-shaped pawls driven in the XY directions from the transfer pallet dedicated to the electronic parts while the mounting head vacuum-sucks the electronic parts. Due to
The position of the electronic component in the XY and θ directions can be corrected. In this alignment mechanism, since the claws do not mechanically strongly contact the electronic component, it is possible to prevent a defect that the electronic component is cracked or chipped by the alignment operation.

Since the spherical solder electrode of the electronic component is formed with a certain height from the base material of the component, if the spherical solder electrode is obliquely exposed to light, the base material of the spherical solder electrode must be formed. There is a shadow This shadow occurs regardless of the surface condition of the base material and the spherical solder electrode, and has a very good contrast with the base material. Therefore, when light is applied to the electrodes from the X direction and a photographing waveform of a white spot of a binarized digital image is taken with respect to the X axis and the center of this waveform is obtained, the center of this waveform is found in the X direction. Will be obtained as the center position of. Similarly, by switching the illumination to the illumination from the Y direction and obtaining the center of the waveform, the center position in the Y direction can be obtained.

As described above, the electrode position detecting mechanism can detect the center position of the electrode of the electronic component by the spherical solder. Furthermore, the center position of the electronic component can be accurately detected from these electrode positions.

The back pressure adjusting mechanism pushes up the shaft on which the suction head, which contacts the substrate with the electronic components sucked on the suction head, is pushed up, and pushes up the contact of the landing detection section provided on the mounting shaft. Thus, the landing of the electronic component on the substrate can be detected. Accordingly, it is possible to reliably detect landing of electronic components having different thicknesses, so that a constant load can be supplied from behind the electronic components.

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION Various embodiments of an electronic component mounting apparatus according to the present invention and an embodiment of an electronic component mounting apparatus using these mechanisms will be described in detail with reference to the drawings.

FIG. 1 is a perspective view showing the external appearance of an electronic component mounting apparatus according to an embodiment of the present invention. In FIG. 1, 1 is a flux coating mechanism, 2 is a flux drying mechanism, 3 is a mounting portion, 4 is a mounting head, 5 is an optical system, and 21 is an alignment claw.

In the electronic component mounting apparatus according to the embodiment of the present invention shown in FIG. 1, a substrate (not shown) is set on a substrate carrying jig and placed under the flux coating mechanism 1.
Flux is applied to a predetermined portion on the substrate at this position, then is transported on the substrate transport path 101, dried by the flux drying mechanism 2 and then transported to the mounting portion 3.

On the other hand, the electronic components mounted on the substrate are placed on a component storage pallet (not shown), and the component transfer path 10
2 is conveyed to the position of the mounting head 4. Mounted head 4
Is equipped with a head for adsorbing components and a back pressure adjusting mechanism to be described later, and adsorbs electronic components from the pallet, and moves in the direction of the mounting portion 3 for mounting on the substrate. During this movement, the electronic components are aligned by the alignment claw 24.

For the electronic component which has been carried to the position of the mounting portion 3 after receiving the above-mentioned alignment, the optical system 5 detects a spherical electrode position as described later, and a predetermined back pressure is applied to a predetermined position on the substrate. Is added and mounted on the substrate.

Next, the structures of various mechanisms constituting the electronic component mounting apparatus according to the present invention will be described in the order of respective steps in the electronic component mounting apparatus described above.

FIG. 2 is a diagram showing an outline of a flux coating head used in the flux coating mechanism 1, and FIG. 3 is a diagram showing a detailed structure of a nozzle of the flux coating head. 2 and 3, 6 is a syringe, 7 is a nozzle,
8 is a silicon tube, 9 is a dispenser, 10 is felt, 13 is a substrate, 14 is a flux discharge hole, and 15 is a groove.

As shown in FIG. 2, the flux applying head constituting the flux applying mechanism 1 connects the syringe 6 for injecting the flux, the nozzle 7 for discharging and directly applying the flux, and the syringe 6 and the nozzle 7. It is composed of a silicon tube 8. Further, the syringe 6 is connected to a dispenser 9 that controls the amount of flux discharged. The inside of the nozzle 7 is hollow, and a felt 10 as a sea surface body into which flux is impregnated is built therein.

This flux coating head is a syringe 6
After injecting the flux into the interior, air pressure 11 is applied from the dispenser 9 to allow the flux to soak into the felt 10 to form a flux pool inside the nozzle 7. Further, in order to prevent the flux from dripping from the nozzle 7, the dispenser 9 applies vacuum pressure 12 to suck up the flux and prevent dripping.

In this case, the optimum setting of the vacuum pressure 12 is a range in which the flux does not drip and the bubbles are not generated in the syringe 6 due to excessive suction of the liquid. Felt 10
In this case, it is effective to make the range of the above-mentioned vacuum pressure 12 extremely wide, and thus, the discharge of the flux can be easily controlled.

As shown in FIG. 3A, the discharge surface of the nozzle 7 is formed by forming grooves 15 in a mesh shape on the entire discharge surface and further providing a flux discharge hole 14. In such a mesh structure, since the ejection surface of the nozzle 7 is not a flat surface, when the liquid such as flux having high viscosity is applied to the substrate 13, the nozzle 7 and the substrate 13 are attached and the substrate 13 is lifted. Further, after the flux is discharged onto the discharge surface of the nozzle 7, about half of the flux is applied on the substrate 13 and the other half remains in the groove 15 of the nozzle 7. Both effects combined with ease of control of vacuum pressure 12)
This produces the advantage that the flux can be applied uniformly and in a fixed amount.

FIG. 4 is a diagram showing the structure of the flux drying mechanism 2. In FIG. 4, reference numeral 16 is a far infrared heater.

The substrate 13 coated with the flux by the flux coating mechanism 1 is conveyed to the position of the flux drying mechanism 2. The flux drying mechanism 2 is for drying the flux applied by the above-mentioned flux applying mechanism 1, and as shown in FIG. 4, heat is applied from above the substrate 13 by the far infrared heater 16 for a certain period of time to apply heat to the substrate. Force the applied flux to dry. As a result, the viscosity of the flux can be increased, and it is possible to prevent the displacement of the electronic component mounted on the substrate due to the impact generated when the substrate is transported in the subsequent process.

The far-infrared heater 16 in the flux drying mechanism 2 may be an ordinary heater for heating, or the drying mechanism may be one for drying with hot air or the like.

FIG. 5 is a diagram showing a stored state of a pallet for storing electronic components, and FIG. 6 is a diagram for explaining a relationship between a detection visual field and a component position when the electrode position of the component is detected by an optical system. In FIG. 5, 17 is a pocket, 18, A,
B and C are electronic components, 19 is an electrode, and 20 is a detection visual field.

The substrate on which the flux has been dried as described above is conveyed to the position of the mounting mechanism 3 in FIG.
The pallet having the pockets 17 in which electronic components are stored is also transported to the position of the mounting mechanism 3 in FIG. Several types of electronic parts having different outer shapes (parts A, B, and C in FIG. 5) are used. To store and use the electronic parts having different outer shapes in common in one pallet, 1 The size of the pocket 17 must be determined according to the largest part C.

Therefore, the component A having the smallest size is
As shown as a component 18 in FIG. 5, the product is conveyed while moving in various directions in the pocket 17.
Further, in this state, when the mounting head 4 in FIG. 1 vacuum-sucks an electronic component from the pallet and the optical system 5 tries to detect the electrode surface of the electronic component, as shown in FIG.
There is a problem that the electrode 19 to be detected is out of the detection visual field 20.

Therefore, in order to solve this problem, an alignment mechanism for correcting the position of the electronic component is necessary.

FIG. 7 is a view showing the arrangement of the alignment mechanism. In FIG. 7, 21 is an alignment claw, 22 is an electronic component, 38 is an XY table, and 39 is an arm part. 40 is an X-axis motor and 41 is a Y-axis motor.

This alignment mechanism is shown in FIG.
The mounting head 4 is installed above a suction point for sucking an electronic component from the pallet, and as shown in FIG. 7A, an alignment claw 21 and an arm portion 39 for fixing the alignment claw 21 to the XY table 38. It is composed of an X-axis motor 40 and a Y-axis motor 41 that drive the XY table 38.

As shown in FIG. 7 (b), the electronic component alignment method using this alignment mechanism moves the alignment claw 21 in the X direction while the electronic component 22 is adsorbed by the mounting head 4 to move in the X and θ directions. Alignment is performed, and the alignment claw 21 is moved in the Y direction to perform alignment in the Y direction. During this alignment operation, the electronic component 22 is in a state of being adsorbed to the mounting head 4 by vacuum adsorption, and therefore, by pressing the alignment claw 21, the electronic component 22 is aligned while being slid in the state of being adsorbed to the mounting head 4. Become. As a result, the electronic components can be aligned with low stress, the electronic components are not damaged, and the electrode 19 to be detected by the electronic component 22 is always placed in the detection visual field 20 in FIG. It becomes possible.

The electronic component aligned by the alignment claw 21 as described with reference to FIG. 7 is carried onto the optical system 5 by the mounting head 4 of FIG. 1, and the electrode position of the electronic component is detected.

FIG. 8 is a view showing the arrangement of an electrode position detecting mechanism for electronic parts. In FIG. 8, 23 is a lighting device, and 24
Is an electrode of an electronic component, 25 is a shadow of the electrode, and 26 is a base material of the electronic component.

In the electrode position detection mechanism shown in FIG. 8, the illumination surface is illuminated by the illumination device 23 from the X direction at an angle of γ with respect to the electrode surface of the electronic component 22 attracted to the mounting head 4. Thereby, the base material 2 of the electronic component 22
A shadow 25 of the electrode 24 is formed on the surface 6. When the image having this shadow is detected and binarized, the shadow 25 of the electrode can be obtained as a stable white dot region 42. In this binary image, a waveform as shown in image 27 can be obtained by performing integration processing of white points in the X-axis direction. The edge Xa of the waveform 28 of the white point of the image 27 subjected to the integration processing
And Xb are detected, and the center position of the electrode in the X direction is obtained based on these values. The center position X in the X direction can be calculated by the following equation (1). X = (Xa + Xb) / 2 (1) Further, similarly, by switching the direction of the illumination light from the Y direction, the same processing as in the X direction is performed so that the center position of the electrode in the Y direction is changed. You can ask.

Thus, the center position of each electrode of the electronic component can be detected regardless of the surface condition of the electrode and the base material, and the center position of the electronic component can be determined from the plurality of electrode positions based on this result. Since it can be obtained, the mounting position of the component can be detected and determined with higher accuracy.

As described above, the electronic component whose position has been detected is mounted on the substrate by the mounting head 4 having a back pressure adjusting mechanism. Next, this mechanism will be described.

FIG. 9 shows a mounting head 4 having a back pressure adjusting mechanism.
It is a figure which shows the mechanism of. In FIG. 9, 29 is a suction tool, 30 is a back pressure adjusting screw, 31 is an electronic component landing detection unit,
32 is a push-up rod B, 33 is a contact B, 34 is a push-up rod A, 35 is a contact A, and 37 is a tool mounting shaft.

The illustrated mounting head 4 is composed of a suction tool 29 for sucking an electronic component, a back pressure adjusting mechanism by a back pressure adjusting screw 30 and a spring, and an electronic component landing detecting section 31 as large mechanical sections. , Is movably attached to the tool attachment shaft 37. The landing detection unit 31 is normally in a state where the push-up rod A34 and the contact A35 are in contact with each other,
The lead wire 36 connected to these is in a conductive state. Further, the push-up rod B32 and the contact B31 are in contact with each other.

The entire mounting head in the above-described state descends toward the substrate 13 in order to mount the electronic component 22 on the substrate 13, and the electronic component 2 sucked by the suction tool 29.
When the second electrode lands on the substrate 13, the tool mounting shaft 37 to which the suction tool 29 is mounted is pushed up, and the contact B33 at the upper end of the shaft 37 is pushed up. Along with this, the push-up rod B32 is pushed up, and the rod B
The push-up rod A34 connected to 32 is also pushed up. As a result, the push-up rod A34 and the contact A
35 is separated and the lead wire 36 is broken, whereby it is possible to detect that the electronic component 22 has landed on the substrate 13.

After that, by lowering the mounting head from this position by a certain amount, a constant back pressure can be applied to the electronic component by the spring attached to the lower portion of the back pressure adjusting screw 30. Even when the viscosity of the flux on the substrate on which the electronic component is mounted is reduced, the electronic component can be mounted on the substrate with high accuracy.

At least one of the various mechanisms according to the above-described embodiments of the present invention can be used as a component of an electronic component mounting apparatus, and as a result, an electronic component having an effect obtainable by these mechanisms can be obtained. The mounting device can be configured.

According to the coating mechanism of the above-described embodiment of the present invention, since a high-viscosity liquid such as flux can be collectively applied to a wide range of the substrate, the application according to the present invention can be applied to equipment requiring a working tact. Mechanisms can be incorporated. In addition, since it is possible to obtain a uniform and uniform coating film thickness, flux drying to prevent misalignment of electronic parts due to vibration that occurs when the board is transported after mounting electronic parts, and soldering of electronic parts, which is a process after mounting It is possible to perform the work under a certain condition even in the cleaning process and the like.
Therefore, it is possible to obtain the effect that the reliability of subsequent processing such as transportation, connection, and cleaning of the substrate on which the electronic component is mounted can be improved.

Since the alignment mechanism according to the above-described embodiment of the present invention performs the alignment while the electronic components are adsorbed to the mounting head, the alignment can be performed with a very low impact, and the electronic components are not damaged such as chipping and cracks. This brings about an effect that alignment can be performed without giving.

The electrode position detection mechanism using the spherical solder according to the above-mentioned embodiment of the present invention utilizes the shadow of the spherical solder electrode formed on the base material and performs image processing to detect the shadow. This shadow can be generated regardless of the surface condition of the electrode and has a very good contrast with the substrate. Therefore, the electrode position detection mechanism can accurately detect the center position of the spherical solder electrode, which cannot be detected by the conventional technique, by an indirect method without using the electrode itself.

Further, the back pressure adjusting mechanism according to the above-described embodiment of the present invention can mount the electronic component on the substrate while supplying a constant load even when the thickness of the electronic component changes. For this reason, according to this back pressure adjusting mechanism, between the mounting surface of the electronic component and the mounting surface of the substrate such that the electrode surface of the mounted electronic component is spherical and the mounting surface is coated with flux. Even when is unstable, the electronic component can be mounted on the substrate with high accuracy and stability.

Further, according to the electronic component mounting apparatus according to the embodiment of the present invention which is provided with the above-mentioned mechanism, the electronic component having the spherical solder electrodes can be stably and highly accurately mounted on the substrate. ..

[0063]

As described above, according to the present invention, it is possible to provide an electronic component mounting apparatus capable of mounting electronic components on a substrate with high accuracy, and an electronic component mounting apparatus for this purpose. The various mechanisms that make up the above, namely, a flux coating mechanism that can perform quantitative coating over a wide area at once, a drying mechanism for the applied flux, an alignment mechanism that does not damage electronic components with low impact, and electronic components It is possible to provide a spherical solder electrode position detecting mechanism and a back pressure adjusting mechanism when a component is mounted on a substrate.

[Brief description of drawings]

FIG. 1 is a perspective view showing an external appearance of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing an outline of a flux coating head used in the flux coating mechanism 1.

FIG. 3 is a diagram showing a detailed structure of a nozzle of a flux coating head.

FIG. 4 is a diagram showing a configuration of a flux drying mechanism 2.

FIG. 5 is a diagram showing a stored state of a pallet that stores electronic components.

FIG. 6 is a diagram illustrating a relationship between a detection field of view and a position of a component when the electrode position of the component is detected by an optical system.

FIG. 7 is a diagram showing a configuration of an alignment mechanism.

FIG. 8 is a diagram showing a configuration of an electrode position detection mechanism of an electronic component.

FIG. 9 is a view showing a mechanism of a mounting head having a back pressure adjusting mechanism.

[Explanation of symbols]

 1 Flux Coating Mechanism 2 Flux Drying Mechanism 3 Mounting Part 4 Mounting Head 5 Optical System 6 Syringe 7 Coating Nozzle 8 Silicon Tube 9 Dispenser 10 Felt 13 Substrate 14 Flux Discharge Hole 15 Groove 16 Far-Infrared Heater 17 Pocket 21 Alignment Claw 22 Electronic Component 23 Lighting device 24 Electrode 26 Base material 29 Adsorption tool 30 Back pressure adjusting screw 31 Electronic component landing detection part 32 Push-up rod B 33 Contact point B 34 Push-up rod A 35 Contact point A 36 Lead wire 37 Tool mounting shaft 38 XY table 39 Arm part 40 X-axis motor 41 Y-axis motor

Claims (6)

[Claims] 1. A flux applying head, a flux injecting syringe, and a flux ejecting device, in a flux applying mechanism for applying a flux to a predetermined position of a substrate on which electronic components are mounted in an electronic component mounting apparatus for mounting electronic components on a substrate. A flux applying mechanism comprising a controller, wherein a sponge material for impregnating flux is installed inside the flux applying head, and the flux discharge surface of the head has a mesh shape. 2. A flux drying mechanism for drying flux applied to a predetermined position of a board on which electronic parts are mounted in an electronic part mounting apparatus for mounting electronic parts on a board A flux drying mechanism characterized in that the surface on which the parts are mounted is heated by a heater. 3. An alignment mechanism for correcting the position of an electronic component when the electronic component is mounted on the substrate in an electronic component mounting apparatus for mounting the electronic component on the substrate, wherein the electronic component mounted on the substrate is transferred from an electronic component storage pallet. An alignment mechanism characterized in that an electronic component is taken out by a vacuum suction head and is aligned by a V-shaped alignment claw while the electronic component is suctioned by the vacuum suction head. 4. An electrode position detecting mechanism for detecting an electrode position of an electronic component in an electronic component mounting apparatus for mounting an electronic component on a substrate, illuminating an electrode surface from an oblique direction to form a base material for the electronic component. An electrode position detecting mechanism for detecting the center position of the electrode by image-processing the projected shadow of the electrode. 5. A back pressure adjusting mechanism for mounting an electronic component on a substrate in an electronic component mounting apparatus for mounting an electronic component on a substrate, wherein a vacuum suction head, a back pressure adjusting section, and the electronic component contact the substrate. And a landing detection section for detecting that the tool mounting shaft is movably coupled, and the landing detection section detects that the electronic component has come into contact with the substrate,
A back pressure adjusting mechanism characterized in that the back pressure adjusting section acts to apply a predetermined back pressure to an electronic component. 6. An electronic component mounting apparatus for mounting an electronic component on a substrate, comprising at least one mechanism according to claim 1.